KR19990082585A - Manufacturing method and apparatus for plasma display - Google Patents

Abstract

In the method of manufacturing a plasma display, a phosphor layer is formed on a substrate on which a plurality of partitions are formed, thereby continuously discharging a phosphor paste containing a phosphor split and an organic compound onto the substrate through a nozzle having a plurality of discharge ports, and then on the substrate on which a plurality of partitions are formed. It is characterized by forming a phosphor layer.

Three kinds of phosphor pastes each containing phosphor divisions emitting red, green or blue light are used in the gaps between the partitions formed in a straight line from the nozzle, and then a phosphor layer is formed by heating the paste.

The apparatus for manufacturing a plasma display provides a table for holding a partitioned substrate, a nozzle in contact with a partition of a substrate, a nozzle having a discharge opening, a method of providing a phosphor paste to the nozzle, and a method of moving a table and a nozzle relative to each other. It features.

Description

Manufacturing method and apparatus for plasma display

In the plasma display, discharge is caused in a discharge space formed between the front plate and the back plate. By this discharge, ultraviolet rays centered on the wavelength of 147 nm are generated from the xenon gas, and the ultraviolet rays excite the phosphor to enable display. By discharging the discharge cells dried by applying a phosphor that emits RGB light by a driving circuit, it becomes possible to cope with full color display.

In addition, the AC plasma display, which is being actively developed recently, is matched with a front glass substrate on which display electrodes / conductor layers / protective layers are formed, and a rear glass substrate on which address electrodes / conductor layers / binder layers / phosphor layers are formed. It has a structure in which a mixed gas of He-Xe or Ne-Xe is sealed in a discharge space partitioned by stripe-shaped partition walls.

Conventionally, the screen printing method using the phosphor paste which consists of phosphor powder and binder resin has been mainly used as a method of forming the phosphor layer of RGB required for a plasma display. In this method, openings are provided in screen meshes in accordance with the partition wall spacing, and the paste is applied to the screen plate that is blocked by an emulsion at other parts of the screen mesh, and the portion where phosphor paste is required, that is, between partition walls. Only the screen mesh is transferred.

In Japanese Patent Laid-Open No. 6-5205, after screen printing, a method of using sandblasting is used, and in Japanese Patent Laid-Open No. 5-144375, a method of screen printing after applying a crosslinking agent, respectively. It is proposed.

However, the method of using screen printing has a drawback that it is difficult to form a phosphor layer that is low in precision and can cope with a high-precision plasma display because the shape of the screen plate changes during repeating printing. There is a problem that the cost becomes high because it is necessary to replace the in-screen board frequently.

Moreover, as a method of forming the phosphor layer corresponding to a high precision plasma display, the method of using the photosensitive fluorescent substance paste which mixed the fluorescent substance powder and the binder resin which has photosensitivity is also known. This method is a method in which the photosensitive paste is completely coated on the substrate on which the barrier ribs are formed, partially irradiated with a port mask, and then formed after the soluble and insoluble portions of the developer are formed to leave the necessary portions. However, in this method, since each color phosphor layer of red (R), green (G), and blue (B) is formed, a complicated process such as three times of RGB coating, exposure, development, and drying is required.

Moreover, this method also has the drawback that there is a large loss of phosphor paste, and has a problem that it is expensive. In addition, a method of forming a phosphor layer by ejecting the phosphor paste from the tip of the inkjet nozzle is also proposed, but in this case, it is necessary to eject the paste from the tip of the inkjet nozzle having a small diameter. It was necessary to make viscosity into 0.2 poise or less. For this reason, since the amount of phosphor powder in the paste cannot be increased, there is a drawback that the thickness of the phosphor layer cannot be controlled. Moreover, this method also has a problem that the phosphor powder is clogged in the ink jet nozzle, and has not been practically used.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel method and apparatus for manufacturing a plasma display, which is suitably used as a display for a wall-mounted television or an information display.

Recently, with the development of multimedia, the role of the display for displaying various kinds of various information is increasing. Accordingly, there is a demand for larger displays and thinner displays, and liquid crystal displays have been used in many fields, including notebook type personal computers. However, it is difficult to use a liquid crystal display for large-sized televisions in view of the price and response speed at the time of enlargement. Therefore, as a candidate for a large display, a plasma display is attracting attention.

The present invention relates to means for providing a plasma display capable of forming a phosphor layer corresponding to a high precision plasma display in this field.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a coating apparatus for explaining an example of a coating process of the photosensitive member paste of the present invention.

Fig. 2 is a cross-sectional view for explaining the relationship between the substrate for plasma display of the present invention and the detention for coating.

3 is an overall perspective view showing an outline of an apparatus for manufacturing a plasma display according to an embodiment of the present invention.

FIG. 4 is a schematic diagram for explaining a main part of the apparatus for manufacturing a plasma display shown in FIG.

5 is a perspective view showing an example of the detention used in the present invention.

6 is a perspective view showing an example of another detention used in the present invention.

Fig. 7 is a sectional view and a bottom view showing an example of yet another detention used in the present invention.

8 is a perspective view of an apparatus for manufacturing a plasma display according to another embodiment of the present invention.

Fig. 9 is a side view showing the cleaning device of the discharge port surface of the detention in the apparatus for manufacturing a plasma display of the present invention.

In the above drawings, the symbols each indicate the following.

Explanation of symbols on the main parts of the drawings

2 … Expectations 4. Board

6. Table 7. Suction

8 … Guide groove 9. Slide angle

10... Feed screw 11. connector

12... Bearing 16. AC servo motor

20... Detention 22. holder

24. Horizontal bar 26. Linear Actuator

28. Lifting bracket 29. Telescopic rod

30. Lifting mechanism 32. Y-axis moving bracket

34. Landlord 36. Width moving mechanism

38. Sensor holding 40. Height sensor

41…. Manifold 42. Phosphor paste

44. Discharge port 46. Supply hose

48. Discharge solenoid valve 50. Supply Unit

52... Suction hose 54... Suction solenoid valve

56. Phosphor paste tank 58. Supply controller

60... Full controller 62. Motor controller

64. Sensor bracket 66. Position sensor

68. Position sensor 70. Camera

72. Camera 74. Image processing device

76. Actuator for lifting mechanism 78.. Actuator for Width Moving Mechanism

501... Discharge port 601. pipe

701. Phosphor paste supply port 702. Phosphor Paste Storage

703. Passage portion 704. Outlet

801. Detention 802. Detention

901... Cleaning device 902. Discharge sphere

903... Wiping member 904. Brackets

905... Tray 906... outlet

907... Tube 908. Lift

909... Guide 910. Mobile unit

911. Trestle 912. Bowl Screw

(Embodiment for Carrying Out the Invention)

A plasma display (PDP) mainly consists of a front plate and a back plate, and the rare gas is enclosed between them.

As for the back plate, it is necessary to form a phosphor layer on a substrate on which an electrode for applying a driving voltage or a partition wall for partitioning a discharge gel is formed. In addition, discharge stabilization may be attained by forming a derivative layer on the substrate again. As a board | substrate, glass substrates, such as soda glass, PD200 (made by Asahi Glass Co., Ltd.) marketed for plasma displays, and the board | substrate made from ceramics can be used. The substrate thickness is preferably 1 to 3 mm, preferably 2 to 3 mm glass.

An electrode made of a conductive metal is formed on the substrate. Examples of the electrode material to be used include metal materials containing at least one selected from gold, silver, copper, chromium, palladium, aluminum and nickel. have. Using these metal materials, the required pattern electrode is formed to a thickness of preferably 0.1 to 10 m, more preferably 1 to 5 m.

As a method of forming an electrode pattern, the method of pattern-printing the metal paste obtained by mixing with the said organic powder containing the said metal powder and the cellulose compound represented by ethyl cellulose on a glass substrate using a screen board, or vacuum deposition, After forming a metal film on a glass substrate by sputtering, the etching method using a resist, etc. can be used. In another preferred method, a photosensitive paste obtained by kneading a metal powder and an organic binder component containing a photosensitive organic component is applied onto a glass substrate, followed by pattern exposure using a photomask. After removing the soluble part of, it is a method of forming an electrode by baking at 500-600 degreeC, and a highly precise electrode can be formed with high precision.

On this electrode, light emission can be stabilized by further forming a dielectric layer. The dielectric can be formed by applying a glass paste composed of an organic binder containing a glass powder and a cellulose compound represented by ethyl cellulose, and then firing at 450 to 600 ° C. As a method of forming a partition, various methods are applied.

For example, the glass paste which consists of an organic binder containing a glass powder and the cellulose compound represented by ethyl cellulose can be formed by baking at 450-600 degreeC after multilayer printing in a pattern form using a screen board.

In addition, the barrier rib can be formed by coating the entire surface of the glass paste on the substrate, laminating the dry film resist, masking the pattern formed by ore plate printing, and then firing after grinding by sandblasting. . One of the preferable formation methods of a partition is the method of pattern-forming and baking by photolithographic plate printing using a photomask, after apply | coating the photosensitive glass paste obtained by kneading | mixing glass powder and the photosensitive organic component on the board | substrate. As the partition wall formed, stripe-shaped or lattice-shaped partition walls for partitioning the discharge of each discharge cell are used. However, the stripe-shaped partition walls can be easily formed at low cost.

In particular, according to the present invention, a phosphor layer can be formed on a glass substrate on which a high-precision partition wall is difficult to form in conventional screen printing.

For example, in the case of a stripe-shaped partition wall in which the partition layer has the following preferred dimensions, it is possible to form a phosphor layer free of defects as compared with the screen printing method.

Pitch = 100 to 250㎛

Line width = 15 to 40 µm

Height = 60-170㎛

In the case where a discharge port is set between the partition wall and the partition wall, the image recognition can be further facilitated by making the upper surface of the partition wall formed on the substrate black.

In the present invention, the phosphor layer is formed by discharging a paste containing phosphor powder from a mold having a plurality of discharge ports on the glass substrate on which the partition wall is formed as described above.

As the phosphor powder to be used, a phosphor powder which emits light in red, blue and green is used. As the phosphor powder used in the present invention, for example, in red, Y ₂ O ₃ : Eu, YVO ₄ : Eu, (Y, Gd) BO ₃ : Eu, Y ₂ O ₃ S: Eu, γ-Zn ₃ (PO ₄ ) ₂ : Mn, (ZnCd) S: Ag + In ₂ O ₃ , and the like. In green, Zn ₂ GeO ₂ = M, BaAl ₁₂ O ₁₉ : Mn, Zn ₂ SiO ₄ : Mn, LaPO ₄ : Tb, ZnS: Cu, A1, ZnS: Au, Cu, A1, (ZnCd) S: Cu, A1 , Zn ₂ SiO ₄ : Mn, As, Y ₃ Al ₅ O ₁₂ : Ce, CeMgAl ₁₁ O _19: Tb, Gd ₂ O ₂ S: Tb, Y ₃ Al ₅ O _12; Tb, ZnO: Zn, etc. are mentioned. In blue, Sr ₅ (PO ₄ ) ₃ Cl: Eu, BaMgAl ₁₄ O ₂₃ : Eu, BaMgAl ₁₆ O _27: Eu, BaMgAl ₁₄ O ₂₄ : Eu, ZnS: Ag + red pigment, Y ₂ SiO ₃ : Ce, and the like. Can be.

