KR20000044970A - Apparatus for deforming lead frame - Google Patents

Apparatus for deforming lead frame Download PDF

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Publication number
KR20000044970A
KR20000044970A KR1019980061477A KR19980061477A KR20000044970A KR 20000044970 A KR20000044970 A KR 20000044970A KR 1019980061477 A KR1019980061477 A KR 1019980061477A KR 19980061477 A KR19980061477 A KR 19980061477A KR 20000044970 A KR20000044970 A KR 20000044970A
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South Korea
Prior art keywords
lead frame
deformation
plastic deformation
die
pressing member
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KR1019980061477A
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Korean (ko)
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김감곤
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이채우
엘지마이크론 주식회사
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Priority to KR1019980061477A priority Critical patent/KR20000044970A/en
Publication of KR20000044970A publication Critical patent/KR20000044970A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: An apparatus for a plastic-deformation of a lead frame is provided to improve the deforming work of the lead frame and to increase the productivity of articles by preventing the spring back when the plastic-deformation of the lead frame is carried out. CONSTITUTION: A lead frame deforming apparatus has a press member(50) which presses the lead frame by a punch to deform the lead frame in a desired shape. The lead frame is rested on a support member(60) having a die plate(64). Both ends of the die plate(64) of the support member(60) are rounded and the surface of the die plate(64) are surface-treated to a predetermined shape. A concave recess(61) is formed on the surface of a female deforming section(62) of the support member(60) so a down-set work of the lead frame is effectively carried out.

Description

리드프레임 소성변형 장치Leadframe Plastic Deformation Device

본 발명은 리드프레임(Lead Frame) 소성변형 장치에 관한 것으로, 특히 소성변형(Plastic Deformation)시 스프링백(Spring Back)에 의해 인어리드(Inner Lead)가 일어나는 현상을 방지하기 위한 리드프레임 소성변형 장치에 관한 것이다.The present invention relates to a lead frame plastic deformation apparatus, and in particular, a lead frame plastic deformation apparatus for preventing a phenomenon in which an inner lead occurs due to spring back during plastic deformation. It is about.

일반적으로, 리드 프레임(LEAD FRAME)은 아이시(IC)의 기능을 외부회로 단자로 연결하는 리드(LEAD) 역할과 칩(CHIP)을 탑제하고 지지(FRAME)해 주는 역할을 하는 틀 형태의 구조물로서 반도체 실장용 부품을 말한다.In general, the lead frame (LEAD FRAME) is a frame-shaped structure that serves as the lead (LEAD) connecting the function of the IC (IC) to the external circuit terminal and the chip (CHIP) to mount and support (FRAME) It refers to the component for semiconductor mounting.

도 1은 일반적인 리드 프레임의 구성도로서, 리드 프레임은 인어리드(Inner Lead)(30), 댐바(Damber)(40), 아우트리드(Outer Lead)(32), 버스바(Bus Bar)(16), 더미 리드(Dumy Lead)(18), 사이드레일(Side Rail)(10)로 구성된다.FIG. 1 is a block diagram of a general lead frame, in which a lead frame includes an inner lead 30, a dam bar 40, an outer lead 32, and a bus bar 16. ), A dummy lead 18, and a side rail 10.

상기 리드 프레임을 제조하기 위해서는 정면, 노광, 현상, 에칭, 도금, (다운셋), 테핑(Taping) 등의 작업을 거치게 된다. 이때 다운셋(Downset) 작업은 상기 인어리드(Inner Lead)(30)를 일정량 만큼 디프레스(Depress) 시켜주는 것을 말한다.In order to manufacture the lead frame, operations such as front side, exposure, development, etching, plating, (downset), and taping are performed. In this case, the downset operation refers to depressing the inner lead 30 by a predetermined amount.

상기 인어리드(Inner Lead)(10)를 일정량 만큼 디프레스(Depress) 시켜주는 다운셋(Downset) 작업을 하기 위해서는 리드 프레임 소성 변형장치가 필요하다.A lead frame plastic deformation apparatus is required to perform a downset operation of depressing the inner lead 10 by a predetermined amount.

도 2a 종래의 리드프레임 소성변형 장치의 다운셋 작업 전을 나타내는 단면도이고, 도 2b는 종래의 리드프레임 소성변형 장치의 다운셋 작업 후를 나타내는 단면도이다.FIG. 2A is a cross-sectional view of a conventional leadframe plastic deformation apparatus before downset operation, and FIG. 2B is a cross-sectional view of a conventional leadframe plastic deformation apparatus after downset operation.

