CN220671808U

CN220671808U - Cooling device of color photoresist developing machine

Info

Publication number: CN220671808U
Application number: CN202322309373.4U
Authority: CN
Inventors: 宗健; 李红岩
Original assignee: Jiangsu Boyan Electronic Technology Co ltd
Current assignee: Jiangsu Boyan Electronic Technology Co ltd
Priority date: 2023-08-28
Filing date: 2023-08-28
Publication date: 2024-03-26
Anticipated expiration: 2033-08-28

Abstract

The utility model discloses a cooling device of a color photoresist developing machine, which relates to the technical field of photoresist production equipment and aims to solve the problems that the temperature of a silicon wafer is required to be reduced to about 23 ℃ after exposure by a developing machine, so that the temperature detection accuracy of a cold plate in a photoresist homogenizing developing machine is very high, the silicon wafer is usually cooled by placing the silicon wafer on a cold plate, the bottom of the cold plate is connected with a cooling mechanism to cool the silicon wafer, the bottom of the silicon wafer is attached to the cold plate, but the upper surface of the silicon wafer is contacted with air, so that the temperature of the silicon wafer is reduced unevenly, and the silicon wafer generates certain loss; further comprises: the inside of pivot, its setting in the rubber coating room, the upper end of pivot is provided with the cold dish, and the cold dish rotates through the pivot, the inside of cold dish is provided with the coil pipe, and coils the inside upper end that the pipe is S type evenly winding at the cold dish, the one end of coil pipe is connected with the water inlet, and the bottom of water inlet intercommunication cold dish.

Description

Cooling device of color photoresist developing machine

Technical Field

The utility model relates to the technical field of photoresist production equipment, in particular to a cooling device of a color photoresist developing machine.

Background

In the semiconductor industry, photolithography and development are two important steps, the development process is completed on a developing machine, the development process is a process of taking out or retaining a part of the exposed photoresist which is subjected to chemical reaction with ultraviolet light, and the basic process of development is as follows: alignment exposure (photoetching machine), post-exposure baking, development, hardening and development detection.

The temperature of the silicon wafer which is dried after exposure needs to be reduced to about 23 ℃ by a developing machine, so that the temperature detection accuracy of a cold plate in the spin coater is high, the silicon wafer is usually cooled by placing the silicon wafer on a cold plate, connecting a cooling mechanism at the bottom of the cold plate to cool the silicon wafer, and the bottom of the silicon wafer is attached to the cold plate, but the upper surface of the silicon wafer is contacted with air, so that the temperature of the silicon wafer is reduced unevenly, and a certain loss is generated on the silicon wafer; we have therefore proposed a cooling device for a color photoresist developer in order to solve the problems set forth above.

Disclosure of Invention

The utility model aims to provide a cooling device of a color photoresist developing machine, which aims to solve the problems that the prior developing machine is required to cool a dried silicon wafer after exposure to about 23 ℃, so that the temperature detection accuracy of a cold plate in a photoresist homogenizing developing machine is very high, the silicon wafer is usually cooled by being placed on a cold plate, the bottom of the cold plate is connected with a cooling mechanism to cool the silicon wafer, the bottom of the silicon wafer is attached to the cold plate, but the upper surface of the silicon wafer is contacted with air, so that the temperature of the silicon wafer is unevenly cooled, and the silicon wafer generates certain loss.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a cooling device of a color photoresist developing machine comprises a gluing chamber;

further comprises:

the automatic glue spreading device comprises a rotating shaft, wherein the rotating shaft is arranged inside a glue spreading chamber, the upper end of the rotating shaft is provided with a cold disc, the cold disc rotates through the rotating shaft, a coiled pipe is arranged inside the cold disc, the coiled pipe is uniformly wound on the upper inner end of the cold disc in an S shape, one end of the coiled pipe is connected with a water inlet, the water inlet is communicated with the bottom of the cold disc, the other end of the coiled pipe is connected with a water outlet, the water outlet is communicated with the bottom of the cold disc, the upper inner end of the glue spreading chamber is provided with a first lifter, the bottom of the first lifter is provided with a first telescopic rod, the first telescopic rod is lifted and moved through the first lifter, the bottom of the first telescopic rod is provided with a connecting disc, and a cover disc is connected with the bottom of the connecting disc, and a sealing space is formed between the cover disc and the cold disc.

