KR20000031452A - Printed circuit board of liquid crystal display - Google Patents

Printed circuit board of liquid crystal display Download PDF

Info

Publication number
KR20000031452A
KR20000031452A KR1019980047505A KR19980047505A KR20000031452A KR 20000031452 A KR20000031452 A KR 20000031452A KR 1019980047505 A KR1019980047505 A KR 1019980047505A KR 19980047505 A KR19980047505 A KR 19980047505A KR 20000031452 A KR20000031452 A KR 20000031452A
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
lcd panel
pcb
tcp
Prior art date
Application number
KR1019980047505A
Other languages
Korean (ko)
Other versions
KR100568508B1 (en
Inventor
안현선
Original Assignee
윤종용
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR1019980047505A priority Critical patent/KR100568508B1/en
Publication of KR20000031452A publication Critical patent/KR20000031452A/en
Application granted granted Critical
Publication of KR100568508B1 publication Critical patent/KR100568508B1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Abstract

PURPOSE: A PCB of a liquid crystal display is provided in order to prevent from dropping the confidence of the products through occurring the open from an output pads of PCB and from the input leads of TCP(Tape Carrier Package) because of an incompletely compressed adhesion of a bi-directional conduction film, by improving the leveling of PCB through removing the solder resist of a margin which is confronted to the margin that the output pads are formed in the surface of PCB to that TCP is not bonding. CONSTITUTION: A driving device of LCD panel contains the followings: LCD panel to be consisted of a color-filter substrate adhering so as to face thin film transistor (TFT), which is formed input pads at one end of the data wires and the gate wires, that are formed so as to cross each other; PCB driving the above LCD panel through connecting electrically with the LCD panel; the connecting coupler to connect electrically the above PCB with the above LCD panel through connecting one end to the above input pads and another end to the above PCB; and the area facing to the above output pads in the surface of the above PCB, is coated with metallic layer.

Description

액정표시장치의 인쇄회로기판Printed Circuit Board of LCD

본 발명은 액정표시장치의 인쇄회로기판에 관한 것으로, 더욱 상세하게는 테이프 캐리어 패키지(Tape Carrier Package; 이하 TCP라 함)가 본딩되지 않는 인쇄회로기판의 표면 중 출력패드들이 형성된 영역과 대응되는 영역의 솔더 레지스트를 제거하여 인쇄회로기판의 평탄도를 향상시킨 액정표시장치의 인쇄회로기판에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board of a liquid crystal display. More particularly, the present invention relates to an area corresponding to an area where output pads are formed on a surface of a printed circuit board on which a tape carrier package (hereinafter referred to as TCP) is not bonded. The present invention relates to a printed circuit board of a liquid crystal display device in which the solder resist is removed to improve the flatness of the printed circuit board.

최근 디스플레이 제품으로 각광받고 있는 LCD 모듈은 TFT(Thin Film Transistor) 기판과, TFT 기판을 마주보는 칼라필터 기판과, 양 기판 사이에 주입되는 액정물질을 포함하는 장치로서, 내부에 주입된 액정의 전기 광학적 성질을 이용한 표시장치이다.Recently, the LCD module, which has been spotlighted as a display product, includes a TFT (Thin Film Transistor) substrate, a color filter substrate facing the TFT substrate, and a liquid crystal material injected between both substrates. It is a display device using optical properties.

일반적으로, TFT 기판에는 다수의 게이트선과 다수의 데이터선이 서로 교차되어 형성되고, 교차된 영역 각각에는 스위칭소자인 박막트랜지스터와 화소전극이 형성되며, 게이트선과 데이터선의 일단에는 입력패드가 형성된다.In general, a plurality of gate lines and a plurality of data lines cross each other on a TFT substrate, thin film transistors and pixel electrodes, which are switching elements, are formed in each of the crossed regions, and input pads are formed at one end of the gate line and the data line.

이 중 데이터선은 데이터 구동드라이브 IC에서 선택한 계조전압을 입력받아 액정에 계조전압을 전달하며, 게이트선은 게이트 구동드라이브 IC에서 출력된 온(on)/오프(off) 신호에 따라 스위칭 소자인 박막트랜지스터를 개방 또는 폐쇄한다.Among these, the data line receives the gray voltage selected by the data driving driver IC and transfers the gray voltage to the liquid crystal. The gate line is a thin film which is a switching element according to the on / off signal output from the gate driving drive IC. Open or close the transistor.

