KR19990085871A - Electronic device with heat transfer pump and cooling device using same - Google Patents

Abstract

The present invention relates to a heat transfer pump for moving a fluid using evaporation and condensation of a fluid by an electronic cooling device, and an electronic device having a cooling device using the same. The heat transfer pump according to the present invention is provided with a first tank and a second tank having a predetermined space, at least one fluid passage connecting the first and second tanks, and injected into the first and second tanks at a predetermined pressure to vaporize and It is characterized in that it comprises a fluid to be condensed, and at least one side of the first and second tanks, and cold and warm means for breaking the temperature balance of the first and second tanks. As described above, the heat transfer pump according to the present invention can move a large amount of liquid without noise and without vibration in a small amount of power.

Description

Electronic device with heat transfer pump and cooling device using same

The present invention relates to an electronic apparatus having a heat transfer pump and a cooling apparatus using the same, and more particularly, to an electronic apparatus having a heat transfer pump and a cooling apparatus using the same by using an evaporation and condensation of the fluid by an electronic cooling device. It is about.

Generally, pumps are used to force fluid movement, and various pumps are well known. For example, a large-capacity pump includes a centrifugal pump, a flanger pump, a diaphragm pump, and the small-capacity pump includes a small pump for an electronic device cooling device disclosed in Korean Patent Application Nos. 96-4676 and 96-2368. have.

The fluid carried by the pump does several things. The most common of these is the transfer of heat. For example, it absorbs heat from a computer and moves it outside, absorbs heat from a boiler and moves it to a room, or absorbs heat from an automobile engine and moves it to a radiator. Pumps that do this are desired to be designed to move large amounts of liquid into noise-free, vibration-free applications with less power.

For example, a pump installed in an electronic device will be described as an example. Heat is inevitably generated in the internal parts of the electronic devices, and a cooling device is installed in the electronic device to discharge the generated heat to the outside.

As is well known, the cooling method having the best cooling performance among electronic device cooling devices is water cooling cooling method. Water-cooled cooling method has excellent cooling performance, but the motor pump that moves the fluid consumes a lot of power and makes a lot of noise. There is a disadvantage that the fluid leaks from the motor pump.

In addition to the electronics industry, a lot of research is being conducted to solve problems such as noise and leakage of fluid in the motor industry, the automobile industry, the building industry, and the heating and cooling industry. In other words, many people are eager for a pump that can move a large amount of liquid to a noiseless, vibration-free, low power.

Accordingly, an object of the present invention is to provide a heat transfer pump capable of moving a large amount of water silently and vibrating semi-permanently with low power, and another object of the present invention is to provide an electronic device cooling apparatus using the fluid pump.

The technical problem of the present invention is to implement a heat transfer pump that can move a large amount of water silently and vibrationless semi-permanently with low power, another technical problem of the present invention is a low-power, noiseless vibration-free electronic device cooling apparatus using the fluid pump To implement

1 is a cross-sectional view of a heat transfer pump according to the present invention.

2 is an exploded perspective view of the heat transfer pump according to the present invention.

3 is a cross-sectional view of the circulation heat transfer pump according to the present invention.

Figure 4 is a perspective view showing another form of the heat transfer pump according to the present invention.

Figure 5 is a partially separated perspective view showing an electronic device having a cooling device using a heat transfer pump according to the present invention.

<Description of Signs of Major Parts of Drawings>

10 ... 1 tank 20 ... 2 tank

30 ... pipe 40 ... thermoelectric element

50 ... Liquid 60 ... Check Valve

90 ... heat transfer pump 100 ... computer base frame

110 Power supply 120 Main board

130 ... HDD 140 ... CPU

150 ... heat sink

The heat transfer pump according to the present invention comprises: a first tank and a second tank having a predetermined space, at least one fluid passage connecting the first tank and the second tank, and the first tank and the second tank in advance. It is characterized in that it comprises a fluid which is injected at a predetermined pressure to vaporize and condense, and cold and warm means installed on at least one side of the first tank and the second tank to break the temperature balance between the first tank and the second tank. In addition, the cold and hot means is characterized in that the thermoelectric element provided between the first tank and the second tank.

An electronic device cooling apparatus using a heat transfer pump according to the present invention includes: a cooling apparatus for cooling an electronic device having at least one heat generating source, an endothermic portion absorbing heat generated from the heat generating source, and transferred from the endothermic portion At least one fluid passage providing a path for fluid to reciprocate between the heat absorbing portion and the heat radiating portion to transfer heat from the heat absorbing portion to the heat radiating portion, A first tank and a second tank installed; Unbalance means for injecting the first tank and the second tank at a predetermined pressure to vaporize and condense, and at least one side of the first tank and the second tank to break the temperature balance between the first tank and the second tank It characterized by having a. In addition, the cold and hot means is characterized in that the thermoelectric element provided between the first tank and the second tank.

