KR20000069912A - An Agent and a Method for Preventing Epoxy-Bleed-Out - Google Patents

Abstract

It is a technology to establish an epoxy-bleed-out prevention method that does not adversely affect die bonding strength or assembly characteristics, and does not impair discoloration prevention or sealing effect. Carboxylic acids or thiols having three or more carbon atoms in the straight-chain moiety, carboxylic acids or thiols having a benzene ring

(Thiol), a carboxylic acid having a mercapto group or a hydroxyl group, a polyunsaturated alcohol, a nitrogen-containing heterocyclic compound containing sulfur in the molecule, or these Epoxy bleed out agent in the die bonding process of the semiconductor manufacturing process characterized by containing 1 or more types of organic compounds chosen from derivatives.

Description

An Agent and a Method for Preventing Epoxy-Bleed-Out

In the die bonding step of adhesively fixing a semiconductor device such as a lead frame or a printed wiring board and an IC chip with an epoxy resin, the surface roughness of the adhesive surface (usually plating of gold, silver, copper, palladium, etc. is performed). Is too rough, or the surface is contaminated with organic materials such as discoloration inhibitors, sealing agents, and the like, the exudation of resins or additives during epoxy coating Occurs. This epoxy bleed out reduces the die bonding strength or is a cause of failure in a subsequent wire bonding process.

Conventionally, in order to prevent such epoxy bleed out, the surface roughness of an adhesive surface was made small, the capillary phenomenon was suppressed, or the surface was wash | cleaned and the contaminant was removed. However, since the surface roughness of the adhesive surface affects the die bonding strength and the image recognition ability of the assembly machine, the surface roughness cannot be uniformly reduced. In addition, cleaning the surface has a problem because it impairs discoloration preventing treatment and sealing effect.

SUMMARY OF THE INVENTION The present invention establishes an epoxy bleed out prevention method that does not adversely affect die bonding strength or assembly characteristics and does not impair discoloration prevention or sealing effect.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy-bleed-out inhibitor and a prevention method in a die-bonding step of adhesively fixing a semiconductor device such as a lead frame or a printed wiring board and an IC chip with an epoxy resin. It is about.

MEANS TO SOLVE THE PROBLEM As a result of earnest research, this inventor immersed a base material in the solution containing a specific organic compound, and adsorb | sucks an organic film to the surface of a plating surface, We found that we could effectively prevent the bleed out.

The present invention is based on what was found above.

1.carboxylic acids having three or more carbon atoms in the straight-chain moiety, or

Thiol, carboxylic acid or thiol with benzene ring, mercapto

Carboxylic acids, polyunsaturated alcohols, powders having groups or hydroxyl groups

Nitrogen-containing heterocyclic compound containing sulfur in its own, or

It is characterized by containing one or more organic compounds selected from these derivatives.

Epoxy bleed out in die bonding process of semiconductor manufacturing process to assume

Inhibitor

2. Having a carboxylic acid or thiol or benzene ring having 3 or more carbon atoms in the straight chain portion

Carboxylic acids or carboxylic acids with thiols, mercapto groups or hydroxyl groups, polyvalent unsaturated

Alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule, or these

Of semiconductor manufacturing processes containing at least one organic compound selected from derivatives

Wiring base material is immersed in the epoxy bleed out agent in the bonding process

Either underground or spraying this epoxy bleed out agent onto the wiring substrate

Epoxy bleed out prevention method characterized in that

3. Having a carboxylic acid or thiol or benzene ring having 3 or more carbon atoms in the straight chain portion

Carboxylic acids or carboxylic acids with thiols, mercapto groups or hydroxyl groups, polyvalent unsaturated

Alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule, or these

A semiconductor manufacturing process containing at least one organic compound selected from derivatives

The wiring base material is immersed in the epoxy bleed out prevention agent in a die bonding process.

Or by spraying this epoxy bleed

Wiring base material characterized in that the epoxy bleed out prevention treatment

Semiconductor package

4. Having a carboxylic acid or thiol or benzene ring having 3 or more carbon atoms in the straight chain portion

Carboxylic acids or carboxylic acids with thiols, mercapto groups or hydroxyl groups, polyvalent unsaturated

Alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule, or these

At least one organic compound selected from derivatives is adsorbed on the surface

Wiring board and semiconductor package

5. Having a carboxylic acid or thiol or benzene ring having 3 or more carbon atoms in the straight-chain part

Carboxylic acids or carboxylic acids having thiols, mercapto groups or hydroxyl groups, polyvalent

Saturated alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule, or these

Epoxy brid outs consisting of at least one organic compound selected from derivatives

It provides the discoloration prevention liquid or sealing processing liquid containing the rust inhibitor.