여기서, 데이터선과 게이트선에 구동신호를 인가하기 위해서는 각종 반도체 소자들 및 부품들이 실장된 인쇄회로기판과, 게이트선과 데이터선에 구동신호를 전달하는 구동드라이브 IC와, 정보를 표시하는 LCD 패널을 상호 연결시켜야 한다.In order to apply a driving signal to the data line and the gate line, a printed circuit board on which various semiconductor elements and components are mounted, a drive driver IC which transmits a driving signal to the gate line and the data line, and an LCD panel displaying information Should be connected.

LCD 패널, 인쇄회로기판, 구동드라이브 IC를 상호 연결하는 방식에는 크게 COG(Chip On Glass) 실장방식과, TAB(Tape Automated Bonding) 실장방식으로 구분된다.The LCD panel, printed circuit board, and driving drive IC are interconnected into a chip on glass (COG) mounting method and a tape automated bonding (TAB) mounting method.

여기서, COG 실장방식은 구동드라이브 IC를 LCD 패널에 실장하고 FPC와 같은 연결용 커넥터를 이용하여 LCD 패널과 인쇄회로기판을 연결하는 방식이고, TAB 실장방식은 테이프에 구동드라이브 IC가 탑재된 TCP를 이용하여 LCD 패널과 인쇄회로기판을 연결하는 방식이다.Here, the COG mounting method is to mount the drive driver IC on the LCD panel and connect the LCD panel and the printed circuit board by using a connector for connection such as FPC, and the TAB mounting method uses a TCP with a drive drive IC mounted on the tape. It connects LCD panel and printed circuit board by using.

TAP 실장방식에 대해 개략적으로 설명하면, 먼저 LCD 패널에 형성된 입력리드들에 이방성 도전필름(ACF;Anisotropic Conductive Film)을 부착하고 이방성 도전필름의 상부면에 TCP의 출력측을 위치시킨 후 열 가압바를 하강시켜 TCP의 출력측과 LCD 패널을 전기적으로 연결시킨다.To explain the TAP mounting method, anisotropic conductive film (ACF) is first attached to the input leads formed on the LCD panel, and the output side of TCP is placed on the upper surface of the anisotropic conductive film, and then the thermal pressure bar is lowered. Connect the TCP output side and LCD panel.

이후, TCP(30)의 입력리드들과 인쇄회로기판(20)의 출력패드들을 본딩하는데, 인쇄회로기판의 이면에 형성된 출력패드들간의 피치가 세밀할 경우 이방성 도전필름을 개재하여 TCP의 입력리드들과 출력패드들을 본딩하고 출력패드들간의 피치가 넓을 경우에는 TCP의 입력리드들과 출력패드들을 납땜으로 본딩한다.Thereafter, the input leads of the TCP 30 and the output pads of the printed circuit board 20 are bonded. When the pitch between the output pads formed on the rear surface of the printed circuit board is fine, the input leads of the TCP are interposed through the anisotropic conductive film. And output pads are bonded, and when the pitch between the output pads is wide, the input leads and output pads of TCP are soldered together.

여기서는, 이방성 도전필름을 이용하여 인쇄회로기판과 TCP를 부착하는 과정에 대해 설명하면, 인쇄회로기판의 출력리드들에 이방성 도전필름을 부착하고 이방성 도전필름의 상부면에 TCP의 입력측을 위치시킨 다음 열 가압바를 TCP 쪽으로 하강시켜 인쇄회로기판과 TCP의 출력측을 본딩한다.Here, the process of attaching the printed circuit board and the TCP using the anisotropic conductive film will be described. Anisotropic conductive film is attached to the output leads of the printed circuit board and the TCP input side is placed on the upper surface of the anisotropic conductive film. Lower the thermal pressure bar toward TCP to bond the printed circuit board and the output side of the TCP.