Preferably, the inside bottom of rubber coating room is provided with the second lift, and the second lift is provided with two and symmetry setting in the both sides of pivot, the upper end of second lift is provided with the second telescopic link, and the second telescopic link moves through the second lift, the upper end of second telescopic link is fixed with the mounting disc, the upper end both sides of mounting disc are provided with the interface, interface and mounting disc intercommunication, the interface is provided with two, and two interfaces are located respectively under water inlet and the delivery port, the upper end outside of interface is provided with the sealing washer, and the sealing washer passes through the adhesion to be fixed in the upper end outside of interface.

Preferably, the below of interface is connected with outlet pipe and inlet tube respectively, and outlet pipe and inlet tube block respectively in the downthehole bottom contact with the interface of mounting disc both sides, and outlet pipe and inlet tube are the rubber material, the other end intercommunication of outlet pipe and inlet tube has the cooler bin, the inside of cooler bin is provided with the refrigerator, the inside left side of cooler bin is provided with the water pump, and water pump and inlet tube laminating.

Preferably, the upper end of cooling box is provided with the fan, and the inside intercommunication of fan and cooling box, the upper end of fan is provided with the intake pipe, and the other end of intake pipe and one side fixed connection of first telescopic link, the inside of first telescopic link is provided with the through-hole, and through-hole and intake pipe intercommunication, the inside of connection pad is provided with the splitter box, and splitter box and through-hole intercommunication, the bottom of connection pad is provided with the air inlet tank, and the air inlet tank is provided with a plurality of, and the air inlet tank runs through the lid dish and communicates with sealed space.

Preferably, the two sides of the sealing space are provided with exhaust holes, the exhaust holes penetrate through the two sides of the inner part of the cover disc, and the inner part of the exhaust holes is provided with a one-way valve port.

Preferably, the bottom of the cover disc is provided with a sealing ring, and the sealing ring is fixedly installed at the bottom of the cover disc through adhesion.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the cover disc is covered on the cold disc, so that the silicon wafer is in the sealed space, the temperature of the surface of the cold disc is reduced by the cooling liquid flowing in the coiled tube, so that the bottom end of the silicon wafer is cooled, meanwhile, the cooling air generated in the cooling box is blown into the sealed space by the fan, so that the temperature in the sealed space is kept low, the cooling effect on the silicon wafer can be uniformly generated, and meanwhile, the blown cooling air cools the surface of the silicon wafer, so that the temperatures of the upper end and the lower end of the silicon wafer are almost consistent with the temperature in the space, and the situation that the silicon wafer is lost due to uneven cooling temperature is prevented.

2. Through cooling the cooling liquid inside the cooling box all the time with the refrigerator for the temperature of cooling liquid remains unanimous all the time, and the both sides of cover dish air outlet all the time, can follow the exhaust hole with the cold air of cooling and discharge, thereby make the sealed space remain cold air entering all the time.

Drawings

FIG. 1 is a front view of the interior of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a cold plate structure according to the present utility model;

FIG. 3 is a schematic view of a coiled tubing structure according to the present utility model;

FIG. 4 is an enlarged view of a portion of the utility model at A;

in the figure: 1. a gluing chamber; 2. a first elevator; 3. a first telescopic rod; 4. a through hole; 5. an air inlet pipe; 6. a blower; 7. a cooling box; 8. a refrigerating machine; 9. a water pump; 10. a water outlet pipe; 11. a water inlet pipe; 12. a second lifter; 13. a rotating shaft; 14. a second telescopic rod; 15. a mounting plate; 16. an interface; 17. a water outlet; 18. a water inlet; 19. a cover plate; 20. a connecting disc; 21. sealing the space; 22. an air inlet groove; 23. a shunt channel; 24. an exhaust hole; 25. a one-way valve port; 26. coiling a pipe; 27. a seal ring; 28. a seal ring; 29. and (5) a cold plate.

