KR20000058878A - Semiconductor Chip Tester - Google Patents

Abstract

PURPOSE: An apparatus for testing a semiconductor chip is to allow a BGA(ball grid array) semiconductor device to be tested at a PC(personal computer) condition using an existing module PCB(printed circuit board). CONSTITUTION: An apparatus for testing a semiconductor chip comprises a housing(200) formed with a chip receiving groove(210) in which a BGA semiconductor chip is mounted, a module PCB(100) to which the housing is coupled, a contactor(220) provided in the chip receiving groove to be electrically connected with a pad(120) of the module PCB, and an upper cover(300) coupled to an upper portion of the housing to prevent a separating of the BGA semiconductor chip from the chip receiving groove. In the apparatus, a guide pin(330) is provided at a lower portion of the upper cover to facilely couple the upper cover to the housing. A guide groove(250) is formed at an upper portion of the housing. The module PCB, the housing and the upper cover are removably couple to each other.

Description

Semiconductor Chip Tester {Semiconductor Chip Tester}

The present invention relates to a semiconductor chip test apparatus, and more particularly, to a semiconductor chip test apparatus for testing a plurality of ball grid array (BGA) type semiconductor devices in a PC environment using a module PCB socket.

In general, in order to check the characteristics and reliability of the internal circuit after the semiconductor device assembly process, the assembled semiconductor device is inserted into a socket and then tested using expensive specialized equipment.

However, the above-mentioned specialized semiconductor device test apparatus has various problems, for example, because the separate specialized semiconductor device test apparatus is very expensive, the cost of testing one semiconductor device becomes high. In addition to lowering the price competitiveness, environmental characteristics such as noise generated in a computer main board, which is an environment in which the semiconductor element is actually used, are tested because the semiconductor element is not actually installed and used in a completely separate device. Because of the lack of proper implementation of the test, the accuracy of the test is inferior, causing a quality problem.

Due to these problems, semiconductor device manufacturers tend to prefer a test method using a main board of a computer that actually uses a semiconductor device. As such, a method using a computer main board may attach a module or a semiconductor unit to a main board. In order to be able to install it, it is possible to determine whether a semiconductor device is normal or defective by inserting a module or unit device to be tested and operating a PC in the socket after attaching the socket.

However, in this case, in order to test the BGA type semiconductor device, a separate module PCB should be designed, and accordingly, there is a problem in that a cost for a separate PCB design is required.

Accordingly, an object of the present invention is to provide a semiconductor chip test apparatus capable of testing a BGA type semiconductor device in a PC environment by using an existing module PCB as it is.

1 is an exploded perspective view of a semiconductor chip test apparatus of the present invention.

2 is a perspective view of the combination of FIG.

3 is a cross-sectional view of the cutting state along the plane 'A' of FIG. 2.

4 shows a state in which the invention is mounted in a socket for testing.

<Explanation of symbols for main parts of drawing>

100: module PCB 110: terminal

120: pad 130: bonding hole

200: housing 210: chip seating groove

220: contactor 230,240: coupling hole

231 screw 250: guide groove

260 semiconductor chip 261 solder ball

270: contact hole 271: locking jaw

300: top cover 310: bonding holes

311: screw 320: pressure protrusion

330: guide pin 400: socket

In the semiconductor chip test apparatus according to the present invention for achieving the above object, in the semiconductor chip test apparatus for inserting a module PCB into the socket of the main board of the PC to test the semiconductor element in a PC environment,

A housing having at least one chip seating groove on which a BGA type semiconductor chip is seated is coupled to the module PCB, and a contactor is provided at the chip seating groove to electrically contact the pad of the module PCB. It is characterized in that the top plate cover is configured to be coupled so as not to be separated from the chip mounting groove BGA type semiconductor chip.

Guide pins are provided at a lower portion of the upper plate cover and a guide groove is provided at the upper portion of the housing to facilitate coupling of the upper plate cover and the housing.

The present invention configured as described above will be described in detail with reference to the accompanying drawings.

First, Figure 1 is an exploded perspective view of the present invention, the module PCB 100 shows a general module PCB, the module PCB 100 is provided with a terminal 110 for insertion into the socket of the main board of the PC In addition, a pad 120 for providing a test signal provided through the terminal 110 to the BGA type semiconductor chip 260 is provided.

A housing 200 having a plurality of chip seating grooves for mounting the BGA type semiconductor chip 260 to be tested is placed on the module PCB 100, wherein the module PCB 100 and the housing 200 are coupled to each other. It is coupled so as not to be separated from each other through, for example, the screw 231 is fitted into the coupling holes 130 and 230 formed on both sides of the module PCB 100 and the housing 200 can be fixed.

Of course, such a coupling means may use other coupling means without screwing.

