JPH10233163A - Method and device for manufacturing plasma display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately and simply form a phosphor layer between high-precise partitioning walls, by continuously discharging phosphor paste; containing phosphor powder, and organic compounds such as photosensitive polymer and photosensitive monomer, etc., from a base having plural discharging ports, to form a phosphor layer on a base plate thereon plural partitioning walls are formed. SOLUTION: Photosensitive phosphor paste is manufactured by mixing various kinds of component, namely, phosphor powder, an ultraviolet ray absorbing agent, a photosensitive polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent, so as to have a given composition, and then mixing homogeneously dispersing then with a triple roller or a kneader. Then, the phosphor paste is discharged, continuously from a discharge hole provided on a base, to be arranged between a plurality of partitioning walls provided on a base plate. A high-precise phosphor layer can be formed by using phosphor powder, luminous in red, blue, and green, as the phosphor powder to be used to the phosphor paste; making a partitioning wall interval (S) and the means hole diameter (D) of discharge ports satisfy the condition of 10μm<=D<=S<=500μm, and the hole have the number of the discharge ports of 20-2000.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a novel plasma display. The plasma display according to the present invention is used as a wall-mounted television or a display for displaying information.

[0002]

2. Description of the Related Art In recent years, with the development of multimedia, the role of a display for displaying a variety of information has been increasing. Along with this, there is a demand for larger and thinner displays, and liquid crystal displays have been used in many fields, including notebook computers. However, it is difficult to use a liquid crystal display for a large-sized television in terms of price and response speed when the liquid crystal display is enlarged. Therefore, a plasma display is attracting attention as a favorite of a large display. The plasma display generates a discharge in a discharge space formed between a front plate and a back plate. After that, this discharge generates ultraviolet rays having a wavelength of 147 nm from the xenon gas,
This ultraviolet light excites the phosphor, thereby enabling display. By causing the driving circuit to emit light from the discharge cells, each of which is coated with a phosphor that emits RGB light, full color display can be supported.

An AC type plasma display which has been actively developed recently has a front glass substrate on which a display electrode / dielectric layer / protective layer is formed and an address electrode / dielectric layer / partition layer / phosphor layer. To the discharge space separated by stripe-shaped barrier ribs.
It has a structure in which a mixed gas of e-Xe or Ne-Xe is sealed.

As a method for forming an RGB phosphor layer required for a plasma display, a screen printing method using a phosphor paste comprising a phosphor powder and a binder resin has been mainly used. In this method, an opening is provided in the screen mesh in accordance with the space between the partitions, and the other portion is coated with a paste on a screen plate covered with the emulsion, and is transferred through the screen mesh only to the portion where the phosphor paste is required (between the partitions). This is a method that utilizes what is done.

Also, a method of performing screen printing and then using sandblasting as disclosed in JP-A-6-5205, and a method of performing screen printing after applying a crosslinking agent as disclosed in JP-A-5-144375 Has been proposed.

However, the method using screen printing has a drawback that the shape of the screen plate changes during repeated printing, so that the accuracy is low and it is difficult to form a phosphor layer that can support a high-definition plasma display. In addition, there is a problem that the cost increases because the expensive screen plate needs to be frequently replaced.

As a method of forming a phosphor layer corresponding to a high-definition plasma display, there is a method of using a photosensitive phosphor paste obtained by mixing a phosphor powder and a photosensitive binder resin. In this method, a photosensitive paste is applied to the entire surface of the substrate on which the partition walls are formed, and is partially irradiated with light using a photomask to form a soluble portion and an insoluble portion in a developing solution and then developed. It is a method to leave the important part. However, in this method, in order to form the red (R), green (G), and blue (B) phosphor layers,
Steps such as application, exposure, development, and drying of RGB three times are required. Further, there is a drawback that the phosphor paste loses a lot, and there is a problem that the cost is increased.

A method has also been proposed in which a phosphor paste is ejected from the tip of an ink jet nozzle to form a phosphor layer. In this case, however, it is necessary to eject the paste from the tip of an ink jet nozzle having a small diameter. Therefore, the paste viscosity needs to be 0.2 poise or less. For this reason, there is a disadvantage that the amount of the phosphor powder in the paste cannot be increased and the thickness of the phosphor layer cannot be controlled. Also,
There was a problem that the phosphor powder was clogged in the ink jet nozzle, and it could not be used practically.

[0009]

SUMMARY OF THE INVENTION The present invention has been obtained as a result of intensive studies on a method of manufacturing a plasma display which does not have the above-mentioned drawbacks, and it is possible to form a phosphor layer between high-definition partitions with high precision and ease. An object of the present invention is to provide a plasma display manufacturing method and a plasma display manufacturing apparatus therefor.

[0010]

SUMMARY OF THE INVENTION It is an object of the present invention to continuously discharge a phosphor paste containing a phosphor powder and an organic compound from a base having a plurality of discharge ports onto a substrate on which a plurality of partition walls are formed. To form a phosphor layer.

[0011] Another object of the present invention is to provide a table for fixing a substrate having a plurality of partitions formed on its surface, a die having a plurality of discharge ports facing the partition of the substrate, the table and the die. This is achieved by an apparatus for manufacturing a plasma display, comprising a moving means for relatively moving three-dimensionally.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Plasma Display (PDP)
Is mainly composed of a front plate and a back plate, and is filled with a rare gas between the front plate and the back plate. On the back plate side, it is necessary to form a phosphor layer on a substrate on which electrodes for applying a driving voltage and partition walls for partitioning discharge cells are formed.
In some cases, discharge stabilization is achieved by forming a dielectric layer on the substrate.

As the substrate, a soda glass, a glass substrate such as PD200 (manufactured by Asahi Glass Co., Ltd.) commercially available for a plasma display, or a ceramic substrate can be used. The substrate thickness is 1 to 3 mm, preferably 2 to
3 mm glass can be used.

An electrode made of a conductive metal is formed on the substrate. Preferred electrode materials include gold,
It is a metal material containing at least one selected from silver, copper, chromium, palladium, aluminum, and nickel.
As a method for forming an electrode pattern for forming an electrode having a required pattern with a thickness of 0.1 to 10 μm, preferably 1 to 5 μm using these metal materials, the above metal powder and cellulose typified by ethyl cellulose are used. A method of pattern printing a metal paste obtained by kneading with an organic binder containing a compound on a glass substrate using a screen plate, or forming a metal film on a glass substrate by vacuum evaporation or sputtering, and then etching using a resist. The method used can be used. Further, as a preferred method, after applying a photosensitive paste obtained by kneading an organic binder component containing a metal powder and a photosensitive organic component on a glass substrate, pattern exposure using a photomask is performed, and development is performed. 500 after removing the soluble portion of the developer
A method of forming an electrode by baking at a temperature of 600 ° C. to 600 ° C. is preferable because a high-definition electrode can be formed with high precision.

The emission can be stabilized by forming a dielectric layer on the electrode. The dielectric can be formed by applying a glass paste made of an organic binder containing a glass powder and a cellulose compound typified by ethyl cellulose, and then baking at 450 to 600 ° C.

Various methods can be applied for forming the partition. For example, it can be formed by firing a glass paste composed of a glass powder and an organic binder containing a cellulose compound represented by ethylcellulose in a multilayer pattern using a screen plate at 450 to 600 ° C. Alternatively, it can be formed by applying a glass paste on the entire surface of the substrate, laminating a dry film resist, grinding using sand blast using a pattern formed by photolithography as a mask, and then firing. A preferred method of forming the partition walls is a method in which a photosensitive glass paste obtained by kneading a glass powder and a photosensitive organic component is applied over the entire surface of the substrate, and then a pattern is formed and fired by photolithography using a photomask. is there. As the partition to be formed, a stripe shape or a lattice shape is used to partition the discharge of each discharge cell. However, a stripe-shaped partition can be easily formed at low cost.

In particular, according to the method of the present invention, a phosphor layer can be formed on a glass substrate having a high-definition partition wall which is difficult to form by screen printing. For example, when the partition has a stripe shape having the following dimensions, the phosphor layer can be formed without defects as compared with the screen printing method.

Pitch: 100 to 250 μm Line width: 15 to 40 μm Height: 60 to 170 μm When an ejection port is set between partitions, the upper surface of the partition formed on the substrate is made black. Image recognition becomes easy.