Description of the embodiments

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, an embodiment of the present utility model is provided: a cooling device of a color photoresist developing machine comprises a gluing chamber 1;

further comprises:

the pivot 13, it sets up the inside at the rubber coating room 1, the upper end of pivot 13 is provided with cold dish 29, and cold dish 29 rotates through pivot 13, the inside of cold dish 29 is provided with coiled pipe 26, and coiled pipe 26 is the inside upper end of S type even winding at cold dish 29, the one end of coiled pipe 26 is connected with water inlet 18, and the bottom of water inlet 18 intercommunication cold dish 29, the other end of coiled pipe 26 is connected with delivery port 17, and the bottom of delivery port 17 intercommunication cold dish 29, the inside upper end of rubber coating room 1 is provided with first lift 2, the bottom of first lift 2 is provided with first telescopic link 3, and first telescopic link 3 goes up and down through first lift 2 and removes, the bottom of first telescopic link 3 is provided with the bottom of connection pad 20 and is connected with lid dish 19, form sealed space 21 between lid dish 19 and the cold dish 29.

The cover plate 19 and the cold plate 29 are attached to each other to form a sealed space 21 therein, so that both the upper and lower ends of the silicon wafer can be subjected to a cooling treatment.

Referring to fig. 1-2, a second lifter 12 is disposed at the bottom end of the glue chamber 1, two second lifters 12 are symmetrically disposed at two sides of a rotating shaft 13, a second telescopic rod 14 is disposed at the upper end of the second lifter 12, the second telescopic rod 14 moves through the second lifter 12, a mounting plate 15 is fixed at the upper end of the second telescopic rod 14, two connectors 16 are disposed at two sides of the upper end of the mounting plate 15, the connectors 16 are communicated with the mounting plate 15, the connectors 16 are disposed at two positions, the two connectors 16 are respectively located under a water inlet 18 and a water outlet 17, a sealing ring 28 is disposed at the outer portion of the upper end of the connectors 16, the sealing ring 28 is fixed at the outer portion of the upper end of the connectors 16 through adhesion, the mounting plate 15 is lifted through the second lifter 12, and the two connectors 16 are respectively inserted into the water inlet 18 and the water outlet 17.

Referring to fig. 1, a water outlet pipe 10 and a water inlet pipe 11 are respectively connected below an interface 16, the water outlet pipe 10 and the water inlet pipe 11 are respectively clamped in holes at two sides of a mounting plate 15 and are in contact with the bottom end of the interface 16, the water outlet pipe 10 and the water inlet pipe 11 are made of rubber, the other ends of the water outlet pipe 10 and the water inlet pipe 11 are communicated with a cooling box 7, a refrigerator 8 is arranged in the cooling box 7, a water pump 9 is arranged at the left side of the inside of the cooling box 7, the water pump 9 is attached to the water inlet pipe 11, and cooling liquid is transmitted into a coiled pipe 26 through the water outlet pipe 10 and the water inlet pipe 11 to cool the surface of a cooling plate 29.

Referring to fig. 1, a fan 6 is disposed at the upper end of a cooling box 7, the fan 6 is communicated with the inside of the cooling box 7, an air inlet pipe 5 is disposed at the upper end of the fan 6, the other end of the air inlet pipe 5 is fixedly connected with one side of a first telescopic rod 3, a through hole 4 is disposed in the inside of the first telescopic rod 3, the through hole 4 is communicated with the air inlet pipe 5, a shunt groove 23 is disposed in the inside of a connecting disc 20, the shunt groove 23 is communicated with the through hole 4, an air inlet groove 22 is disposed at the bottom end of the connecting disc 20, a plurality of air inlet grooves 22 penetrate through a cover disc 19 and are communicated with a sealing space 21, and cold air generated in the cooling box 7 is blown into the sealing space 21 through the air inlet pipe 5 by the fan 6 to cool the upper surface of a silicon wafer.

Referring to fig. 1-4, two sides of the sealed space 21 are provided with air discharge holes 24, the air discharge holes 24 penetrate through two sides of the inside of the cover plate 19, and one-way valve ports 25 are provided in the air discharge holes 24 to discharge cooled cold air from the air discharge holes 24, so that the sealed space 21 always keeps cold air entering.

Referring to fig. 1-4, a sealing ring 27 is disposed at the bottom end of the cover disc 19, and the sealing ring 27 is fixedly mounted at the bottom end of the cover disc 19 by adhesion, so as to perform a sealing function.