Further, in the present invention, itium (Y) gardium (Gd) and lutetium (Lu) in at least one element selected from the group consisting of triumium (Tm), terbium (Tb) and europium (Eu). Tantalic acid rare earth phosphors substituted with at least one parent constituent rare earth element selected from are used. A preferred tantalum rare earth-like fruit is a europium-activated yttrium fluorescent substance represented by the composition formula Y _1-x Eu _x TaO ₄ (wherein X is approximately 0.005 to 0.1). Europium-activated yttrium phosphate is preferred for the red phosphor, and for the green phosphorus, terbium-activated yttrium phosphate is represented by the composition Y _1-x Tb _x TaO ₄ (wherein X is approximately 0.001 to 0.2). This is preferred. As the blue phosphor, trium-activated yttrium tantalate is preferable in which the tantalum rare earth phosphor is represented by Y ₁ - _x Tb _x TaO ₄ (wherein X is approximately 0.001 to 0.2). The green phosphor has a manganese-activated zinc phosphor (Zn ₂ SiO ₄₎ having an average particle diameter of 2.0 μm or more and 8.0 μm or less, in which Mn is 0.2% by weight or more and less than 0.1% by weight with respect to the zinc silicate (Zn ₂ SiO ₄ ) matrix amount. Manganese _- activated zinc silicate represented _by : Mn) and the general formula (Zn _1-x Mn _x ) O.αSiO ₂ , wherein X and α are in the range of 0.01 ≦ X ≦ 0.2 and 0.5 <α ≦ 1.5. Phosphor is preferred.

The particle diameter of the phosphor powder used in the above is selected in consideration of the line width, line spacing and thickness of the phosphor layer pattern to be reduced, but the 50 wt% particle diameter is 0.5 to 10 µm and specific surface area is 0.1 to 2 It is preferable that it is m <2> / g. More preferably, 50 weight% particle diameter is 0.5-5 micrometers, and specific surface area is 0.2-1.0 m <2> / g. When the particle diameter and the specific surface area are in this range, since the kneading property of the paste can be improved and a compact phosphor layer can be formed, the luminous efficiency is improved and the long life is preferable. When the particle diameter of the powder is less than 0.5 µm and the specific surface area is 2 m 2 / g or more, the lifetime until the powder is so small that the luminance of light emission decreases is shortened.

As the shape of the phosphor powder, a polyhedral (granular) powder is preferably used, but a powder without aggregation is preferable. Especially, since spherical powder can form a dense fluorescent substance layer, it has the advantage of improving luminous efficiency, and furthermore, since it is possible to reduce the influence of scattering at the time of exposure, it is preferable. It is preferable that the sphericity of the phosphor powder has a particle shape of 80% or more. More preferably, the sphericity is 90% or more. When the sphericity is less than 80% by number, it becomes difficult to obtain a high precision pattern under the influence of scattering by the phosphor powder during ultraviolet exposure. The measurement of the sphericity is carried out by photographing a phosphor powder at a magnification of 300 times with an optical microscope, and counting the countable particles among them, so that the proportion of spherical powder is set as the sphericity.

The organic component used in the present invention includes a binder resin, a solvent, and additives such as a plasticizer, a dispersant, and a leveling agent, as necessary.

Specific examples of the binder resin include polyvinyl butyral, polyvinylacetate, polyvinyl alcohol, polyethylene, silicone polymer (eg, polymethylsiloxane, polymethylphenylsiloxane), polystyrene, butadiene / styrene copolymer, polystyrene, polyvinylpyrrolidone, Polyamides, high molecular weight polyethers, copolymers of ethylene oxide and propylene oxide, polyacrylamides and various acrylic polymers (e.g. sodium polyacrylate, polylower alcohol acrylates, polylower alkyl methacrylates, and lower And various high polymers and multipolymers of alkyl acrylates and methacrylates, etc. Moreover, as a preferable binder resin, a cellulose compound, (for example, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, methyl hydroxyethyl Vine after baking by using cellulose) It is possible to form a phosphor layer with less remaining.

Specific examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, glyceline and the like.

Specific examples of the solvent include terpineol, isobutyl alcohol, isopropyl alcohol, benzyl alcohol, 2-phenoxyethanol, γ-phenylaryl alcohol, dimethylbenzyl carbinol, β-phenylethyl alcohol, methyl cellosolve, ethyl Alcohol solvents such as cellosolve and butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, tetrahydrofuran, butyl carbitol acetate, dimethyl sulfoxide, γ-butyrolactone , Bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and the like, and an organic solvent mixture containing at least one of them is used. In particular, the alcohol solvent is advantageous in that the powder is dispersed. Especially, terpineol is especially preferable. Moreover, the viscosity of a paste becomes easy by mixing and using another alcohol solvent, such as terpineol and benzyl alcohol.

The above-mentioned phosphor powder, binder and solvent are mixed and kneaded at a desired ratio to produce a phosphor paste. Preferably, a paste having a viscosity of 2 to 50 Pa · S is used to apply the paste so that It is easy to adjust thickness and it is effective because it raises brightness and uniformity of a display.

When the phosphor paste having a weight ratio of the phosphor powder and the binder resin is 6: 1 to 3: 1, the uniformity of the thickness can be further increased when producing a high-precision PDP. The preferred paste is composed of 30 to 60% by weight of phosphor powder, 5 to 20% by weight of binder resin, and 20 to 65% by weight of solvent, which emit light of one color of red, green or blue. Thus, a phosphor layer having a uniform thickness can be formed on the partition wall side and the bottom of the discharge space, regardless of the drying conditions after the paste coating.

Also, with respect to the composition of the paste, when the partition height of the plasma display to be produced was H 占 퐉, the barrier pitch P 占 퐉, and the partition line width W 占 퐉, the ratio a (vol%) of the phosphor powder contained in the phosphor paste was By setting it as the composition which the relationship of following formula holds, it is possible to form the phosphor layer of uniform thickness in the partition side surface and the bottom of discharge space.

(2H + P-W) × 5 ≦ H × (P-W) × a ≦ (2H + P-W) × 30

In the present invention, the coated portion and the uncoated portion can be easily distinguished by adding an organic dye in the phosphor paste. In this case, the defect inspection after application | coating becomes easier by adding an organic dye which develops a different color to each phosphor layer of RGB. As organic dyes, leuco dyes, azo dyes, amino ketone dyes, xanthene dyes, quinoline dyes, amino ketone dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes, tria A true type, p-amino benzoic acid dye, etc. can be used. Specifically, Sudan Blue, Sudan 4, Victoria Pure Blue, Nile Blue, Brian Green, Neutral Red, Methyl Violet and the like can be used.

In the present invention, a photosensitive phosphor paste containing a photosensitive compound can be used as the binder resin. By using the photosensitive fluorescent substance paste, the fluorescent substance paste which adhered to the unnecessary part by exposing and developing using a photomask can be removed. In particular, when the applied phosphor paste adheres to the upper surface of the partition wall or when it sticks out to a cell adjacent to the cell to be coated, light is irradiated only to the portion to be applied, and the portion where the light is not irradiated is removed by development. By doing so, mixing and discharging defects can be prevented.

The organic component containing the photosensitive compound used for the photosensitive phosphor paste contains a photosensitive component selected from at least one of a photosensitive polymer, a photosensitive monomer, and a photosensitive oligomer, and, if necessary, a photopolymerization initiator and a sensitizer ultraviolet absorber. Additives such as these are the ingredients.

As a photosensitive fluorescent substance paste, the paste which consists of 15-60 weight part of organic components, 40-85 weight part of fluorescent substance powder, and 10-50 weight part of solvents is effective at the point which improves thickness uniformity and pattern formation property.

It is preferable that the quantity of the organic component containing the photosensitive compound used by this invention is 15 to 60 weight%. If it is less than 15 weight%, the pattern property will deteriorate because of photosensitive shortage, and when more than 60 weight%, the binder removal property at the time of baking is bad, and it shows the tendency to become a baking short.

The photosensitive component used in the present invention includes a photoinsoluble type photosensitive component. As thing of photoinsolubilization,

(A) containing a functional monomer, oligomer, or polymer having at least one unsaturated group in the molecule,

(B) containing photosensitive compounds, such as an aromatic diazo compound, an aromatic azide compound, and an organic halogen compound, and

(C) So-called diazo resins, such as a condensate of a diazo amine and formaldehyde. In addition, as a light-soluble type,

(D) mixed with inorganic salts or organic acids of diazo compounds, containing quinone diazos,

(E) A phenol and the naphthoquinone 1, 2- diazide- 5-sulfonic acid ester of phenol and a novolak resin which combined quinone diazos with a suitable polymer binder are mentioned.

As the photosensitive component used in the present invention, all of the above can be used, but the photosensitive component of the above-mentioned (A) is particularly preferable. Moreover, in this invention, inorganic fine particles can be mixed and used for the photosensitive paste easily.

The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond. Specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, sec-butyl acrylate, sec-butyl acrylate, isobutyl acrylate and tert-butyl Acrylate, n-pentyl acrylate, aryl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxy triethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2 -Ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobornyl acrylate, 2-hydroxypropyl acrylate, isodecyl acrylate, Isooctylacrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxy Ethylene glycol acrylate, methoxydiethylene glycol acrylate, octapropentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, triloethyl acrylate, arylated cyclohexane sildi acrylate, 1,4-buta Diol diacrylate, 1, 3- butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, di Pentaerythritol monohydroxypentaacrylate, ditrimetholol propane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate Latex, triglycerol diacrylate, tri Tyrol propane triacrylate, acrylamido, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, pendyl acrylate 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, bisphenol A -1 to 5 of ethylene oxide adduct diacrylate, bisphenol A-propylene oxide adduct diacrylate, thiophenol acrylate, benzyl mertan acrylate, and hydrogen atoms of these aromatic rings as chlorine or bromine atoms; Substituted monomer or styrene, p-methyl styrene, o-methyl styrene, m-methyl styrene, chlorinated styrene, bromide styrene, α-methyl styrene, chlorinated α-methyl styrene, brominated α-methyl styrene, chloromethyl styrene , Hydroxymethylstyrene, carboxymethylstyrene, vinylnaphthalene, vinylanthracene, vinylcarbazole, and the molecule of the compound What changed an acrylate part or all to methacrylate, (gamma) -methacryloxypropyl trimethoxysilane, 1-vinyl- 2-pyrrolidone, etc. are mentioned. In this invention, this can use 1 type, or 2 or more types.

In addition to these, the developability after photosensitive can be improved further by adding unsaturated acids, such as unsaturated carboxylic acid, to these photosensitive pastes. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, or acid anhydrides thereof.

Examples of the binder include polyvinyl alcohol, polyvinyl butyral, methacrylic acid ester polymer, acrylic acid ester polymer, acrylic acid ester methacrylic acid ester copolymer, α-methylstyrene polymer, butyl methacrylate resin and the like.

Moreover, the oligomer and polymer obtained by superposing | polymerizing at least 1 sort (s) of the compound which has a carbon-carbon double bond mentioned above can be used. When superposing | polymerizing, it can copolymerize with another photosensitive monomer so that the content rate of these monomers may be 10 weight% or more, More preferably, 35 weight% or more.

As a monomer to copolymerize, the developability after photosensitive can be improved further by copolymerizing unsaturated acids, such as unsaturated carboxylic acid. As a specific example of unsaturated carboxylic acid, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, meleinic acid, fumaric acid, vinyl acetic acid, or these acid anhydrides are mentioned. The acid value (AV) of the polymer or oligomer which has linear groups, such as a carboxyl group, in the side chain obtained in this way becomes like this. Preferably it is 50-180, More preferably, it is the range of 70-140. If the acid value exceeds 180, the developing allowable width is narrowed, and if the acid value is less than 50, solubility in the developing solution of the unexposed part is reduced, so that the developer concentration is increased, and peeling occurs to the exposed part. It is difficult to obtain a precise pattern.

