KR20000043455A - Cooling apparatus for spin motor - Google Patents

Cooling apparatus for spin motor Download PDF

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Publication number
KR20000043455A
KR20000043455A KR1019980059834A KR19980059834A KR20000043455A KR 20000043455 A KR20000043455 A KR 20000043455A KR 1019980059834 A KR1019980059834 A KR 1019980059834A KR 19980059834 A KR19980059834 A KR 19980059834A KR 20000043455 A KR20000043455 A KR 20000043455A
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KR
South Korea
Prior art keywords
spin motor
cooling
wafer
pipe
flange
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KR1019980059834A
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Korean (ko)
Inventor
오정은
신원열
이제철
이정훈
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윤종용
삼성전자 주식회사
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Priority to KR1019980059834A priority Critical patent/KR20000043455A/en
Publication of KR20000043455A publication Critical patent/KR20000043455A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Motor Or Generator Cooling System (AREA)

Abstract

PURPOSE: A cooling apparatus for a spin motor is provided to reduce a production cost, to extend a life span, and to improve productivity. CONSTITUTION: A cooling apparatus includes a chuck(21) for supporting a wafer(10), a spin motor(23) for rotating the chuck(21), a flange(22) disposed between the chuck(21) and the spin motor(23), and a cooling pipe(26) wound on the spin motor(23). In particular, the cooling pipe(26) is connected with an air influx pipe(24) at one end and an exhaust pipe(25) at the other end. While the spin motor(23) is rotated, air is pumped into the influx pipe(24) by a compressor. Then, the air circulates through the cooling pipe(26) to cool the spin motor(23), and therefore becomes warmer. The warmed air is exhausted through the exhaust pipe(25). The flange(22) is formed by vacuum inside body and covered with an insulating material such as teflon to intercept a heat transmission to the wafer(10). The cooling pipe(26) may be installed inside the spin motor(23).

Description

스핀모터 냉각장치{Cooling apparatus for spin motor}Spin motor cooling device {Cooling apparatus for spin motor}

본 발명은 웨이퍼에 감광막을 코팅하는 스핀모터의 공냉식 냉각장치에 관한 것이다.The present invention relates to an air-cooled cooling apparatus of a spin motor for coating a photosensitive film on a wafer.

반도체 웨이퍼 제조공정 중에 포토리소그라피(photolithography) 공정이 있다. 이 공정은 웨이퍼에 감광막(포토레지스트)을 코팅하고 빛을 쬐고(노광) 현상하여 원하는 패턴을 형성하는 공정이다. 포토리소그라피 공정을 하기 위해서는 웨이퍼에 감광막을 코팅하여야 하는데, 일반적으로 웨이퍼에 약간량의 감광액을 떨어뜨리고 웨이퍼를 스핀모터로 회전시켜서 원심력으로써 감광액이 웨이퍼 전면에 골고루 분산되도록 하는 방법을 쓰고 있다. 이러한 방법을 스핀코팅(spin coating)이라고 한다. 통상, 감광막의 두께는 0.5㎛이고 오차는 10% 미만이어야 하고, 막질은 ㎠당 2 개 이하의 핀홀(pin hole)이 허용된다.There is a photolithography process in the semiconductor wafer manufacturing process. This process is a process of forming a desired pattern by coating a photosensitive film (photoresist) on a wafer, exposing it to light (exposure) and developing it. In order to perform a photolithography process, a photoresist film should be coated on a wafer. In general, a small amount of the photoresist is dropped on the wafer, and the wafer is rotated by a spin motor to centrifugally distribute the photoresist evenly across the wafer. This method is called spin coating. Usually, the thickness of the photoresist film should be 0.5 mu m and the error should be less than 10%, and the film quality is allowed to have 2 or less pin holes per cm 2.

스핀코팅에 대해서 보다 더 구체적으로 설명한다. 먼저 물림쇠(chuck)에 웨이퍼를 올려놓고 웨이퍼의 중앙에 수 cc의 감광액을 떨어뜨린다. 물림쇠는 밑에서 진공펌프를 써서 공기를 빼내기 때문에 웨이퍼가 확고하게 고정될 수 있다. 웨이퍼를 스핀모터로 약 3000~9000RPM으로 회전시키면 감광액이 윈심력에 의해 웨이퍼 가장자리로 퍼져 나가면서 웨이퍼 위에 골고루 코팅된다.Spin coating will be described in more detail. First, the wafer is placed on a chuck and several cc of photoresist is dropped in the center of the wafer. Since the chuck uses a vacuum pump to draw out air, the wafer can be firmly fixed. Rotating the wafer at about 3000 to 9000 RPM with a spin motor spreads the photoresist evenly over the wafer as it spreads out to the edge of the wafer by Winsim's force.

