KR20010003192A - Structure For Improving The Assembly Of The Package Device - Google Patents
Structure For Improving The Assembly Of The Package Device Download PDFInfo
- Publication number
- KR20010003192A KR20010003192A KR1019990023386A KR19990023386A KR20010003192A KR 20010003192 A KR20010003192 A KR 20010003192A KR 1019990023386 A KR1019990023386 A KR 1019990023386A KR 19990023386 A KR19990023386 A KR 19990023386A KR 20010003192 A KR20010003192 A KR 20010003192A
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- KR
- South Korea
- Prior art keywords
- solder ball
- package device
- circuit board
- printed circuit
- pad
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
Abstract
Description
본 발명은 패키지장치의 솔더볼을 조립성을 향상시키도록 하는 구조에 관한 것으로서, 특히, 인쇄회로기판에 일정 깊이 함몰된 함몰패드부를 형성하거나 혹은 기판의 표면을 일정 높이 돌출된 돌출패드부를 형성하여 패키지장치의 저면에 형성된 솔더볼을 납땜함으로써 패키지장치가 인쇄회로기판에 조립된 상태를 용이하고 정확하게 파악하도록 하는 패키지장치의 솔더볼 조립성 향상구조에 관한 것이다.The present invention relates to a structure for improving the assemblability of the solder ball of the package device, in particular, to form a recessed pad portion recessed to a certain depth in the printed circuit board or to form a protruding pad portion protruding the surface of the substrate to a certain height The present invention relates to a solder ball assembling improvement structure of a package device for soldering a solder ball formed on a bottom surface of the device to easily and accurately grasp the state in which the package device is assembled to a printed circuit board.
일반적으로, 반도체장치의 내부에 각종의 절연층 및 도전층등을 적층한 후 식각을 통하여 형성시킨 트랜지스터 및 커패시터등의 기억소자를 갖는 다이(Die)를 기판의 상부면에 접착하여 부설시킨 후에 골드와이어로 다이의 금속배선층과 기판상에 박막화된 금속도선에 납땜으로 연결하여 반도체장치를 형성하게 된다.Generally, after stacking various insulating layers, conductive layers, etc. in a semiconductor device, a die having memory elements such as transistors and capacitors formed by etching is bonded to an upper surface of a substrate, and then gold is deposited. The semiconductor device is formed by soldering the metal wiring layer of the die and the metal conductor thinned on the substrate by wire.
상기한 반도체장치는 종래에는 모듈의 기판 위에 반도체장치를 설치하기 위하여 반도체장치에 다리와 같이 하부로 리이드프레임이 형성되어 있으며, 이 프레임에 모듈의 박막에 납땜으로 연결하여 사용하도록 하였으나 최근에는 반도체장치와 그와 관련된 부품이 소형화됨에 따라 리이드프레임 대신에 반도체기판의 저면부분에 박막으로 연결된 도선에 구형의 작은 납으로 된 솔더볼(Solder Ball)을 사용하여 모듈의 기판에 형성된 박막에 납땜하여 도전하도록 구성된다.In the above-described semiconductor device, in order to install a semiconductor device on a substrate of a module, a lead frame is formed in a lower portion of the semiconductor device, such as a leg, and is connected to the thin film of the module by soldering. And related components are miniaturized and used to solder and conduct thin films formed on the substrate of the module by using a small solder ball made of a small spherical solder ball on the conductor connected to the bottom part of the semiconductor substrate as a thin film. do.
한편, 솔더볼을 반도체기판[BGA(Ball Grid Array) Sub-Strate]에 접착시키기 위하여 솔더볼 마운트(Solder Ball Mount)장치는 볼이 보관된 볼박스에서 진공으로 볼을 흡착시킬 수 있는 툴을 하부로 이동시켜 반도체기판의 볼공급위치에 해당하는 저면부에 형성된 진공흡착공에 진공으로 솔더볼을 흡착하여서 패키지장치의 상부면에 솔더볼을 대고서 툴에 가하여진 진공을 해제한 후 솔더볼을 패키지장치에 융착하도록 한다.Meanwhile, in order to bond the solder ball to the semiconductor substrate (BGA (Ball Grid Array) Sub-Strate), the solder ball mount device moves a tool that can suck the ball by vacuum in the ball box where the ball is stored. The solder ball is sucked by vacuum to the vacuum suction hole formed in the bottom part corresponding to the ball supply position of the semiconductor substrate, the solder ball is placed on the upper surface of the package device to release the vacuum applied to the tool, and then the solder ball is fused to the package device. do.