In the present invention, the above-described polymer or oligomer can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity by adding a photoreactive group to the side chain or the molecular end thereof. Preferable photoreactive group has an ethylenically unsaturated group. As an ethylenically unsaturated group, a vinyl group, an aryl group, an acryl group, methacryl group, etc. are mentioned.

In the method of adding such a side chain to an oligomer or a polymer, the ethylenically unsaturated compound, acrylic acid chloride, methacrylic acid chloride, or aryl chloride which has glycidyl group or an isocyanate group with respect to the mercap group, an amino group, a hydroxyl group, or a carboxyl group in a polymer is included. There is a method of addition reaction.

Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, aryl glycidyl ether, glycidyl acrylate, crotonyl glycidyl ether, crotonic acid glycidyl ether, and iso Crotonic acid glycidyl ether, etc. are mentioned.

As an ethylenic unsaturated compound which has an isocyanate group, (meth) acryloyl isocyanate, (meth) acryloyl ethyl isocyanate, etc. are mentioned.

Moreover, it is preferable to add 0.05-1 molar equivalent of the ethylenically unsaturated compound which has glycidyl group and an isocyanate group, acrylic acid chloride, methacrylic acid chloride, or aryl chloride with respect to the mercapto group, an amino group, a hydroxyl group, or a carboxyl group in a polymer.

Specific examples of the photopolymerization initiator include phenzophenone, o-benzoylbenzoate-enhanced methyl, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone , 4-benzoyl-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2-diethoxy acetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, 2-hydroxy-2 -Methyl propiophenone, p-t-butyldichloroacetphenone, thioxanthone, 2-methyloxanthone, 2-chlorothioxanthone, 2-isopropyldioxanthone, diethyl thioxanthone, benzyl, benzyl dimethyl Ketanol, benzyl methoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, anthraquinone, 2-t-butyl anthraquinone, 2-amyl anthraquinone, β-croc anthraquinone, anthrone, benzoan Tron, dibenzosverone, methylene anthrone, 4-azide benzalacetphenone, 2,6-bis (p-azidebenzylidene) cyclohexanone, 2,6-bi (p-azidebenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadiene-2- (o-methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (o- Ethoxycarbonyl) oxime, 1, 3- diphenyl propane trione 2- (o-ethoxycarbonyl) oxime, 1-phenyl-3- ethoxy propane trione 2- (o-benzoyl) Oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propane, naphthalenesulfonyl chloride, chinoline sulfonyl chloride, N-phenylthioacridone, 4, Photoreducible compounds such as 4-azobisisobutyronitrile, diphenyldisulfide, benzothiazoledisulfide, triphenylphosphine, ganpaquinone, carbon tetrabromide, tribromophenylsulfone, benzoin peroxide and eosin, methylene blue And combinations of dyes and reducing agents such as ascorbic acid and triethanolamine. In the present invention, these may be used alone or in combination of two or more.

A photoinitiator is added with respect to a photosensitive component, Preferably it is 0.1-6 weight%, More preferably, it is added in 0.2-5 weight% of range. If the amount of the polymerization initiator is too small, the sensitivity to light becomes dull, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion may be too small.

It is also effective to add an ultraviolet light absorber to the photosensitive paste. By adding a high light absorber with ultraviolet absorption effect, a high aspect ratio, high precision and high resolution are obtained. As an ultraviolet absorber, what consists of organic dyes, especially the organic dye which has a high UV absorption coefficient in the wavelength range of 350-450 nm is used preferably. Specifically, azo dyes, amino ketone dyes, chianthene dyes, quinoline dyes, amino ketone dyes, anthraquinone dyes, benzophenones, diphenylcyanoacrylates, triazines, and p-aminobenzoic acid Dyestuffs etc. are used. The organic dyes are preferred because they do not remain in the insulating film after firing even when added as a light absorbing agent, and the degradation of the insulating film properties due to the light absorbing agent can be reduced. Among these, azo-type and a precursor phenol type dye are especially preferable. The amount of the organic dye added is preferably 0.05 to 5% by weight. If the amount of organic dye is small, the effect of adding the ultraviolet absorber decreases. If the amount of the organic dye is too high, the insulating film properties after firing decrease. The amount of the organic dye added is more preferably 0.15 to 1% by weight.

As an example of the addition method of the ultraviolet absorber which consists of organic pigments, the solution which melt | dissolved the organic pigment previously in the organic solvent is made, Next, after mixing a glass powder in the organic solvent, it is a method of drying. By this method, a so-called capsule-like powder obtained by applying an organic film to individual powder surfaces of the glass powder is produced.

A sensitizer is added in order to improve the sensitivity of the photosensitive paste. As a specific example of a sensitizer, 2, 4- diethyl thioxanthone, isopropyl thioxanthone, 2, 3-bis (4-diethylamino benzal) cyclopentanone, 2, 6-bis (4-dimethylamino Benzal) cyclohexanone, 2, 6-bis (4-dimethylaminobenzal)-4-methylcyclohexanone, Michler's ketone, 4, 4-bis (diethylamino)-benzophenone, 4, 4-bis ( Dimethyl amino) carbon, 4, 4- bis (diethylamino) carbon, p-dimethylamino cinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene)- Isonaphthazole, 1,3-bis (4-dimethylaminobenzal) acetone, 1,3-carbonyl-bis (4-diethylaminobenzal) acetone, 3,3-carbonyl-bis (7-di Ethylaminocoumarin), N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-triethanolamine, N-phenylethanolamine, dimethylamino benzoyl isoamyl, diethylamino benzoyl azoamyl, 3 － The carbonyl benzoyl-5-thio trad sol, 1-phenyl-5, and the like ethoxycarbonyl-thio-tetrazole. In this invention, these can be used 1 type or 2 or more types. Some photosensitive agents can also be used as photopolymerization initiators. When adding a sensitizer to the photosensitive paste of this invention, the addition amount is 0.05-10 weight% normally with respect to a photosensitive component, More preferably, it is 0.1-10 weight%.

If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exerted. If the amount of the sensitizer is too large, the residual ratio of the photosensitive section may be too small.

The photosensitive paste is usually produced by combining and dispersing various components of a phosphor powder, an ultraviolet light absorber, a photosensitive polymer, a photosensitive monomer, a photopolymerization initiator and a solvent so as to have a predetermined composition, followed by mixing and dispersing in a three roller or a kneader.

The viscosity of the paste is suitably prepared by the addition ratio of the phosphor powder, the organic solvent, the plasticizer, and the precipitation inhibitor, but the range is preferably 2 to 5 Pa · S, more preferably 5 to 20 Pa · S.

Next, formation of the phosphor layer of the present invention will be described. The fluorescent substance paste prepared as mentioned above is apply | coated between the partitions (between a partition and a partition) of the board | substrate with which the some partition was provided. FIG. 1 shows a state in which phosphor paste is discharged and applied from a discharge port of a detention between partitions of a substrate provided with an electrode, a dielectric, and a partition. 2 is a figure prepared in order to demonstrate the positional relationship of such a board | substrate and a detention, and is further useful for understanding of this invention demonstrated below.

As the discharge port for discharging the above-mentioned phosphor paste, a metal cap having a discharge hole, a nozzle, a needle having a metal, ceramics, or a plastic cap can be used. As the discharge port, a discharge port having a pore size (inner diameter) of 10 to 500 m can be used, but a preferred pore size is 50 to 500 m. If the pore size is smaller than 10 μm, clogging due to the phosphor powder is likely to occur, and if the pore size is larger than 500 μm, there is a problem that the phosphor paste leaks into neighboring cells upon application to high precision. In addition, adhesion of the phosphor paste to the upper portion of the partition wall can be further suppressed by satisfying the condition of the following formula with the distance S between the adjacent partition walls and the average hole diameter D of the discharge port.

10 μm ≦ D ≦ S ≦ 500 μm

The number of ejection openings (airborne) may use 1 to 600 holes, but 20 to 2000 holes may be preferable. However, when the number of ejection openings is small, it takes too long to apply. Preferably, 150 or more can form the phosphor layer corresponding to the high-precision PDP in a short time. When the number of airflows exceeds 2000 pieces, it becomes difficult to secure the processing accuracy of the discharge port portion, and it becomes difficult to cope with a high-precision PDP. In addition, by setting the number of discharge ports in the range of 16n ± 5 (n is a natural number), it is easy to form a phosphor layer for a PDP that can be driven in a general-purpose circuit.

The pitch of the discharge port is preferably 0.12 to 3 mm. If the thickness is less than 0.12 mm, the gap between the discharge port and the discharge port becomes small. Therefore, it is difficult to manufacture the mold. When the thickness is larger than 3 mm, the coating control is difficult when the glass having the partition wall is coated on the plate at a pitch of 300 mm or less. Done. In addition, the pitch of the discharge port is 3 m times the partition pitch (m is an integer of 1 to 10), whereby the coating can be applied efficiently and accurately. In addition, with respect to the length L of the discharge port and the average pore D of the discharge port, the use of a mold satisfying the following expression improves the discharge property of the paste.

L / D = 0.1 to 600

If the L / D exceeds 600, the pressure loss becomes large, so that the discharge amount of the paste decreases and the thickness of the phosphor layer becomes thin. In addition, when it becomes less than 0.1, the sagging of the paste from the discharge port becomes large.

In order to discharge the phosphor paste from the discharge port, it is preferable to discharge the paste continuously at a predetermined range of pressure. As a result, the discharge amount of the paste can be kept constant, and a stable coating thickness can be obtained.

As shown in Fig. 1, the phosphor paste can be applied while discharging the paste from the discharge port. In this case, the substrate may be fixed and the detention may be driven, or the substrate may be fixed and the substrate may be driven. Or there is no phase light even if both run simultaneously.

When the discharge of the phosphor paste is stopped from the discharge port of the cap, the inside of the cap is brought into a negative pressure state, whereby the paste can be applied without liquid sagging at the coating end and without imbalance in the coating thickness.

In addition, by discharging the phosphor paste after the relative movement starts parallel to the partition on the substrate of the glass substrate and the glass substrate, and discharging is stopped before the relative movement ends, the thickness imbalance due to the liquid droop at the coating end is also suppressed. can do.

The interval between the discharge port leading end portion and the partition upper end portion formed on the glass substrate in the case of discharging is preferably 0.01 to 2 mm, more preferably 0.05 to 0.5 mm. In order to suppress the contact of a discharge port and the upper part of a partition, this space | interval is preferably 0.01 mm or more, or 0.05 mm or more. In order to prevent the paste discharged from the discharge port from breaking, the interval is preferably 2 mm or less, or 0.5 or less.

In addition, by applying a plurality of detention on the device and applying at the same time, it can be applied efficiently in a short time. In this case, it can apply | coat with a uniform thickness by moving several detention | capture at the same speed. In addition, it is possible to apply RGB three colors at once by attaching three or more detentions and discharging a paste containing a phosphor that develops a different color from 23 or more detentions. In addition, the phosphor paste of three colors can be discharged from one mold. In this case, by mixing the shortest intervals of the discharge ports for discharging the phosphor pastes of different colors into 600 mm or more, it is possible to prevent color mixing of the respective phosphors of RGB.

In the case where the phosphor layer is formed on the high-precision bulkhead, the color is applied to each color and the drying process is performed every time one color is applied, whereby color mixing can be prevented.

In the present invention, after the phosphor paste is discharged from the discharge port, the phosphor layer is formed by evaporating or decomposing and removing water, an organic solvent, an organic component, or the like using a heating step such as a drying step or a firing step. Can be.