It is.

Embodiment of invention

Especially the epoxy bleed out prevention agent of this invention is applicable to semiconductor devices, such as a lead frame and a printed wiring board, but it is not necessarily limited to this, It is not necessarily limited to any of the products with which epoxy bleed out may arise in a die bonding process. Applicable

The following organic compound can be illustrated as an organic compound contained in the epoxy bleed out prevention agent of this invention, and having an epoxy bleed out prevention function.

A: carboxylic acid or thiol having 3 or more carbon atoms in the straight chain portion,

For example, caproic acid (C ₅ H ₁₁ COOH), butyric acid (Butyric acid:

C ₃ H ₇ COOH), enanthic acid (C ₆ H ₁₃ COOH), perargonic acid (Pelargonic acid:

C ₈ H ₁₇ COOH), capuric acid (Capric acid: C ₉ H ₁₉ COOH), undecylic acid:

C ₁₀ H ₂₁ COOH), Lauric acid (C ₁₁ H ₂₃ COOH), Tridecyl acid (Tridecylic acid:

C ₁₂ H ₂₅ COOH), Myristic acid (C ₁₃ H ₂₇ COOH), Pentadecyl acid (Pentadecylic

acid: C ₁₄ H ₂₉ COOH), parmitic acid (Palmitic acid: C ₁₅ H ₃₁ COOH), heptadecyl acid

(Heptadecylic acid: C ₁₆ H ₃₃ COOH), Stearic acid (Stearic acid: C ₁₇ H ₃₅ COOH), Nona

Decanoic acid (C ₁₈ H ₃₇ COOH), behenic acid (C ₂₁ H ₄₃ COOH),

Oleic acid (C ₁₇ H ₃₃ COOH), erucic acid (C ₂₁ H ₄₁ COOH),

Linoleic acid (C ₁₇ H ₃₁ COOH), linolenic acid (C ₁₇ H ₂₉ COOH)

Carboxylic Acid,

Pentanethiol (C ₅ H ₁₁ SH), Octanethiol (C ₈ H ₁₇ SH), Deccanthiol

(Decanethiol: C ₁₀ H ₂₁ SH), Hexadecylmercaptane (C ₁₆ H ₃₃ SH),

Mercapto-propyl methoxy silane: HS (CH ₂ ) ₃ Si (OCH ₃ ) ₃ )

Thiols and the like.

B: carboxylic acid or thiol having a benzene ring,

For example, nitrobenzoic acid (O ₂ NC ₆ H ₄ COOH), benzyl mercaptan

(Benzylmercaptane: C ₆ H ₅ CH ₂ SH) and the like.

C: carboxylic acid having a mercapto group or a hydroxyl group,

For example, mercaptoacetic acid (HSCH ₂ COOH), mucinic acid (Mucic

acid: HOOC (CHOH) ₄ COOH).

D: polyunsaturated alcohol,

For example, putynediol (HOCH ₂ C CH ₂ OH), butenethiol (Butenediol: HOCH ₂ CH =

CHCH ₂ OH) and the like.

E: nitrogen-containing heterocyclic compound containing sulfur in the molecule,

For example, Thiobarbituric acid.

At least one organic compound selected from the above organic compounds or derivatives thereof

Epoxy bleed out preventing agent containing is included in this invention.

The epoxy bleed out agent of the present invention contains 0.1 mg / L of the aforementioned organic compound.

100 g / L, Preferably it contains 10 mg / L-10 g / L.

Epoxy bleed out prevention when the concentration of the organic compound is too low

There is no effect, and even if concentration is too high, more effect can be expected.

It is not desirable because it is not.

Moreover, when the said organic compound is hard to melt | dissolve in water, alcohol, a ketone as needed

Organic solvents, such as (Ketone), are added.

If necessary, 0.1-100 g / L of a pH buffer of boric acid, phosphoric acid, and organic acid,

Preferably 1-50 g / L is added.

Furthermore, if necessary, the surface activity of an anionic, cationic, and nonionic system

Any of the agents or mixtures thereof is 1 μg / L to 10 g / L, preferably

10 μg / L to 1 g / L are added.

The pH of the epoxy bleed out agent solution need not be particularly limited.

The temperature of the epoxy bleed out agent solution is 5 to 80 ° C, preferably 10 to 50 ° C.

do. If the temperature is too low, the epoxy bleed out effect is low,

Even if it is too high, it is not preferable because further effects cannot be expected.