As such, an electronic device having a heat transfer pump and a cooling device using the same according to the present invention can move a large amount of water in a low power and noise-free and vibration-free with low power, and use the fluid pump for low power, noise-free vibration-free cooling. It is possible to implement an electronic device cooling device having a device.

Hereinafter, preferred embodiments of the heat transfer pump according to the present invention will be described in detail with reference to the accompanying drawings.

The heat transfer pump according to the present invention is used where the fluid to be moved moves the heat. For example, it is used to absorb heat from electronic devices and move it to the outside, to absorb heat from a boiler and to move it into a room, or to absorb heat from an automobile engine and to move it to a radiator.

1 is a cross-sectional view of a heat transfer pump according to the present invention and Figure 2 is a perspective view of an embodiment. As shown, the heat transfer pump includes a first tank 10 and a second tank 20 into which fluid is injected, a pipe 30 connecting the first tank 10 and the second tank 20, and a first tank. 10 and the temperature imbalance means installed in the second tank (20).

The pressures in the first and second tanks 10 and 20 and the pipe 30 are adjusted to allow the fluid 50 to vaporize and condense at a predetermined temperature. For example, when the fluid is water, the pressure in the first and second tanks 10 and 20 and the pipe 30 may be set lower than atmospheric pressure so that the water may be vaporized and condensed at 100 ° C. or lower.

Both ends 31 of the pipe 30 preferably extend so as to be immersed in the fluid injected into the first and second tanks 10 and 20. This is to ensure that fluid is always injected into the pipe 30. The pipe 30 is provided with a heat dissipation portion 32 and a heat absorbing portion 33. That is, as the fluid 50 moves in the pipe 30, the heat absorbing portion 33 absorbs heat to allow the heat radiating portion 32 to radiate heat. For example, when installed in a boiler (not shown), the heat absorbing portion 33 is installed in the boiler, the heat radiating portion 32 is installed in the room. In addition, when installed in an automobile (not shown), the heat absorbing portion 33 passes through the jacket of the engine, and the heat dissipation portion 32 passes through the radiator.

The unbalance means may be implemented in various forms. The first tank 10 and the second tank 20 are alternately heated by using a heater (not shown) and a power controller, or the first and second tanks are alternately heated and cooled by using a thermoelectric element and a power controller. Just do it. Preferably, heating and cooling are performed simultaneously using a thermoelectric element. That is, when electricity is applied to the thermoelectric element, it becomes cold on one side and hot on the other side. When the direction of application of electricity is reversed, the moving direction of heat is reversed, and the tank that is cold becomes hot, and the tank that is hot becomes cold.

Referring to FIG. 4, the pipe may be configured as a capillary heat pipe 30a. Multiple capillary pipes are stacked so that one end becomes a heat absorbing portion 33 and the other end becomes a heat dissipating portion 32. The liquid passing through the heat absorbing portion 33 absorbs heat, and the liquid passing through the heat absorbing portion releases the absorbed heat.

The heat transfer pump according to the present invention configured as described above is operated as follows.

1 and 2, when electricity is applied to the thermoelectric element 40, which is a temperature unbalance means, the first tank 10 is heated and the second tank 20 is cooled so that the fluid of the first tank 10 Vaporized and the gas of the second tank 20 is liquefied. Therefore, the vapor pressure of the first tank 10 is higher than the vapor pressure of the second tank 20, so that the fluid of the first tank 10 is moved to the second tank 20 through the pipe 30. When the pole of electricity applied to the thermoelectric element 40 is reversely applied, the first tank 10 is cooled, the second tank 20 is heated, and the fluid of the second tank 20 is vaporized and the first tank 10 is heated. Gas is liquefied. Therefore, the vapor pressure of the second tank 20 is higher than the vapor pressure of the first tank 10 so that the fluid of the second tank 20 is moved to the first tank 10 through the pipe 30.

Referring to FIG. 3, two pipes 30 and 30b are installed in the first tank 10 and the second tank 20, and check valves 60 are installed in each pipe 30 and 30b, respectively. It can be seen that. As such, the two pipes 30 and 30b and the check valve 60 allow the liquid to be circulated. In detail, when the liquid is moved along the two pipes 30 and 30b due to the pressure difference between the first tank 10 and the second tank 20, the check valve 60 is operated so that the liquid is in the first tank. (10) → pipe 30 → the second tank 20 → pipe (30b) → the first tank 10 to be circulated.

As described above, the heat transfer pump according to the present invention can move a large amount of water without noise and without vibration with little power.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the electronic device having a cooling device using a heat transfer pump according to the present invention.

Cooling apparatus using a heat transfer pump according to the present invention is any electronic device having a component that generates heat such as a computer, a monitor, a TV, a VCR, a TV projector, a power unit, a projector, a slider, an overhead projector, a refrigerator, a water purifier, a facsimile, It can be used in electronic devices such as a battery of a car.

For example, Figure 5 is a perspective view showing a state in which the electronic device heat dissipation device is installed in a computer. As shown, the power supply unit 110, the main board 120, the auxiliary memory device 110 is installed in the base frame 100 of the computer, the CPU 120 is installed in the main board 120 The heat sink 150 is installed outside the base frame 100.