In the present invention, a phosphor layer is formed by discharging a paste containing a phosphor powder from a base having a plurality of discharge ports on the glass substrate on which the partition walls are formed as described above. As the phosphor powder to be used, a phosphor powder that emits red, blue, and green light is used. As the phosphor powder used in the present invention, for example, in the case of red, Y ₂ O ₃ : Eu and YVO ₄ : E
u, (Y, Gd) BO ₃ : Eu, Y ₂ O ₃ S: Eu, γ-
Zn ₃ (PO ₄ ) ₂ : Mn, (ZnCd) S: Ag + In ₂
O ₃ and the like. In green, Zn ₂ GeO ₂ : M, BaA
l ₁₂ O ₁₉ : Mn, Zn ₂ SiO ₄ : Mn, LaPO ₄ : T
b, ZnS: Cu, Al, ZnS: Au, Cu, Al,
(ZnCd) S: Cu, Al, Zn ₂ SiO ₄ : Mn, A
s, Y ₃ Al ₅ O ₁₂ : Ce, CeMgAl ₁₁ O ₁₉ : Tb,
Gd ₂ O ₂ S: Tb, Y ₃ Al ₅ O ₁₂ : Tb, ZnO: Zn
and so on. In blue, Sr ₅ (PO ₄ ) ₃ Cl: Eu,
BaMgAl ₁₄ O ₂₃ : Eu, BaMgAl ₁₆ O ₂₇ : E
u, BaMg ₂ Al ₁₄ O ₂₄ : Eu, ZnS: Ag + red pigment, Y ₂ SiO ₃ : Ce.

In addition, thulium (Tm), terbium (T
b) tantalum substituted by at least one element selected from the group consisting of europium (Eu) and at least one host element rare earth element selected from yttrium (Y), gadolinium (Gd) and lutetium (Lu) Acid rare earth phosphors can be used. Preferably, the rare earth tantalate phosphor has a composition formula of Y _1-x Eu _x TaO ₄ (where X is
Is approximately 0.005 to 0.1), which is a europium-activated yttrium tantalate phosphor. For the red phosphor, europium-activated yttrium tantalate is preferable, and for the green phosphor, a rare earth tantalate phosphor is represented by a composition formula Y _1-x Tb _x TaO ₄ (where X is about 0.0
Terbium-activated yttrium tantalate represented by the following formula: The blue phosphor is preferably a thulium-activated yttrium tantalate whose rare earth tantalate phosphor is represented by Y _1-x Tb _x TaO ₄ (where X is approximately 0.001 to 0.2). . The green phosphor has an average particle diameter of 2.0 μm or more activated with Mn of 0.2% by weight or more and less than 0.1% by weight based on the amount of zinc silicate (Zn ₂ SiO ₄ ). A manganese-activated zinc phosphor (Zn ₂ SiO ₄ : Mn) having a particle size of 0 μm or less and a general formula (Z
n in _{1-x Mn x) O ·} αSiO 2 ( wherein X and alpha,
A manganese-activated zinc silicate phosphor represented by the following formula: 0.01 ≦ X ≦ 0.2, 0.5 <α ≦ 1.5) is preferable.

The particle diameter of the phosphor powder used in the above is selected in consideration of the line width, line interval (space) and thickness of the phosphor layer pattern to be produced. 5-10 m, specific surface area 0.1-2 m
It is preferably ² / g. More preferably, the 50% by weight particle size is 0.5 to 5 μm, and the specific surface area is 0.2 to 1.0 m.
² / g. When the content is within this range, the kneadability of the paste is improved, and a dense phosphor layer can be formed.
It is preferable because the luminous efficiency can be improved and the life can be increased. If the powder particle size is less than 0.5 μm and the specific surface area is 2 m ² / g or more, the powder becomes too fine, and the life until the emission luminance decreases is shortened. As the shape of the phosphor powder, a polyhedral (granular) shape can be used, but a powder without aggregation is preferable. Among them, spherical powder has a merit of improving luminous efficiency since it can form a dense phosphor layer. This is more preferable because the influence of scattering during exposure can be reduced. It is preferable that the sphere ratio of the phosphor powder has a particle shape of 80% by number or more. More preferably, the sphericity is 9
0% by number or more. If the sphericity is less than 80% by number, it is difficult to obtain a high-definition pattern due to the influence of the scattering of the phosphor powder during ultraviolet exposure. The sphericity is measured by photographing the phosphor powder with an optical microscope at a magnification of 300 times, and counting the number of particles that can be counted. The ratio of spherical particles is defined as the sphericity.

The organic component used in the present invention contains a binder resin, a solvent, and, if necessary, additives such as a plasticizer, a dispersant, and a leveling agent.

Specific examples of the binder resin include polyvinyl butyral, polyvinyl acetate, polyvinyl alcohol, polyethylene, silicone polymer (for example, polymethylsiloxane, polymethylphenylsiloxane), polystyrene, butadiene / styrene copolymer, polystyrene, polyvinylpyrrolidone. , Polyamides, high molecular weight polyethers, copolymers of ethylene oxide and propylene oxide, polyacrylamide and various acrylic polymers (eg, sodium polyacrylate, poly (lower alkyl acrylate), poly (lower alkyl methacrylate) and various copolymers of lower alkyl acrylate and methacrylate and multipolymers. Polymer is a preferable binder resin.
By using a cellulose compound (for example, methylcellulose, ethylcellulose, hydroxyethylcellulose, methylhydroxyethylcellulose), it is possible to form a phosphor layer with less binder residue after firing.

Specific examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, glycerin and the like.

Specific examples of the solvent include terpineol, isobutyl alcohol, isopropyl alcohol,
Benzyl alcohol, 2-phenoxyethanol, γ-
Alcohol solvents such as phenylallyl alcohol, dimethylbenzylcarbinol, β-phenylethyl alcohol, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, tetrahydrofuran, butyl carbitol acetate, dimethyl sulfo Oxide, γ-butyrolactone, bromobenzene,
Chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and the like, and an organic solvent mixture containing at least one of these are used.
In particular, an alcohol solvent is advantageous in dispersing the powder. Among them, terpineol is particularly preferred. Also,
By using a mixture of terpineol and another alcohol solvent such as benzyl alcohol, the viscosity of the paste can be easily adjusted.

A phosphor paste is prepared by mixing and kneading the above-mentioned phosphor powder, binder and solvent at a desired ratio, and the paste is applied by using a paste having a viscosity of 2 to 50 Pa · s. In this case, it is easy to control the thickness of the side wall of the partition wall, which is effective for improving the brightness and the uniformity of display.

The phosphor paste in which the weight ratio between the phosphor powder and the binder resin is 6: 1 to 3: 1 is used for a high-definition PD.
When producing P, the thickness uniformity can be improved. The preferred composition of the paste is one of red, green and blue.
A composition of 30 to 60% by weight of a phosphor powder that emits light of a color, 5 to 20% by weight of a binder resin and 20 to 65% by weight of a solvent allows the side surfaces of the partition walls and the bottom of the discharge space to be formed irrespective of the drying conditions after paste application. A phosphor layer having a uniform thickness can be formed.

The composition of the paste is such that the partition height of the plasma display to be manufactured is H μm, the partition pitch is P μm,
In the case where the partition line width is W μm, the composition is such that the following relationship is established between the ratio a (vol%) of the phosphor powder contained in the phosphor paste, so that a uniform thickness is formed on the partition wall side and the bottom of the discharge space. Phosphor layer can be formed.

(2H + P−W) × 5 ≦ H × (P−W) ×
a ≦ (2H + P−W) × 30 By adding an organic dye to the phosphor paste,
It becomes easy to distinguish the applied part from the uncoated part. In this case, by adding an organic dye that emits a different color to each of the RGB phosphor layers, a defect inspection after coating becomes easy. As organic dyes to be used, leuco dyes, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes, triazine dyes, p-aminobenzoic acid dyes Dyes and the like can be used. Specifically, Sudan Blue, Sudan 4,
Victoria Pure Blue, Nile Blue, Brilliant Green, Neutral Red, Methyl Violet and the like can be used.

In the present invention, a photosensitive phosphor paste containing a photosensitive compound as a binder resin can be used. By using photosensitive phosphor paste,
Exposure and development can be performed using a photomask to remove the phosphor paste attached to unnecessary portions. Especially,
When the applied phosphor paste adheres to the upper surface of the partition wall or protrudes into the cell next to the cell to be applied, light is irradiated only to the area to be applied, and the area not irradiated with light is removed by development. By doing so, color mixing and discharge defects can be prevented.