상기 도면에서, 프레스기(도시하지 않음)에 장착된 누름부재(50)는 그 형상이 리드프레임(100)의 변형 형상과 동일한 숫변형부(또는 '펀치'라고도 함)(52)를 이루며, 상기 누름부재(50)의 숫변형부(52)와 맞물리는 암변형부(또는 '다이(Die)(62)를 갖는 받침다이(60)로 이루어진다.In the figure, the pressing member 50 mounted on the press machine (not shown) forms a male deformation portion (or also referred to as a punch) 52 whose shape is the same as the deformation shape of the lead frame 100. It consists of a support die 60 having a female deformation portion (or 'die' 62) that engages with the male deformation portion 52 of the pressing member 50.

상기 누름부재(50)에 형성된 베이스(54)는 그 하부에 돌출형성된 숫변형부(52)를 구비한 펀치플레이트(56)가 형성되어 있으며, 상기 누름부재(50)와 맞물리는 받침다이(60)는 상기 리드프레임(100)을 올려놓을 수 있도록 형성된 다이플레이트(64)가 베이스(66) 상부에 형성되어 있다.The base 54 formed on the pressing member 50 has a punch plate 56 having a male deformation portion 52 protruding from the bottom thereof, and a support die 60 engaged with the pressing member 50. ) Is formed on the base 66 is a die plate 64 formed to place the lead frame 100.

또한, 상기 숫변형부(52)가 하부로 가압력을 발휘할 경우 이를 받아들이는 암변형부(62)가 상기 다이플레이트(64)의 중심부에 형성되어 있으며, 상기 다이플레이트(64)의 하부에는 베이스(66)가 이루어져 있다.In addition, when the male deformation portion 52 exerts a pressing force to the lower portion, a female deformation portion 62 is formed in the center of the die plate 64, and a base () is disposed below the die plate 64. 66).

여기에서 상기 누름부재(50) 및 받침다이(60)는 각각 일체 성형되어 상기 리드프레임(100)을 원하는 형상으로 변형시킬 수 있도록 구성된다.Here, the pressing member 50 and the support die 60 are each integrally formed so as to deform the lead frame 100 into a desired shape.

상기 구성으로 이루어진 종래 기술에 따른 리드프레임 소성변형 장치의 동작을 설명하면 다음과 같다.Referring to the operation of the lead frame plastic deformation apparatus according to the prior art made of the configuration as follows.

도 2a에 도시된 바와 같이 암변형부(62)를 갖는 받침다이(60)상에 소성변형시킬 리드프레임(100)을 올려놓은 후 도 2b에 도시된 바와 같이 통상의 프레스기에 장착된 누름부재(50)를 가압하여 숫변형부(52)가 상기 받침다이(60)의 암변형부(62)에 맞물릴 수 있도록 한다.As shown in FIG. 2A, the lead frame 100 to be plastically deformed is placed on the support die 60 having the female deformation part 62, and as shown in FIG. 50 is pressed to allow the male deformation portion 52 to engage the female deformation portion 62 of the support die 60.

이때, 상기 받침다이(60)와 누름부재(50) 사이에 놓여져 있는 리드프레임(100)은 상기 숫변형부(52)와 암변형부(62)의 형상에 따라 소성 변형되어 원하는 제품을 얻을 수 있다.At this time, the lead frame 100 placed between the support die 60 and the pressing member 50 may be plastically deformed according to the shape of the male deformation portion 52 and the female deformation portion 62 to obtain a desired product. have.

그런데, 이와 같이 구성된 종래의 리드프레임 소성변형 장치에 있어서는, 리드프레임의 소성변형 작업 시 스프링백(Spring Back)에 의하여 인어리드의 끝단부가 일어나기 때문에 리드프레임의 소성변형 작업이 불편할 뿐만 아니라 생산성이 현저히 떨어지는 문제점이 있었다.By the way, in the conventional leadframe plastic deformation apparatus configured as described above, since the end of the inlead occurs by spring back during plastic deformation of the leadframe, the plastic deformation of the leadframe is not only inconvenient but also the productivity is remarkably increased. There was a problem falling.

이에, 본 발명은 상기 문제점을 해결하기 위하여 발명된 것으로, 그 목적으로 하는 바는 소성 변형시 스프링백에 의해 인어리드가 일어나는 현상을 방지하여 생상선을 향상시킨 리드프레임 소성변형 장치를 제공함에 있다.Accordingly, the present invention was invented to solve the above problems, and an object thereof is to provide a lead frame plastic deformation apparatus which improves the live line by preventing the occurrence of inlead by spring back during plastic deformation. .