In addition, the epoxy bleed out prevention method is a solution of an epoxy bleed out agent.

Either immersing the wiring board or spraying the epoxy bleed out agent solution on the substrate

After contacting by a method such as (shower, spray, etc.), it may be washed with water and dried.

Moreover, the same effect can also be exhibited by adding the said organic compound which is a main component of an epoxy bleed | out_out_preventive agent to a discoloration inhibitor and a sealing agent.

By performing the epoxy bleed out prevention treatment as described above, the organic compound is adsorbed on the plating surface of the wiring substrate surface, and a film made of an organic compound having a thickness of about 1 to several molecules is formed. Therefore, it becomes possible to increase the contact angle of a plating surface and an epoxy resin, and to suppress the exfoliation of an epoxy resin. Moreover, since the coating of the organic compound to be adsorbed is very thin, it does not adversely affect assembly characteristics such as wire bonding properties and molding properties. Moreover, it does not impair the discoloration prevention effect and the sealing effect.

The wiring base material and semiconductor package which performed the epoxy bleed-out prevention process by the above-mentioned method are also included in this invention.

Hereinafter, although it demonstrates based on an Example, this invention is not limited to these Examples.

(Examples 1 to 15)

Copper alloy (Cu: 97.7%-Sn: 2.0%-Ni: 0.2%-P: 0.03%) After the copper strike plating as a base to improve the adhesion to the lead frame base material, the pad Spot silver plating or a part of the inner lead portion of the pad portion and the inner lead portion were all performed by copper plating, gold plating, or palladium plating on the entire surface of the lead frame.

Then, the epoxy bleed out prevention process of Table 1-Table 3 was performed.

Example No. One 2 3 4 5 Plating film Spot is (銀) Spot silver Spot silver Spot silver Spot silver Discoloration prevention Presence or absence of treatment has exist none has exist has exist none Discoloration prevention liquid composition Benzotriazole: 0.1 g / L - Benzotriazole: 0.1 g / L Benzotriazole: 0.1 g / L - p.H 9.0 - 9.0 9.0 - Bath temperature (℃) 25 - 25 25 - Time (s) 10 - 10 10 - Way Immersion - Immersion Immersion - Sealing none none none none none Epoxy Breed Outer Agent Composition chief ingredient Butyric Acid: 1 g / L Enanthate: 1 g / L Capuric Acid: 1 g / L Lauric acid: 1 g / L Heptadecyl acid: 1 g / L solvent - Methanol: 100 ml / L Methanol: 100 ml / L Isopropyl Alcohol: 100 ml / L Isopropyl Alcohol: 100 ml / L pH buffer Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Surfactants - - - - - Epoxy bleed out protection pH 10.0 10.0 10.0 10.0 10.0 Liquid temperature) 25 25 25 25 25 Time (s) 10 10 10 10 10 Way Immersion shower Immersion Immersion Immersion evaluation Epoxy bleed out ○ ○ ○ ○ ○ Wire bonding (g) 10.5 9.8 11.2 10.6 9.9 Molding (㎏ / ㎠) 15.0 16.2 17.3 15.4 16.3 Discoloration prevention effect ○ × ○ ○ × Sealing effect × × × × ×

Epoxy Breed Outlet Reviews

○: 0 μm, △: 1OOμm, ×: 1OOμm

Evaluation of discoloration prevention effect

○: no discoloration, ×: discoloration

Evaluation of sealing effect

○: no corrosion, ×: corrosion

Example No. 6 7 8 9 10 Plating film Spot silver Spot silver Spot silver Spot silver Spot silver Discoloration prevention Presence or absence of treatment has exist has exist has exist has exist none Discoloration prevention liquid composition Benzotriazole: 0.1 g / L Benzotriazole: 0.1 g / L Benzotriazole: 0.1 g / L Benzotriazole: 0.1 g / L - p.H 9.0 9.0 9.0 9.0 - Bath temperature (℃) 25 25 25 25 - Time (s) 10 10 10 10 - Way Immersion Immersion Immersion Immersion - Sealing Presence or absence of treatment none none none none none Epoxy Breed Outer Agent Composition chief ingredient Oremic acid: 1 g / L Chiovaric acid: 1 g / L Mercaptoacetic acid: 1 g / L Hexadecyl mercaptan: 1 g / L Putinthiol: 1 g / L solvent Isopropyl Alcohol: 100 ml / L - - Methanol: 100 ml / L - pH buffer Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Surfactants Polyoxyethylene nonylphenyl ether: l mg / L - - Polyoxyethylene nonylphenyl ether: l mg / L - Epoxy bleed out protection pH 10.0 10.0 10.0 10.0 10.0 Liquid temperature (℃) 25 25 25 25 25 Time (s) 10 10 10 10 10 Way shower Immersion Immersion shower Immersion evaluation Epoxy bleed out ○ ○ ○ ○ ○ Wire bonding (g) 9.7 11.3 11.5 10.6 10.0 Molding (㎏ / ㎠) 16.0 17.3 17.9 16.2 15.6 Discoloration prevention effect ○ ○ ○ ○ × Sealing effect × × × ○ ×