The organic component containing a photosensitive compound used in the photosensitive phosphor paste includes a photosensitive component selected from at least one of a photosensitive polymer, a photosensitive monomer, and a photosensitive oligomer. Additives such as a photopolymerization initiator, a sensitizer and an ultraviolet absorber may be added accordingly.

As the photosensitive phosphor paste, an organic component 1
5 to 60 parts by weight, phosphor powder 40 to 85 parts by weight, solvent 1
The paste having a composition of 0 to 50 parts by weight has a uniform thickness,
This is effective in improving pattern formability.

The amount of the organic component containing the photosensitive compound used in the present invention is preferably 15 to 60% by weight. Fifteen
If the amount is less than 10% by weight, the patterning property is deteriorated due to insufficient light exposure.
When the content is 0% by weight or more, the binder removal property at the time of firing is poor and the firing is insufficient.

The photosensitive component includes a photo-insolubilizing type and a photo-solubilizing type. The photo-insolubilizing type includes: (A) a functional monomer having at least one unsaturated group in the molecule. (B) those containing photosensitive compounds such as aromatic diazo compounds, aromatic azide compounds, and organic halogen compounds. (C) So-called diazo resins such as condensates of diazo amines and formaldehyde. And others.

Examples of the photo-soluble type include (D) a complex of a diazo compound with an inorganic salt or an organic acid, and a compound containing quinone diazos. (E) a quinone diazo combined with an appropriate polymer binder. For example, there are naphthoquinone 1,2-diazido-5-sulfonic acid ester of phenol and novolak resin.

As the photosensitive component used in the present invention, all of the above can be used. As the photosensitive component which can be easily used as a photosensitive paste by being mixed with inorganic fine particles, (A) is preferred.

The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and sec-butyl. Acrylate, sec-
Butyl acrylate, iso-butyl acrylate, te
rt-butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate Heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobonyl acrylate, 2-hydroxypropyl acrylate, isodecyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafuro Pentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene Glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, Polypropylene Glycol diacrylate, triglycerol diacrylate,
Trimethylolpropane triacrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct,
Bisphenol A-propylene oxide adduct diacrylate, thiophenol acrylate, benzyl mercaptan acrylate, and monomers in which 1 to 5 hydrogen atoms of these aromatic rings are substituted with chlorine or bromine atoms, or styrene, p -Methylstyrene,
o-methylstyrene, m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α
-Methyl styrene, brominated α-methyl styrene, chloromethyl styrene, hydroxymethyl styrene, carboxymethyl styrene, vinyl naphthalene, vinyl anthracene, vinyl carbazole, and changing part or all of the acrylate in the molecule of the above compound to methacrylate And γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone and the like. In the present invention, one or more of these can be used.

In addition to these, the developability after exposure can be improved by adding an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

As the binder, polyvinyl alcohol, polyvinyl butyral, methacrylate polymer, acrylate polymer, acrylate ester
Examples include methacrylate copolymers, α-methylstyrene polymers, and butyl methacrylate resins.

An oligomer or polymer obtained by polymerizing at least one of the compounds having a carbon-carbon double bond described above can be used.

At the time of polymerization, these monomers can be copolymerized with other photosensitive monomers such that the content of these monomers is at least 10% by weight, more preferably at least 35% by weight.

As a monomer to be copolymerized, the developability after exposure can be improved by copolymerizing an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

The polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained has an acid value (AV) of preferably from 50 to 180, more preferably from 70 to 140. When the acid value exceeds 180, the allowable development width becomes narrow. On the other hand, if the acid value is less than 50, the solubility of the unexposed portion in the developer decreases, so that the concentration of the developer is increased, and peeling occurs up to the exposed portion, and a high-definition pattern is obtained. It is hard to be.

By adding a photoreactive group to the polymer or oligomer described above to a side chain or a molecular terminal, the polymer or oligomer can be used as a photosensitive polymer or oligomer having photosensitivity.

Preferred photoreactive groups are those having an ethylenically unsaturated group. As the ethylenically unsaturated group,
Examples include a vinyl group, an allyl group, an acryl group, and a methacryl group.

A method for adding such a side chain to an oligomer or a polymer is based on a method in which an ethylenically unsaturated compound having a glycidyl group or an isocyanate group, an acrylic acid, or There is a method in which chloride, methacrylic chloride or allyl chloride is added to make an addition reaction.

Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonate, and glycidyl ether isocrotonic acid. .

Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate.

The ethylenically unsaturated compound having a glycidyl group or an isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is used in an amount of 0.05 to 0.05 to the mercapto group, amino group, hydroxyl group and carboxyl group in the polymer. It is preferable to add one molar equivalent.

As specific examples of the photopolymerization initiator,
Benzophenone, methyl o-benzoylbenzoate, 4,
4-bis (dimethylamine) benzophenone, 4,4-
Bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorenone, 2,
2-diethoxyacetophenone, 2,2-dimethoxy-
2-phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyl, Benzyl dimethyl ketanol, benzyl methoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, anthraquinone,
2-t-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzosuberone, methyleneanthrone,
4-azidobenzalacetophenone, 2,6-bis (p
-Azidobenzylidene) cyclohexanone, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadione-2- (o
-Methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o
-Ethoxycarbonyl) oxime, 1-phenyl-3-
Ethoxy-propanetrione-2- (o-benzoyl)
Oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, N-phenylthioacridone, 4,4
-Azobisisobutyronitrile, diphenyl disulfide, benzothiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenyl sulfone, benzoin peroxide and eosin,
Examples include a combination of a photoreducing dye such as methylene blue and a reducing agent such as ascorbic acid and triethanolamine. In the present invention, one or more of these can be used.

The photopolymerization initiator is used in an amount of 0.
It is added in the range of 1 to 6% by weight, more preferably, 0.1 to 6% by weight.
2 to 5% by weight. If the amount of the polymerization initiator is too small, the sensitivity to light becomes low, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion may be too small.

It is also effective to add an ultraviolet absorber. A high aspect ratio, high definition, and high resolution can be obtained by adding a light absorbing agent having a high ultraviolet absorbing effect. UV absorbers composed of organic dyes, especially 35
Organic dyes having a high UV absorption coefficient in the wavelength range of 0 to 450 nm are preferably used. Specifically, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinones, benzophenones, diphenylcyanoacrylates, triazines, p-aminobenzoic acid dyes and the like can be used. . Even when the organic dye is added as a light absorbing agent, it is preferable because deterioration of the insulating film characteristics due to the light absorbing agent can be reduced without remaining in the insulating film after firing. Among these, azo dyes and benzophenone dyes are preferred. The addition amount of the organic dye is preferably 0.05 to 5% by weight. When the content is less than 0.05% by weight, the effect of adding the ultraviolet absorber is reduced, and
Exceeding the range is not preferred because the properties of the insulating film after firing deteriorate. More preferably, it is 0.15 to 1% by weight. To give an example of the method of adding an ultraviolet light absorber composed of an organic pigment, to prepare a solution in which the organic pigment was previously dissolved in an organic solvent,
Next, the glass powder can be mixed with the organic solvent and dried. By this method, a so-called capsule-like powder in which an organic film is coated on the surface of each glass powder can be produced.

A sensitizer is added to improve the sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone,
2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone,
4,4-bis (diethylamino) -benzophenone,
4,4-bis (dimethylamino) chalcone, 4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene)- Isonaphthothiazole, 1,3-bis (4-
Dimethylaminobenzal) acetone, 1,3-carbonyl-bis (4-diethylaminobenzal) acetone,
3,3-carbonyl-bis (7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N
-Phenylethanolamine, N-tolyldiethanolamine, N-phenylethanolamine, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazole, 1-phenyl-5-ethoxycarbonylthiotetrazole and the like. Can be In the present invention, one or more of these can be used. Some sensitizers can also be used as photopolymerization initiators. When a sensitizer is added to the photosensitive paste of the present invention, the amount is usually 0.05 to 10% by weight, more preferably 0.1 to 10% by weight, based on the photosensitive component. If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion may be too small.

The photosensitive phosphor paste is usually composed of a phosphor powder, an ultraviolet absorber, a photosensitive polymer, a photosensitive monomer,
After blending various components of the photopolymerization initiator and the solvent so as to have a predetermined composition, the mixture is uniformly mixed and dispersed by using three rollers or a kneader to produce.