도 1은 일반적인 리드프레임을 나타내는 평면도1 is a plan view showing a typical lead frame

도 2a 종래의 리드프레임 소성변형 장치의 다운셋 작업 전을 나타내는 단면도Figure 2a is a cross-sectional view before the downset operation of the conventional leadframe plastic deformation apparatus

도 2b는 종래의 리드프레임 소성변형 장치의 다운셋 작업 후를 나타내는 단면도Figure 2b is a cross-sectional view showing after the downset operation of the conventional lead frame plastic deformation apparatus

도 3a는 본 발명의 리드프레임 소성변형 장치의 다운셋 작업 전을 타나내는 단면도Figure 3a is a cross-sectional view showing before the downset operation of the lead frame plastic deformation apparatus of the present invention

도 3b는 본 발명의 리드프레임 소성변형 장치의 다운셋 작업 후를 나타내는 일부확대 단면도Figure 3b is a partially enlarged cross-sectional view showing after the downset operation of the lead frame plastic deformation apparatus of the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 사이드레일 16 : 버스바10: side rail 16: bus bar

18 : 더미리드 20 : 타이바18: dummy lead 20: tie bar

30 : 인어리드 32 : 아웃리드30: Inlead 32: Outlead

40 : 댐바 50 : 누름부재40: dam bar 50: pressing member

52 : 숫변형부 54,66 : 베이스52: male deformation part 54,66: base

56 : 펀치플레이트 60 : 받침다이56: punch plate 60: support die

61 : 오목홈부 62 : 암변형부61: concave groove portion 62: female deformation portion

64 : 다이플레이트64: die plate

상기 목적을 달성하기 위한 본 발명에 따른 리드프레임 소성변형 장치는,Lead frame plastic deformation apparatus according to the present invention for achieving the above object,

적어도, 리드프레임을 펀치로 압착하여 원하는 형상으로 변형시키는 누름부재와, 상기 리드프레임을 올려놓는 곳으로 상기 누름부재의 펀치가 압착되었을 때 맞물리도록 형성된 다이를 구비한 받침부재를 포함하는 리드프레임 소성변형 장치에 있어서,At least a lead frame plasticizer comprising a pressing member for pressing the lead frame into a punch to deform it into a desired shape, and a supporting member having a die formed to engage when the punch of the pressing member is pressed into a place where the lead frame is placed. In the deforming device,

상기 받침부재의 다이의 양단에 일정 비율의 라운딩과 일정 형상의 표면가공을 한 것을 특징으로 한다.Both ends of the die of the support member is characterized in that a certain ratio of rounding and surface processing of a predetermined shape.

이하, 본 발명에 따른 리드프레임 소성변형 장치에 대하여 첨부된 도면을 참조하여 설명하면 다음과 같다. 설명의 간략화를 위하여 종래 설명과 같은 부품에 대해서는 동일부호를 사용하여 설명상의 번잡함을 피하고자 한다.Hereinafter, the lead frame plastic deformation apparatus according to the present invention will be described with reference to the accompanying drawings. For the sake of simplicity, the same reference numerals are used for the same parts as the conventional description to avoid descriptive clutter.

도 3a는 본 발명의 리드프레임 소성변형 장치의 다운셋 작업 전을 타나내는 단면도, 도 3b는 본 발명의 리드프레임 소성변형 장치의 다운셋 작업 후를 나타내는 일부확대 단면도이다.Figure 3a is a cross-sectional view showing before the downset operation of the leadframe plastic deformation apparatus of the present invention, Figure 3b is a partially enlarged cross-sectional view showing after the downset operation of the leadframe plastic deformation apparatus of the present invention.

상기 도면에서, 프레스기에 장착된 누름부재(50)는 그 형상이 리드프레임(100)의 변형 형상과 동일한 숫변형부(또는 '펀치'라고도 함)(52)를 이루며, 상기 누름부재(50)의 숫변형부(52)와 맞물리는 암변형부(또는 '다이'라고도 함)(62)를 갖는 받침다이(60)로 이루어진다.In the drawing, the pressing member 50 mounted on the press machine forms a male deformation portion (or 'punch') 52 whose shape is the same as the deformation shape of the lead frame 100, and the pressing member 50 It consists of a support die 60 having a female deformation portion (or also referred to as a 'die') 62 engaged with the male deformation portion 52 of.

상기 누름부재(50)에 형성된 베이스(54)는 그 하부에 돌출형성된 숫변형부(52)를 구비한 펀치플레이트(56)가 형성되어 있으며, 상기 누름부재(50)와 맞물리는 받침다이(60)는 상기 리드프레임(100)을 올려놓을 수 있도록 형성된 다이플레이트(64)가 상부에 형성되어 있다. 또한 상기 숫변형부(52)가 하부로 가압력을 발휘할 경우 이를 받아들이는 암변형부(62)가 상기 다이플레이트(64)의 중심부에 형성되어 있으며, 상기 다이플레이트(64)의 하부에는 베이스(66)가 이루어져 있다.The base 54 formed on the pressing member 50 has a punch plate 56 having a male deformation portion 52 protruding from the bottom thereof, and a support die 60 engaged with the pressing member 50. ) Has a die plate 64 formed thereon so as to place the lead frame 100 thereon. In addition, when the male deformation portion 52 exerts a pressing force downward, a female deformation portion 62 is formed at the center of the die plate 64, and a base 66 is disposed below the die plate 64. )

여기에서 상기 누름부재(50) 및 받침다이(60)는 각각 일체 성형되어 상기 리드프레임(100)을 원하는 형상으로 변형시킬 수 있도록 구성된다.Here, the pressing member 50 and the support die 60 are each integrally formed so as to deform the lead frame 100 into a desired shape.