그러나, TCP와 이방성 도전필름과 인쇄회로기판을 가압할 때 인쇄회로기판의 표면에 도포된 솔더 레지스트막이 평탄하지 않아 출력패드들과 TCP의 입력리드들이 접속되지 않는 리드 오픈이 발생된다.However, when pressurizing the TCP, the anisotropic conductive film, and the printed circuit board, the solder resist film applied to the surface of the printed circuit board is not flat, and lead open where the output pads and the input leads of the TCP are not connected is generated.

이는, 인쇄회로기판의 표면에 도포된 솔더 레지스트가 평탄하지 않을 경우 솔더 레지스트가 돌출된 부분에 놓여진 TCP와 이방성 도전필름이 열 가압바에 의해 인쇄회로기판에 완전히 압착되고, 상대적으로 높이가 낮은 부분에 놓여진 TCP와 이방성 도전필름은 인쇄회로기판과 제대로 압착되지 않기 때문이다.When the solder resist applied to the surface of the printed circuit board is not flat, the TCP and the anisotropic conductive film placed on the protruding portion of the solder resist are completely pressed onto the printed circuit board by the thermal pressing bar, and the relatively low height is applied to the printed circuit board. This is because TCP and anisotropic conductive film are not pressed well with a printed circuit board.

따라서, 본 발명의 목적은 상기와 같은 문제점을 감안하여 안출된 것으로써, 인쇄회로기판의 표면 중 출력패드들이 형성된 부분과 대응되는 부분의 평탄도를 향상시켜 TCP의 입력리드들과 인쇄회로기판의 출력리드들이 오픈되는 것을 방지하는데 있다.Accordingly, an object of the present invention has been made in view of the above problems, and improves the flatness of the portion of the surface of the printed circuit board corresponding to the portion where the output pads are formed, thereby improving the input lead and the printed circuit board of TCP. To prevent the output leads from opening.

본 발명의 다른 목적은 다음의 상세한 설명과 첨부된 도면으로부터 보다 명확해 질 것이다.Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

도 1은 본 발명에 의한 LCD 패널과 인쇄회로기판이 전기적으로 연결된 상태를 나타낸 사시도이고,1 is a perspective view illustrating a state in which an LCD panel and a printed circuit board according to the present invention are electrically connected.

도 2는 본 발명에 의한 인쇄회로기판의 표면을 나타낸 사시도이며,2 is a perspective view showing a surface of a printed circuit board according to the present invention;

도 3은 도 1을 I-I선을 따라 절단한 단면도이다.3 is a cross-sectional view taken along the line I-I of FIG. 1.

도 4는 테이프 캐리어 패키지와 인쇄회로기판을 연결시키는 과정을 설명하기 위한 동작도이다.4 is an operation diagram illustrating a process of connecting a tape carrier package and a printed circuit board.

이와 같은 목적을 달성하기 위해서 본 발명은 반도체 소자 및 부품이 실장된 않는 인쇄회로기판의 표면 중 출력패드들이 형성된 영역과 대응되는 폭방향 일단에는 솔더 레지스트막을 도포하지 않아 인쇄회로기판의 표면에 도포된 금속막을 솔더 레지스트막의 외부로 노출시킨다.In order to achieve the above object, the present invention does not apply a solder resist film at one end in a width direction corresponding to a region where output pads are formed on a surface of a printed circuit board on which a semiconductor device and a component are not mounted. The metal film is exposed to the outside of the solder resist film.

이하, 본 발명에 의한 액정표시장치의 인쇄회로기판에 대해 첨부된 도면 도 1 내지 도 4를 참조하여 설명하면 다음과 같다.Hereinafter, a printed circuit board of a liquid crystal display device according to the present invention will be described with reference to FIGS. 1 to 4.

도 1에 도시된 바와 같이 LCD 패널(100)은 외부에서 전기적 신호를 입력받아 정보를 디스플레이하고, 인쇄회로기판(200)은 LCD 패널(100)의 폭방향 일단과 길이방향 일단에 각각 연결되어 LCD 패널(100)에 전기적 신호를 전달하며, 테이프 캐리어 패키지(300)는 LCD 패널(100)과 인쇄회로기판(200)을 연결시켜 LCD 패널(100)을 구동시킨다.As shown in FIG. 1, the LCD panel 100 receives an electrical signal from the outside to display information, and the printed circuit board 200 is connected to one end in the width direction and one end in the length direction of the LCD panel 100, respectively. The electrical signal is transmitted to the panel 100, and the tape carrier package 300 connects the LCD panel 100 and the printed circuit board 200 to drive the LCD panel 100.