도 1은 종래의 패키지장치의 솔더볼을 인쇄회로기판에 납땜한 상태를 보인 도면으로서, 패키지장치(4)의 저면에 납땜으로 고정된 다수의 솔더볼(3)을 인쇄회로기판(1)의 패드부(2)에 열을 가하여 융착시켜 양자를 서로 조립시키게 된다.1 is a view showing a solder ball of a conventional packaging device soldered to a printed circuit board, a plurality of solder balls (3) fixed by soldering to the bottom surface of the package device 4 pad portion of the printed circuit board (1) Heat is applied to (2) to fuse them together to assemble them together.
그런데, 상기한 바와 같이 종래의 인쇄회로기판은 패키지장치(4)의 솔더볼 (3)이 마운트(Mount)되는 인쇄회로기판(1)의 패드부(2)와 인쇄회로기판(1)에 형성된 피씨비홀(5)의 의 높이가 거의 동일하여 인쇄회로기판(1)에 패키지장치(4)가 올라간 경우, 솔더볼(3)의 위치를 육안으로 확인할 수 없을 뿐만아니라 전기적인 테스트를 하여야만 정상적으로 조립된 상태 여부를 판단할수 있으며, 전기적인 페일(Fail)이 발생된 경우 패키지장치를 다시 분리하여 재차 조립하여야 하는 문제점을 지니고 있었다.As described above, the conventional PCB has a PCB formed in the pad portion 2 and the printed circuit board 1 of the printed circuit board 1 on which the solder balls 3 of the package device 4 are mounted. When the package device 4 is raised on the printed circuit board 1 because the heights of the holes 5 are almost the same, the position of the solder balls 3 may not be visually confirmed, and the assembly state is normally performed only by an electrical test. It was possible to determine whether the electrical failure (fail) had a problem of having to re-assemble the packaging device again and again.
본 발명의 목적은 이러한 점을 감아하여 안출한 것으로서, 인쇄회로기판에 일정 깊이 함몰된 함몰패드부를 형성하거나 혹은 기판의 표면을 일정 높이 돌출된 돌출패드부를 형성하여 패키지장치의 저면에 형성된 솔더볼을 납땜함으로써 패키지장치가 인쇄회로기판에 조립된 상태를 용이하고 정확하게 파악하도록 하는 것이 목적이다.An object of the present invention is to wind up this point, to form a recessed pad portion recessed to a predetermined depth on the printed circuit board or to form a protruding pad portion protruding the surface of the substrate to a certain height to solder the solder ball formed on the bottom of the package device It is an object of the present invention to easily and accurately grasp the state in which the package device is assembled to a printed circuit board.
도 1은 종래의 패키지장치의 솔더볼을 인쇄회로기판에 납땜한 상태를 보인 도면이고,1 is a view showing a state in which a solder ball of a conventional package device is soldered to a printed circuit board,
도 2는 본 발명에 따른 일실시예의 패키지장치의 솔더볼을 인쇄회로기판에 납땜한 상태를 보인 도면이며,2 is a view showing a state in which the solder ball of the package device of one embodiment according to the present invention soldered to a printed circuit board,
도 3은 본 고안에 따른 다른 실시예의 패키지장치의 솔더볼을 인쇄회로기판에 납땜한 상태를 보인 도면이며,3 is a view showing a solder ball of a solder ball of a package device of another embodiment according to the present invention to a printed circuit board,
도 4는 본고안에 따른 일실시예의 조립 상태를 상세하게 보인 도면이며,4 is a view showing in detail the assembled state of one embodiment according to the present invention,
도 5는 본고안에 따른 다른 실시예의 조립 상태를 상세하게 보인 도면이다.5 is a view showing in detail the assembled state of another embodiment according to the present invention.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10 : 인쇄회로기판 15 : 피씨비홀10: printed circuit board 15: PCB Hall
20 : 함몰패드부 25 : 돌출패드부20: recessed pad portion 25: protruding pad portion
30 : 솔더볼 40 : 패키지장치30: solder ball 40: package device
이러한 목적은 패키지장치의 저면에 솔더볼을 형성하고, 이 솔더볼을 패키지장치의 패드에 납땜하는 조립구조에서, 상기 솔더볼이 접속되는 인쇄회로기판에 일정 깊이 함몰된 반구홈을 형성하고, 상기 반구홈에 함몰패드부를 라운드형상으로 형성하는 패키지장치의 솔더볼 조립성 향상구조을 제공함으로써 달성된다.This object is to form a solder ball on the bottom surface of the package device, in the assembly structure to solder the solder ball to the pad of the package device, to form a hemisphere groove recessed to a certain depth in the printed circuit board to which the solder ball is connected, It is achieved by providing a solder ball assembling improvement structure of a package device which forms a recessed pad part in a round shape.