The paste has a viscosity of phosphor powder, organic solvent,
It is appropriately adjusted depending on the addition ratio of a plasticizer and a suspending agent, but the range is preferably 2 to 50 Pa · s,
More preferably, it is 5 to 20 Pa · s.

Next, the formation of the phosphor layer of the present invention will be described. The phosphor paste prepared as described above is applied between partition walls (between partition walls) of a substrate provided with a plurality of partition walls. FIG. 1 shows a state in which a phosphor paste is discharged from a discharge port of a base and applied between partition walls of a substrate provided with electrodes, dielectrics, and partition walls. FIG. 2 is a drawing prepared for explaining such a positional relationship between the substrate and the base, and is more useful for understanding the present invention described below.

As a discharge port for discharging the phosphor paste, a base having a metal, ceramics, or plastic base having a discharge hole, a nozzle, or a needle at the tip can be used. The outlet has a hole diameter (inner diameter) of 1
Although a pore having a diameter of 0 to 500 μm can be used, a preferable pore diameter is 50 to 500 μm. When the pore size is smaller than 10 μm, clogging with the phosphor powder is liable to occur, and when the pore size is larger than 500 μm, there is a problem that the phosphor paste leaks to an adjacent cell during application to high definition. Further, when the distance (S) between the adjacent partition walls and the average pore diameter (D) of the discharge port satisfy the following expression,
Adhesion of the phosphor paste to the upper part of the partition can be suppressed.

10 .mu.m.ltoreq.D.ltoreq.S.ltoreq.500 .mu.m The number of discharge ports can be from 1 to 6000, but preferably from 20 to 2000. If the number of holes is less than 20, it takes too much time for coating. Desirably, when the number is 150 or more, a phosphor layer corresponding to a high-definition PDP can be formed in a short time. If the number of holes exceeds 2,000, it becomes difficult to ensure the processing accuracy of the discharge port portion, and it becomes difficult to support a high-definition PDP. Further, by setting the number of discharge ports to a range of 16n ± 5 (n is a natural number), it becomes easy to form a phosphor layer on a PDP that can be driven by a general-purpose circuit.

The pitch of the discharge ports is 0.12 to 3 m
m is desirable. If the distance is less than 0.12 mm, the distance between the discharge ports becomes small, so that it is difficult to produce a die.
Is exceeded, it is difficult to control the application when coating is performed on a glass substrate on which partition walls are formed at a pitch of 300 μm or less. Further, by setting the pitch of the discharge ports to 3 m times the partition pitch (m is an integer of 1 to 10), the coating can be performed accurately and efficiently. Further, with respect to the length (L) of the discharge port and the average hole diameter (D) of the discharge port, the discharge performance of the paste is improved by the base satisfying the following formula.

L / D = 0.1 to 600 When L / D exceeds 600, the pressure loss increases, so that the amount of paste discharged is reduced and the thickness of the phosphor layer is reduced. On the other hand, when it is less than 0.1, the dripping of the paste from the discharge port becomes large.

In order to discharge the phosphor paste from the discharge port, the paste is continuously pressurized at a certain range of pressure.
It is preferable to discharge the paste at that pressure. Thereby, the discharge amount of the paste can be kept constant, and a stable coating thickness can be obtained.

As shown in FIG. 1, the phosphor paste can be applied by moving the base and the substrate relatively to the partition on the substrate while discharging the paste from the discharge port. In this case, the base may be run with the substrate fixed, or the base may be run with the base fixed. Alternatively, both may be run at the same time.

When the discharge of the phosphor paste from the discharge port of the base is stopped, the inside of the base is kept in a negative pressure state.
The paste can be applied without dripping at the application end and without variation in application thickness.

Further, the discharge of the phosphor paste is started after the relative movement is started in parallel with the base and the partition on the glass substrate, and the discharge is stopped before the end of the relative movement. Variation in thickness due to dripping can be suppressed.

In the case of discharging, the distance between the distal end of the discharge port and the upper end of the partition formed on the glass substrate is 0.01 to 2 m.
m, preferably 0.05 to 0.5 mm. In order to suppress the contact between the discharge port and the upper end of the partition, the thickness is preferably 0.01 mm or more, more preferably 0.05 mm or more. In order to prevent the paste discharged from the discharge port from being cut, the thickness is preferably 2 mm or less, more preferably 0.5 mm or less.

In addition, by applying a plurality of bases on the apparatus and applying simultaneously, the application can be performed efficiently and in a short time. In this case, it is possible to apply a uniform thickness by moving a plurality of bases at the same speed. Also,
By attaching three or more bases and discharging a paste containing a phosphor that emits a different color from the three or more bases, it becomes possible to apply three colors of RGB at a time. Further, three color phosphor pastes can be discharged from one base. In this case, mixing of the RGB phosphors can be prevented by setting the shortest interval between the ejection ports for ejecting phosphor pastes of different colors to be 600 μm or more.

In the case where a phosphor layer is formed on a high-definition partition wall, color mixing can be prevented by applying each color and passing through a drying step after each color application.

In the present invention, after the phosphor paste is discharged from the discharge port, water, an organic solvent, organic components and the like are removed by evaporation or decomposition using a heating step such as a drying step and a baking step. A phosphor layer can be formed.

In the heating step in this case, drying is usually performed with the phosphor-coated surface up, but drying may be performed with the phosphor-coated surface down. By setting the phosphor application surface downward, the phosphor paste is transmitted along the side wall of the partition wall, so that a phosphor layer can be formed on the side wall of the partition wall. By forming the phosphor layer not only between the partition walls but also on the side surfaces of the partition walls, the area of the phosphor surface can be increased, which is effective for improving the brightness of the plasma display.

By using a photosensitive phosphor paste as the phosphor paste, pattern processing by photolithography becomes possible. In this case, the phosphor formed through the coating process is effective for removing the phosphor formed on an unnecessary portion such as the upper part of the partition.

The photosensitive phosphor paste of each color of RGB is discharged from the discharge port and applied, and then exposed through a photomask, and the exposed portion of the paste is solubilized or insolubilized in a developing solution, so that a developing process is performed. Thus, unnecessary portions can be removed and a phosphor layer can be formed. As the developing solution, an organic solvent in which an organic component in the photosensitive paste can be dissolved can be used. Water may be added to the organic solvent as long as the solvent does not lose its solubility. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, development can be performed with an aqueous alkali solution. As the alkali aqueous solution, a metal alkali aqueous solution such as a sodium hydroxide or calcium hydroxide aqueous solution can be used, but it is preferable to use an organic alkali aqueous solution since the alkali component can be easily removed at the time of firing.

As the organic alkali, an amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine and the like. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the unexposed portions are not removed, and if the alkali concentration is too high, the pattern portions may be peeled off and the exposed portions may be corroded, which is not good.
The development temperature during development is preferably from 20 to 50 ° C. from the viewpoint of process control.

The thickness of the phosphor layer is determined by the thickness (T1) of the side face (at half the height of the partition wall) and the bottom thickness (T1).
By showing the following relationship between 2), a plasma display excellent in luminance can be manufactured.

10 ≦ T1 ≦ 50 μm 10 ≦ T2 ≦ 50 μm If T1 or T2 is less than 10 μm, it is difficult to obtain sufficient luminance because ultraviolet rays generated by discharge pass through the phosphor layer, and it is difficult to obtain a sufficient luminance. However, there are disadvantages such as an increase in discharge voltage.

The relationship between T1 and T2 preferably satisfies the following expression.

0.2 ≦ T1 / T2 ≦ 5 When the ratio of the thickness of the side surface to the thickness of the bottom portion is too large or too small, the viewing angle is likely to be dependent on the display screen. There's a problem.

After the phosphor paste is applied to a predetermined position, the phosphor component is removed by firing in a firing furnace to remove the organic components. The firing atmosphere and temperature vary depending on the type of the paste and the substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. Firing temperature is 300 ~ 550
Perform at ° C. Preferably, it is 350-500 ° C.

When the phosphor adheres to the upper surface of the partition wall, when the cell is sealed together with the front plate, discharge leakage occurs due to insufficient partitioning of the cells by the partition wall. In this case, a method of removing the adhesive by attaching the adhesive to the adhesive can be used.

In order to completely remove the organic components, 30
The temperature needs to be raised to 0 ° C., preferably 350 ° C., and must be 550 ° C. or lower, preferably 500 ° C. or lower in order to suppress the deterioration of the phosphor due to heat. As the firing furnace, a batch type firing furnace or a belt type or roller hearth type continuous firing furnace can be used.