LCD 패널(100)은 TFT 기판(110)과, TFT 기판(110)과 마주보도록 부착되는 칼라필터 기판(150)으로 구성되는데, 칼라필터 기판(150)의 크기가 TFT 기판(110)의 크기보다 작게 형성되어 TFT 기판(110)의 폭방향 및 길이방향 일단의 소정영역이 칼라필터 기판(150)의 외부로 노출된다.The LCD panel 100 includes a TFT substrate 110 and a color filter substrate 150 that is attached to face the TFT substrate 110. The size of the color filter substrate 150 is larger than that of the TFT substrate 110. It is formed small so that predetermined regions of one end in the width direction and the longitudinal direction of the TFT substrate 110 are exposed to the outside of the color filter substrate 150.

TFT 기판(110) 상에는 복수개의 게이트선들(120)이 폭방향을 따라 일렬로 배열되고, 게이트선들(120)과 교차되도록 TFT 기판(110)의 길이방향을 따라 복수개의 데이터선들(130)이 일렬로 배열된다. 여기서, 게이트선들(120)은 TFT 기판(110)의 길이방향 일단에서 타단까지 연장 형성되고, 데이터선들(130)이 TFT 기판(110)의 폭방향 일단에서 타단까지 연장 형성된다.A plurality of gate lines 120 are arranged in a line along the width direction on the TFT substrate 110, and a plurality of data lines 130 are arranged in a line along the length direction of the TFT substrate 110 so as to intersect the gate lines 120. Is arranged. Here, the gate lines 120 extend from one end in the longitudinal direction of the TFT substrate 110 to the other end, and the data lines 130 extend from the end in the width direction of the TFT substrate 110 to the other end.

또한, 칼라필터 기판(150)의 외부로 노출된 게이트선들(120) 및 데이터선들(130)의 일단에는 게이트 및 데이터 입력패드들(125, 135)이 형성된다.In addition, gate and data input pads 125 and 135 are formed at one end of the gate lines 120 and the data lines 130 exposed to the outside of the color filter substrate 150.

본 발명에 의한 인쇄회로기판(200)은 TCP(300)를 개재하여 게이트 입력패드들(125)과 연결되는 게이트 인쇄회로기판(220)과, TCP에 의해 데이터 입력패드들(135)과 전기적으로 연결되는 소스 인쇄회로기판(210)으로 구성된다.The printed circuit board 200 according to the present invention is a gate printed circuit board 220 connected to the gate input pads 125 via the TCP 300, and electrically connected to the data input pads 135 by TCP. The source printed circuit board 210 is connected.

게이트 및 소스 인쇄회로기판(220, 210)은 도 3에 도시된 바와 같이 신호패턴(232)이 형성된 경질의 판재들을 다층으로 적재하고, 각 층에 형성된 신호패턴들(232)을 비아홀(via hole; 230)로 연결한 다층 인쇄회로기판이다.As shown in FIG. 3, the gate and source printed circuit boards 220 and 210 stack hard plates having the signal pattern 232 formed therein in multiple layers, and via holes the signal patterns 232 formed in each layer. It is a multilayer printed circuit board connected by 230).

도 1에 도시된 바와 같이 게이트 및 소스 인쇄회로기판(220, 210)의 이면 중 폭방향 일단에는 출력패드들(240)이 소스 및 게이트 인쇄회로기판들(210, 220)의 길이방향을 따라 형성되고, 도 2에 도시된 게이트 및 소스 인쇄회로기판(220, 210)의 표면 중 출력패드들(240)이 형성된 영역과 대응되는 폭방향 일단에는 금속막(250)이 도포된다.As shown in FIG. 1, output pads 240 are formed along the length direction of the source and gate printed circuit boards 210 and 220 at one end in the width direction of the rear surface of the gate and the source printed circuit boards 220 and 210. The metal film 250 is coated on one end in the width direction of the gate and source printed circuit boards 220 and 210 shown in FIG. 2 to correspond to a region where the output pads 240 are formed.

