KR20000074037A - Prober apparatus for testing of tft-lcd - Google Patents

Abstract

PURPOSE: A probe apparatus is provided to judge the goodness and the badness of a thin film transistor liquid crystal display by exactly detecting a pixel operation signal. CONSTITUTION: A probe apparatus comprises a plurality of thin film probe members each of which has a transfer tip for transferring an operation signal of a pixel. An insulation guide film is located at an upper part of the probe members, and has a plurality of guide holes penetrating the transfer tip. An insulation ceramic pole is received in a fixing hole so as to maintain the fixing of an arrangement position of a probe tip of the probe member. A probe body is located at an upper part of the probe member, and a fixing block is located between the probe body and the probe member so as to fix the probe body to an external assembly. A pair of guide plate fixes the probe members and are coupled with one side and the other side of the probe body, respectively.

Description

Probe device for liquid crystal display inspection {PROBER APPARATUS FOR TESTING OF TFT-LCD}

The present invention relates to a probe device for inspecting a liquid crystal display, and more particularly, a probe device for inspecting a liquid crystal display for inspecting whether a TFT-LCD (hereinafter referred to as TFT-LCD) is effectively operated without errors and having a good lighting state. It is about.

In general, a TFT-LCD is a type of flat panel display, in which a number of thin film transistors (TFTs) and pixel electrodes are arranged to form a lower plate having a predetermined size, and a color filter and a common electrode for displaying colors are sequentially formed. And a top plate spaced apart from each other by a predetermined distance, and a liquid crystal filled in a space between the top plate and the bottom plate. Such a TFT-LCD includes a TFT, which is a switching element, a charging region and an auxiliary charging region formed by a liquid crystal between upper and lower electrodes, a gate driving electrode for driving the TFT on and off, and an external device. The predetermined screen (including the video) is turned on by the video signal electrode or the like to which the video signal is applied.

As shown in FIG. 1, the system for accurately checking the lighting state of the TFT-LCD as described above includes a probe frame 51 having a predetermined shape and a base 52 supporting the probe frame 51 from below. ), A cylinder (53) screwed to one side of the probe frame (51), a slider (54) received and slipped in the cylinder (53), and a trapezoidal head screwed with the slider (54). A portion 55, a head support portion 57 coupled to be elastically retained by the head portion 55 and the spring 56, a bearing 58 coupled below the base 52, and the base ( 52 is disposed below the signal processing PCB section 60 and the signal processing PCB section 60 and the base 52 to process a signal applied from the TFT-LCD into a predetermined signal. It has an insulating acrylic plate 59 for insulation. In addition, a probe unit 61 coupled below the head support 57 to detect a signal from a pixel of the TFT-LCD, and a stepped IC and a step IC housing 62 coupled to be connected to a lower end of the probe unit. ), An upper and lower connection block 63 electrically connecting the step IC to the signal processing PCB 60, and a cover 64 formed on the probe frame 51. .

As shown in FIG. 2, a probe unit of a conventional probe apparatus includes a plurality of probes 65 contacting a pixel surface of the TFT-LCD and sensing a predetermined electrical signal from the pixels, and an arrayed probe 65. It is composed of an epoxy resin 66 for fixing them. The probe is arranged in one-to-one correspondence with countless RGB pixels of the TFT-LCD and includes a length part 67 and a bent part 68, and the length part 67 is the bent part 68. Each length value is different so that predetermined intervals are formed therebetween, and the bent portion 68 includes a contact portion 69 bent toward the pixel on one side of the length portion 67 and the contact portion on the other side. And a transfer section 70 that bends in a direction opposite to that to transfer the signal from the pixel to the step IC. Here, the contact portion 69 has a larger bending angle and a longer length than that of the transfer portion 70. In addition, the attachments located at the ends of the contact portions 69 of the respective probes 65 are spaced apart.

By the way, the probe unit of the probe device as described above is not evenly spaced between the contact portion 69 of the plurality of probes 65 and the degree of bending, so that the pixel signal of the TFT-LCD is not accurately detected, whether the TFT-LCD is turned on or not There is a problem in that it is difficult to clearly determine the fine operating state of the device, and thus it is difficult to determine whether the TFT-LCD is good or bad.

The present invention has been made to solve the above problems, and provides a liquid crystal display inspection probe device capable of reliably determining the good and bad of the TFT-LCD by accurately detecting the pixel operation signal of the TFT-LCD. There is a purpose.