The substrate on which the phosphor layer has been formed is sealed together with the front and rear glass substrates. The front plate is formed with a discharge sustaining electrode composed of ITO and a bus electrode, a dielectric composed of a glass layer, and a protective film (usually magnesium oxide) for protecting the dielectric from discharge. A black matrix and a black stripe are formed. The sealing between the front plate and the back plate is performed using a glass frit or the like.

Next, helium was added between the front plate and the back plate.
By encapsulating rare gases such as neon and xenon,
A panel portion of a plasma display can be manufactured. Furthermore, by mounting a driver IC for driving,
A plasma display can be manufactured. Display can be performed by driving the electrodes on the front plate and the rear plate in a matrix.

Next, an apparatus for applying the phosphor paste of the present invention will be described. The apparatus for applying the phosphor paste of the present invention corresponds to a table surface on which a substrate on which a plurality of partitions are formed is placed, and a partition arrangement in which the phosphor paste is formed in stripes between the partitions on the substrate. An apparatus having a base having a plurality of discharge ports can be used.

FIG. 3 is an overall perspective view of a plasma display manufacturing apparatus according to an embodiment of the present invention.
FIG. 4 is a schematic view of the vicinity of the table 6 and the base 20 of FIG.

A pair of guide groove rails 8 is provided on the base 2, and the table 6 is arranged on the guide groove rails 8. The table 6 is provided with a plurality of suction holes 7, and the substrate 4 having the partition walls at a constant pitch on the surface is fixed to the table surface by vacuum suction. The substrate 4 is moved up and down on the table 6 by lift pins (not shown). Further, the table 6 is connected to the guide groove rails 8 via the slide legs 9.
The upper part is reciprocable in the X-axis direction.

A feed screw 10 constituting a feed screw mechanism extends between the pair of guide groove rails 8 through a nut-shaped connector 11 fixed to the lower surface of the table 6. Both ends of the feed screw 10 are rotatably supported by bearings 12, and one end of the feed screw 10 is connected to an AC servomotor 16.

Above the table 6, a base 20 for discharging the phosphor paste is provided via a holder 22 with a lifting mechanism 3.
0, connected to the width direction moving mechanism 36. Lifting mechanism 3
Numeral 0 is provided with a vertically movable bracket 28, which is attached to a pair of guide rods inside the casing of the vertically movable mechanism 30 so as to be vertically movable. In this casing, a feed screw (not shown) formed of a ball screw is also rotatably disposed between the guide rods, and is connected to the lifting bracket 28 via a nut-type connector. . An AC servo motor (not shown) is connected to the upper end of the feed screw,
The rotation of the AC servomotor causes the lifting bracket 2
8 can be arbitrarily moved up and down.

Further, the elevating mechanism 30 is connected to a width direction moving mechanism 36 via a Y-axis moving bracket 32.
The width direction moving mechanism 36 moves the Y-axis moving bracket 32 so as to be able to reciprocate in the Y-axis direction. A guide rod, a feed screw, a nut-type connector, an AC servomotor, and the like necessary for the operation are arranged in the casing in the same manner as the lifting mechanism 30. The width direction moving mechanism 36 is fixed on the base 2 with the support columns 34. With these configurations, the base 20 can be freely moved in the Z-axis and Y-axis directions.

The base 20 extends horizontally in the direction orthogonal to the reciprocating direction of the table 6, that is, in the Y-axis direction.
The holder 22 for directly holding the lifting bracket 2
8 so as to be freely rotatable in a vertical plane in the direction of the arrow in FIG.

The horizontal bar 2 located above the holder 22
4 is also fixed to the lifting bracket 28. At both ends of the horizontal bar 24, electromagnetically actuated linear actuators 26 are attached. The linear actuator 26 includes a telescopic rod 2 protruding from the lower surface of the horizontal bar 24.
When the telescopic rods 29 come into contact with both ends of the holder 22, the rotation angle of the holder 22 can be regulated, and as a result, the inclination of the base 20 can be set arbitrarily.

On the upper surface of the base 2, an inverted L-shaped sensor support 38 and a camera support 70 are fixed. Sensor support 3
A height sensor 40 for measuring the height of the upper end of the partition on the surface of the substrate 4 on the table 6 is attached to the tip of the table 8. At one end of the table 6, a position sensor 66 is provided via a sensor bracket 64,
The position of the lower end surface having the 0 discharge port in the vertical direction with respect to the table 6 is detected.

At the tip of the camera support 70, a camera 72 for detecting a partition on the surface of the substrate 4, a position between the partitions, or an origin mark other than the partition is mounted.
As shown in FIG. 4, the camera 72 is electrically connected to the image processing device 74, and quantitatively obtains the positions of the partitions on the substrate 4, the positions between the partitions and the number between the partitions, and the positions of the origin marks. Can be.

In FIG. 4, the base 20 is the manifold 4
1, the manifold 41 is filled with the phosphor paste 42, and the phosphor paste 42 is discharged from the discharge port 44. A supply hose 46 is connected to the base 20, and a discharge electromagnetic switching valve 48, a supply unit 50, a suction hose 52,
The suction electromagnetic switching valve 54 and the phosphor paste tank 56 are connected to each other. The phosphor paste tank 56 stores the phosphor paste 42.

Examples of the supply unit 50 include a constant volume pump such as a piston and a diaphragm, a tubing pump, a gear pump, a mono pump, and a pressure feed controller for pushing out a liquid by gas pressure.

In response to a control signal from the supply device controller 58, the supply unit 50 and the respective electromagnetic switching valves are operated, and the phosphor paste 42 is sucked from the phosphor paste tank 56 and supplied to the base 20. can do.

The supply device controller 58 is further electrically connected to the general controller 60. The entire controller 60 is provided with all control information such as motor controller 62, electric input of height sensor 40, image processing device 74 of camera 72, information from actuator 76 for lifting / lowering mechanism, and actuator 78 for width direction moving mechanism. And is able to manage the entire sequence control. The general controller 60 may be any computer having a control function, such as a computer or a sequencer.

The motor controller 62 has a signal of the AC servo motor 16 for driving the table 6, a signal of each of the AC servo motors of the lifting mechanism 30 and the width direction moving mechanism 36, and a position for detecting the moving position of the table 6. A signal from the sensor 68, Y for detecting the operating position of the base 20,
A signal from each linear sensor (not shown) on the Z axis is input. In addition, instead of using the position sensor 68, an encoder is incorporated in the AC servomotor 16 and
The position of the table 6 can be detected based on the pulse signal output from the encoder.

Next, a method of applying a phosphor paste using the apparatus for manufacturing a plasma display will be described. First, when the origin return of each operating section is performed, the table 6 and the base 20 move to the standby positions. At this time, the phosphor paste has already been filled from the phosphor paste tank 56 to the base 20, and the discharge electromagnetic switching valve 48 is open and the suction electromagnetic switching valve 54 is closed. Then, lift pins (not shown) rise on the surface of the table 6, and the substrate 4 is placed on the lift pins from a loader (not shown).

Next, the substrate 4 is placed on the upper surface of the table by lowering the lift pins. After the substrate 4 is positioned on the table 6 by an alignment device (not shown), the substrate 4 is vacuum-sucked.

Next, in the table 6, the partition wall of the substrate 4 is
It moves until it comes under the camera 72 and the height sensor 41, and stops. The camera 72 is adjusted in advance so as to project the end of the partition on the substrate 4 positioned on the table 6, detects the position between the end partitions by image processing, and determines the position from the reference point of the camera 72. Find the distance of On the other hand, the distance between the reference point of the camera 72 and the outlet 44 located at the end of the base 20 at the predetermined Y-axis coordinate position is measured at the time of advance adjustment and is input to the overall controller 60 as information. I have. Therefore, when the distance between the camera reference point and the partition is transmitted to the image processing apparatus 7, the base 2
The Y-axis coordinate value at which the discharge hole 44 at the end of 0 is located above the partition wall at the end of the partition wall is calculated, and the base 20 is moved to that position. As a result, the centers of all the discharge ports of the base 20 have been moved above between the partition walls to which the phosphor paste is applied, and the relative positioning of the base 20 and the substrate 4 is completed.