또한, 소스 및 게이트 인쇄회로기판(210, 220)의 표면과 이면 중 출력패드들(240)이 형성된 부분과 금속막(250)이 형성된 부분 및 부품(270)이 실장될 영역을 제외한 전영역에는 솔더 레지스트막(260)이 도포되는데, 솔더 레지스트막(260)은 인쇄회로기판(200)의 표면과 이면에 형성된 신호패턴들(232)을 보호하고 인쇄회로기판(200)의 표면에 부품(270)을 실장할 때 납이 서로 인접한 신호패턴(232)으로 번지는 것을 방지한다.In addition, all areas of the source and gate printed circuit boards 210 and 220 except for a portion where the output pads 240 are formed, a portion where the metal film 250 is formed, and a region where the component 270 is to be mounted are located. The solder resist film 260 is applied, and the solder resist film 260 protects the signal patterns 232 formed on the surface and the back surface of the printed circuit board 200 and the components 270 on the surface of the printed circuit board 200. ) Prevents lead from spreading to adjacent signal patterns 232.

여기서, 출력패드들(240)이 형성된 영역에 솔더 레지스트막(260)을 형성하지 않는 이유는 출력패드들(240)과 TCP(300)를 전기적으로 연결시키기 위해서이고, 금속막(250)이 형성된 영역에 솔더 레지스트막(260)을 형성하지 않는 이유는 솔더 레지스트막(260) 자체가 평탄하게 도포되지 않기 때문에 TCP(300)와 인쇄회로기판(200)을 전기적으로 연결시킬 때 리드 오픈이 발생되기 때문이다.The reason why the solder resist film 260 is not formed in the region where the output pads 240 are formed is to electrically connect the output pads 240 and the TCP 300, and the metal film 250 is formed. The reason why the solder resist film 260 is not formed in the region is that the lead open is generated when the TCP 300 and the printed circuit board 200 are electrically connected because the solder resist film 260 is not applied evenly. Because.

TCP(300)의 표면에는 게이트선들(120)과 데이터선들(130)을 구동시키는 구동드라이브 IC(350)가 부착되고, TCP(300)의 이면에는 출력패드들(240)과 전기적으로 연결되는 입력리드들(320)과 게이트 및 데이터 입력패드들(125, 135)과 전기적으로 연결되는 출력리드들(310)이 형성된다.A drive drive IC 350 for driving the gate lines 120 and the data lines 130 is attached to a surface of the TCP 300, and an input electrically connected to the output pads 240 is provided on the rear surface of the TCP 300. Output leads 310 are formed to be electrically connected to the leads 320 and the gate and data input pads 125 and 135.

여기서, 입력리드들(320)이 폭방향을 따라 일렬로 형성된 영역을 입력측이라 하고, 출력리드들(310)이 폭방향을 따라 일렬로 형성된 영역을 출력측이라 한다.Here, an area where the input leads 320 are formed in a line along the width direction is called an input side, and an area where the output leads 310 are formed in a line along the width direction is called an output side.

한편, 인쇄회로기판(200)과 TCP(300)의 입력측을 연결시키는 가압장치(500)는 도 4에 도시된 바와 같이 인쇄회로기판(200)이 놓여지는 베이스판(520)과, TCP(300)의 상부면에서 가압하여 인쇄회로기판(200)과 TCP(300) 사이에 부착된 이방성 도전필름(400)에 접착력을 발생시키는 열 가압바(510)로 구성된다.Meanwhile, the pressurizing device 500 connecting the printed circuit board 200 and the input side of the TCP 300 includes a base plate 520 on which the printed circuit board 200 is placed and a TCP 300 as shown in FIG. 4. It is composed of a heat pressing bar 510 to generate an adhesive force on the anisotropic conductive film 400 attached between the printed circuit board 200 and the TCP (300) by pressing from the upper surface of the).