The bottom surface of the chip seating groove 210 is in contact with the terminal of the BGA type semiconductor chip 260 under test to apply a test signal applied from the pad 120 of the PCB module 100 to the BGA type semiconductor chip 260. A contactor 220 is provided for providing.

The contactor 220 may be provided to correspond to the terminal of the BGA type semiconductor chip 260 1: 1.

When the BGA type semiconductor chip 260 to be tested is seated in the chip seating groove 210 of the housing 200, the BGA type semiconductor chip 260 is stably contacted with the contactor 220 and the chip is seated. The top cover 300 is coupled to the coupling means such as the screw 311 on the upper portion of the housing 200 so as not to be separated from the groove 210.

That is, the screws 311 may be inserted into and coupled to the coupling holes 240 and 310 formed at both sides of the housing 200 and the upper plate cover 300.

FIG. 2 is a perspective view illustrating a state in which the module PCB 100, the housing 200, and the top plate cover 300 described in FIG. 1 are coupled so as not to be separated from each other by a coupling means.

That is, the housing 200 is coupled to the upper portion of the module PCB 100, the top plate cover 300 is coupled to the upper portion of the housing 200, the BGA-type semiconductor chip 260 seated inside the housing 200 It has a structure that does not escape to the outside.

3 is a cross-sectional view taken along a plane of 'A' in a state in which the module PCB 100, the housing 200, and the top cover 300 are coupled as shown in FIG. It is also.

Its combined structure is described in more detail.

The housing 200 is positioned above the module PCB 100, and a contact hole 270 is formed at the bottom of the chip seating groove 210 of the housing 200. The terminal 261 of the BGA type semiconductor chip 260 is provided. That is, the contact hole is formed with a number corresponding to the number of solder balls, and the contactor insertion hole 270 is provided with a contactor 220.

At this time, the contactor 220 is preferably composed of a pogo pin (POGO) pin or a contactor pin, the locking jaw 271 in the upper portion of the contact insertion hole 270 to prevent the contact of the contact 220 Is formed.

Therefore, when the module PCB 100 and the housing 200 are coupled by the screw 231, the contactor 220 is contacted with the pad 120 of the module PCB 100 with elastic force without being separated outward. Will be.

The BGA type semiconductor chip 260 is seated in the chip seating groove 210, and the upper plate cover is coupled to an upper portion thereof. A pressing protrusion 220 is formed below the upper plate cover 300 to form a BGA type semiconductor chip ( 260 is pressed from above to increase the coupling force between the terminal 261 and the contactor 220.

In addition, the guide pin 330 formed in the lower portion of the upper cover 300 is fitted into the guide groove 250 formed in the housing 200 to facilitate easy and stable coupling at the time of coupling.

The top cover 300 and the housing 200 is coupled by a coupling means, that is, the screw 311 is prevented from the separation of the top cover 300 is consequently the BGA type semiconductor chip 260 itself contactor 220 It is to prevent deviation from.

After the test of the BGA-type semiconductor chip 260 is finished, only the top plate cover 300 is removed, and then a new BGA type semiconductor chip is seated on the chip seating groove 210 again to combine the top plate cover 300 to perform a new test. Will continue.

4 is a socket of a main board of a PC in a state in which a BGA type semiconductor chip is mounted on the upper and / or lower portions of the module PCB 100 by the housings 200 and 200 'and the upper plate covers 300 and 300' as described above. Shows the module PCB 100 is inserted into the 400.

This maximizes the test environment area of the BGA type semiconductor chip in one module PCB.

As described above, the semiconductor chip test apparatus of the present invention can reduce the cost in the test environment by testing the BGA type semiconductor chip using the existing module PCB as it is, and also in the case of the BGA type semiconductor chip, the PC environment. It has the effect of being able to test under

Claims (5)

In the semiconductor chip test apparatus for inserting a module PCB into the socket of the main board of the PC to test the semiconductor device in a PC environment, A housing having at least one chip seating groove on which a BGA type semiconductor chip is seated is coupled to the module PCB, and a contactor is provided at the chip seating groove to electrically contact the pad of the module PCB. A semiconductor chip test apparatus, characterized in that the top plate cover is coupled to prevent the BGA type semiconductor chip from being separated from the chip seating groove. The semiconductor chip test apparatus of claim 1, wherein a guide pin is provided at a lower portion of the upper cover and an upper portion of the housing is provided to facilitate coupling of the upper cover and the housing. The semiconductor chip test apparatus of claim 1, wherein the module PCB, the housing, and the upper plate covering are detachably coupled to each other by a coupling means. The apparatus of claim 1, wherein the contactor is one of a pogo pin and a contact pin. The semiconductor chip test apparatus of claim 1, wherein a housing and an upper plate cover are respectively provided on an upper portion and / or a lower portion of the module PCB.