Epoxy Breed Outlet Reviews

○: Oμm. △: lOOμm. ×: 1OOμm

Evaluation of discoloration prevention effect

(Circle): No discoloration. ×: discoloration

Evaluation of sealing effect

○: no corrosion, ×: corrosion

Example No. 11 12 13 14 15 Plating film copper gold gold Palladium Palladium Discoloration prevention Presence or absence of treatment has exist none none none none Discoloration prevention liquid composition Benzotriazole: 0.1 g / L - - - - p.H 9.0 - - - - Bath temperature (℃) 25 - - - - Time (s) 10 - - - - Way Immersion - - - - Sealing Whether treatment none has exist none none has exist Sealing liquid composition - Triethanolamine: 1.0 g / L - - Triethanolamine: 1.0 g / L pH - 9.0 - - 9.0 Bath temperature (℃) - 25 - - 25 Time (s) - 10 - - 10 Way - Immersion - - Immersion Epoxy Breed Outer Agent Composition Main ingredients Stearic Acid: 1 g / L Linolenic Acid: 1 g / L Mercaptoacetic acid: 1 g / L Undecyl Acid: 1 g / L Decanthiol: 1 g / L solvent Isopropyl Alcohol: 100 ml / L Acetone: 100 ml / L Isopropyl Alcohol: 100 ml / L Isopropyl Alcohol: 100 ml / L Methanol: 100 ml / L pH buffer Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Potassium Pyrophosphate: 5 g / L Surfactants - - Polyoxyethylene nonylphenyl ether: lmg / L - - Epoxy bleed out protection pH 10.0 10.0 10.0 10.0 10.0 Liquid temperature (℃) 25 25 25 25 25 Time (s) 10 10 10 10 10 Way Immersion shower Immersion shower Immersion evaluation Epoxy bleed out ○ ○ ○ ○ ○ Wire bonding (g) 5.2 10.8 11.5 9.6 9.2 Molding (㎏ / ㎠) 18.1 9.5 9.0 8.9 17.3 Discoloration prevention effect ○ ○ ○ ○ ○ Sealing effect × ○ × × ○

Epoxy Breed Outlet Reviews

○: Oμm. △: 100 μm, × lOOμm

Evaluation of discoloration prevention effect

○: no discoloration, ×: discoloration

Evaluation of sealing effect

○: no corrosion, ×: corrosion

In addition, before the epoxy bleed out prevention treatment, a part of samples was subjected to discoloration prevention treatment or sealing.

Discoloration prevention process was performed on condition of the following.

Discoloration preventing solution: 0.l g / L of main ingredient Benzotriazole

pH: 9.0

Bath temperature: 25 ℃

Time: 10 s

Method: dipping

In addition, the sealing process was performed on condition of the following.

Sealing solution: 1.0 g / L of triethanolamine as the main ingredient

pH: 9.0

Bath temperature: 25 ℃

Time: 10 s

Method: dipping

These base materials were subjected to die bonding and wire bonding to evaluate epoxy bleed outs, wire bonding characteristics, and molding characteristics.

Evaluation of the epoxy bridout was performed by the following method.

After applying a commercially available low-stress die-bonding epoxy resin to the plated surface, heat-curing at 200 ° C. for 60 min, and then observing the epoxy coating portion under a microscope (30 times) to determine the amount of epoxy bridout. Measured.

Evaluation of the wire bonding characteristic was performed by the following method.

After wire bonding using an ultrasonic combination thermocompression method (temperature: 200 ° C, load: 50 g, time: 10 mS), pull strength is obtained using a pull tester. Measured.

Evaluation of the molding characteristic was performed by the following method.

A commercial molding epoxy resin was applied to the plated surface, and then cured at 175 ° C. for 5 h, and then shear strength was measured.