여기서, 베이스판(520)의 상부면에는 인쇄회로기판(200)의 표면에 실장된 각종 부품들(270)과 대응되도록 수납홈(525)들이 형성되어 부품들(270) 수납한다.Here, accommodating grooves 525 are formed on the upper surface of the base plate 520 to correspond to various components 270 mounted on the surface of the printed circuit board 200 to accommodate the components 270.

이와 같이 구성된 가압장치를 이용하여 LCD 패널과 인쇄회로기판을 TCP로 연결시키는 과정을 도 4를 참조하여 설명하면 다음과 같다.The process of connecting the LCD panel and the printed circuit board by TCP using the pressure device configured as described above will be described with reference to FIG. 4.

먼저, 게이트 입력패드들(125) 및 데이터 입력패드들(135)의 상부에 이방성 도전필름(400)을 부착하고, 각각의 게이트 및 데이터 입력패드들(125, 135)과 TCP(300)의 출력리드들(310)이 대응되도록 LCD 패널(100)과 TCP(300)의 출력측을 얼라인시킨다.First, the anisotropic conductive film 400 is attached to the gate input pads 125 and the data input pads 135, and outputs of the gate and data input pads 125 and 135 and the TCP 300, respectively. The output side of the LCD panel 100 and the TCP 300 are aligned so that the leads 310 correspond to each other.

이 후 이방성 도전필름(400)의 상부면에 TCP(300)의 출력측 단부를 올려놓고 열 가압바(510)를 하강시킨다. 여기서, TCP(300)와 접촉되는 열 가압바(510)의 면은 평탄하고 고온의 열이 발생되기 때문에 TCP(300)의 표면을 가압하면 열경화성 수지인 이방성 도전필름(400)이 열과 힘에 의해 LCD 패널(100)에 완전히 압착되면서 출력리드들(310)과 게이트 및 데이터 입력패드들(125, 135)을 전기적으로 연결시킨다.Thereafter, the output side end of the TCP 300 is placed on the upper surface of the anisotropic conductive film 400 and the heat press bar 510 is lowered. Here, since the surface of the heat pressing bar 510 in contact with the TCP 300 is flat and generates high temperature heat, when the surface of the TCP 300 is pressurized, the anisotropic conductive film 400, which is a thermosetting resin, is formed by heat and force. The output leads 310 and the gate and the data input pads 125 and 135 are electrically connected to each other while being completely compressed to the LCD panel 100.

이와 같이, 게이트 및 데이터 입력패드들(125, 135)과 TCP(300)의 출력리드들(310)이 이방성 도전필름(400)에 의해 전기적으로 연결되면, 인쇄회로기판(200)의 표면에 실장된 부품들(270)이 부품 수납홈(525)에 삽입되도록 인쇄회로기판(200)을 베이스판(520)에 올려놓는다.As such, when the gate and data input pads 125 and 135 and the output leads 310 of the TCP 300 are electrically connected by the anisotropic conductive film 400, the gate and data input pads 125 and 135 are mounted on the surface of the printed circuit board 200. The printed circuit board 200 is placed on the base plate 520 so that the parts 270 are inserted into the part receiving groove 525.

이후, 인쇄회로기판(200)의 이면에 형성된 출력패드들(240)의 상부면에 이방성 도전필름(400)을 부착하고, 각각의 출력패드들(400)과 TCP(300)의 입력리드들(320)이 대응되도록 인쇄회로기판(200)과 TCP(300)의 입력측을 얼라인시킨다.Thereafter, the anisotropic conductive film 400 is attached to the upper surfaces of the output pads 240 formed on the rear surface of the printed circuit board 200, and the respective input pads 400 and the input leads of the TCP 300 ( The input side of the printed circuit board 200 and the TCP 300 are aligned so that the 320 corresponds.

이어, TCP(300)의 입력측으로 열 가압바(510)를 하강시켜 TCP(300)의 입력측과 인쇄회로기판(200)의 이면을 부착한다. 이때, 이방성 도전필름(400)은 열 가압바(510)에서 가해지는 힘과 열 가압바(510)의 표면에서 발생되는 고온의 열에 의해 경화되면서 TCP(300)의 입력리드들(320)과 인쇄회로기판(200)의 출력패드들(240)을 전기적으로 연결시킨다.Subsequently, the thermal pressure bar 510 is lowered to the input side of the TCP 300 to attach the input side of the TCP 300 and the back surface of the printed circuit board 200. At this time, the anisotropic conductive film 400 is hardened by the force applied from the heat pressing bar 510 and the high temperature heat generated from the surface of the heat pressing bar 510 while printing with the input leads 320 of the TCP (300) The output pads 240 of the circuit board 200 are electrically connected to each other.