In this case, the phosphor coating surface is usually dried up, but the phosphor coating surface may be dried down. By lowering the phosphor coating surface, a phosphor layer can be formed on the partition wall side by the phosphor paste along the partition surface side. By forming the phosphor layer not only at the bottom between the partition walls but also at the partition wall side surface, the area of the phosphor surface can be increased, and the luminance of the plasma display can be improved.

In addition, by using the photosensitive phosphor paste as the phosphor paste, pattern processing by ore plate printing becomes possible. In this case, the phosphor formed through the application process is effective for removing the phosphor formed at an unnecessary portion such as the upper portion of the partition wall.

After discharging and applying the RGB photosensitive phosphor paste from the discharge port, it is exposed through a photomask, and the paste of the exposed portion is solubilized or insolubilized with the developer to remove the unnecessary portion in the developing process, and the tongue The body layer can be formed. The developing solution can use the organic solvent in which the organic component in a photosensitive paste is soluble. Moreover, you may add water to the organic solvent in the range in which the solvent power is not lost. When there exists a compound which has acidic groups, such as a carboxyl group, in a photosensitive paste, it can develop with alkaline aqueous solution. As the alkaline aqueous solution, a metal alkaline aqueous solution such as sodium hydroxide or calcium hydroxide can be used, but an organic alkaline aqueous solution is preferred because it is easy to remove the alkali component during firing.

As the organic alkali, an amine compound can be used. Specific examples of the amine compound include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine, and the like. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the unexposed portion is difficult to remove. If the alkali concentration is too high, the pattern portion may be peeled off and the exposed portion may be corroded, which is not preferable. Moreover, it is preferable in process control that the developing concentration at the time of image development shall be 20-50 degreeC.

The thickness of the phosphor layer satisfies the following relationship between the thickness T1 and the bottom portion T2 of the phosphor layer on the side surface (at half of the partition thickness), whereby a plasma display excellent in luminance can be produced. have.

10≤T1≤50㎛

10≤T2≤50㎛

When T1 or T2 is less than 10 µm, since ultraviolet rays generated from the discharge escape the phosphor layer, it is difficult to obtain sufficient luminance, and when the thickness exceeds 50 µm, problems such as high discharge voltage arise.

In addition, it is preferable that T1 and T2 satisfy the following formula.

0.2≤T1 / T2≤5

If the thickness ratio of the side surface and the bottom portion is excessive or excessive, the dependence of the viewing angle is likely to occur on the display screen, and there is a problem in making the large screen.

After apply | coating fluorescent substance paste to a predetermined | prescribed position, an organic component can be removed by baking in a kiln and a fluorescent substance layer can be formed. The minor component risk and temperature vary depending on the type of paste or substrate, but are fired in an atmosphere such as nitrogen or hydrogen in the air. The firing temperature is preferably 300 to 550 ° C, more preferably 350 to 500 ° C.

In the case where the fluorescent material is attached to the upper surface of the partition wall, discharge leakage occurs due to the fact that each cell is not sufficiently intercalated at the partition wall when sealing together with the front plate. Therefore, the fluorescent material attached to the upper surface part is attached to the adhesive. The removal method can be used.

In order to completely remove an organic component, it is necessary to raise it to 300 degreeC, Preferably it is 350 degreeC, but in order to suppress deterioration of fluorescent substance by heat, it is set to 550 degreeC or less, Preferably it is 500 degrees C or less. As a predetermined method, a batch type firing furnace or a belt type or a roller type continuous firing furnace can be used.

Thus, the board | substrate with which the fluorescent substance layer was formed is matched with the glass substrate of the front surface, and is sealed. On the front panel, a discharge holding electrode made of ITO and a bus electrode, a derivative made of a glass layer, and a protective film (usually magnesium oxide) for protecting the dielectric from discharge are formed, and if necessary, a color filter, a black matrix, or a black stripe. Is formed. Sealing of the front plate and the back plate is carried out using glass frit or the like.

Next, a panel portion of the plasma display is manufactured by enclosing rare gases such as helium, neon and xenon between the front plate and the back plate. Furthermore, a plasma display can be manufactured by mounting a driver IC for driving. In addition, display driving is possible by matrix driving the electrodes of the front plate and the back plate.

Next, an apparatus for applying the phosphor paste of the present invention will be described. The apparatus for manufacturing a plasma display according to the present invention includes a metal table having a table on which a plurality of partitions are formed, and a plurality of discharge ports corresponding to the partition arrangement for forming a phosphor paste in a stripe shape between partitions on the substrate. The apparatus provided can be used.

3 is an overall perspective view of the apparatus for manufacturing a plasma display according to the embodiment of the present invention, and FIG. 4 is a schematic diagram of the periphery 20 of the table 6 in FIG. 3 and for explaining the main part of the apparatus. .

3 and 4, a pair of guide groove rails 8 are provided on the base 2, and a table 6 is disposed on the guide groove rails 8. A plurality of suction holes 7 are provided in the table 6, and the substrate 4 holding the partition walls having a constant pitch is fixed to the surface of the table 6 by vacuum suction. Moreover, the board | substrate 4 raises and lowers the table 6 by the lift pin which is not shown in figure. Further, the table 6 is free to reciprocate in the X-axis direction on the guide groove rail 8 via the bottom portion 9 supporting the slide.

Between the pair of guide groove rails 8, the feed screw 10 constituting the delivery screw mechanism extends through the connector 11 which is a nut shape fixed to the lower surface of the table 6. Both ends of the feed screw 10 are rotatably supported by the bearing 12, and one end thereof is connected to the AC servomotor 16.

Above the table 6, a metal fitting 20 for discharging the phosphor paste is connected to the lifting mechanism 30 and the widthwise movement mechanism 36 via the holder 22. The elevating mechanism 30 includes an elevating bracket 28 that is capable of elevating, and the elevating bracket 28 is installed on the pair of guide rods in the casing of the elevating mechanism 30. In this casing, a feed screw (not shown), which is located between the guide rods and made of a threaded screw, is also disposed to rotate, and is connected to the lifting bracket 28 via a nut-shaped connector. Furthermore, an AC servomotor (not shown) is connected to the upper end of the feed screw (not shown), and the lifting bracket 28 can be arbitrarily lifted and operated by the rotation of the AC servomotor.

Further, the elevating mechanism 30 is connected to the widthwise moving mechanism 36 via the Y-axis moving bracket 32. The width direction movement mechanism 36 moves the Y-axis movement bracket 32 reciprocally in the Y-axis direction. The guide rod, feed screw, nut type connector, AC servo motor, etc. necessary for the operation are arranged in the casing to be the same as the lifting mechanism 30. The width direction movement mechanism 36 is fixed on the base 2 by the support | pillar 34. As shown in FIG.

By these configurations, the detention 20 can be freely moved in the Z-axis and Y-axis directions. Although the cage 20 extends horizontally in the direction orthogonal to the reciprocating direction of the table 6, and eventually in the Y-axis direction, the holder 22 which holds this directly is a rotating material in the lifting bracket 28. It can be rotated in the direction of the arrow of FIG. 3 in a vertical plane.

The horizontal bar 24 located above the holder 22 is also fixed to the lifting bracket 28. At both ends of the horizontal bar 24, an electronically actuated linear actuator 26 is provided. The linear actuator 26 has telescopic rods 29 protruding from the lower surface of the horizontal bar 24, and the telescopic rods 29 come into contact with both ends of the holder 22 to rotate the holder 22. As shown in FIG. An angle can already be produced, and as a result, the inclination of the detention 20 can be arbitrarily set.

On the upper surface of the base 2, an inverted L-shaped sensor column 38 and a camera column 70 are fixed. At the tip of the sensor column 38, a height sensor 40 for measuring the height of the upper end of the partition wall on the surface of the substrate 4 on the table 6 is provided. In addition, at one end of the table 6, the position sensor 66 is provided via the sensor bracket 64, and this position sensor 66 is the table 6 of the lower end surface in which the discharge port of the detention 20 is located. Detect the position in the vertical direction with respect to

At the tip of the camera support 70, a camera 72 for detecting the origin mark is provided in addition to the position of the partition wall or the partition wall of the surface of the substrate 4 or the partition wall portion. As shown in Fig. 4, the camera 72 is connected to the image processing apparatus 74 in the above manner, and by this camera 72, the position of the partition walls or partition walls of the substrate 4 and the number of partition walls, and The position of the origin mark can be calculated quantitatively.

In FIG. 4, the detention 20 holds the manifold 41, and the phosphor paste 42 is filled into the manifold 41 to discharge the phosphor paste 42 from the discharge port 44. A supply hose 46 is connected to the cap 20, and the discharge electromagnetic conversion valve 48, the supply unit 50, the suction hose 52, the suction electromagnetic conversion valve 54, and the phosphor paste tank 56 ), And so on. The phosphor paste 42 is stored in the phosphor paste tank 56.

The supply unit 50 may be a constant capacity pump such as a piston or a diaphragm, a tubing pump, a gear pump, a mono pump, or a pressure feeding roller for pushing liquid at the pressure of gas.

In response to the control signal from the supply device controller 58, the phosphor paste 42 is sucked from the phosphor paste tank 56 by actuating the supply unit 50 or the respective electromagnetic conversion valves. Can be supplied to

The supply device controller 58 is further connected to the whole controller 60 in the above manner. The entire controller 60 includes a motor controller 62, the input of the height sensor 40, the image processing apparatus 74 of the camera 72, the actuator 76 for the lifting mechanism, and the actuator 78 for the widthwise movement mechanism. All the control information, such as the accuracy from the above, is connected to the above, and is responsible for the whole sequence control. The whole controller 60 may be any mechanism as long as it has a control function, such as a computer and a sequencer.

In addition, the motor controller 62 includes a signal of the AC servomotor 16 for driving the table 6, a signal of the AC servomotor of each of the lifting mechanism 30 and the widthwise movement mechanism 36, and the table 6. The signal from the position sensor 68 which detects the movement position of), the signal from each linear sensor (not shown) of the Y- and Z-axis which detects the operation position of the detention | suction 20, etc. are input. In addition, instead of using the position sensor 68, the encoder may be incorporated in the AC servomotor 16, and the position of the table 6 may be detected based on the valve signal output from the encoder.

Next, a method of applying the phosphor paste using the apparatus for manufacturing this plasma display will be described.

First, when the origin return of each operation part is performed, the table 6 and the detention part 20 respectively move to the position of a standby. At this time, the phosphor paste is already filled from the phosphor paste tank 56 to the detention 20, the discharge electron conversion valve 48 is in an open state, and the suction electron conversion valve 54 is in a closed state. . Then, a lift pin (not shown) rises on the surface of the table 6, and the substrate 5 is placed on the lift pins from a loader not shown.

Next, the lift pins are lowered, the substrate 4 is placed on the table top surface, and the substrate 4 is vacuumed after the positioning of the substrate 4 on the table 6 is performed by an alignment device (not shown). Adsorb.

Next, the table 6 moves until the partition part of the board | substrate 4 comes under the camera 72 and the height sensor 40, and it stops. The camera 72 is pre-positioned so as to cut the partition wall end portion on the substrate 4 positioned on the table 6, and detects the position between the partition walls at the first end by image processing, and the reference point of the camera 72 is detected. The distance at was calculated. On the other hand, the distance between the reference point of the camera 72 and the discharge port 44 located at the shortest end of the cap 20 at the predetermined Y-axis coordinate position is measured at the time of prior adjustment, and the entire controller 60 as information. Is entered. Therefore, when the distance between the camera reference point and the partition wall is transmitted to the image processing apparatus 7, the discharge hole 44 of the shortest part of the detention part 20 calculates the Y-axis coordinate value which is extended between the partition walls of the partition part end part, and the detention part 20 ) To the position. As a result, the centers of all the ejection openings of the caps 20 are moved above the respective partition walls for applying the phosphor paste, and the relative positioning of the caps 20 and the substrate 4 is completed.