스핀코팅에서 고려해야 할 중요한 점으로는 떨어뜨리는 감광액의 양과 스핀모터의 회전속도이다. 감광액의 양이 적으면 웨이퍼에 골고루 코팅되지 못하고 반면에 너무 많으면 웨이퍼를 벗어나 웨이퍼 원주측면과 뒷면에까지 코팅되는 일이 생길 수 있다. 감광막질은 또한 감광액의 점도에 의해서도 영향을 받는다.Important considerations in spin coating are the amount of photosensitive solution dropped and the rotational speed of the spin motor. If the amount of the photoresist is small, the wafer may not be evenly coated, whereas if the amount of the photoresist is too high, the coating may be applied to the wafer circumferential side and the back side beyond the wafer. The photoresist quality is also affected by the viscosity of the photosensitive liquid.

마찬가지로, 스핀모터의 회전속도가 감광막질에 큰 영향을 끼친다. 보통 스핀모터의 회전속도는 3000~9000RPM으로서, 매우 고속이다. 이는 스핀모터의 기계적 수명에 영향을 주는 것은 물론이지만, 스핀모터의 온도가 올라감에 따라 웨이퍼에 온도차이를 주어 감광막의 막질에도 큰 영향을 준다. 따라서, 스핀모터에서 발생하는 열을 최소화하여 웨이퍼에 열이 전달되지 않도록 할 필요가 있다.Similarly, the rotational speed of the spin motor greatly affects the photosensitive film quality. Normally, the rotational speed of spin motor is 3000 ~ 9000RPM, which is very high speed. This not only affects the mechanical life of the spin motor, but also increases the temperature of the wafer as the temperature of the spin motor rises, which greatly affects the film quality of the photosensitive film. Therefore, it is necessary to minimize heat generated in the spin motor so that heat is not transferred to the wafer.

도1은 종래에 이용되고 있는 스핀모터 냉각장치의 얼개를 나타낸다. 웨이퍼(10)를 고정하는 물림쇠(chuck, 11) 아래에 플랜지(12)가 설치된다. 플랜지(12)는 속이 비어 있고, 두 개의 관이 나와 있는데, 하나는 입수관(13)이고 하나는 출수관(14)이다. 입수관(13)은 펌프(15)와 연결되고 펌프(15)는 온조기(16)의 아랫부분에 연결되어 있다. 출수관(14)은 온조기(16)의 윗부분에 연결되어 있다. 온조기(16)의 주위에는 냉각기(17)가 설치되는데, 냉각용 코일 등 일반적인 냉각방식으로 온조기(16)에 담긴 물을 냉각할 수 있는 장치이다.Fig. 1 shows the structure of a spin motor cooling apparatus conventionally used. A flange 12 is installed below the chuck 11 that fixes the wafer 10. The flange 12 is hollow and there are two tubes, one being the inlet 13 and one being the outlet 14. Inlet pipe 13 is connected to the pump 15 and the pump 15 is connected to the lower portion of the thermostat (16). The water outlet pipe 14 is connected to the upper part of the thermostat 16. The cooler 17 is installed around the temperature controller 16, and is a device capable of cooling the water contained in the temperature controller 16 by a general cooling method such as a cooling coil.

위와 같이 구성되어, 스핀모터(18)가 고속회전할 때 발생하는 열을 냉각시키기 위하여 펌프(15)가 작동되어 온조기(16)에 담긴 냉각수가 입수관(13)을 통해 플랜지(12) 내부로 들어가고 플랜지(12) 내부에 냉각수가 가득차면 출수관(14)을 통해 다시 온조기(16)로 들어간다. 플랜지(12)가 스핀모터(18) 몸체에 직접 부착되어 있기 때문에 냉각수에 의해 플랜지(12)와 스핀모터(18)가 냉각되고, 냉각수의 온도가 올라간 상태로 온조기(16)로 되돌아간 냉각수는 냉각기(17)에 의해 다시 온도가 내려가서 펌프(15)에 의해 다시 플랜지(12) 내부로 들어간다. 냉각수로는 여러 가지가 쓰일 수 있지만 보통 항온수(DI water)가 쓰인다.In this way, the pump 15 is operated to cool the heat generated when the spin motor 18 rotates at a high speed so that the coolant contained in the temperature controller 16 is introduced into the flange 12 through the inlet pipe 13. And the coolant inside the flange 12 is filled into the temperature controller 16 again through the outlet pipe (14). Since the flange 12 is directly attached to the body of the spin motor 18, the coolant 12 is cooled by the coolant to cool the flange 12 and the spin motor 18, and the coolant returned to the temperature controller 16 while the temperature of the coolant is raised. The temperature is lowered again by the cooler 17 and enters the flange 12 again by the pump 15. There are many different types of cooling water, but usually DI water is used.