As another positioning method, a camera 72 is used.
May detect an origin mark other than the partition on the substrate 4. The distance between the camera reference point and the discharge port 44 located at the end of the base 20 and the distance between the origin mark and the end between the partition walls to be coated are measured at the time of advance adjustment and input to the overall controller 60 as information. Have been. Therefore, when the distance between the camera reference point and the origin mark is transmitted to the image processing device 74, the base 20 is moved to a position to be applied.

As a method for determining the distance between the camera reference point and the discharge port of the base 20, the phosphor paste is discharged from the base 20 onto a flat substrate having a flat surface to form a stripe of the phosphor paste. The position of the stripe may be measured and detected by image processing to determine the absolute position.
Thereby, the position of the discharge port of the base 20 can be known, and as a result, the absolute position of the base can be obtained. According to this method, the discharge port of the base 20 can also be applied between the partition walls on the surface of the substrate 4 for application.

The height sensor 40 detects the vertical position of the upper end of the partition wall of the substrate 4 and calculates the height of the upper end of the partition wall of the substrate 4 from the difference in position with respect to the table upper surface. At this height,
From the discharge port of the base 20 given in advance, the substrate 4
, The value of the base 20 to be lowered on the Z-axis linear sensor is calculated, and the base 20 is moved to that position. Thereby, even if the position of the upper end of the partition wall of the substrate 4 on the table 6 changes for each substrate, the distance from the discharge port of the base 20 important for coating to the upper end of the partition wall of the substrate 4 can be always kept constant. become.

As the height sensor 40 to which the present invention can be applied, a non-contact measurement type using a laser, an ultrasonic wave, or the like, a contact measurement type using a dial gauge, a differential transformer, or the like can be measured. Any principle may be used.

Next, the operation is started with the table 6 directed toward the base 20, and the table 6 is accelerated to a predetermined coating speed before the application start position of the substrate 4 reaches below the discharge port of the base 20. deep. The distance between the operation start position of the table 6 and the application start position must be sufficiently ensured that the table 6 can be increased to the application speed.

Further, the coating start position of the substrate 4 is
A position sensor 68 for detecting the position of the table 6 is arranged under the discharge port of the table 6.
Has reached this position, the operation of the supply unit is started and the supply of the phosphor paste 42 to the base 20 is started.
The same can be achieved by connecting an encoder to a motor or a feed screw instead of the position sensor 68 and detecting the position by the value of the encoder.

The application of the phosphor paste is performed until the position where the application of the substrate 4 is completed is located below the discharge port of the base 20. That is, since the substrate 4 is always placed at a predetermined position on the table 6, the position sensor and its encoder value are set in advance at the position of the table 6 corresponding to the position where the substrate coating end position is just below. Aside
When the table 6 comes to the corresponding position, a stop command is issued from the general controller 60 to the supply device controller 58 to stop the supply of the phosphor paste 42 to the base 20. At this time, the base 20 may be raised to completely emit the phosphor paste.

In the case where the phosphor paste 42 is a liquid having a relatively high viscosity, the discharge from the discharge port of the base 20 can be stopped instantaneously by the action of the residual pressure simply by stopping the supply of the paste. difficult. For this purpose, the supply of the phosphor paste is stopped, and at the same time, the pressure of the manifold 41 of the base 20 is set to the atmospheric pressure.
By setting the pressure to a negative pressure and sucking the phosphor paste from the discharge port of the base 20, discharge of the phosphor paste from the discharge port can be stopped in a short time. Manifold 41
When a pump is used as the supply unit 50, the pump may be operated in a reverse operation, that is, in a direction in which the phosphor paste is sucked. Then, the pressure of the manifold 41 may be reduced to a negative pressure by connecting a vacuum source to the vacuum source.

As another means for reducing the pressure of the manifold 41 to a negative pressure, an electromagnetic switching valve connected to a vacuum source is provided between the discharge electromagnetic switching valve 48 and the base 20 or on the base 20 itself. It is also possible by switching. At this time, if the pressure of the vacuum source can be adjusted from atmospheric pressure to an arbitrary negative pressure, the speed at which the phosphor paste is sucked from the discharge port can be adjusted. As a vacuum source, there is a vacuum pump, an aspirator, or a device that reversely operates a piston type pump.

The timing of these pressure adjustments can be controlled by the supply device controller 58 and the overall controller 60. By the way, even after passing the coating end position,
The table 6 continues its operation and stops when it reaches the end point position. At this time, if the portion to be applied still remains, the same procedure is performed except that the base 20 is moved in the Y-axis direction to the next start position to be applied and the table 6 is moved in the opposite direction. To apply. If the application is performed in the same movement direction of the table 6 as the first time, the base 20 is moved in the Y-axis direction to the next start position to be applied.
Returns to the X-axis preparation position.

When the coating process is completed, the table 6 is moved to the place where the substrate 4 is transferred by the unloader and stopped, and the suction of the substrate 4 is released, and the substrate 4 is released to the atmosphere. Is lifted off the surface of the table 6.

At this time, the lower surface of the substrate 4 is held by an unloader (not shown), and the substrate is transported to the next step.
When the substrate 4 is delivered to the unloader, the table 6 lowers the lift pins and returns to the home position.

At this time, the supply unit 50 is set with the discharge electromagnetic switching valve 48 closed and the suction electromagnetic switching valve 54 opened.
Is operated, and the phosphor paste is supplied from the phosphor paste tank 56 to the base 20 in an amount necessary for coating one substrate.

In the above coating process, in order to improve the coating thickness accuracy in a given effective area, the supply of the phosphor paste to the base 20 with respect to the coating start position and the phosphor with the base 20 with respect to the coating end position are performed. Since the timing of stopping the supply of the paste is important, each operation must be performed at an optimum point.

In this embodiment, the supply of the phosphor paste is started after setting the distance between the discharge port of the base 20 and the upper end of the partition wall of the substrate 4. This means that if the supply of the phosphor paste is started before the interval between the two is set, the phosphor paste spreads to the tip end surface of the discharge port when the phosphor paste is discharged from the discharge port, and contaminates portions other than the discharge port. In the worst case, there is a disadvantage that the phosphor pastes discharged from the adjacent discharge ports merge, which makes it impossible to perform the coating with high accuracy. If the supply of the phosphor paste is started after the tip end face of the discharge port portion of the base 20 is brought close to the substrate 4, the phosphor paste is guided between the partition walls before the phosphor paste spreads on the tip face. Such a disadvantage does not occur.

Further, in this embodiment, the application example in which the substrate 4 moves in the X-axis direction and the base 20 moves in the Y-axis and Z-axis directions has been described, but the base 20 and the substrate 4 are relatively moved. The table and the base can be moved in any manner as long as the table and the base can be moved three-dimensionally.

Although the case where one kind of phosphor paste is applied has been described in detail, the present invention can be applied to the case where phosphors of three colors such as red, blue and green are applied simultaneously.

FIG. 5 is a schematic sectional view of a base used in the present invention. Holes of a predetermined pitch and diameter are formed in a flat surface of the discharge port 5.
01 is provided. Further, as shown in FIG. 6, the discharge port may be formed by arranging a pipe 601 having the same shape, which is preferable because the base is less likely to be stained.

It is preferable that all the outlets of the base are arranged so that the center thereof is located between the partition walls to which the phosphor paste is applied.

The average diameter of the discharge port of the die is 10 μm.
It is preferably not less than m and not more than 500 μm and not more than the interval between the partition walls, so that color mixing with an adjacent color can be prevented.

Further, the shape of the outlet of the base is not circular,
The opening length substantially perpendicular to the partition wall is 10 μm or more and 500 μm.
Hereinafter, it may be smaller than the interval between the partition walls. At this time, the shape of the discharge port includes a long hole, an ellipse, a rectangle, and the like.

Further, by coating a fluororesin film such as “Teflon” (PTFE) on the discharge port surface and / or the inner wall of the discharge port of the base, the releasability of the phosphor paste on the discharge port surface and the inner wall of the discharge port is improved. And the discharge port surface can be prevented from becoming dirty.

Further, by coating an amorphous carbon film (DLC) on the discharge port surface and / or the discharge port inner wall of the base, the surface hardness of the discharge port surface and the discharge port inner wall is improved, and the wear resistance is improved. Is improved.