In addition, as another positioning method, there is also a method in which the camera 72 detects an origin mark that is other than the partition portion on the substrate 4. The distance between the camera reference point and the discharge port 44 located at the shortest end of the cap 20 and the distance between the origin mark and the partition wall to be applied are measured at the time of prior adjustment, and are input to the entire controller 60 as information. have. Therefore, when the distance between the camera reference point and the origin mark is transmitted to the image processing apparatus 74, the detention 20 is moved to the position to be applied.

In addition, as a method of calculating the distance between the camera reference point and the discharge port of the cap 20, the phosphor paste is discharged from the cap 20 to form a stripe of the phosphor paste on a smooth substrate having a flat surface, and the position of the stripe is The position may be measured and measured in the image processing, and the absolute position may be calculated. As a result, since the position of the discharge port of the cap 20 can be known, the absolute position of the cap can be calculated as a result. By this method, it can also apply | coat with the discharge opening of the metal mold | die 20, between the partitions of the surface of the board | substrate 4.

The height sensor 40 detects the position in the vertical direction of the partition upper end of the substrate 4, and calculates the height of the partition upper end of the substrate 4 from the difference in position with the table top surface. At this height, the distance from the outlet portion of the inlet 20 previously provided to the upper end of the partition wall of the substrate 4 is added to calculate the value to be lowered on the Z-axis linear sensor of the inlet 20. Move the detention 20 to position. Thereby, even if the position of the partition upper end part of the board | substrate 4 on the table 6 changes for every board | substrate, the space | interval from the discharge port part of the detention part 20 which is important for application | coating to the partition upper end part of the board | substrate 4 will always be constant To maintain.

The height sensor 40 to which the present invention can be applied may be any type of measuring device such as a non-contact measurement type using a laser or ultrasonic wave or a contact measurement type using a dial gauge or differential transformer. good.

Next, the operation of the table 6 toward the detention part 20 is started, and before the application start position of the substrate 4 reaches under the discharge port portion of the detention part 20, the table 6 is applied to a predetermined application speed. )). The distance between the operation start position and the application start position of the table 6 must be sufficiently secured so that the table 6 can accelerate to the application speed.

Furthermore, the position sensor 68 which detects the position of the table 6 is arrange | positioned in the place until the application start position of the board | substrate 4 reaches the discharge port part of the detention | base_side down, and the table 6 When () reaches this position, the operation of the supply unit is started and the supply of the phosphor paste 42 to the detention 20 is started. It is also possible to connect the encoder to a motor or feed screw instead of the position sensor 68 and to detect the position by the value of the encoder.

Application of the phosphor paste is carried out until the application end position of the substrate 4 comes to the bottom of the discharge port portion of the cap 20. That is, since the board | substrate 4 is always placed in the fixed position on the table 6, the position sensor or its encoder value is placed in the position of the table 6 corresponding to the position where the application | coating end position of a board | substrate is just underneath. After setting in advance, when the table 6 comes to the corresponding position, the supply controller 58 is given a stop command from the entire controller 60 to stop the supply of the phosphor paste 42 to the detention 20. At this time, the supply of the phosphor paste may be cut off completely by raising the cap 20.

In the case where the phosphor paste 42 is a relatively high viscosity liquid, it is difficult to stop the discharge from the discharge port of the cap 20 at the moment by the action of the residual pressure only by stopping the supply of the paste. Therefore, while supplying the phosphor paste 42 is stopped, the pressure of the manifold 41 of the detention 20 is made atmospheric pressure. Alternatively, the discharge of the phosphor paste from the discharge port can be stopped in a short time by sucking the phosphor paste at the discharge port of the die 20 with the pressure of the manifold 41 at a negative pressure. As a means for setting the pressure of the manifold 41 to a negative pressure, when the pump is used for the supply unit 50, the pump may be operated in the reverse operation and eventually in the direction of sucking the phosphor paste. The pressure of the manifold 41 may be made negative so that a vacuum source may be associated with the supply unit 50.

As another means for setting the pressure of the manifold 41 to negative pressure, an electron conversion between the discharge electron conversion valve 48 and the detention 20 or between the detention 20 itself and the vacuum source is in contact with the vacuum source. By installing a valve, the pressure can be made negative by this conversion.

At this time, if the pressure of the vacuum source can be adjusted from the atmospheric pressure to any negative pressure, the speed at which the phosphor paste 42 is sucked at the discharge port can be adjusted. As a vacuum source, there exists a thing which reversely operates a vacuum pump, an inhaler, and a piston type pump.

The timing of these pressure adjustments can be controlled by the supply controller 58 and the entire controller 60.

The table 6 continues to operate even after passing through the application end position, and stops for the first time after reaching the end position. At this time, if the part to be applied still remains, the detention 20 is moved in the Y-axis direction to the next starting position to be applied, except that the table 6 is moved in the opposite direction. Application is carried out in the same procedure. When applying in the moving direction of the same table 6 as the first time, the detention 20 moves in the Y-axis direction to the next starting position to be applied, and returns the table 6 to the X-axis ready position.

After the coating process is completed in this way, the table 6 is moved and stopped to the place where the substrate 4 is removed from the unloader, the release of the substrate 4 is released, and the air is released. The board 4 is lifted off from the surface of the table 6 by raising the pins.

At this time, the lower surface of the board | substrate 4 is hold | maintained by the unloader which is not shown in figure, and a board | substrate is conveyed to the next process. After moving the substrate 4 to the unloader, the table 6 returns to the home position by lowering the lift pins.

At this time, the discharge electron conversion valve 48 is closed, the suction electron change valve 54 is opened, and the supply unit 50 is operated so that one substrate of the substrate is discharged from the phosphor paste tank 56. The phosphor paste 42 in an amount necessary for the application is supplied to the detention 20.

In the above application step, in order to improve the coating thickness precision in the given effective area, the timing of the start of supplying the phosphor paste to the detention 20 at the application start position, and the supply of the phosphor paste to the detention 20 at the application end position Since the timing of stopping becomes important, each operation must be performed at an optimal point.

In this embodiment of the present invention, the gap value between the discharge port portion of the cap 20 and the upper end of the partition wall of the substrate 4 is set, and then the phosphor paste 42 is started to be supplied. This starts supplying the phosphor paste 42 in the state before setting the distance between them, and the phosphor paste 42 expands to the discharge port portion end face at the time of discharge from the discharge port, contaminating parts other than the discharge port, This is because, if too severe, the inconvenience that the phosphor pastes 42 discharged from the discharge ports of neighbors join together occurs, and application of high precision cannot be achieved. When the tip end surface of the discharge port portion of the cap 20 is brought close to the substrate 4 and the phosphor paste 42 is supplied, the phosphor paste 42 is interposed between the partition walls before the phosphor paste 42 is expanded at the tip surface. Since it is to be guided, such inconvenience does not occur.

In addition, in this embodiment, the application example in the case where the board | substrate 4 moves to an X-axis direction, and the metal mold | die 20 moves to a Y-axis and Z-axis direction was demonstrated, but the metal mold | die 20 and the board | substrate 4 were demonstrated. It is a structure and a form which can move relatively three-dimensionally, and the movement form of a table and a detention may be any.

In addition, although the case where one kind of fluorescent substance paste is apply | coated was demonstrated in detail here, this invention can be applied when applying three colors of fluorescent substance, such as red, blue, and green simultaneously.

5 and 6 are schematic perspective views illustrating the detention used in the present invention. In Fig. 5, a hole having a diameter at a predetermined pitch is provided as the discharge port 501 in the flat surface. In addition, the discharge port may be configured by arranging a pipe 601 having the same shape as in FIG. 6, and in the case of the detention, the detention is hardly contaminated.

Moreover, it is preferable that all the discharge ports of the cap are disposed so that the center thereof is located above each partition wall to which the phosphor paste is applied.

The average hole diameter of the discharge port of the mold is preferably 10 µm or more and 500 µm or less, and preferably equal to or less than the gap between the partition walls, whereby color mixing with neighboring colors can be prevented.

Further, the discharge port shape of the mold is not circular, and the opening length substantially perpendicular to the partition wall is 10 µm or more and 500 µm or less, and may be smaller than the gap between the partitions. The discharge port shape at this time includes long holes, ellipses, rectangles, and the like. In addition, by coating a film of a fluorine-based resin such as polytetrafluoroethylene on the discharge port surface and / or the discharge port inner wall, the formation of the phosphor paste on the discharge port surface and the discharge port inner wall can be improved, and contamination of the discharge port surface can be prevented. Can be.

In addition, by coating the amorphous carbon film (DLC) on the discharge port surface and / or the discharge port inside of the mold, the surface strength of the discharge port surface and the discharge port inner wall is improved, and the wear resistance is improved.

Fig. 7 is a sectional view and a bottom view showing an example of another cage of the present invention. In one detention, a plurality of phosphor paste storage units 704, 705, 706, phosphor paste supply holes 701, 702, 703 for supplying phosphor paste to the phosphor paste storage units 704, 705, 706, storage units 704, 705, 706, and discharge ports 710, 711, 712 are provided. Retaining path portions 707,708, 709 that fluidly connect. Furthermore, as shown in the bottom view, the number is larger than the discharge ports 710, 711, 712, and is arranged in a straight line. Thereby, the phosphor paste of a different kind can be discharged from one set of detention. Moreover, since the shortest distance of the discharge port which discharges fluorescent substance paste of a different color is 600 micrometers or more, mixing with other colors can be prevented.

8 is a schematic perspective view for explaining a main part of an apparatus for manufacturing a plasma display according to another embodiment of the present invention. Not only one piece of detention, but two or more of them may be arranged in the Y direction. The detainers 801 and 802 are driven by a control device (not shown) so as to be driven synchronously or asynchronously with the X and Y directions. As described above, since the application of the phosphor paste to the substrate 4 on the table 6 is shared by two or more groups of detention, the application time can be shortened.

At this time, as the detention of two or more groups, the detention for discharging the phosphor paste emitting the same color, the detention for discharging the phosphor paste for emitting different colors, or the discharging for discharging the phosphor paste emitting in two or more different colors May be either.

In addition, two or more of these detentions are moved to an integer multiple of the partition spacing in the vertical direction with respect to the partition wall direction, and when two or more neighboring positions are "crossed" <"outer dimension of the detention body", they are parallel to the partition wall. Efficient and desirable to stagger in the direction.

Furthermore, by arranging the above three coating apparatuses in series corresponding to red, green, and blue of the phosphor paste, it is possible to efficiently form three-color phosphor layers between partition walls.

9 is a schematic side view illustrating a cleaning apparatus of the discharge port surface of the mold.

The cleaning device 901 is disposed at a position at which the member 903 wiping the discharge port surface 902 of the detention 20 contacts. The wiping member 903 has a shape that encloses the discharge spherical surface end portion, but may be a shape in which only the discharge spherical surface 902 contacts. The wiping member 903 is fixed to the bracket 904 attached to the tray 905 and moves in the width direction (Y axis direction) together with the tray 905. The phosphor paste adhering to the discharge port surface is peeled off by the wiping member 903 moving in the width direction in contact with the discharge port surface 902. The peeled phosphor paste is guided from the discharge port 906 to a waste liquid tank (not shown) via a tube 907 connected thereto. When gravity does not reach the waste tank only by gravity, it is preferable to draw using a vacuum source such as a vacuum pump. Further, the wiping member 903 is located on the right side of the opening of the cap 20 when the tray 905 reaches the right end of No. 1 in FIG. 9, and the phosphor paste discharged from the cap 20 is caught. It is placed in a position not to. The tray 905 has a size capable of recovering all of the phosphor paste discharged from the detention 20.