그러나, 이러한 종래의 냉각장치에서는 냉각수가 배관을 순환해야 하고 온조기를 냉각시켜야 하기 때문에 설비 가격이 높은 문제가 있다. 또한, 냉각수에 있는 광물질 무기물 등이 침전되고 찌꺼기를 만들어서 배관 내벽에 껴서 배관과 플랜지가 막히는 일이 자주 발생한다.However, such a conventional cooling device has a problem in that the cost of equipment is high because the cooling water must circulate the pipes and cool the temperature controller. In addition, mineral minerals, etc. in the cooling water are precipitated and the residue is often stuck to the inner wall of the pipe to block the pipe and the flange.

따라서, 본 발명의 목적은 냉각수를 쓰지 않고 공냉식으로 스핀모터를 냉각시키는 냉각장치를 제공하는 것이다.Accordingly, an object of the present invention is to provide a cooling apparatus for cooling a spin motor by air cooling without using cooling water.

도1은 종래의 스핀모터 냉각장치의 개념도.1 is a conceptual diagram of a conventional spin motor cooling apparatus.

도2는 본 발명에 따른 스핀모터 냉각장치의 개념도.2 is a conceptual diagram of a spin motor cooling apparatus according to the present invention.

<도면의 주요 부호에 대한 설명><Description of Major Symbols in Drawing>

웨이퍼(10) 물림쇠(chuck, 11) 플랜지(12)Wafer 10 Chuck 11 Flange 12

입수관(13) 출수관(14) 펌프(15)Inlet pipe (13) Outlet pipe (14) Pump (15)

온조기(16) 냉각기(17) 스핀모터(18)Thermostat (16) Cooler (17) Spin Motor (18)

물림쇠(21) 테플론플랜지(22) 스핀모터(23)Chuck (21) Teflon Flange (22) Spin Motor (23)

공기유입관(24) 배기관(25) 냉각관(26)Air inlet pipe (24) Exhaust pipe (25) Cooling pipe (26)

본 발명은, 웨이퍼에 감광액을 떨어뜨려 원심력에 의해 감광막을 형성하는 스핀코팅장치의 스핀모터를 냉각하는 장치로서, 웨이퍼를 고정하는 물림쇠, 물림쇠를 회전시키는 스핀모터, 스핀모터와 물림쇠 사이에 설치되어 스핀모터에 부착되는 플랜지, 스핀모터를 코일식으로 감아서 부착되는 냉각관으로 구성되어, 상기 냉각관에 공기를 유입시켜 냉각관을 순환토록 하여 스핀모터를 냉각시키는 것을 특징으로 한다. 상기 플랜지는 내부가 진공상태이고 단열재로 형성되어 냉각효율을 극대화시킨다.The present invention is a device for cooling a spin motor of a spin coating apparatus in which a photosensitive liquid is dropped onto a wafer to form a photosensitive film by centrifugal force, and is provided between a staple for fixing a wafer, a spin motor for rotating a staple, a spin motor and a staple. A flange attached to the spin motor and a cooling tube attached to the coil by winding the spin motor in a coil form, characterized in that to cool the spin motor by introducing air into the cooling tube to circulate the cooling tube. The flange has a vacuum inside and is formed of a heat insulating material to maximize the cooling efficiency.

도2에 본 발명에 따른 스핀모터 냉각장치를 그려놓았다. 웨이퍼(10)를 고정하는 물림쇠(21) 아래에 스핀모터(23) 상부에 접촉하도록 테플론플랜지(teflon flange)(22)를 설치하였다. 테플론플랜지(22)는 내부가 빈 진공상태이고 외벽에 테플론이 감싸고 있는 플랜지이다. 스핀모터(23)의 케이스에는 두 개의 관이 연결되는데, 하나는 공기가 들어가는 공기유입관(24)이고 다른 하나는 공기가 빠져 나가는 배기관(25)이다. 공기유입관(24)과 배기관(25)은 냉각관(26)으로써 서로 연결되어 있는데 스핀모터(23)를 코일식으로 감는 형태로 설치된다.2 shows a spin motor cooling apparatus according to the present invention. A teflon flange 22 was installed under the chuck 21 fixing the wafer 10 so as to contact the upper portion of the spin motor 23. The teflon flange 22 is a flange in which the inside is vacuumed and the Teflon is wrapped on the outer wall. Two tubes are connected to the case of the spin motor 23, one of which is an air inlet tube 24 through which air enters and the other is an exhaust pipe 25 through which air escapes. The air inlet pipe 24 and the exhaust pipe 25 are connected to each other by the cooling pipe 26, and is installed in the form of winding the spin motor 23 in a coiled manner.