Moreover, in the sample which performed the discoloration prevention process or the sealing process, the discoloration prevention effect or the sealing process effect was evaluated.

The evaluation of the discoloration prevention effect is based on the spot plating part and the copper strike plating part in the spot silver plated product, and the plating part in the whole surface plating product. It carried out by the following method.

The plating surface after 10 min immersion in boiling pure water was visually observed.

Evaluation of the sealing processing effect was performed with respect to the plating surface in any of a spot plating goods and a whole surface plating goods by the following method.

The plating surface after immersion of 40 degreeC and 24 h in the following artificial fluids was visually observed.

Artificial Solution

Sodium Chloride: 9.9 g / L

Sodium sulfide: 0.8 g / L

Element: 1.7 g / L

Lactic acid: l.l mL / L

Ammonia Number: 0.27 mL / L

pH: 5

These results are shown together in Tables 1-3.

(Examples 16 to 20)

Copper alloy (Cu: 97.7%-Sn: 2.0%-Ni: 0.2%-P: 0.03%) The lead frame base material was any of silver plating, gold plating, copper plating, or palladium plating.

Discoloration prevention processing or sealing was performed with respect to these wiring base materials. At this time, the epoxy bleed out agent of this invention was added to the discoloration prevention liquid or the sealing process liquid as shown in Table 4.

Example No. 16 17 18 19 20 Plating film copper Spot is gold Palladium copper Discoloration prevention Presence or absence of treatment has exist has exist none none has exist Discoloration prevention liquid composition Benzotriazole: 0.1 g / L Linolenic acid: 1 g / L Isopropyl alcohol: 100 mL / L Benzotriazole: 0.1 g / L Hexadecyl mercaptan: 1 g / L Isopropyl alcohol: 100 mL / L - - Imidazolsilane: 1.0 g / L Lauric acid: 1.0 g / L Isopropyl alcohol: 100 mL / L p.H 9.0 9.0 - - 9.0 Bath temperature (℃) 25 25 - - 25 Time (s) 10 10 - - 10 Way Immersion Immersion - - Immersion Sealing Presence or absence of treatment none none has exist has exist none Sealing liquid composition - - Triethanolamine: 1.0 g / L Butyric acid: 1 g / L Triethanolamine: 1.0 g / L Oremic acid: 1 g / L Isopropyl alcohol: 100 mL / L - pH - - 9.0 9.0 - Bath temperature (℃) - - 25 25 - Time (s) - - 10 10 - Way - - Immersion Immersion - evaluation Epoxy breadboard ○ ○ ○ ○ ○ Wire bonding (g) 5.3 10.1 10.3 8.9 5.7 Molding (㎏ / ㎠) 16.5 15.3 10.1 16.5 15.3 Discoloration prevention effect ○ ○ ○ ○ ○ Sealing effect × ○ ○ ○ ×

Epoxy Breed Outlet Reviews

○: Oμm, △: lOOμm ×: 1OOμm

Evaluation of discoloration prevention effect

○: No discoloration ×: Discoloration

Evaluation of sealing effect

○: no corrosion ×: corrosion

These base materials were subjected to die bonding and wire bonding to evaluate the epoxy bridout, the wire bonding characteristics, the molding characteristics, and the discoloration prevention effect or the sealing treatment effect as in Examples 1 to 15.

These results are shown in Table 4 together.

(Comparative Examples 1 to 5)

The lead frame substrate made of copper alloy (Cu: 97.7%-Sn: 2.0%-Ni: 0.2%-P: 0.03%) was subjected to any of silver plating, gold plating, copper plating, or palladium plating.

In some samples, discoloration prevention processing or sealing was performed.

Discoloration prevention process was performed on condition of the following.

Discoloration preventing solution: 0.1 g / L of main ingredient Benzotriazole

pH: 9.0

Bath temperature: 25 ℃

Time: 10 s

Method: Immersion

In addition, the sealing process was performed on condition of the following.

Sealant Treatment Solution: Triethanolamine (1.0 g / L)

pH: 9.0

Bath temperature: 25 ℃

Time: 10 s

Method: dipping

These base materials were subjected to die bonding and wire bonding, and evaluation of the epoxy bridout, the wire bonding characteristics, the molding characteristics, and the discoloration prevention effect or the sealing treatment effect was performed as in the examples.

These results are shown together in Table 5.