Furthermore, the tray 905 is connected to the lifting unit 908. The lifting unit 908 moves up and down the moving unit 910 in an up and down direction by an air cylinder (not shown) along the guide 909. When the lifting portion 908 is at the lowest point, the wiping member 903 is at the lowest point and does not contact the discharge port surface 902 of the detention 20 at a predetermined distance. The lifting unit 908 is adjusted to ascend to the place where the wiping member 903 is in contact with the discharge port surface 902 of the cage 20.

The moving unit 910 is driven by the bowl screw 912 and moves in the width direction according to a guide (not shown) on the mount 911. The bowl screw 912 is connected to a servomotor (not shown), and any operation can be performed by this operation control.

The material of the wiping member 903 may be any material, but a resin or rubber is preferable so as not to damage the discharge port surface of the detention, and may be selected in consideration of chemical resistance to the phosphor paste.

The application sequence using this wiping device 901 is as follows. First, while the wiping member 903 is placed at the lowest point, the tray 905 is moved below the cap 20, and the phosphor paste supplying device is operated to discharge the phosphor paste from the cap 20 to bleed. do. After the bleed is finished, the member 903 that lifts and wipes the lifting unit 908 is brought into contact with the discharge port surface 902 of the cage 20. Next, a servomotor (not shown) is driven to move the wiping member 903 to the left side in FIG. 8 in the width direction to wipe off the phosphor paste attached to the discharge port surface 902. Next, the detention 20 is moved to a predetermined position, and the phosphor paste is applied to the partition walls.

In the following, each time the application of the phosphor paste to the partition walls is completed, the above wiping operation may be performed or the wiping operation may be performed after several application operations. The timing at which the wiping operation is performed depends on the degree of adhesion of the phosphor paste to the discharge port surface 902.

This wiping operation enables the coating operation to be carried out in a state where the discharge port surface of the detention is always clean, so that the phosphor paste remaining on the upper partition wall of the substrate is attached, or the phosphor paste is applied between neighboring partition walls between the partition walls to be applied. It is possible to prevent discomfort, such as, and to apply phosphor paste between uniform and stable partition walls.

In addition, it is preferable to provide means for removing the phosphor paste other than the predetermined coating position, such as when the phosphor paste is attached to the upper end of the partition.

As a means for removing the phosphor paste, there are means for scraping off with a spatula and removing the adhesive by contacting the upper end of the partition wall, or by blowing compressed air with an air nozzle. The material of the pressure-sensitive adhesive is not particularly limited as long as it possesses the above-described characteristics, but examples thereof include polyurethane rubber, polyethylene rubber, silicone rubber, and gels thereof.

Although the structure of the adhesive body which consists of said viscous material is not specifically limited, Preferably, it is good to set it as the belt or roller which is a shape which comes into contact with the surface of a board | substrate. The belt may be in contact with the substrate being conveyed while rotating between the feeding roll and the winding roll. By the contact, the phosphor paste placed on the top of the partition wall of the substrate can be adhered and removed.

MEANS TO SOLVE THE PROBLEM The present inventors reached | attained the following this invention as a result of earnestly examining about the manufacturing means of the plasma display without the said fault.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a plasma display which can form a phosphor layer between high precision partition walls easily and with high accuracy.

Another object of the present invention is to provide a manufacturing apparatus for continuously producing the high quality plasma display at a high productivity level.

Still other objects of the present invention will become apparent from the following description.

These objects of the present invention have been industrially advantageously achieved by a method and apparatus for manufacturing a plasma display having the following constitution.

In the method of manufacturing a plasma display according to the present invention, a phosphor paste containing a phosphor powder and an organic compound is continuously discharged from a paste applicator having a plurality of discharge ports on a substrate on which a plurality of partition walls are formed, and a phosphor layer is formed. It is characterized by forming. In the method of manufacturing a plasma display of the present invention, three kinds of phosphor pastes each containing phosphor powders emitting red, green, and blue light are formed on a substrate on which a plurality of partitions are formed, and a partition on a substrate is formed from a mold having a discharge port. It is a manufacturing method characterized by forming a fluorescent substance layer by apply | coating each in stripe shape in between, and heating.

Moreover, the manufacturing method of the plasma display of this invention contains the following preferable embodiment.

(1) The partition gap (S) and the average hole diameter (D) of the discharge port satisfy the conditions of the following formula,

10 μm ≦ D ≦ S ≦ 500 μm,

(2) the discharge port is a flat plate, a nozzle or a needle,

(3) using a mold having 20 to 2,000 discharge holes, more preferably 150 to 2,000 discharge holes,

(4) The use of detention whose discharge port is in the range of 16n ± 5 (n is a natural number),

(5) the pitch of the discharge port is used in the mold of 0.12 ~ 3mm,

(6) The pitch of the discharge port is to use a detention which is 3m times the partition pitch (m is an integer of 1 to 10),

(7) The use of the mold in which the length L of the discharge port and the average hole diameter D of the discharge port satisfy the following formula,

L / D = 1.0 to 600,

(8) coating the average hole diameter (D) of the discharge port by means of a detention of 60 to 400 mu m,

(9) Applying a phosphor paste in a state where the interval between the discharge port end portions of the detention portion from the upper end of the partition formed on the glass substrate is 0.01 to 2 mm;

(10) The shortest interval between the discharge ports for discharging the paste containing phosphors of different colors from one mold and discharging the phosphor pastes of other colors is 600 µm or more;

(11) applying at the same time from two or more independent detentions, and applying two or more detentions at the same speed;

(12) Apply to every one color and go through drying process every time one color is applied

(13) relative movement of the detention and the substrate relative to the partition on the glass substrate,

(14) When the discharge of the phosphor paste is stopped, the inside of the detention is brought to a negative pressure state,

(15) starting discharge of the phosphor paste after initiating relative movement in parallel to the partition on the substrate of the detention and the substrate, and stopping the discharge before the relative movement ends;

(16) A mold powder having a 50 wt% particle diameter of 0.5 to 10 µm and a phosphor powder having a specific surface area of 0.1 to 2 m 2 / g,

(17) A phosphor paste composed of 30 to 60 wt% of a phosphor powder, 5 to 20 wt% of a binder resin and a solvent, and having a weight ratio of the phosphor powder to the binder resin of 6: 1 to 3: 1,

(18) the binder resin is a cellulose compound,

(19) The solvent is a solvent containing terpineol,

(20) A method of manufacturing a plasma display in which a fluorescent surface is formed by applying three kinds of phosphor pastes each containing phosphor powders emitting red, green, and blue light, respectively, between partition walls on a glass substrate, except for a predetermined application position. Removing the existing phosphor by attaching it to the adhesive;

(21) Removing the fluorescent substance located in the upper end part of a partition by attaching to an adhesive,

(22) Use of a phosphor paste having the following relationship holds between the partition height H mu m, the barrier pitch P mu m, the partition line width W mu m, and the ratio a (vo1%) of the phosphor powder contained in the phosphor paste;

(2H + P-W) × 5≤H × (P-W) × a / 100≤ (2H + P-W) × 30

(23) using a paste having a viscosity of 2 to 50 Pa · S as the phosphor paste;

(24) the phosphor paste is a photosensitive phosphor paste,

(25) using a paste of the following composition as the photosensitive phosphor paste,

Organic Ingredients: 15-60 parts by weight

Phosphor Powder: 40 to 85 parts by weight

Solvent: 10-50 parts by weight

(26) The partition layer has a stripe shape having the following dimensions,

Pitch: 100-250 μm

Line width: 15-40㎛

Height: 60 ~ 170㎛

(27) The upper surface of the bulkhead is black,

(28) The following relationship is satisfied between the side thickness T1 and the bottom thickness T2 at the position of half the height of the partition wall of the phosphor layer,

10≤T1≤50㎛

10≤T2≤50㎛

0.2≤T1 / T2≤5

In addition, the plasma display manufacturing apparatus of the present invention provides a table for fixing a substrate having a plurality of partition walls formed thereon, a cap having a plurality of discharge ports facing the partition walls of the substrate, and supplying a phosphor paste to the thin metal mold. And supply means and a moving means for relatively moving the table and the detention in three dimensions.

The apparatus for manufacturing a plasma display of the present invention includes the following preferred embodiments.

(29) The average hole diameter (D) of the discharge port of the said mold | membrane satisfy | fills the following conditions with respect to the partition space | interval S,

10 μm ≦ D ≦ S ≦ 500 μm

(30) The shape of the discharge port of the detention is not circular, and the opening length B orthogonal to the partition wall satisfies the following conditions with respect to the partition wall spacing S;

10 μm ≦ B ≦ S ≦ 500 μm

(31) The pitch of the discharge port of the said detention is 3m times the partition pitch (m is an integer of 1-10,

(32) the outlets of the detention are on the same plane,

(33) The discharge port of the said cage is comprised by arrange | positioning the pipe of the same shape,

(34) The discharge port of the said detention is 20-2000,

(35) the number of discharge ports of the detention is in the range of 16n ± 5 (n is a natural number),

(36) The pitch of the discharge port of the said mold is 0.12-3 mm,

(37) The average pore diameter D and the length L of the discharge port of the detention satisfies the following formula,

L / D = 0.1 to 600

(38) The average pore size of the discharge port of the cap is 60 to 400 µm,

(39) Arranged so that the center of the discharge port of the detention is above each partition wall,

(40) The fluorine resin film is coated on the discharge port surface and / or the inner wall of the discharge port;

(41) An amorphous carbon film is coated on the discharge port surface and / or the inner wall of the discharge port;

(42) The detention has a plurality of phosphor paste storage sections, a phosphor paste supply port for supplying a phosphor paste to the storage section, and a passage portion for fluidly connecting the storage section and the discharge port. More than the storage section, and the discharge ports corresponding to the storage section are arranged in a substantially straight line periodically in a certain order,

(43) Having placed two or more detentions,

(44) A plurality of phosphor pastes and a plurality of phosphor paste supplying apparatuses for supplying phosphor pastes corresponding to each of the molds are provided in response to a plurality of different kinds of phosphor pastes, and a plurality of phosphor pastes are simultaneously placed between the partition walls of the substrate. To be applied,

(45) having pressure adjusting means for arbitrarily setting the pressure in the detention from atmospheric pressure to negative pressure, and controlling means for controlling timing of pressure adjusting,

(46) detecting means for detecting the position of the discharge port of the cap, detecting means for detecting the position of the partition wall or partition walls of the substrate, detecting means for detecting the position of the upper end portion of the partition wall on the substrate, and position of the discharge port end portion of the cap A detecting means for detecting the discharge and control means for controlling the execution of the discharge start and end of the phosphor paste in accordance with the relative position of the substrate with respect to the discharge port of the cap;

(47), an adjusting means for adjusting the hardness (degree) of the cap with respect to the upper end of the partition wall, and a control means for providing the discharge port leading end of the cap with a predetermined interval approximately parallel to the upper end of the partition wall of the substrate. that,

(48) providing detection means for detecting a position in the substrate of the phosphor paste discharged onto the substrate from the detention,

(49) Detecting means for detecting the number of partitions on the substrate or between the substrates and recognition means for recognizing between the partitions to be applied from the number of detected partitions or the number of partition walls,

(50) A movement for moving the detention and the partition wall relatively so that the origin mark detection means for detecting the origin mark provided on the substrate and the discharge port of the detention is above the partition wall on which the phosphor paste is to be applied, based on the detected origin mark. Installing means and control means,

(51) Provided with means for cleaning the discharge port surface of the detention,

(52) Means provided for removing the phosphor paste existing outside the predetermined coating position of the substrate,

(53) a table fixing a substrate on which a partition is formed on a surface thereof, a cap having a plurality of discharge ports facing the partition wall of the substrate, supply means for supplying a phosphor paste to the cap, and the table and the cap Arranged in three series in correspondence with three kinds of phosphor pastes, each having an application means for moving relative in dimensions

In the following, the present invention will be described in detail using Examples, but the present invention is not limited to these Examples. In addition, the density | concentration (%) in an Example and a comparative example is weight% unless there is particular notice. In addition, evaluation of the formed phosphor layer was performed by the following seven items.