위와 같이 구성되는 스핀모터 냉각장치의 작용을 설명한다. 스핀모터(23)가 회전하는 상태에서 공기유입관(24)에 공기를 불어넣는다. 이는 생산라인에서 많이 쓰고 있는 콤프레서를 이용할 수 있다. 공기유입관(24)으로 들어간 공기는 냉각관(26)을 따라 스핀모터(23) 몸체를 순환한 후 더워져서 배기관(25)을 통해 빠져나간다.It describes the operation of the spin motor cooling device configured as described above. Air is blown into the air inlet pipe 24 while the spin motor 23 rotates. It is possible to use the compressor which is used a lot in the production line. The air entering the air inlet tube 24 circulates through the body of the spin motor 23 along the cooling tube 26 and then warms up and exits through the exhaust pipe 25.

한편, 냉각효율을 더 높히기 위하여 테플론플랜지(22)를 스핀모터(23) 상부에 부착하였다. 플랜지 내부의 진공과 테플론의 단열작용에 의하여 스핀모터(23)에 남은 열이 웨이퍼(10)로 전달되는 것을 차단할 수 있다.Meanwhile, in order to further increase the cooling efficiency, the Teflon flange 22 is attached to the upper portion of the spin motor 23. The heat remaining in the spin motor 23 may be prevented from being transferred to the wafer 10 by the adiabatic action of the vacuum inside the flange and the teflon.

코일형상의 냉각관(26)은 스핀모터(23)의 외부케이스를 감는 형태일 수도 있고, 외부케이스의 내면에 설치될 수도 있다. 이는 가장 냉각효율이 높게 나올 수 있도록 변형할 수 있는, 당업자가 쉽게 실시할 수 있는 사항이다.The coil-shaped cooling tube 26 may be in the form of winding the outer case of the spin motor 23, or may be installed on the inner surface of the outer case. This is a matter that can be easily carried out by those skilled in the art, which can be modified so that the cooling efficiency is highest.

이상에서와 같이, 본 발명에 따르면 복잡한 배관시설이 없고 펌프와 냉각수 냉각기와 같은 구동부분이 없기 때문에 전체설비의 가격을 낮출 수 있고, 수명을 연장시킬 수 있다. 또한, 냉각수에 의해 배관이 막히는 등의 문제가 없어 반영구적으로 사용할 수 있어 생산성을 향상시키고 제조원가를 낮출 수 있다.As described above, according to the present invention, since there are no complicated piping facilities and no driving parts such as a pump and a coolant cooler, the price of the entire equipment can be lowered and the life can be extended. In addition, since there is no problem such as clogging of the piping by the cooling water, it can be used semi-permanently, thereby improving productivity and lowering manufacturing costs.

Claims (2)

웨이퍼에 감광액을 떨어뜨려 원심력에 의해 감광막을 형성하는 스핀코팅장치에서,In the spin coating apparatus for dropping the photosensitive liquid on the wafer to form a photosensitive film by centrifugal force, 웨이퍼를 고정하는 물림쇠,Chuck fixing wafers, 물림쇠를 회전시키는 스핀모터,Spin motor to rotate chuck, 스핀모터와 물림쇠 사이에 설치되어 스핀모터에 부착되는 플랜지,A flange installed between the spin motor and the chuck and attached to the spin motor, 스핀모터를 코일식으로 감아서 부착되는 냉각관으로 구성되어,Consists of a cooling tube that is wound by coiling the spin motor, 상기 냉각관에 공기를 유입시켜 냉각관을 순환토록 하여 스핀모터를 냉각시키는 스핀모터 냉각장치.Spin motor cooling apparatus for cooling the spin motor by introducing air into the cooling tube to circulate the cooling tube. 제1항에 있어서, 상기 플랜지는 내부가 진공상태이고 단열재로 형성되는 것을 특징으로 하는 스핀모터 냉각장치.The spin motor cooling apparatus according to claim 1, wherein the flange is vacuumed inside and formed of a heat insulating material.
KR1019980059834A 1998-12-29 1998-12-29 Cooling apparatus for spin motor KR20000043455A (en)

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KR1019980059834A KR20000043455A (en) 1998-12-29 1998-12-29 Cooling apparatus for spin motor

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KR1019980059834A KR20000043455A (en) 1998-12-29 1998-12-29 Cooling apparatus for spin motor

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KR20000043455A true KR20000043455A (en) 2000-07-15

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