1 is an exploded perspective view of the entire system of a probe apparatus for inspecting a liquid crystal display according to the present invention;

2 is an explanatory view showing a probe unit of a probe device according to the prior art,

3 is an exploded perspective view illustrating a probe device for inspecting a liquid crystal display according to the present invention;

4 is a front view showing a probe member of the probe device according to the present invention,

5 is a front view showing the upper end of FIG.

6 is a front view showing the lower portion of FIG.

FIG. 7 is a perspective view of a plurality of different probe members arranged in FIG. 4;

FIG. 8 is a perspective view illustrating an insulating slit of the upper end of FIG. 7;

9 is a perspective view illustrating an insulating slit of the lower part of FIG. 7;

10 is a front view showing the insulating guide film formed on the lower end of the probe member according to the present invention,

FIG. 11 is a front view illustrating a guide film fixing the insulating guide film of FIG. 10. FIG.

12 and 13 are a front view and a cross-sectional view showing a probe body according to the present invention,

14 is a front view showing a guide plate according to the present invention,

15 is a perspective view showing a fixing block according to the present invention,

16 is a partial cutaway perspective view illustrating the assembled state of FIGS. 4 to 14.

17 is a front view showing a film fixing member according to the present invention,

18 is a front view showing a step IC housing according to the present invention,

19 and 20 is a front view showing the upper and lower connection blocks according to the present invention.

-Explanation of symbols for the main parts of the drawings-

One ; Probe member 2; With probe

3; Transfer attachment 4; Fixing hole

5; Heat dissipation hole 7; Accommodation slot

8 ; Probe unit 9; Insulation Slit

13 guide hole 17; Insulation Guide Film

23; Step IC 31; Insulation Ceramic Rod

33; Probe body 35; Fixed block

37; Rod fixing holes 39; Guide plate

41; Film guide 44; Tep IC Housing

45,46; Connecting block 47; Pinhole

The above object is, according to the present invention, a liquid crystal display inspection probe device for inspecting characteristics of a TFT-LCD panel, comprising: a probe for detecting an operation of each pixel from an RGB pixel of the TFT-LCD panel as an electrical signal; And a plurality of thin film type probe members each having a transfer attachment for transmitting an operation signal of the pixel, and an accommodating slot for accommodating a predetermined region of the upper end portion and the lower end portion of the probe member in order to maintain a predetermined distance between the probe members. A pair of insulating slits arranged in a plurality of directions, an insulating guide film disposed on the probe member and having a plurality of guide holes penetrating from one side to the other side, and the transfer exposed from the guide hole. A signal processing PCB unit for processing the operation signal attached, the insulation guide film and the signal processing PCB unit This is achieved by a probe device for testing a liquid crystal display including a tab IC for transmitting an operation signal of the transfer attached.

In addition, an insulating ceramic rod is accommodated in at least one fixing hole formed in a predetermined section of the thin film type probe member in a lateral direction to fix the arrangement position of the probe tip of the probe member, and is located above the probe member. A probe body in contact with a slit, a fixing block positioned between the probe body and the probe member to secure the probe body to an external system, and screwed to one side and the other side of the probe body to form the insulating ceramic rod It is preferable to further include a pair of guide plates for fixing the probe member, the film guide for fixing in contact with the insulating guide film.

In addition, a step IC housing positioned in the first half of the step IC and interposed with the probe body with the insulating guide film therebetween to support the printed circuit of the step IC, and a second half of the step IC located in the signal processing PCB It is preferable to further include a pair of connecting blocks for coupling the pattern on the printed circuit up and down to make electrical contact with the part.

Hereinafter, a probe device for inspecting a liquid crystal display according to the present invention will be described in detail with reference to the accompanying drawings. Figure 3 is an exploded perspective view showing a probe device for inspecting the liquid crystal display according to the invention, Figure 4 is a front view showing the probe member of the probe device according to the invention, Figure 5 is a front view showing the upper end of Figure 4, Figure 6 4 is a front view showing the lower end of FIG. 4, FIG. 7 is a perspective view of a plurality of different probe members arranged in FIG. 4, FIG. 8 is a perspective view showing an insulating slit of the upper part of FIG. 7, and FIG. 9 is of FIG. 7. 10 is a perspective view showing an insulating slit at the lower end, and FIG. 10 is a front view showing an insulating guide film formed on the lower end of the probe member according to the present invention, and FIG. 11 is a front view showing a guide film fixing the insulating guide film of FIG. 12 and 13 are a front view and a cross-sectional view showing a probe body according to the present invention, Figure 14 is a front view showing a guide plate according to the present invention, Figure 15 according to the present invention A perspective view showing the information block, Figure 16 is a fragmentary perspective view showing an assembled state of FIG. 4 to FIG. Figure 17 is a front view showing a film fixing member according to the present invention, Figure 18 is a front view showing a step IC housing according to the present invention, Figures 19 and 20 is a front view showing the upper and lower connection blocks according to the present invention. .

