KR20000019877U - Apparatus for loading a silicon wafer in the stepper - Google Patents
Apparatus for loading a silicon wafer in the stepper Download PDFInfo
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- KR20000019877U KR20000019877U KR2019990006694U KR19990006694U KR20000019877U KR 20000019877 U KR20000019877 U KR 20000019877U KR 2019990006694 U KR2019990006694 U KR 2019990006694U KR 19990006694 U KR19990006694 U KR 19990006694U KR 20000019877 U KR20000019877 U KR 20000019877U
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
본 고안은 반도체 노광 장치에 있어서 웨이퍼 로딩에 따른 웨이퍼 정렬(wafer alignment)이 잘못되거나 웨이퍼 진공 에러(wafer vacuum error)가 발생하는 경우 OF(Oriental Flat) 재세팅을 실시하도록 하는 장치에 관한 것이다. 종래의 기술에 있어서는 웨이퍼를 재로딩하기 위해 OF 재세팅을 실시하는 경우 OF 재세팅을 위한 시퀀스를 장시간동안 수행해야 하기 때문에, 반도체의 생산성이 떨어지는 결점이 있었다. 이에, 본 고안에서는 종래의 웨이퍼 로딩 장치에 OF 재세팅 암(38)을 추가로 설치해서 OF 재세팅 시퀀스를 단축하여 웨이퍼 정렬을 신속하게 처리하도록 하기 때문에, 반도체 노광 공정 속도가 빨라진다. 따라서, 반도체의 생산성이 향상되는 효과가 있는 것이다.The present invention relates to an apparatus for performing OR (Oriental Flat) resetting when a wafer alignment due to wafer loading is incorrect or a wafer vacuum error occurs in a semiconductor exposure apparatus. In the prior art, when OF resetting is performed to reload a wafer, a sequence for OF resetting has to be performed for a long time, and thus there is a disadvantage that the productivity of the semiconductor is low. Accordingly, in the present invention, the OF resetting arm 38 is additionally installed in the conventional wafer loading apparatus to shorten the OF resetting sequence so that the wafer alignment can be processed quickly, thereby increasing the semiconductor exposure process speed. Therefore, the productivity of a semiconductor is improved.
Description
본 고안은 반도체 노광 장치(stepper)의 웨이퍼 로딩(wafer loading) 장치에 관한 것으로서, 특히 반도체 노광 장치에 있어서 웨이퍼 로딩에 따른 웨이퍼 정렬(wafer alignment)이 잘못되거나 웨이퍼 진공 에러(wafer vacuum error)가 발생하는 경우 OF(Oriental Flat) 재세팅을 실시하도록 하는 장치에 관한 것이다.The present invention relates to a wafer loading apparatus of a semiconductor exposure apparatus, and in particular, in a semiconductor exposure apparatus, wafer alignment due to wafer loading is incorrect or a wafer vacuum error occurs. The present invention relates to a device for performing OF (Oriental Flat) resetting.
도 1은 종래의 기술에 따른 반도체 노광 장치의 웨이퍼 로딩 장치의 일 실시예를 개략적으로 나타낸 개략 사시도로, 언로드 암(unload arm)(2), 웨이퍼 스테이지(wafer stage)(4), 제 1, 제 2, 제 3 웨이퍼(6, 10, 14), 로드 암(load arm)(8), OF 기구부(12), 및 로봇 암(robot arm)(16)으로 구성된다.1 is a schematic perspective view schematically showing an embodiment of a wafer loading apparatus of a semiconductor exposure apparatus according to the prior art, with an unload arm 2, a wafer stage 4, a first, It consists of the 2nd, 3rd wafers 6, 10, 14, the load arm 8, the OF mechanism part 12, and the robot arm 16. As shown in FIG.
동 도면에 있어서, OF 기구부(12)는 자신쪽으로 로딩된 웨이퍼의 OF를 검출한다. 이때, 본 명세서에서 명시하는 웨이퍼는 통상 실리콘 웨이퍼(silicon wafer)이다. 다음, 언로드 암(2) 및 로드 암(8)은 웨이퍼 스테이지(4)에 웨이퍼를 언로딩 및 로딩하는 수단을 제공하는 것으로, 언로드 암(2)은 웨이퍼 스테이지(4)에 있는 노광된 웨이퍼를 언로딩시키고, 로드 암(8)은 노광될 웨이퍼를 웨이퍼 스테이지(4)에 로딩시킨다. 또한, 로봇 암(16)은 웨이퍼를 소정의 위치로 운반한다.In the same figure, the OF mechanism part 12 detects the OF of the wafer loaded toward itself. At this time, the wafer specified in the present specification is usually a silicon wafer. The unload arm 2 and the load arm 8 then provide a means for unloading and loading the wafer into the wafer stage 4, which unloads the arm 2 to expose the exposed wafer in the wafer stage 4. Unloaded, the load arm 8 loads the wafer to be exposed to the wafer stage 4. In addition, the robot arm 16 carries the wafer to a predetermined position.
이와 같은 웨이퍼 로딩 장치의 기본적인 구성하에 종래의 기술에 따른 OF 재세팅의 실시예를 보면 다음과 같다.An embodiment of OF resetting according to the prior art under the basic configuration of such a wafer loading apparatus is as follows.
먼저, 언로드 암(2)이 웨이퍼 스테이지(4)에 있는 제 1 웨이퍼(6)를 언로딩시켜 로봇 암(16)이 다른 곳에 로딩시킬 수 있도록 한다.First, the unload arm 2 unloads the first wafer 6 in the wafer stage 4 so that the robot arm 16 can be loaded elsewhere.
다음, 로드 암(8)이 자신에 위치한 제 2 웨이퍼(10)를 웨이퍼 스테이지(4)에 로딩시킨다.The load arm 8 then loads the second wafer 10 positioned thereon onto the wafer stage 4.
또한, 로드 암(8)이 OF 기구부(12) 쪽으로 이동하여 OF 기구부(12)에 있는 제 3 웨이퍼(14)를 로딩하여 웨이퍼 스테이지(4) 쪽으로 이동한다.In addition, the load arm 8 moves toward the OF mechanism portion 12 to load the third wafer 14 in the OF mechanism portion 12 and move toward the wafer stage 4.
이어, 로봇 암(16)이 언로드 암(2)에 있는 제 1 웨이퍼(6)를 OF 기구부(12)에 로딩시킨다.The robot arm 16 then loads the OF mechanism 12 with the first wafer 6 in the unload arm 2.
따라서, OF 기구부(12)는 제 1 웨이퍼(6)의 OF 검출을 실시한다.Therefore, the OF mechanism part 12 performs OF detection of the first wafer 6.
또한, 언로드 암(2)이 웨이퍼 스테이지(4)에 있는 제 2 웨이퍼(10)를 언로딩시킨다.In addition, the unload arm 2 unloads the second wafer 10 in the wafer stage 4.
이어, 로드 암(8)은 자신에 위치한 제 3 웨이퍼(14)를 웨이퍼 스테이지(4)에 로딩시킨 후, OF 기구부(12)로 이동하여 제 1 웨이퍼(6)를 로딩하고 웨이퍼 스테이지(4) 쪽으로 이동한다.Subsequently, the load arm 8 loads the third wafer 14 positioned thereon on the wafer stage 4, and then moves to the OF mechanism 12 to load the first wafer 6 and the wafer stage 4. To the side.
한편, 로봇 암(16)이 언로드 암(2)에 있는 제 2 웨이퍼(10)를 잡아 OF 기구부(12)로 이동시킨다.On the other hand, the robot arm 16 grabs the second wafer 10 in the unload arm 2 and moves it to the OF mechanism part 12.
이어, 언로드 암(2)이 웨이퍼 스테이지(4)에 있는 제 3 웨이퍼(14)를 언로딩시킨다.The unload arm 2 then unloads the third wafer 14 in the wafer stage 4.
또한, 로드 암(8)은 OF 기구부(12)에서 로딩한 제 1 웨이퍼(6)를 웨이퍼 스테이지(4)에 로딩시킨 후, OF 기구부(12)에 있는 제 2 웨이퍼(10)를 로딩한다.In addition, the load arm 8 loads the first wafer 6 loaded from the OF mechanism part 12 onto the wafer stage 4, and then loads the second wafer 10 in the OF mechanism part 12.
이에, 로봇 암(16)이 언로드 암(2)에 있는 제 3 웨이퍼(14)를 OF 기구부(12)에 로딩시킴으로써 제 3 웨이퍼(14)의 OF 재세팅이 이루어진다.Thus, the robot arm 16 loads the third wafer 14 in the unload arm 2 into the OF mechanism part 12, thereby resetting OF of the third wafer 14.
이와 같은 종래의 기술은 노광 전에 레티클(reticle)과 웨이퍼을 정렬하기 위한 정렬 시퀀스(alignment sequence)를 실시한다. 이때, 웨이퍼의 로딩이 잘못되거나 OF 기구부(12)에서 웨이퍼의 편심이 틀어진 경우 정렬 에러 또는 웨이퍼 진공 에러 등이 발생한다.This conventional technique implements an alignment sequence for aligning the reticle and wafer prior to exposure. At this time, when the loading of the wafer is wrong or the eccentricity of the wafer is misaligned in the OF mechanism 12, an alignment error or wafer vacuum error occurs.
따라서, 웨이퍼를 재로딩하기 위해 OF 재세팅을 실시하는 경우 OF 재세팅을 위한 시퀀스를 장시간동안 수행해야 하기 때문에, 반도체의 생산성이 떨어지는 결점이 있다.Therefore, when OF resetting is performed to reload the wafer, the sequence for OF resetting must be performed for a long time, so that there is a disadvantage that the productivity of the semiconductor is lowered.
본 고안은 종래의 웨이퍼 로딩 장치에 OF 재세팅 암을 별도로 설치해서 OF 재세팅 시퀀스가 단축되도록 하여 웨이퍼 정렬을 신속하게 처리하도록 하는 반도체 노광 장치의 웨이퍼 로딩 장치를 제공하는 데 그 목적이 있다.The object of the present invention is to provide a wafer loading apparatus of a semiconductor exposure apparatus that allows an OF reset arm to be separately installed in a conventional wafer loading apparatus to shorten an OF reset sequence so that wafer alignment can be processed quickly.
이와 같은 목적을 달성하기 위한 본 고안은 자신쪽으로 로딩된 웨이퍼의 OF를 검출하는 OF 기구부; 웨이퍼 스테이지에 있는 노광된 웨이퍼를 언로딩시키는 언로드 암; 노광될 웨이퍼를 상기 웨이퍼 스테이지에 로딩시키는 로드 암; 웨이퍼를 운반하는 로봇 암; 및 OF 재세팅시 상기 OF 기구부에 있는 웨이퍼를 업/다운(up/down)시켜 상기 OF 기구부에 있는 웨이퍼를 재세팅시키는 OF 재세팅 암을 포함하는 것을 특징으로 한다.The present invention for achieving the above object is an OF mechanism unit for detecting the OF of the wafer loaded toward it; An unload arm for unloading the exposed wafer in the wafer stage; A load arm for loading the wafer to be exposed onto the wafer stage; A robot arm for carrying a wafer; And an OF reset arm for resetting the wafer in the OF mechanism by up / down the wafer in the OF mechanism.
도 1은 종래의 기술에 따른 반도체 노광 장치의 웨이퍼 로딩 장치의 일 실시예를 개략적으로 나타낸 개략 사시도,1 is a schematic perspective view schematically showing an embodiment of a wafer loading apparatus of a semiconductor exposure apparatus according to the prior art;
도 2는 본 고안에 따른 반도체 노광 장치의 웨이퍼 로딩 장치의 일 실시예를 개략적으로 나타낸 개략 사시도.2 is a schematic perspective view schematically showing an embodiment of a wafer loading apparatus of a semiconductor exposure apparatus according to the present invention;
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
22 : 언로드 암 24 : 웨이퍼 스테이지22: unload arm 24: wafer stage
26, 30, 34 : 제 1, 제 2, 제 3 웨이퍼26, 30, 34: first, second, third wafer
28 : 로드 암 32 : OF 기구부28: rod arm 32: OF mechanism part
36 : 로봇 암 38 : OF 재세팅 암36: robot arm 38: OF reset arm
이하, 이와 같은 본 고안의 실시예를 다음과 같은 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the following drawings.
도 2는 본 고안에 따른 반도체 노광 장치의 웨이퍼 로딩 장치의 일 실시예를 개략적으로 나타낸 개략 사시도로, 언로드 암(22), 웨이퍼 스테이지(24), 제 1, 제 2, 제 3 웨이퍼(26, 30, 34), 로드 암(28), OF 기구부(32), 로봇 암(36), 및 OF 재세팅 암(38)으로 구성된다.2 is a schematic perspective view schematically showing an embodiment of a wafer loading apparatus of a semiconductor exposure apparatus according to the present invention, in which an unload arm 22, a wafer stage 24, first, second, and third wafers 26, 30, 34, rod arm 28, OF mechanism 32, robot arm 36, and OF reset arm 38.
동 도면에 있어서, OF 기구부(32)는 자신쪽으로 로딩된 웨이퍼의 OF를 검출한다. 이때, 본 명세서에서 명시하는 웨이퍼는 통상 실리콘 웨이퍼이다. 다음, 언로드 암(22) 및 로드 암(28)은 웨이퍼 스테이지(24)에 웨이퍼를 언로딩 및 로딩하는 수단을 제공하는 것으로, 언로드 암(22)은 웨이퍼 스테이지(24)에 있는 노광된 웨이퍼를 언로딩시키고, 로드 암(28)은 노광될 웨이퍼를 웨이퍼 스테이지(24)에 로딩시킨다. 또한, 로봇 암(36)은 웨이퍼를 소정의 위치로 운반하고, OF 재세팅 암(38)은 OF 재세팅시 OF 기구부(32)에 있는 웨이퍼를 업/다운시켜 이 웨이퍼를 재세팅시킨다.In the same figure, the OF mechanism part 32 detects OF of the wafer loaded toward itself. At this time, the wafer specified in this specification is a silicon wafer normally. Next, the unload arm 22 and the load arm 28 provide a means for unloading and loading the wafer to the wafer stage 24, which unloads the arm 22 to expose the exposed wafer in the wafer stage 24. Unloaded, the load arm 28 loads the wafer to be exposed onto the wafer stage 24. In addition, the robot arm 36 carries the wafer to a predetermined position, and the OF resetting arm 38 resets the wafer by up / down the wafer in the OF mechanism 32 during OF resetting.
이와 같은 웨이퍼 로딩 장치의 기본적인 구성하에 본 고안의 기술에 따른 OF 재세팅의 실시예를 보면 다음과 같다.An embodiment of OF resetting according to the technology of the present invention under the basic configuration of such a wafer loading apparatus is as follows.
먼저, OF 재세팅 암(38)이 OF 기구부(32)에 있는 제 3 웨이퍼(34)를 들어올린다.First, the OF reset arm 38 lifts the third wafer 34 in the OF mechanism 32.
다음, 언로드 암(22)이 웨이퍼 스테이지(24)에 있는 제 1 웨이퍼(26)를 언로딩시켜 로봇 암(36)이 로딩할 수 있도록 한다.The unload arm 22 then unloads the first wafer 26 in the wafer stage 24 so that the robot arm 36 can load it.
또한, 로드 암(28)이 자신에 위치된 제 2 웨이퍼(30)를 웨이퍼 스테이지(24)에 로딩시킨다.In addition, the load arm 28 loads the second wafer 30 positioned thereon on the wafer stage 24.
이어, 로봇 암(36)이 언로드 암(22)에 있는 제 1 웨이퍼(26)를 OF 기구부(32)에 로딩시킨다.The robot arm 36 then loads the OF mechanism 32 with the first wafer 26 in the unload arm 22.
따라서 OF 기구부(32)는 로봇 암(36)에 의해 로딩된 제 1 웨이퍼(26)의 OF 검출을 실시한다.Thus, the OF mechanism 32 performs OF detection of the first wafer 26 loaded by the robot arm 36.
이어, 언로드 암(22)이 웨이퍼 스테이지(24)에 있는 제 2 웨이퍼(30)를 언로딩시킨다.The unload arm 22 then unloads the second wafer 30 in the wafer stage 24.
또한, 로드 암(28)이 OF 기구부(32)에 있는 제 1 웨이퍼(26)를 웨이퍼 스테이지(24)에 로딩시킨다.In addition, a load arm 28 loads the first wafer 26 in the OF mechanism 32 onto the wafer stage 24.
이에, 로봇 암(36)이 언로딩 암(22)에 있는 제 2 웨이퍼(30)를 OF 기구부(32)에 로딩시킨다.Thus, the robot arm 36 loads the second wafer 30 in the unloading arm 22 onto the OF mechanism 32.
이어, 로드 암(28)이 OF 기구부(32)에 있는 제 2 웨이퍼(30)를 로딩한다.The load arm 28 then loads the second wafer 30 in the OF mechanism 32.
그리고 OF 재세팅 암(38)은 제 3 웨이퍼(34)를 OF 기구부(32)에 내려놓음으로써 제 3 웨이퍼(34)의 OF 재세팅이 이루어진다.The OF resetting arm 38 lowers the third wafer 34 to the OF mechanism 32 so that the OF reset of the third wafer 34 is performed.
이상에서 설명한 바와 같이 본 고안은 종래의 웨이퍼 로딩 장치에 OF 재세팅 암(38)을 추가로 설치해서 OF 재세팅 시퀀스를 단축하여 웨이퍼 정렬을 신속하게 처리하도록 하기 때문에, 반도체 노광 공정 속도가 빨라진다. 따라서, 반도체의 생산성이 향상되는 효과가 있다.As described above, the present invention additionally installs the OF reset arm 38 in the conventional wafer loading apparatus to shorten the OF reset sequence so that the wafer alignment can be processed quickly, thereby increasing the semiconductor exposure process speed. Therefore, there is an effect that the productivity of the semiconductor is improved.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-1999-0006694U KR200382979Y1 (en) | 1999-04-22 | 1999-04-22 | Apparatus for loading a silicon wafer in the stepper |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-1999-0006694U KR200382979Y1 (en) | 1999-04-22 | 1999-04-22 | Apparatus for loading a silicon wafer in the stepper |
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| Publication Number | Publication Date |
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| KR20000019877U true KR20000019877U (en) | 2000-11-25 |
| KR200382979Y1 KR200382979Y1 (en) | 2005-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR20-1999-0006694U KR200382979Y1 (en) | 1999-04-22 | 1999-04-22 | Apparatus for loading a silicon wafer in the stepper |
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| KR (1) | KR200382979Y1 (en) |
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