그리고, 이러한 목적은 패키지장치의 저면에 솔더볼을 형성하고, 이 솔더볼을 패키지장치의 패드에 납땜하는 조립구조에서, 상기 솔더볼이 접촉되는 인쇄회로기판에 일정 높이 돌출된 돌출패드부를 형성하는 다른 패키지장치의 솔더볼 조립성 향상구조를 제공함으로써 달성된다.Another object of the present invention is to form a solder ball on a bottom surface of a package device, and in another assembly device for soldering the solder ball to a pad of the package device, another package device for forming a protruding pad portion protruding a predetermined height onto a printed circuit board to which the solder ball is in contact. By providing an improved structure of solder ball assembly.
이하, 첨부한 도면을 참조하여 본 발명의 바람직한 일실시예의 구성에 대해 상세하게 설명하도록 한다.Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of a preferred embodiment of the present invention.
도 2는 본 발명에 따른 일실시예의 패키지장치의 솔더볼을 인쇄회로기판에 납땜한 상태를 보인 도면이며, 도 4는 본고안에 따른 일실시예의 조립 상태를 상세하게 보인 도면이다.2 is a view showing a solder ball of a soldering device of a package device according to an embodiment of the present invention on a printed circuit board, Figure 4 is a view showing in detail the assembled state of an embodiment according to the present invention.
본 발명의 일실시예의 구성을 살펴 보면, 패키지장치(40)의 저면에 솔더볼(30)을 형성하고, 이 솔더볼(30)을 패키지장치(40)의 패드에 납땜하는 조립구조에서, 상기 솔더볼(50)이 접속되는 인쇄회로기판(10)에 일정 깊이 함몰된 반구홈(17)을 형성하고, 상기 반구홈(17)에 함몰패드부(20)를 라운드형상으로 형성하여 구성하도록 한다.Looking at the configuration of an embodiment of the present invention, the solder ball 30 is formed on the bottom surface of the package device 40, the solder ball 30 in the assembly structure for soldering to the pad of the package device 40, the solder ball ( A semispherical groove 17 recessed to a certain depth is formed in the printed circuit board 10 to which the 50 is connected, and the recessed pad part 20 is formed in a round shape in the hemisphere groove 17.
이 때, 상기 솔더볼(30)의 곡률은 함몰패드부(20)의 곡률과 동일하게 형성하도록 하여 정확하게 밀착되어 조립되도록 한다.At this time, the curvature of the solder ball 30 is formed to be the same as the curvature of the recessed pad portion 20 so as to be assembled in close contact with each other.
즉, 이 패키지장치(40)의 저면에 형성된 솔더볼(30)이 함몰패드부(20)에 밀착되어 조립된 여부를 눈으로 확인하지 않더라도 자동적으로 솔더볼(30이 함몰패드부(20)에 전기적으로 접속되어진다.That is, even if the solder ball 30 formed on the bottom surface of the package device 40 is not in close contact with the recessed pad part 20 and is not visually checked, the solder ball 30 is electrically connected to the recessed pad part 20. Is connected.
도 3은 본 고안에 따른 다른 실시예의 패키지장치의 솔더볼을 인쇄회로기판에 납땜한 상태를 보인 도면이며, 도 5는 본고안에 따른 다른 실시예의 조립 상태를 상세하게 보인 도면이다.3 is a view showing a solder ball of a solder ball of a package device of another embodiment according to the present invention to a printed circuit board, Figure 5 is a view showing the assembly state of another embodiment according to the present invention in detail.