As shown in FIG. 3, the probe device includes a probe member 1, an insulation slit 9, an insulation guide film 17, a step IC 25, an insulation ceramic rod 31, and a probe. The main body 33, the fixed block 35, the guide plate 39, the film guide 41, the step IC housing 44 and the connecting blocks 45, 46 are provided. Although not shown, a signal processing PCB unit which receives electrical signals of RGB pixels of the TFT-LCD panel transmitted from the step IC 25 by the connection blocks 45 and 46 and processes them into predetermined data processed ( Not shown).

As shown in Figs. 4, 5 and 6, the probe member 1 is for detecting the operation of each pixel from the RGB pixel of the TFT-LCD panel as an electrical signal, and the upper end portion is directly connected to the pixel surface of the panel. The probe attachment part 2 which is in contact is formed, and at the lower end, the transmission attachment part 3 which transmits the operation signal of the said pixel to the said step IC 25 is formed. In each of the adjacent regions of the probe attachment portion 2 and the transmission attachment portion 3, a fixing hole 4 for fixing a plurality of integrated probe members 1 is formed, and the pixel is between the fixing holes 4. At least one heat dissipation hole 5 for dispersing the minute heat generated at the time of contact with is formed. The probe member 1 processes the thin plate having a thickness in the range of 20 to 35 μm by an etching method to form the probe attachment part 2, the transfer attachment part 3, the fixing hole 4, and the heat dissipation hole 5. In order to improve the tensile strength of the probe, heat treatment was performed at a predetermined temperature for a predetermined time, and rhodium plating in a range of 0.5 to 3 µm was deposited to increase the hardness.

As shown in FIG. 7, the probe member 1 arranges the probe attachment 2 or the transfer attachment 3 to correspond to each pixel in order to simultaneously inspect a large number of pixels, that is, the probe attachment 2 ) Is located at a constant separation distance in the longitudinal direction of the probe member 1, the pattern in which at least three or more are sequentially reduced by the separation distance is repeated a plurality of times. The three or more probe members 1 disposed at different positions have different lengths of lengths, and the probes 2 and the transfer attachments 3 have predetermined lengths different from each other corresponding to the lengths. It has a pattern shape. In fact, the separation distance between the probe members 1 has an equal interval of 65 μm (45 to 75 μm), and 300 to 400 probe members 1 are formed in one group. Such a group is called a probe unit 8.

In the upper end region and the lower end region of the probe unit 8 as described above, an upper end portion (probe attachment portion 2) and a lower end portion of the probe member 1 is maintained to maintain a predetermined distance (65 μm) between the probe members 1. (Transfer Attachment 3) Insulated slits 9 in which the accommodating slots 7 arranged to accommodate a predetermined region are arranged in the longitudinal direction by the number of the probe members 1 are unevenly coupled. As shown in FIGS. 8 and 9, the insulating slit 9 has a tearing function for preventing interference between signals detected by each probe member 1, and is located at an upper end of the probe attachment part 2. Prevent warpage.

A plurality of guide holes 13 are formed on the upper side of the transmission attachment 3 at the lower end of the probe unit 8 so as to set the position of the transmission attachment 3 at a distance equal to the separation distance of the probe attachment 2. The insulating guide film 17 is combined. As shown in FIG. 10, the insulation guide film 17 is coupled on the lower end of the probe member 1 and maintains insulation by the guide hole 13. At this time, the film guide 41 as shown in Figure 11 is coupled to the upper portion of the insulating guide film 17, and also connected to the signal processing PCB portion transfers the operation signal of the transfer attachment (3) The step IC 25 is fixed with the step IC 25 interposed therebetween.

A cylindrical insulating ceramic rod 31 having a predetermined length is inserted into the fixing hole 4 of the probe unit 8, and the predetermined arrangement position according to the intrinsic length of each of the probe members 1 is provided. In addition to the fixed holding function, the probe unit 8 is fixed to the probe body 33.