이때, 상기 암변형부(62)의 윗쪽에 있는 양쪽 모서리 부분에는 일정 형상으로 라운딩되어 있으며, 아래쪽의 양단부에는 상기 인어리드(30)이 안전하게 절곡될 수 있는 역할을 하는 오목홈부(61)가 각각 형성되어 있다.At this time, both corners of the upper portion of the female deformation portion 62 is rounded in a predetermined shape, and both recesses at the bottom thereof have concave grooves 61 which serve to bend the inlead 30 safely. Formed.

상기 구성으로 이루어진 종래 기술에 따른 리드프레임 소성변형 장치의 동작을 설명하면 다음과 같다.Referring to the operation of the lead frame plastic deformation apparatus according to the prior art made of the configuration as follows.

도 3a에 도시된 바와 같이 암변형부를 갖는 받침다이(60) 상에 소성변형시킬 리드프레임(100)을 올려놓은 후, 도 3b에 도시된 바와 같이 통상의 프레스기에 장착된 누름부재(50)를 가압하면 상기 숫변형부(52)가 상기 받침다이(60)의 암변형부(62)에 맞물릴 수 있게 된다. 이때, 상기 누름부재(50) 및 받침다이(60)는 각각 일체 성형되어 상기 리드프레임(100)을 원하는 형상으로 변형시킬 수 있다.After placing the lead frame 100 to be plastically deformed on the support die 60 having the female deformation portion as shown in FIG. 3A, the pressing member 50 mounted to the conventional press machine is shown in FIG. 3B. When pressurized, the male deformation portion 52 may be engaged with the female deformation portion 62 of the support die 60. In this case, the pressing member 50 and the support die 60 may be integrally molded to deform the lead frame 100 into a desired shape.

이상에서 설명한 바와 같이, 본 발명에 의한 리드프레임 소성변형 장치에 의하면, 받침다이에 형성된 암변형부의 표면에 오목홈부를 형성하고, 또한 상부의 각진 모서리 부분을 라운딩처리함으로써 리드프레임의 다운셋 작업 시 인어리드가 일어나지 않는 유용한 효과가 있다.As described above, according to the lead frame plastic deformation apparatus according to the present invention, a recessed groove portion is formed on the surface of the female deformation portion formed on the support die, and the rounded corner portion of the upper portion is rounded down for the downset operation of the lead frame. There is a useful effect that inleads do not occur.

아울러 본 발명의 바람직한 실시예들은 예시의 목적을 위해 개시된 것이며, 당업자라면 본 발명의 사상과 범위 안에서 다양한 수정, 변경, 부가등이 가능할 것이며, 이러한 수정 변경등은 이하의 특허청구범위에 속하는 것으로 보아야 할 것이다.In addition, preferred embodiments of the present invention are disclosed for the purpose of illustration, those skilled in the art will be able to various modifications, changes, additions, etc. within the spirit and scope of the present invention, these modifications and changes should be seen as belonging to the following claims. something to do.

Claims (1)

적어도, 리드프레임을 펀치로 압착하여 원하는 형상으로 변형시키는 누름부재와, 상기 리드프레임을 올려놓는 곳으로 상기 누름부재의 펀치가 압착되었을 때 맞물리도록 형성된 다이를 구비한 받침부재를 포함하는 리드프레임 소성변형 장치에 있어서,At least a lead frame plasticizer comprising a pressing member for pressing the lead frame into a punch to deform it into a desired shape, and a supporting member having a die formed to engage when the punch of the pressing member is pressed into a place where the lead frame is placed. In the deforming device, 상기 받침부재의 다이의 양단에 일정 비율의 라운딩과 일정 형상의 표면가공을 한 것을 특징으로 하는 리드프레임 소성변형 장치.Lead frame plastic deformation apparatus characterized in that a predetermined ratio of rounding and surface processing of a predetermined shape on both ends of the die of the support member.
KR1019980061477A 1998-12-30 1998-12-30 Apparatus for deforming lead frame KR20000044970A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726041B1 (en) * 2005-11-18 2007-06-08 엘에스전선 주식회사 method and apparatus for manufacturing lead frame with controlled thickness

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726041B1 (en) * 2005-11-18 2007-06-08 엘에스전선 주식회사 method and apparatus for manufacturing lead frame with controlled thickness

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