Working principle: when the cooling box is used, a silicon wafer is placed at the upper end of the cold disc 29, the second lifter 12 is started to move the mounting disc 15 upwards and drive the interface 16 to lift, the interface 16 is in butt joint with the water outlet 17 and the water inlet 18, the water pump 9 is started, cooling liquid in the cooling box 7 is conveyed into the coiled pipe 26 through the water inlet pipe 11 and the water outlet pipe 10, the cold disc 29 is cooled, the bottom end of the silicon wafer is driven to be cooled, the first lifter 2 is started to lower the cover disc 19 and attach the cold disc 29 to cover the silicon wafer, and the fan 6 is started to convey cold air in the cooling box 7 into the sealed space 21 from the air inlet pipe 5, so that the inside of the sealed space 21 is cooled, and the surface of the silicon wafer is cooled.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A cooling device of a color photoresist developing machine comprises a gluing chamber (1);

the method is characterized in that: further comprises:

the gluing device comprises a rotating shaft (13), wherein the rotating shaft (13) is arranged inside a gluing chamber (1), a cold disc (29) is arranged at the upper end of the rotating shaft (13), the cold disc (29) rotates through the rotating shaft (13), a coiled pipe (26) is arranged inside the cold disc (29), the coiled pipe (26) is uniformly wound at the upper inner end of the cold disc (29) in an S shape, one end of the coiled pipe (26) is connected with a water inlet (18), the water inlet (18) is communicated with the bottom end of the cold disc (29), the other end of the coiled pipe (26) is connected with a water outlet (17), the water outlet (17) is communicated with the bottom end of the cold disc (29), a first lifter (2) is arranged at the upper inner end of the gluing chamber (1), the first telescopic rod (3) is lifted and moved through the first lifter (2), a cover disc (19) is connected to the bottom end of the first telescopic rod (3) provided with a cover disc (20), and a sealing space (21) is formed between the cover disc (19) and the cold disc (29).

2. A cooling apparatus for a color photoresist developer according to claim 1, wherein: the inside bottom of rubber coating room (1) is provided with second lift (12), and second lift (12) are provided with two and symmetry setting in the both sides of pivot (13), the upper end of second lift (12) is provided with second telescopic link (14), and second telescopic link (14) remove through second lift (12), the upper end of second telescopic link (14) is fixed with mounting plate (15), the upper end both sides of mounting plate (15) are provided with interface (16), interface (16) and mounting plate (15) intercommunication, interface (16) are provided with two, and two interfaces (16) are located respectively under water inlet (18) and delivery port (17), the upper end outside of interface (16) is provided with sealing washer (28), and sealing washer (28) are fixed in the upper end outside of interface (16) through the adhesion.

3. A cooling apparatus for a color photoresist developer according to claim 2, wherein: the utility model discloses a cooling box, including interface (16), cooling box (7) inside is provided with refrigerator (8), cooling box (7) inside left side is provided with water pump (9), and water pump (9) and inlet tube (11) laminating.

4. A cooling apparatus for a color photoresist developer according to claim 3, wherein: the upper end of cooling box (7) is provided with fan (6), and the inside intercommunication of fan (6) and cooling box (7), the upper end of fan (6) is provided with intake pipe (5), and the other end of intake pipe (5) and one side fixed connection of first telescopic link (3), the inside of first telescopic link (3) is provided with through-hole (4), and through-hole (4) and intake pipe (5) intercommunication, the inside of connection pad (20) is provided with splitter box (23), and splitter box (23) and through-hole (4) intercommunication, the bottom of connection pad (20) is provided with inlet groove (22), inlet groove (22) are provided with a plurality of, and inlet groove (22) run through lid (19) and with sealed space (21) intercommunication.

5. A cooling apparatus for a color photoresist developer according to claim 1, wherein: the two sides of the sealing space (21) are provided with exhaust holes (24), the exhaust holes (24) penetrate through the two sides of the inner part of the cover disc (19), and a one-way valve port (25) is arranged in the exhaust holes (24).

6. A cooling apparatus for a color photoresist developer according to claim 1, wherein: the bottom end of the cover disc (19) is provided with a sealing ring (27), and the sealing ring (27) is fixedly arranged at the bottom end of the cover disc (19) through adhesion.