The probe body 33 has a shape as shown in FIGS. 12 and 13, and is spaced apart from an upper side of the intermediate region of the probe unit 8, and particularly in contact with the upper portion of the insulating slit 9. In fact, the probe body 33 may be provided to fix the outer assembly.

That is, a pair of guide plates 39 for accommodating the insulating ceramic rod 31 are coupled to both ends of the insulating ceramic rod 31 inserted into the fixing hole 4 of the probe unit 8. . 14, the rod fixing hole 37 is formed and the insulating ceramic rod 31 is inserted into the rod fixing hole 37. The probe unit 8 is fixed to the side surface of the probe body 33 by using screw holes located at the upper and lower portions of the fixing hole 37. At this time, as shown in Figure 15, the lower portion of the probe body 33, the fixed block 35 for preventing separation separation from the external assembly (not shown) is screwed.

Thus far, as shown in FIG. 16, the probe device transmits a probe attachment part 2 for detecting an operation of each pixel as an electrical signal and an operation signal of the pixel as shown in the RGB pixel of the TFT-ICD panel. A pair of thin film type probe members 1 having a transmission attachment 3 for receiving and fixing a predetermined area of the upper and lower end portions of the probe member 1 at the same time in order to maintain a predetermined distance between the probe members 1. An insulation guide film 17 having an insulating slit 9 and a plurality of guide holes 13 positioned on the probe member 1 and penetrating the transmission attachment 3 from one side to the other side; Insulated ceramic rods accommodated in at least one fixing hole 4 formed in a predetermined section of the thin film type probe member 1 in the lateral direction to fix the arrangement position of the probe tip 2 of the probe member 1. 31 and the probe member (1) A probe body 33 positioned above and in contact with the insulating slit 9 and positioned between the probe body 33 and the probe member 1 to fix the probe body 33 to an external assembly. A pair of guide plates for screwing the fixed block 35 and the side and one side of the probe body 33 and the insulating ceramic rod 31 is received and fixed to the probe member 1 ( 39).

On the other hand, between the insulating guide film 17 and the guide film 41, as shown in Figure 17, in order to fix the insulating guide film 17, the film fixing member 18 is one side of the probe body 33 It is screwed in.

As shown in FIGS. 18 to 20, the first half of the step IC 25 is fastened to the probe body 33 with the insulating guide film 17 interposed therebetween to print the circuit of the step IC 25 (not shown). A step IC housing 44 is provided to support the step C. In the latter half of the step IC 25, a pair of upper and lower sides of the pattern on the printed circuit is brought into electrical contact with the signal processing PCB. Connecting blocks 45 and 46 are provided.

The upper connection block 45 has a pin hole 47 into which a plurality of connection pins (not shown) can be inserted to electrically connect the step IC 25 and the signal processing PCB.

The present invention has the effect of improving the yield of the product because the pixel operation signal of the TFT-LCD is accurately detected without error and the good and bad of the TFT-LCD are reliably determined.

Claims (3)

A liquid crystal display inspection probe apparatus for inspecting characteristics of a TFT-LCD panel; A plurality of thin film type probe members each having a probe attachment for detecting an operation of each pixel as an electrical signal from an RGB pixel of the TFT-LCD panel and a transmission attachment for transmitting an operation signal of the pixel; A pair of insulating slits in which a plurality of receiving slots are arranged in the longitudinal direction to accommodate a predetermined area of the upper end and the lower end of the probe member in order to maintain a predetermined distance between the probe members; An insulation guide film positioned on the probe member and having a plurality of guide holes penetrating from one side to the other side; A signal processing PCB unit for processing the operation signal of the transfer attachment exposed from the guide hole; And a step IC for transmitting the operation signal of the transfer attachment between the insulation guide film and the signal processing PCB. The method of claim 1; An insulating ceramic rod which is accommodated in at least one fixing hole formed in a predetermined section of the thin film type probe member in a lateral direction to fix the arrangement position of the probe attachment portion of the probe member; A probe body positioned above the probe member and in contact with the insulating slit; A fixing block positioned between the probe body and the probe member to fix the probe body to an outer assembly; A pair of guide plates screwed to one side and the other side of the probe body to fix the probe member accommodating the insulating ceramic rod; And a film guide for fixing the insulating guide film in surface contact with the insulating guide film. The method of claim 1; A step IC housing positioned at the first half of the step IC and supporting the printed circuit of the step IC by engaging with the probe body with the insulating guide film therebetween; And a pair of connection blocks positioned at the second half of the step IC and coupling the patterns on the printed circuit up and down in electrical contact with the signal processing PCB.