Comparative Example No. One 2 3 4 5 Plating film Spot is Spot is gold gold Palladium Discoloration prevention Presence or absence of treatment none has exist none none none Discoloration prevention liquid composition - Benzotriazole: 0.1 g / L - - - p.H - 9.0 - - - Bath temperature (℃) - 25 - - - Time (s) - 10 - - - Way - Immersion - - - Sealing Presence or absence of treatment none none none has exist none Sealing liquid composition - - - Trienolamine: 1.0 g / L - pH - - - 9.0 - Bath temperature (℃) - - - 25 - Time (s) - - - 10 - Way - - - Immersion - evaluation Epoxy Breed Out △ × △ × × Wire bonding (g) 11.2 10.8 10.3 11.8 9.6 Molding (㎏ / ㎠) 15.3 16.2 9.5 8.7 16.5 Discoloration prevention effect × ○ ○ ○ ○ Sealing effect × × × ○ ×

Epoxy Breed Outlet Reviews

○: Oμm, △: 100 μm, × 1OOμm

Evaluation of discoloration prevention effect

○: no discoloration, ×: discoloration

Evaluation of sealing effect

○: no corrosion, ×: corrosion

result

In the wiring base material (Examples 1-15) which performed the epoxy bleed out prevention process using the epoxy bleed out prevention agent of this invention, the occurrence of the epoxy bleed out was not seen in the die bonding process. In addition, when the epoxy bleed out prevention agent of this invention was added to the discoloration prevention liquid or the sealing process liquid (Examples 16-20), the generation of the epoxy bleed out was not seen in a die bonding process similarly. In any case of the examples, the wire bonding properties and the molding properties were good. The base material which performed the discoloration prevention effect or the sealing effect had the discoloration prevention effect and the sealing effect as expected.

On the other hand, in the case where the epoxy bleed out prevention treatment was not performed (Comparative Examples 1 to 5), the occurrence of the epoxy bleed out in the die bonding step was observed.

Effects of the Invention

The epoxy bleed out prevention treatment which adsorbs the organic compound which has an epoxy bleed out prevention function to the surface of semiconductor devices, such as a lead frame and a printed wiring board, is carried out using the epoxy bleed out prevention agent of this invention, and a discoloration prevention effect and a sealing effect are performed. It is possible to prevent the epoxy bleed out in the die bonding process without damage. Moreover, it does not adversely affect assembly characteristics, such as a wire bonding characteristic and molding property.

Claims (5)

Carboxylic acids or thiols having three or more carbon atoms in the straight-chain moiety, carboxylic acids having a benzene ring or thiols, carboxylic acids having a mercapto group or a hydroxyl group And at least one organic compound selected from polyunsaturated alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule, or derivatives thereof. Epoxy-bleed-out inhibitor in the die bonding process of this. Carboxylic acids or thiols having 3 or more carbon atoms in the straight chain portion, carboxylic acids or thiols having a benzene ring, carboxylic acids having a mercapto group or hydroxyl groups, polyunsaturated alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule Or the wiring base material is immersed in the epoxy bleedout preventing agent in the die bonding step of the semiconductor manufacturing process containing at least one organic compound selected from these derivatives, or the epoxy base material is sprayed on the wiring base material. Epoxy bleed out prevention method characterized in that. Carboxylic acids or thiols having 3 or more carbon atoms in the straight chain portion, carboxylic acids or thiols having a benzene ring, carboxylic acids having a mercapto group or hydroxyl groups, polyunsaturated alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule Epoxy bleed by dipping the wiring substrate into the epoxy bleed out preventive agent in the die bonding step of the semiconductor manufacturing process containing one or more organic compounds selected from these derivatives or by spraying the epoxy bridging inhibitor onto the wiring substrate. A wiring substrate and a semiconductor package, characterized by performing an out prevention treatment. Carboxylic acids or thiols having three or more carbon atoms in the straight chain portion, carboxylic acids or thiols having a benzene ring, carboxylic acids having a mercapto group or hydroxyl groups, polyunsaturated alcohols, nitrogen-containing heterocyclic rings containing sulfur in the molecule At least one organic compound selected from the compound or derivatives thereof is adsorbed on the surface of the wiring substrate and the semiconductor package. Carboxylic acids or thiols having 3 or more carbon atoms in the straight chain portion, carboxylic acids or thiols having a benzene ring, carboxylic acids having a mercapto group or hydroxyl groups, polyunsaturated alcohols, nitrogen-containing heterocyclic compounds containing sulfur in the molecule A discoloration preventing liquid or a sealing liquid comprising an epoxy bleed-out preventive agent composed of one or more organic compounds selected from derivatives thereof.