The electronic device cooling apparatus according to the present invention is installed in the CPU 140, the power supply device 110, and the HDD 130 which is an auxiliary memory device, and mainly cools them. The reason for cooling the CPU 140, the power supply unit 110, the HDD 130, and the like is that the heat generated by itself shortens the life of each device or, when severe, stops the operation. In particular, the HDD 130 is because it is not natural air cooling when sealed by the cover due to noise.

1 and 5, the heat transfer pump 90 of the cooling device is preferably installed in the power supply unit 110. This is because it is easy to supply electricity to the thermoelectric element 40 of the heat transfer pump 90. The heat absorbing portion 33 of the pipe 30 is in contact with the CPU 140, the power transistor (not shown) of the power supply unit 110, the HDD 130, the heat dissipating portion 32 of the pipe 30 is a heat sink ( 150). Therefore, the heat generated in each component is absorbed by the heat absorbing portion 33 of the pipe 30 is naturally radiated through the heat sink 150 in the heat radiating portion 32 of the pipe 30.

According to the experiment of the present inventors, the computer (mainboard: supermicro P5MMA98, CPU: AMD 200MHz, HDD: SAMMSUNG 2.5G) installed with the electronic device cooling apparatus according to the present invention is about 90% of the noise of a conventional forced air-cooled computer. The CPU temperature detected by the motherboard was maintained at about 39 ° C. when the area of the heat sink was 6000 cm 2.

The preferred embodiment of the present invention described by the accompanying reference drawings is only one embodiment. Those skilled in the art will fully understand the preferred embodiments of the present invention to realize a cooling device having a similar type of heat transfer pump and a cooling device using the same. Therefore, the true technical protection scope of the present invention will be defined by the appended claims.

Heat transfer pump according to the present invention can move a large amount of water in a low noise and vibration-free with a small power, and its life is also very long semi-permanent, it is possible to transfer a large amount of liquid even if the diameter of the pipe is small due to the high transport pressure of the fluid. It can also be used to implement a low power, noiseless, vibration-free electronics cooling device.

Claims (14)

A first tank and a second tank having a predetermined space; At least one fluid passage connecting the first tank and the second tank; A fluid which is injected into the first tank and the second tank at a predetermined pressure to vaporize and condense; The heat transfer pump is provided on at least one side of the first tank and the second tank having an unbalance means for breaking the temperature balance between the first tank and the second tank. The method of claim 1, And an end portion of the fluid passage is immersed in the fluid. The method of claim 1, The fluid passage is a heat transfer pump, characterized in that the pipe is a plurality of overlapping tubular heat pipe. The method according to any one of claims 1 to 3, The unbalance means includes a thermoelectric element installed between the first tank and the second tank, and a controller for controlling electricity applied to the thermoelectric element. The method according to any one of claims 1 to 3, The unbalance means includes a coil installed in the first tank and the second tank to generate heat when electric power is applied, and a controller to alternately apply electricity to the coil. The method of claim 4, wherein At least two fluid passages are formed between the first tank and the second tank, and the check valve is installed in the at least two fluid passages, characterized in that the fluid is circulated. The method of claim 5, At least two fluid passages are formed between the first tank and the second tank, and a check valve is installed in the at least two fluid passages to circulate the fluid. A cooling device for cooling an electronic device having at least one heat generating source, An endothermic portion that absorbs heat generated from the heat generating source; A heat dissipation unit for dissipating heat transferred from the heat absorbing unit; At least one fluid passage providing a passage for moving fluid between the heat absorbing portion and the heat radiating portion to transfer heat from the heat absorbing portion to the heat radiating portion; A first tank and a second tank installed on the fluid passage portion; A fluid which is injected into the first tank and the second tank at a predetermined pressure to vaporize and condense; The electronic device having a cooling device using a heat transfer pump, characterized in that provided on at least one side of the first tank and the second tank and an unbalance means for breaking the temperature balance between the first tank and the second tank. The method of claim 8, And an end portion of the fluid passage is immersed in the fluid. The method of claim 8, The fluid passage is a heat transfer pump, characterized in that the pipe is a plurality of overlapping tubular heat pipe. The method of claim 8, wherein The unbalance means includes a thermoelectric element installed between the first tank and the second tank, and a controller for controlling electricity applied to the thermoelectric element. The method of claim 8, wherein The unbalance means includes a coil installed in the first tank and the second tank to generate heat when electric power is applied, and a controller to alternately apply electricity to the coil. The method of claim 11, At least two fluid passages are formed between the first tank and the second tank, and at least two fluid passages are provided with check valves to circulate fluid, wherein the electronic device has a cooling device using a heat transfer pump. . The method of claim 12, At least two fluid passages are formed between the first tank and the second tank, and at least two fluid passages are provided with check valves to circulate fluid, wherein the electronic device has a cooling device using a heat transfer pump. .