Paste discharge property at discharge port

· Coating time (Total time spent on phosphor paste coating (excluding drying time)

Side thickness (average thickness of 9 in-plane at the center of bulkhead height)

Bottom thickness (average of 9 in-plane thicknesses on the dielectric layer)

Thickness distribution (difference between maximum thickness and minimum thickness when 9 measurements are made)

· Whether paste adheres to the upper part of bulkhead

Mixed color (leakage of phosphor paste between neighboring partitions between partitions to be formed)

Example 1

Photosensitive to the entire surface on a soda glass substrate of width 340 mm x front to back end 440 mm x thickness 2.8 mm, after screen printing the paste to a thickness of 5 m, exposed using a photomask, developing and firing Through each step of, 1920 silver electrodes having a stripe shape with a pitch of 220 μm were formed. On the electrodes, glass paste made of glass and a binder was printed on screen, and then fired to form a dielectric layer. Next, the photosensitive glass space containing the glass powder and the photosensitive organic component was screen printed to a thickness of 200 µm and dried. Subsequently, it exposed using the photomask designed so that a partition might be formed between neighboring electrodes, and formed by developing and baking. The partitions had a pitch of 220 µm, a line width of 30 µm, and a height of 130 µm, and the number of partitions was 1921.

Thus, the fluorescent substance paste of the following composition was apply | coated to the glass substrate in which the partition was formed, using the apparatus shown in FIG.

Phosphor paste: 40 g of the following phosphor powder angles were mixed with 10 g of ethyl cellulose, 10 g of terpineool, and 40 g of benzyl alcohol, and then kneaded with a three-roller made of ceramics to prepare a phosphor-colored phosphor paste.

Phosphor Powder:

Red: (Y, Gd, Eu) BO ₃

50 volume% particle diameter 2.5㎛, specific surface area 2.3㎡ / g

Green: (Zn, Mn) ₂ SiO ₄

50% by volume Particle diameter 2.9µm, specific surface area 1.8㎡ / g

Blue: (Ba, Eu) MgAl ₁₀ O ₁₇

50% by volume Particle diameter 3.1㎛, specific surface area 2.5㎡ / g

The viscosity of the obtained fluorescent substance paste was red 14 Pa.S, green 18 Pa.S, and blue 15 Pa.S, respectively.

The mold used for the application of the phosphor paste was formed of 64 holes having an average hole diameter of 150 µm at a pitch interval of 660 µm, and one nozzle having a length of 2 mm was used.

Using the above-mentioned red phosphor paste and the metal mold | die, application | coating was performed in the state which maintained the space | interval of the discharge port tip part of a metal mold | die from the upper end of the partition formed on the glass substrate at 0.1 mm. Application | coating was performed continuously by applying pressure to the mold which filled the fluorescent paste, and discharging it at the speed of 50 mm / sec so that it may become parallel to a partition.

After application of red, blue 2.6 kg / cm 2 and green 3 kg / cm 2, the application is stopped at the time when the detention is advanced to the end of the substrate, but the negative pressure is applied 0.1 seconds before reaching the end of the partition wall. The detention was depressurized. Next, the detention was moved 42.24 mm in the vertical direction of the partition to apply the phosphor paste. By applying the coating 10 times, 640 coatings were applied so as to have two spaces between adjacent partitions. Next, after 15 minutes of drying at 80 ° C, the green phosphor was applied between the partitions on the right side where the red phosphor paste was applied, and the blue phosphor was applied between the partitions on the left side.

Evaluation was performed after baking the board | substrate which apply | coated the RGB fluorescent substance paste at 460 degreeC for 15 minutes. The evaluation results are shown in Table 1.

Example 2

The phosphor layer was formed in the same manner as in Example 1 except that the number of detentions was changed from one to two groups, and each of the detentions was moved at 50 mm / sec and applied. The evaluation results are shown in Table 1.

Example 3

The phosphor layer was formed in the same manner as in Example 1 except that the number of detentions was changed from one to three groups, and each of the detentions was applied by filling and discharging the phosphor paste of RGB color. The evaluation results are shown in Table 1.

Example 4

The phosphor layer was formed in the same manner as in Example 1 except that the number of discharge ports was changed from 64 to 640, and the application of the phosphor paste of one color was completed by one detention movement. The evaluation results are shown in Table 1.

Example 5

Using a substrate with an electrode pitch of 120 μm, a barrier pitch of 120 μm, a line width of 30 μm, and a height of 90 μm, the discharge port was once coated with a hole diameter of 75 μm and a pitch of 720 μm. A fluorescent substance layer was formed like Example 1 except having moved -46.08 mm-0.36 mm-46.08 mm-0.36 mm-46.08 mm-0.36 mm-46.08 mm-0.36 mm, and apply | coated ten times in total. Results of the evaluation are shown in Table 1.

Example 6

Using a substrate with an electrode pitch of 120 µm, a barrier pitch of 120 µm, a line width of 30 µm, and a height of 90 µm, the discharge port was coated with a hole diameter of 150 µm and a pitch of 720 µm. A phosphor layer was formed in the same manner as in Example 1 except that the detention was moved to apply a total of 10 times of -46.08 mm-0.36 mm-46.08 mm-0.36 mm-46.08 mm-0.36 mm-46.08 mm-0.36 mm. Furthermore, after firing the phosphor layer, the rollers were operated so that the entire upper partition wall contacted the rollers using an adhesive roller having a width of 500 mm and a 250 mm diameter. The evaluation results are shown in Table 1.

Example 7

The phosphor paste was applied in the same manner as in Example 5 except that the phosphor paste was changed to the paste prepared in the following. Then, exposure was performed using a photomask of pitch 120 mu m, opening line width 80 mu m, and 1920 pixels. Next, after developing in 0.5 weight% aqueous solution of triethanolamine, it baked and formed the phosphor layer. Results of the evaluation are shown in Table 1.

Phosphor paste: 20 g of each of the following phosphor powders is 20 g of a binder (1: 1 copolymer of isobutyl methacrylate, a weight average molecular weight of 2.40,000), 15 g of a photosensitive monomer (trimethylolpropane triacrylate), and 20 g of gamma tyrolactone. After mixing 3 g of a polymerization initiator (irgacure 907 manufactured by Chiba Chemical Co., Ltd.), a paste was prepared by kneading with three rollers.

Phosphor Powder:

Red: (Y, Gd, Eu) BO ₃

50 volume% particle diameter 2.5㎛, specific surface area 2.3㎡ / g

Green: (Zn, Mn) ₂ SiO ₄

50% by volume Particle diameter 2.9µm, specific surface area 1.8㎡ / g

Blue: (Ba, Eu) MgAl ₁₀ O ₁₇

50% by volume Particle diameter 3.1㎛, specific surface area 2.5㎡ / g

The viscosity of the obtained phosphor paste was red 20 Pa.S, green 32 Pa.S, blue 19 Pa.S.

Example 8

The composition of the phosphor paste of Example 1 was 0.4 equivalent glycidyl methacrylate relative to the carboxyl group of the copolymer of phosphor powder 50 g and binder polymer (40% methacrylic acid, 30% methyl methacrylate, 30% styrene). Was changed to a phosphor paste composed of a weight average of 43,000, a photosensitive polymer having an acid value of 95), 30 g of a solvent (γ-butyrolactone), and 4 g of a dispersant. Each component of the organic component was dissolved while heating to 80 ° C., a phosphor powder was then added, and a paste was prepared by kneading with a kneader. The viscosity of the phosphor paste was 0.05 Pa.S with red, green, and blue.

In addition, the substrate was converted into a glass substrate on which 2000 barrier ribs having a pitch of 150 µm, a height of 120 µm, and a width of 30 µm were formed, and a mold having a diameter of 80 µm was converted into a mold having a discharge hole of 640 discharge holes having a pitch of 450 µm. After discharging the powder, the coated surface is dried at 80 ° C. for 60 minutes, and then the green phosphor paste is discharged, and then the coated surface is dried at 80 ° C. for 60 minutes, and then the blue phosphor paste is discharged. It dried for 60 minutes at 80 degreeC with an applied surface underneath, and baked at 500 degreeC for 30 minutes. Other conditions were performed in the same manner as in Example 1 to form a phosphor layer. The evaluation results are shown in Table 1.

Example 9

The composition of the phosphor paste was changed to a phosphor paste consisting of 50 g of phosphor powder, 40 g of binder polymer, 30 g of solvent (γ-butyrolactone), and 4 g of a dispersant, and the viscosity of the phosphor paste was 0.03 Pa.S together with red, green, and blue. A phosphor paste was produced in the same manner as in Example 8 except for the above.

In addition, the substrate was converted into a glass substrate on which 2000 barrier ribs having a pitch of 360 µm, a height of 140 µm, and a width of 50 µm were formed, and 1940 discharge holes having a hole diameter of 100 µm were formed at a pitch of 360 µm, and a red phosphor paste and a blue phosphor The phosphor layer was formed in the same manner as in Example 8 except that the paste and the green phosphor paste were converted into molds designed to simultaneously discharge each, and the respective phosphors were discharged, followed by drying at 80 ° C. for 45 minutes. The evaluation results are shown in Table 1.

Example 10

The composition of the phosphor paste is 50g of a phosphor powder, 20g of a binder polymer, 20g of trimethoololpropane triacrylate, 30g of a solvent (γ-butyrolactone), a dispersant 4g, a photopolymerization initiator ("Irgacure 907", manufactured by Chiba Co., Ltd.). The phosphor layer was formed in the same manner as in Example 8 except that the phosphor paste was changed to 0.03 Pa · S in combination with red, green, and blue.

Thereafter, exposure was performed using a pitch of 120 mu m, an opening line width of 80 mu m, and a 1920 photomask, and then developed with 0.5 wt% aqueous triethanolamine solution, followed by baking to form a phosphor layer.

Thereafter, exposure was performed using a pitch of 150 mu m, an opening line width of 60 mu m, and 1920 photomasks, followed by development with a 0.5 wt% aqueous triethanolamine solution, followed by baking at 500 DEG C for 30 minutes to form a phosphor layer. The evaluation results are shown in Table 1.

(Comparative Example 1)

Screen-printed RGB phosphorescent paste was screened on a substrate having an electrode pitch of 120 µm, a partition pitch of 120 µm, a line width of 30 µm, and a height of 90 µm using a screen panel of pitch 360 µm and opening 80 µm. . Next, the substrate was baked at 460 ° C. for 15 minutes to form a phosphor layer. The evaluation results are shown in Table 1.