FIG. 7 is a sectional view and a bottom view showing another example of the base of the present invention. A plurality of phosphor paste storage units 704, 705, 706 in one base, phosphor paste supply ports 701, 702, 703 for supplying a phosphor paste to the phosphor paste storage units 704, 705, 706, and a storage unit 704, 705, 706 and discharge ports 710, 711,
Pass sections 707, 708, 70 fluidly connecting 712
9 Further, the discharge ports 710, 711, 712
Are more than the storage units 704, 705, 706 and are arranged in a straight line. Thereby, different types of phosphor pastes can be discharged from one base. Further, by setting the shortest distance between the discharge ports for discharging phosphor pastes of different colors to be 600 μm or more, it is possible to prevent color mixture with other colors.

FIG. 8 is a schematic view of a main part of a plasma display manufacturing apparatus according to another embodiment of the present invention. Not only one base but also two or more bases may be arranged in the Y direction. The bases 801 and 802 are driven by a control device (not shown) so as to be driven synchronously or asynchronously in both the X direction and the Y direction.

As described above, since the application of the phosphor paste to the substrate is shared by the two or more bases, the application time can be reduced.

At this time, as the two or more bases, a base for discharging a phosphor paste emitting the same color, a base for discharging a phosphor paste emitting different colors, or
Any base that discharges a phosphor paste that emits light of a different color or more may be used.

Further, these two or more bases are shifted in the direction perpendicular to the direction of the partition wall by an integral multiple of the partition spacing, and the positions of the two or more adjacent bases are determined to be “shift” <“outer dimension of base body”. In this case, it is efficient and preferable to dispose them so as to be shifted from the partition in the parallel direction.

Furthermore, by arranging three coating devices in series corresponding to the red, green, and blue phosphor pastes, phosphor layers of three colors can be efficiently formed between the partition walls.

FIG. 9 is a schematic diagram of a device for cleaning a discharge port surface of a base. The cleaning device 901 includes a discharge port surface 902 of the base 20.
Is disposed at a position where the wiping member 903 contacts. Although the wiping member 903 has a shape that wraps around the tip of the discharge port surface, it may have a shape that contacts only the discharge port surface 902. The wiping member 903 includes a tray 905
And is moved in the width direction (Y-axis direction) together with the tray 905. By the operation in which the wiping member 903 moves in the width direction in contact with the discharge port surface 902, the phosphor paste attached to the discharge port surface is scraped off. The scraped phosphor paste is guided from the outlet 906 to a waste liquid tank (not shown) via a tube 907 connected to the outlet. When gravity does not reach the waste liquid tank, it is desirable to use a vacuum source such as a vacuum pump for suction. Note that the wiping member 903 is located on the right side of the opening of the base 20 when the tray 905 reaches the rightmost end in the figure, and is located at a position where the phosphor paste discharged from the base 20 is not applied. Further, the tray 905 is used for the base 2
It is large enough to collect all of the phosphor paste discharged from 0.

Further, the tray 905 is connected to the lifting unit 908. The elevating unit 908 is configured to move up and down on the moving unit 910 along the guide 909 by an air cylinder (not shown). When the elevating unit 908 is at the lowest point, the wiping member 903 is at the lowest point and does not contact the discharge port surface 902 of the base 20 at a certain distance. The elevating unit 908 is configured such that the wiping member 903 is
Is adjusted so as to rise to a position where it comes into contact with the discharge port surface 902.

The moving unit 910 is driven by a ball screw 912 along a guide (not shown) on the gantry 911 and moves in the width direction. The ball screw 912 is connected to a servomotor (not shown), and can perform an arbitrary operation by controlling the operation.

The material of the wiping member 903 may be any material, but is preferably resin or rubber so as not to damage the discharge port surface of the base, and if it is selected in consideration of the chemical resistance to the phosphor paste. Good.

The application sequence using the wiping device 901 is as follows. First, with the wiping member 903 at the lowest point, the tray 905 is moved below the base 20 and the phosphor paste supply device is operated to discharge the phosphor paste from the base 20 to perform bleeding. When the bleeding is completed, the elevating unit 908 is lifted to remove the wiping member 90.
3 is brought into contact with the discharge port surface 902 of the base 20. Next, a servo motor (not shown) is driven to move the wiping member 903 in the width direction to the left in FIG. 8, and the phosphor paste attached to the discharge port surface 902 is wiped and removed. next,
The base 20 is moved to a predetermined position, and the phosphor paste is applied between the partition walls.

Thereafter, each time one application of the phosphor paste between the partition walls is completed, the above wiping operation may be performed, or the wiping operation may be performed after several application operations. The timing at which the wiping operation is performed depends on the degree of adhesion of the phosphor paste to the discharge port surface 902.

By this wiping operation, the coating operation can be performed while the discharge port surface of the base is always cleaned. Therefore, unnecessary phosphor paste adheres to the upper end of the partition wall of the substrate, or the gap between the partition walls to be coated can be removed. Inconveniences such as the phosphor paste being applied between adjacent partitions can be prevented, and uniform and stable application between the partitions can be performed.

Further, it is preferable to provide a means for removing the phosphor paste at a position other than the predetermined application position, for example, when the phosphor paste adheres to the upper end of the partition.

As a means for removing the phosphor paste,
There is a means for removing the adhesive by scraping with a spatula or removing the adhesive by contacting the upper end of the partition wall, or by blowing compressed air with an air nozzle. The material of the adhesive is not particularly limited as long as it has the above-described characteristics. Examples thereof include, but are not limited to, polyurethane rubber, polyethylene rubber, silicone rubber, and gel bodies thereof.

The constitution of the pressure-sensitive adhesive body composed of the above-mentioned viscous substance is not particularly limited, but it is preferable to use a belt or a roller having such a shape as to come into contact with the surface of the substrate. The belt may contact the substrate being transported while rotating between the feed roll and the take-up roll. The contact makes it possible to adhere and remove the phosphor paste on the top of the partition wall of the substrate.

[0139]

The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this. The concentrations (%) in Examples and Comparative Examples are% by weight unless otherwise specified.

Evaluation of the formed phosphor layer was carried out by the following seven items.

Paste dischargeability from discharge port Application time (total time required for phosphor paste application)
(Excluding drying time)) ・ Thickness of side surface (average thickness of 9 locations in the plane at the center of partition wall height) ・ Bottom thickness (average thickness of 9 locations in the plane on the dielectric layer) ・ Distribution of thickness (9 Difference between maximum thickness and minimum thickness when measuring at several locations)-Presence or absence of paste on top of partition walls-Mixed color (leakage of phosphor paste between adjacent partitions between partition walls to be formed) Example 1 340 mm width x depth After a photosensitive silver paste is screen-printed on a 440 mm × 2.8 mm thick soda glass substrate with a thickness of 5 μm over the entire surface, exposure, development, and baking using a photomask are performed to form a stripe 220 μm pitch. 1920 silver electrodes were formed. A glass paste composed of glass and a binder was screen-printed on the electrode, and then fired to form a dielectric layer. Next, screen printing and drying were performed on a photosensitive glass paste composed of a glass powder and a photosensitive organic component to a thickness of 200 μm. After that, exposure, development, and baking were performed using a photomask designed to form a partition between adjacent electrodes, thereby forming a partition. The shape of the partition walls was 220 μm in pitch, 30 μm in line width, 130 μm in height, and 1921 in number.

A phosphor paste was applied to the glass substrate on which the partition walls were formed, using the apparatus shown in FIG.

Phosphor paste: 40 g each of the following phosphor powders
Was mixed with 10 g of ethylcellulose, 10 g of terpineol and 40 g of benzyl alcohol, and kneaded with three ceramic rollers to prepare phosphor pastes of RGB colors.

Phosphor powder: Red: (Y, Gd, Eu) BO ₃ 50 volume% particle diameter 2.5 μm, specific surface area 2.3 m ² / g Green: (Zn, Mn) ₂ SiO ₄ 50 volume% particle diameter 2.9 μm, specific surface area 1.8 m ² / g Blue: (Ba, Eu) MgAl ₁₀ O ₁₇ 50% by volume particle size 3.1 μm, specific surface area 2.5 m ² / g The viscosity of the obtained phosphor paste is: Red 14 Pa · s, green 18 Pa · s, and blue 15 Pa · s.

The nozzle used for coating had an average pore diameter of 1
This is a base formed with 64 holes of 50 μm at a pitch interval of 660 μm, and one base having a discharge port length of 2 mm was used.

Using the red phosphor paste and the base,
The coating was performed with the distance between the upper end of the partition wall formed on the glass substrate and the tip of the outlet of the die kept at 0.1 mm. The coating was performed by moving the die at a speed of 50 mm / sec so as to be parallel to the partition walls while applying pressure to the die filled with the phosphor paste and continuously discharging the die.