이와 같이, 출력패드들(240)과 대응되는 인쇄회로기판(200)의 표면에 솔더 레지스트막(260)을 도포하지 않고 금속막(250)을 노출시키면 금속막(250)이 솔더 레지스트막(260)보다 평탄도가 좋기 때문에 열 가압바(510)가 TCP(200)와 이방성 도전필름(400)을 가압할 때 전영역에 걸쳐 고르게 가압함으로 이방성 도전필름(400)의 불완전 압착으로 TCP(300)의 입력리드들(320)과 인쇄회로기판(200)의 출력패드들이 오픈되는 것을 방지할 수 있다.As such, when the metal film 250 is exposed without applying the solder resist film 260 to the surface of the printed circuit board 200 corresponding to the output pads 240, the metal film 250 is the solder resist film 260. Since the flatness is better than the thermal pressure bar 510 presses the TCP 200 and the anisotropic conductive film 400 evenly over the entire area by incomplete compression of the anisotropic conductive film 400 by TCP (300) The input leads 320 and the output pads of the printed circuit board 200 may be prevented from being opened.

이상에서 설명한 바와 같이 본 발명은 TCP가 본딩되지 않는 인쇄회로기판의 표면 중 출력패드들이 형성된 영역과 대응되는 영역의 솔더 레지스트를 제거하여 인쇄회로기판의 평탄도를 향상시킴으로써, 이방성 도전필름의 불완전 압착으로 TCP의 입력리드들과 인쇄회로기판의 출력패드들에 오픈이 발생되어 제품의 신뢰성이 저하되는 것을 방지할 수 있는 효과가 있다.As described above, the present invention improves the flatness of the printed circuit board by removing the solder resist in the area corresponding to the area where the output pads are formed on the surface of the printed circuit board where TCP is not bonded, thereby incompletely crimping the anisotropic conductive film. As a result, open occurs in the input leads of the TCP and the output pads of the printed circuit board, thereby preventing the reliability of the product from being degraded.

Claims (2)

일면에 게이트선들과 데이터선들이 서로 교차되도록 형성되고, 상기 게이트선들 및 데이터선들의 일단에 입력패드들이 형성된 TFT 기판과, 상기 TFT 기판과 마주보도록 부착되는 칼라필터 기판으로 구성된 LCD 패널과;An LCD panel formed on one surface thereof so that gate lines and data lines cross each other, a TFT substrate having input pads formed at one end of the gate lines and data lines, and a color filter substrate attached to face the TFT substrate; 상기 LCD 패널과 전기적으로 연결되어 상기 LCD 패널을 구동시키는 인쇄회로기판과;A printed circuit board electrically connected to the LCD panel to drive the LCD panel; 일단이 상기 입력패드들과 연결되고 타단이 상기 인쇄회로기판에 연결되어 상기 LCD 패널과 상기 인쇄회로기판을 전기적으로 연결하는 연결수단을 포함하며;One end of which is connected to the input pads and the other end of which is connected to the printed circuit board, the connecting means for electrically connecting the LCD panel and the printed circuit board; 상기 인쇄회로기판의 이면에는 상기 연결수단과 접속되는 출력패드들이 폭방향 일단에 형성되고, 상기 인쇄회로기판의 표면에는 신호패턴들이 형성되며, 상기 출력패드들과, 상기 인쇄회로기판의 표면 중 상기 출력패드들과 대응되는 폭방향 일단과, 구동소자들이 실장될 영역을 제외한 전 영역에 솔더 레지스트막이 도포되는 것을 특징으로 하는 LCD 패널의 구동장치.Output pads connected to the connecting means are formed at one end in the width direction of the printed circuit board, and signal patterns are formed on the surface of the printed circuit board, wherein the output pads and the surface of the printed circuit board A drive device for an LCD panel, characterized in that a solder resist film is applied to one end of a width direction corresponding to the output pads and to an entire area except for an area in which the driving elements are to be mounted. 제 1 항에 있어서, 상기 인쇄회로기판의 표면 중 상기 출력패드들과 대응되는 영역에는 금속막이 도포되는 것을 특징으로 하는 LCD 패널의 구동장치.The LCD panel driving apparatus of claim 1, wherein a metal film is coated on a region of the printed circuit board corresponding to the output pads.
KR1019980047505A 1998-11-06 1998-11-06 LCD Display KR100568508B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019980047505A KR100568508B1 (en) 1998-11-06 1998-11-06 LCD Display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980047505A KR100568508B1 (en) 1998-11-06 1998-11-06 LCD Display