Evaluation result of the phosphor layer Dischargeability of Paste Application time (seconds) Side thickness (㎛) Bottom thickness (㎛) Thickness distribution (㎛) Attachment on top of bulkhead Horn color Example 1 Good 280 17 19 3 radish radish Example 2 Good 155 19 19 4 radish radish Example 3 Good 103 21 20 3 radish radish Example 4 Good 24 20 20 3 radish radish Example 5 Good 310 18 16 0 radish radish Example 6 Good 310 17 17 One radish radish Example 7 Good 330 18 18 3 radish radish Example 8 Good 24 20 30 4 radish radish Example 9 Good 10 10 40 4 radish radish Example 10 Good 24 23 30 6 radish radish Comparative Example 1 ― 58 8 27 8 U U

According to the present invention, since a high-precision phosphor layer can be easily formed between high-precision partitions, a high-quality plasma display having a wide range of developments having a phosphor layer corresponding to a high-precision plasma display can be obtained. In addition, this plasma display can be manufactured at a continuously high productivity level, which is also industrially advantageous.

The high-precision plasma display obtained in the present invention is widely used in display fields such as TVs or information displays on walls, for example.

Claims (58)

On a substrate on which a plurality of barrier ribs are formed, a phosphor layer is formed by continuously discharging a phosphor paste containing a phosphor powder and an organic compound from a paste applicator having a plurality of discharge ports to form a phosphor layer. Manufacturing method. Three types of phosphor pastes each containing phosphor powders emitting red, green, and blue light are applied onto the substrate on which the plurality of barrier ribs are formed, in a stripe shape between the barrier ribs on the substrate from the mold holding the discharge ports, and then heated. Thereby forming a phosphor layer. The method of manufacturing a plasma display according to claim 1 or 2, wherein the partition gap (S) and the average hole diameter (D) of the discharge port satisfy conditions of the following formula. 10 μm ≦ D ≦ S ≦ 500 μm The method of manufacturing a plasma display according to claim 1 or 2, wherein the discharge port is a flat plate, a nozzle, or a needle. The method of manufacturing a plasma display according to claim 1 or 2, wherein a detention holding 20 to 2000 discharge ports is used. 6. A method of manufacturing a plasma display according to claim 5, wherein a cap having 150 to 2000 discharge ports is used. The method of manufacturing a plasma display according to claim 1 or 2, wherein the number of discharge holes is in the range of 16 n ± 5 (n is a natural number). The method of manufacturing a plasma display according to claim 1 or 2, wherein the pitch of the discharge holes is 0.12 to 3 mm. The method of manufacturing a plasma display according to claim 1 or 2, wherein the pitch of the ejection openings is made of a detention portion 3m times the partition pitch (m is an integer of 1 to 10). The method of manufacturing a plasma display according to claim 1 or 2, wherein the length L of the discharge port and the average hole diameter D of the discharge port are used to satisfy the following formula. L / D = 0.1 to 600 The method of manufacturing a plasma display according to claim 1 or 2, wherein the average hole diameter (D) of the discharge port is applied by a mold of 60 to 400 mu m. The method of manufacturing a plasma display according to claim 1 or 2, wherein the phosphor paste is applied in a state in which the interval between the discharge port end portions of the cap at the upper end of the partition formed on the glass substrate is 0.01 to 2 mm. The discharge gap for discharging a paste containing phosphors emitting colors of different colors from one mold and further discharging phosphor pastes of different colors is 600 µm or more. Method of manufacturing a plasma display. The method of manufacturing a plasma display according to claim 1 or 2, wherein two or more independent detentions are retained and applied simultaneously from the two or more detentions. 15. The method of manufacturing a plasma display according to claim 14, wherein two or more sets of detention are run at the same speed and applied. The method of manufacturing a plasma display according to claim 2, wherein the plasma display is applied for one color and subjected to a drying step for each application of one color. The method of manufacturing a plasma display according to claim 1 or 2, wherein the detention and the substrate are relatively moved in parallel with the partition on the glass substrate. The method of manufacturing a plasma display according to claim 1 or 2, wherein when the discharge of the phosphor paste is stopped, the inside of the cap is brought into a negative pressure state. The method of claim 1 or 2, wherein discharging the phosphor paste is started below the start of relative movement in parallel with the partition on the substrate of the detention and the substrate, and further, the discharge is stopped before the end of the relative movement. Method of manufacturing a plasma display. The method for producing a plasma display according to claim 1 or 2, wherein a phosphor powder having a 50 wt% particle diameter of 0.5 to 10 µm and a specific surface area of 0.1 to 2 m 2 / g is used. A phosphor powder according to claim 1 or 2, which contains 30 to 60% by weight of the phosphor powder, 5 to 20% by weight of the binder resin and a solvent, and the weight ratio of the phosphor powder to the binder resin is 6: 1 to 3: 1. A method of manufacturing a plasma display, characterized by using a phosphor paste. The method for manufacturing a plasma display according to claim 21, wherein the binder resin is a cellulose compound. The method for manufacturing a plasma display according to claim 21, wherein the solvent is a solvent containing terpineol. The method of manufacturing a plasma display according to claim 2, wherein a fluorescent surface is formed by applying three kinds of phosphor pastes each containing phosphor powders emitting red, green, and blue light, respectively, between partition walls on a glass substrate. A method of manufacturing a plasma display, characterized in that it removes by attaching the fluorescent substance which exists other than a position to an adhesive. The method of manufacturing a plasma display according to claim 1 or 2, wherein the phosphor located at the upper end of the partition wall is removed while being attached to the adhesive. The phosphor paste according to claim 1 or 2, wherein the phosphor paste having the following relationship holds between the partition height H mu m, the partition pitch P mu m, the partition line width W mu m, and the ratio a (vol%) of the phosphor powder contained in the phosphor paste. Method for producing a plasma display, characterized in that used. (2H + P-W) × 5≤H × (P-W) × a / 100≤ (2H + P-W) × 30 The plasma display manufacturing method according to claim 1 or 2, wherein a paste having a viscosity of 2 to 50 Pa · S is used as the phosphor paste. The method of manufacturing a plasma display according to claim 1 or 2, wherein the phosphor paste is a photosensitive phosphor paste. 29. The method of manufacturing a plasma display according to claim 28, wherein the following composition paste is used as the photosensitive phosphor paste. Organic Ingredients: 15-60 parts by weight Phosphor Powder: 40 to 85 parts by weight Solvent: 10-50 parts by weight The method of manufacturing a plasma display according to claim 1 or 2, wherein the partition layer has a stripe shape having the following dimensions. Pitch: 100-250 μm Line width: 15-40㎛ Height: 60 ~ 170㎛ The method of manufacturing a plasma display according to claim 1 or 2, wherein the upper surface of the partition wall is black. The plasma display device according to claim 1 or 2, wherein the following relationship is satisfied between the side thickness T1 and the bottom thickness T2 at the position of half the height of the partition wall of the phosphor layer. Manufacturing method. 10≤T1≤50㎛ 10≤T2≤50㎛ 0.2≤T1 / T2≤5 A table for holding a substrate having a plurality of partition walls formed on its surface, a cap holding a plurality of discharge ports facing the partition wall of the substrate, supply means for supplying a phosphor paste to the cap, and the table; And a means for relatively moving the detention in three dimensions. The apparatus for manufacturing a plasma display according to claim 33, wherein the average hole diameter (D) of the discharge port of the detention meets the following conditions with respect to the partition space (S). 10 μm ≦ D ≦ S ≦ 500 μm 34. The plasma as claimed in claim 33, wherein the shape of the discharge port of the cap is not circular, and the opening length B substantially orthogonal to the partition wall satisfies the following conditions with respect to the partition wall spacing S. Display manufacturing apparatus. 10 μm ≦ B ≦ S ≦ 500 μm 34. The apparatus for manufacturing a plasma display according to claim 33, wherein the pitch of the discharge holes of the detention is 3 m times (m is an integer of 1 to 10) of the partition pitch. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein the discharge port of the detention is on the same plane. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein the discharge port of the detention is arranged by arranging pipes having the same shape. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein the number of discharge holes of the detention is 20 to 2000. The apparatus for manufacturing a plasma display according to claim 33, wherein the number of discharge holes of the detention is in the range of 16n ± 5 (n is a natural number). 34. The apparatus for manufacturing a plasma display according to claim 33, wherein the pitch of the discharge port of said cap is 0.12 to 3 mm. The apparatus for manufacturing a plasma display according to claim 33, wherein the average hole diameter (D) of the discharge port of the cap and the length (L) of the discharge port satisfy the following formula. L / D = 0.1 to 600 34. The apparatus for manufacturing a plasma display according to claim 33, wherein the average hole diameter of said discharge hole of said cap is 60 to 400 mu m. The apparatus for manufacturing a plasma display according to claim 33, wherein the center of the discharge port of the detention is disposed above each of the partition walls. The apparatus for manufacturing a plasma display according to claim 33, wherein a bloso resin film is coated on the discharge port surface and / or the discharge port inner wall. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein an amorphous carbon film is coated on the discharge hole surface and / or the discharge hole inner wall. 34. The apparatus of claim 33, wherein the detention includes a plurality of phosphor paste storage portions, a phosphor paste supply port for supplying phosphor paste to the storage portion, and a passage portion for fluidly connecting the discharge port. The number of discharge ports is larger than that of the storage portion, and the discharge holes corresponding to each of the storage portions are arranged in a substantially straight line periodically in a certain order. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein two or more detention units are arranged. 34. The apparatus according to claim 33, further comprising a plurality of detaining devices corresponding to a plurality of different kinds of phosphor pastes, and a plurality of phosphor paste supplying devices for supplying the phosphor pastes corresponding to each of the detaining devices. An apparatus for producing a plasma display, characterized in that the phosphor paste is applied at the same time. 34. The apparatus for manufacturing a plasma display according to claim 33, further comprising pressure adjusting means for arbitrarily setting the pressure in the detention from atmospheric pressure to negative pressure, and control means for controlling timing of pressure adjustment. 34. The apparatus according to claim 33, wherein the detecting means detects the position of the detention, the detecting means detects the position of the partition wall or the partition wall, the detecting means detects the position of the upper end of the partition wall on the substrate, and the discharge port of the detention. Detecting means for detecting the position of the tip portion and control means for controlling the start and end of the discharge of the phosphor paste in accordance with the relative position of the substrate with respect to the discharge port of the detention. 34. The apparatus according to claim 33, further comprising: an adjusting means for adjusting the inclination of the cap with respect to the upper end of the partition wall, and a control means for providing the discharge port leading end of the cap with a predetermined interval approximately parallel to the upper wall of the partition. Apparatus for producing a plasma display, characterized in that. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein detection means for detecting a position in the substrate of the phosphor paste discharged onto the substrate from the above-described detention is provided. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein detection means for detecting the number of partition walls or partition walls on the substrate and recognition means for recognizing the partition walls to be applied from the detected number of partition walls or the number of partition walls are provided. . 34. The apparatus of claim 33, wherein the above-mentioned detention and the partition wall are disposed so that the origin mark detection means for detecting the origin mark installed on the substrate and the discharge port of the detention are on the partition wall to which the phosphor paste should be applied, based on the detected origin mark. An apparatus for manufacturing a plasma display, characterized in that a moving means and a control means for moving the apparatus are provided. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein means for cleaning the discharge port surface of the detention is provided. 34. The apparatus for manufacturing a plasma display according to claim 33, wherein means for removing the phosphor paste existing outside the predetermined application position of the substrate is provided. A table for holding a substrate having a partition formed on its surface, a detention holding a plurality of discharge ports facing a partition of the substrate, a supply device for supplying the phosphor paste to the detention, the table and the detention An apparatus for manufacturing a plasma display, characterized in that three apparatuses are arranged in series to correspond to three kinds of phosphor pastes.