본 발명의 다른 실시예의 구성을 살펴 보면, 패키지장치(40)의 저면에 솔더볼(30)을 형성하고, 이 솔더볼(30)을 패키지장치(40)의 패드에 납땜하는 조립구조에서, 상기 솔더볼(50)이 접촉되는 인쇄회로기판(10)에 일정 높이 돌출된 돌출패드부(25)를 형성하여 구성한다.Looking at the configuration of another embodiment of the present invention, the solder ball 30 is formed on the bottom surface of the package device 40, the solder ball 30 in the assembly structure for soldering the pad of the package device 40, the solder ball ( 50 is formed by forming a protruding pad portion 25 protruding a predetermined height on the printed circuit board 10 is in contact with.
이 때, 상기 패키지장치(40)가 인쇄회로기판(10)으로 부터 일정한 높이로 돌추되므로 사용자가 눈으로 솔더볼(30)이 돌출패드부(25)에 접속되었는 지 여부를 용이하게 파악하는 것이 가능하다.At this time, since the package device 40 protrudes from the printed circuit board 10 to a certain height, it is possible for the user to easily grasp whether the solder ball 30 is connected to the protruding pad portion 25 by eye. Do.
상기한 바와 같이, 본 발명에 따른 솔더볼 조립성 향상구조를 갖는 패키지장치를 이용하게 되면, 인쇄회로기판에 일정 깊이 함몰된 함몰패드부를 형성하거나 혹은 기판의 표면을 일정 높이 돌출된 돌출패드부를 형성하여 패키지장치의 저면에 형성된 솔더볼을 납땜함으로써 패키지장치가 인쇄회로기판에 조립된 상태를 용이하고 정확하게 파악하여 솔더볼을 패드부에 납땜하는 작업을 진행하므로 조립불량을 방지하여 조립성을 향상시키도록 하는 매우 유용하고 효과적인 발명이다.As described above, when using the package device having a solder ball assembly improvement structure according to the present invention, by forming a recessed pad portion recessed to a predetermined depth in the printed circuit board or by forming a protruding pad portion protruding the surface of the substrate to a certain height By soldering the solder ball formed on the bottom surface of the package device, it is possible to easily and accurately grasp the state in which the package device is assembled on the printed circuit board and solder the solder ball to the pad part. It is a useful and effective invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990023386A KR20010003192A (en) | 1999-06-22 | 1999-06-22 | Structure For Improving The Assembly Of The Package Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990023386A KR20010003192A (en) | 1999-06-22 | 1999-06-22 | Structure For Improving The Assembly Of The Package Device |
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| Publication Number | Publication Date |
|---|---|
| KR20010003192A true KR20010003192A (en) | 2001-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990023386A KR20010003192A (en) | 1999-06-22 | 1999-06-22 | Structure For Improving The Assembly Of The Package Device |
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| KR (1) | KR20010003192A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100499865B1 (en) * | 2002-04-25 | 2005-07-07 | 한국과학기술원 | Electronic package using ultrasonic soldering and its packaging method |
| KR100618901B1 (en) * | 2004-08-14 | 2006-09-01 | 삼성전자주식회사 | Semiconductor package having nonlinear characteristics of impact test and manufacturing method the same |
| KR101118878B1 (en) * | 2010-08-19 | 2012-03-12 | 삼성전기주식회사 | Circuit board and method for manufacturing the circuit board, and semiconductor package with the circuit board and method for manufacturing the semiconductor package |
-
1999
- 1999-06-22 KR KR1019990023386A patent/KR20010003192A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100499865B1 (en) * | 2002-04-25 | 2005-07-07 | 한국과학기술원 | Electronic package using ultrasonic soldering and its packaging method |
| KR100618901B1 (en) * | 2004-08-14 | 2006-09-01 | 삼성전자주식회사 | Semiconductor package having nonlinear characteristics of impact test and manufacturing method the same |
| KR101118878B1 (en) * | 2010-08-19 | 2012-03-12 | 삼성전기주식회사 | Circuit board and method for manufacturing the circuit board, and semiconductor package with the circuit board and method for manufacturing the semiconductor package |
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