Publications (2)

Publication Number Publication Date
KR20000031452A true KR20000031452A (en) 2000-06-05
KR100568508B1 KR100568508B1 (en) 2006-06-16

Family

ID=19557370

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980047505A KR100568508B1 (en) 1998-11-06 1998-11-06 LCD Display

Country Status (1)

Country Link
KR (1) KR100568508B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100885378B1 (en) * 2001-10-10 2009-02-26 엘지디스플레이 주식회사 Liquid crystal display

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0310738A (en) * 1989-06-07 1991-01-18 Hideji Murata Centralized control box for dust collecting hose
JPH05190593A (en) * 1992-01-10 1993-07-30 Hitachi Ltd Tape carrier type semiconductor device
JP3203736B2 (en) * 1992-02-13 2001-08-27 株式会社日立製作所 Tape carrier package for liquid crystal driver and liquid crystal display device
JPH06260759A (en) * 1993-03-05 1994-09-16 Meikoo:Kk Manufacture of printed circuit board
KR980010545A (en) * 1996-07-19 1998-04-30 김광호 Soldering tap aisle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100885378B1 (en) * 2001-10-10 2009-02-26 엘지디스플레이 주식회사 Liquid crystal display

Also Published As

Publication number Publication date
KR100568508B1 (en) 2006-06-16

Similar Documents

Publication Publication Date Title
KR100686788B1 (en) Compressive structure of Flexible circuit board
US7134879B2 (en) Anisotropic conductive material body, display apparatus, method for producing the display apparatus, and conductive member
EP0795772B1 (en) Drive circuit connection structure and display apparatus including the connection structure
US20010012706A1 (en) Connecting structure, electro-optical device, and electronic apparatus
CN101504924B (en) Method of producing electro-optical device and electro-optical device
US6559549B1 (en) Tape carrier package and method of fabricating the same
KR19990078144A (en) Mounting structure of semiconductor chip, liquic crystal device, and electronic equipment
KR100248138B1 (en) Liquid crystal display
KR100420880B1 (en) Multichip Mounted structure, Electro-optical apparatus, and Electronic apparatus
KR100568508B1 (en) LCD Display
JP3509573B2 (en) Flexible substrate tape material, flexible substrate manufacturing method, semiconductor device manufacturing method, and liquid crystal device manufacturing method
JPH11135909A (en) Electronic equipment and flexible wiring board
KR100654568B1 (en) liquid crystal display device
KR100615831B1 (en) Printed circuit board and liquid crystal display device using the same
JPH08292443A (en) Liquid crystal display device and its production
KR100863504B1 (en) Circuit board and liquid crystal display device having the same
JPH09305121A (en) Circuit connection structure, and display device and tcp structure body having the circuit connection structure
KR100524484B1 (en) LCD module
KR100640087B1 (en) Printed circuit board in liquid crystal display device
KR100652301B1 (en) Tape carrier package of being easy to discern impression of pressure
KR100726529B1 (en) Printed circuit board with easy discernment of connection and liquid crystal dispaly using the same
KR200160829Y1 (en) Module structure of liquid crystal display device
JPH1051097A (en) Method of connecting electrodes, and manufacture of optical modulator, and interelectrode connection device, and mounter
KR20000038523A (en) Tape carrier package and manufacture thereof
KR20050077425A (en) Driving module and display device having the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130228

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20140303

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20150227

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee