KR20000006052U - Single lead device with bottom lead package - Google Patents

Abstract

The present invention relates to a singulation device for a bottom lid package, and the bottom lid package has a bottom surface exposed so that when a punching die is raised to cut the tie bar by a punch, a means for supporting the tie bar is conventionally used. As a result, the tie bar is lifted, and the present invention provides a punch for cutting a tie bar on the upper surface, and a punch for cutting the tie bar of the package mounted on the upper surface of the punching die when the punching die is raised. And a lifting means for pressing the tie bar to prevent the tie bar from lifting when the tie bar is cut, and a transfer means installed at the upper side of the punching die to transfer a package in which the tie bar is cut. Reduces package failure rates by preventing tiebars from lifting or cracking when cutting tiebars Thereby.

Description

Single lead device with bottom lead package

The present invention relates to a singulation device of a bottom lead package, and more particularly, to a singulation device of a bottom lead package for preventing a tie bar of a bottom lead package from lifting during a singulation process.

In general, the singulation process is a final process of cutting a lead in a package manufacturing process and forming a lead in a desired shape, and then cutting the tie bar connected to the lead frame to separate it into individual units in the lead frame. Say

As shown in FIG. 1, a conventional singulation apparatus for performing such a singulation process includes a punching die 1 on which a package P is placed on an upper surface, and an upper side of the punching die 1. The punch 2 which cuts the tie bar T of the package P, and the conveying means which pick-up and convey the package P which cut | disconnected the tie bar T individually.

The conveying means includes a suction pad (3) for sucking a package in which the cutting operation of the tie bar (T) is completed, and a cylinder (4a) connected to the suction pad (3) to raise and lower the suction pad (3). (4) and a conveying part 5 for conveying the package P adsorbed by the suction pad 3 along the linear belt (not shown) to the tray.

In the conventional singulation device configured as described above, the package P for carrying out the singulation process is seated on the upper surface of the punching die 1, and the punching die 1 has a predetermined height by a driving force of a driving motor (not shown). As it rises, the tie bar T is cut by the punch 2 located above.

The individually separated package P is horizontally moved by the transfer means connected to a linear belt (not shown) and then transferred to a tray (not shown).

However, the bottom lid package P is conventionally supported by the tie bar T when the bottom die is exposed and the punching die 1 is raised to cut the tie bar T by the punch 2. Since there is no means for this, there is a problem that the tie bar (T) is excited as shown in FIG.

Accordingly, the present invention has been made to solve the above-described problems of the prior art, and provides a bottom lid package singulation apparatus that can reduce the failure rate of the package by preventing the tie bar from lifting during cutting of the tie bar. The purpose is.

1 is a schematic view showing a single device of the bottom lid package according to the prior art.

Figure 2 is a perspective view showing a package in a state in which the tie bar is cut by using the conventional singulation device.

Figure 3 is a schematic view showing a single device of the bottom lead package according to the present invention.

Figure 4 is a schematic diagram showing the operation of cutting the tie bar of the package by using a singulation device according to the present invention.

** Explanation of symbols for main parts of drawings **

11; Punching dies 12; punch

13; Adsorption pad 14; cylinder

16; Clamp 17; cylinder

A punching die in which a package for cutting a tie bar is mounted on an upper surface thereof, a punch for cutting a tie bar of a package mounted on an upper surface of the punching die when the punching die is raised, to achieve the object of the present invention; It is characterized in that it comprises a lifting means for supporting the tie bar when the tie bar is cut to prevent the tie bar from lifting, and a transfer means installed on the upper side of the punching die to transfer the package is completed cutting the tie bar. It provides a single lead device of the bottom lead package.

Hereinafter, the singulation device of the bottom lead package according to the present invention will be described according to the embodiment shown in the accompanying drawings.

As shown in FIG. 3, the singulation device according to the present invention has a punching die 11 on which a package is seated on an upper surface thereof, and is installed above a predetermined height of the punching die 11 to raise the punching die 11. The punch 12 which cuts the tie bar T of the package P mounted on the upper surface, and presses the tie bar T of the package P at the time of cutting | disconnecting the tie bar T by the tie bar T It is composed of lifting means for preventing the tie bar (T) remaining in the package (P) after the cutting of the lifting, and the conveying means for transporting the package (P) is completed cutting the tie bar (T).

The lifting preventing means is lowered at the time of cutting the tie bar (T) to support the tie bar (T) 16, and the upper side of the clamp 16 is installed by connecting the cylinder rod (17a) to the clamp (16) It is composed of a cylinder 17 for raising and lowering.

The conveying means includes a suction pad 13 for absorbing the package P separated by the tie bars T and individually transported to the tray, and a cylinder rod 14a on the upper side of the suction pad 13. Is connected to the cylinder 14 for raising and lowering the suction pad 13 and the transfer unit 15 for transporting the package (P) to the tray by the horizontal movement guided by the linear belt.

The process of performing the singulation process of the bottom lead package using the above-mentioned singulation device is as follows.

First, the package P on which the trimming process and the forming process are completed is mounted on the upper surface of the punching die 11.

The punching die 11 is lifted by the driving force of the drive motor, and the tie bar T is cut by the punch 12 fixed at a predetermined height. At this time, the clamp 16 connected to the cylinder 17 is lowered. Since the tie bar (T) is supported, the tie bar (T) is prevented from being lifted off when the tie bar (T) is cut.

Thereafter, the suction pad 13 is lowered to absorb the package P having completed the tie bar T cutting operation to be transferred to the tray.

As described above, in the bottom lid package singleization device according to the present invention, when the tie bar of the package is cut, a clamp that can support the tie bar is installed so that the tie bar is raised or the excited tie bar is cracked by an external element. This prevents the failure rate of the package.

Claims (2)

A punching die on which the package for cutting the tie bar is seated on the upper surface, a punch installed on the upper side of the punching die to cut the tie bar of the package placed on the upper surface of the punching die, and a tie bar when the tie bar is cut. Lifting means for preventing the tie bar is lifted, and the bottom lid package of the singulation device characterized in that it comprises a conveying means installed on the upper side of the punching die for conveying the package is completed cutting the tie bar. 2. The single lead of the bottom lid package according to claim 1, wherein the lifting prevention means comprises a clamp that presses the tie bar when the tie bar is cut, and a cylinder connected to the upper side of the clamp to raise and lower the clamp. Device.