After the start of coating, red and blue 2.6 kg / cm ² ,
After applying a pressure of 3 kg / cm ² for green, the application was stopped when the die advanced to the edge of the substrate, but the pressure was reduced by applying a negative pressure 0.1 seconds before reaching the edge of the partition wall. Next, the die was moved by 42.24 mm in the vertical direction of the partition wall to perform coating. 1
By performing the coating 0 times, 640 coatings were performed so that two coatings were provided between adjacent partition walls. Next, at 80 ° C
After drying for 15 minutes, a green phosphor was applied between the right partition walls and a blue phosphor was applied between the left partition walls to which the red phosphor paste was applied.

The substrate coated with the RGB phosphor paste was baked at 460 ° C. for 15 minutes and evaluated. Table 1 shows the evaluation results.

Example 2 Example 1 was repeated except that the number of bases was changed from one to two, and each base was moved and moved at 50 mm / sec.
A phosphor layer was formed in the same manner as described above. Table 1 shows the evaluation results.

Example 3 The procedure of Example 1 was repeated, except that the number of bases was changed from one to three, and each base was filled with phosphor pastes of RGB colors and applied by discharging. To form a phosphor layer. Table 1 shows the evaluation results.

Example 4 The same procedure as in Example 1 was carried out except that the number of discharge ports was changed from 64 to 640, and the application of one color phosphor paste was completed by one die movement. A body layer was formed. Table 1 shows the evaluation results.

Example 5 Using a substrate having an electrode pitch of 120 μm, a partition wall pitch of 120 μm, a line width of 30 μm, and a height of 90 μm, applying a coating once with a discharge port having a hole diameter of 75 μm and a pitch of 720 μm. 0.36mm-46.08mm-
0.36 mm-46.08 mm-0.36 mm-46.
08mm-0.36mm-46.08mm-0.36m
A phosphor layer was formed in the same manner as in Example 1 except that the coating was performed a total of 10 times by moving m. Table 1 shows the evaluation results.

Example 6 Using a substrate in which the electrode pitch was changed to 120 μm, the partition pitch was changed to 120 μm, the line width was changed to 30 μm, and the height was changed to 90 μm, the discharge port was set to 150 μm, and the pitch was set to 720 μm. 0.36mm-46.08
mm-0.36mm-46.08mm-0.36mm-
46.08 mm-0.36 mm-46.08 mm-0.
A phosphor layer was formed in the same manner as in Example 1 except that the coating was performed a total of 10 times by moving the 36 mm die. Furthermore, after baking the phosphor layer, the roller was rolled using an adhesive roller having a width of 500 mm and a diameter of 250 mm so that the entire upper part of the partition wall was in contact with the roller. Table 1 shows the evaluation results.

Example 7 A phosphor paste was applied in the same manner as in Example 5, except that the phosphor paste was changed to the following paste. Thereafter, the pitch was 120 μm, the opening line width was 80 μm, and the number of lines was 19.
After performing exposure using 20 photomasks, the resultant was developed with a 0.5% by weight aqueous solution of triethanolamine and fired to form a phosphor layer. Table 1 shows the evaluation results.

Phosphor paste: 50 g of each of the following phosphor powders
20 g of a binder (1: 1 copolymer of isobutyl methacrylate-acrylic acid, weight average molecular weight 24,000), 15 g of a photosensitive monomer (trimethylolpropane triacrylate), 20 g of gamma butyrolactone, and a polymerization initiator (manufactured by Ciba Geigy) After mixing 3 g of "Irgacure" 907), the mixture was kneaded with three rollers to prepare a paste.

Phosphor powder: Red: (Y, Gd, Eu) BO ₃ 50 volume% particle size 2.5 μm, specific surface area 2.3 m ² / g Green: (Zn, Mn) ₂ SiO ₄ 50 volume% particle size 2.9 μm, specific surface area 1.8 m ² / g Blue: (Ba, Eu) MgAl ₁₀ O ₁₇ 50% by volume particle size 3.1 μm, specific surface area 2.5 m ² / g The viscosity of the obtained phosphor paste is: Red 20 Pa · s, green 32 Pa · s, and blue 19 Pa · s.

Example 8 The composition of the phosphor paste of Example 1 was changed to 50 g of phosphor powder.
And a binder polymer (40% methacrylic acid, 30
% Methyl methacrylate, 30% styrene and a carboxyl group of 0.4 equivalent of glycidyl methacrylate added to carboxyl groups to obtain a weight average of 43,00.
The phosphor paste was changed to 40 g of a photosensitive polymer having 0 and an acid value of 95), 30 g of a solvent (γ-butyrolactone) and 4 g of a dispersant. Each component of the organic components was dissolved while being heated to 80 ° C., and then a phosphor powder was added and kneaded with a kneader to prepare a paste. The viscosity of the phosphor paste was 0.05 Pa · s for each of red, green and blue.

Further, the substrate is provided with a pitch of 150 μm and a height of 12 μm.
After changing the glass substrate on which 2000 partition walls of 0 μm and 30 μm in width were formed, changing the base to 640 outlets having a hole diameter of 80 μm to a base formed with a pitch of 450 μm, and discharging the red phosphor paste, the coated surface was lowered. And dried at 80 ° C. for 60 minutes. Then, after discharging the green phosphor paste, the coated surface is dried at 80 ° C. for 60 minutes, and after discharging the blue phosphor paste, the coated surface is turned down. After drying at 60 ° C. for 60 minutes, baking was performed at 500 ° C. for 30 minutes. Other conditions were the same as in Example 1 to form a phosphor layer. Table 1 shows the evaluation results.

Example 9 The composition of the phosphor paste was as follows: phosphor powder 50 g, binder polymer 40 g, solvent (γ-butyrolactone) 30 g
A phosphor paste was prepared in the same manner as in Example 8, except that the phosphor paste was changed to a phosphor paste comprising 4 g of a dispersing agent and the viscosity of the phosphor paste was set to 0.03 Pa · s for all of red, green, and blue.

Further, the substrate is provided with a pitch of 360 μm and a height of 14 μm.
Changed to a glass substrate on which 2000 partition walls having a thickness of 0 μm and a width of 50 μm were formed.
Pieces are formed at a pitch of 360 μm, and a red phosphor paste,
In the same manner as in Example 8 except that each of the blue phosphor paste and the green phosphor paste was changed to a die designed to simultaneously eject the phosphors, and the phosphors of each color were ejected and then dried at 80 ° C. for 45 minutes. A phosphor layer was formed. Table 1 shows the evaluation results.

Example 10 The composition of the phosphor paste was as follows: phosphor powder 50 g, binder polymer 20 g, trimethylolpropane triacrylate 20 g, solvent (γ-butyrolactone) 30 g, dispersant 4 g, photopolymerization initiator (“Irgacure 907”) , Manufactured by Ciba Geigy Co., Ltd.), and the viscosity of the phosphor paste is set to 0.03 Pa ·
A phosphor layer was formed in the same manner as in Example 8 except that s was used.

After that, exposure was performed using a photomask having a pitch of 120 μm, an opening line width of 80 μm, and 1920 lines, developed with a 0.5% by weight aqueous solution of triethanolamine, and baked to obtain a phosphor. A layer was formed.

After that, exposure was performed using a photomask having a pitch of 150 μm, an opening line width of 60 μm, and 1920 lines, developed with a 0.5% by weight aqueous solution of triethanolamine, and baked at 500 ° C. for 30 minutes. Thus, a phosphor layer was formed. Table 1 shows the evaluation results.

Comparative Example A screen plate having a pitch of 360 μm and an opening of 80 μm was formed on a substrate having an electrode pitch of 120 μm, a partition pitch of 120 μm, a line width of 30 μm, and a height of 90 μm.
The RGB color phosphor paste was screen printed. Next, the substrate was baked at 460 ° C. for 15 minutes to form a phosphor layer. Table 1 shows the evaluation results.

[0165]

[Table 1]

[0166]

According to the present invention, a phosphor layer of a plasma display can be easily and accurately formed between high-definition partition walls.

[Brief description of the drawings]

FIG. 1 is a schematic view showing one example of a coating method of the present invention.

FIG. 2 is a sectional view showing a relationship between a plasma display substrate and a base according to the present invention.

FIG. 3 is a schematic view of a plasma display manufacturing apparatus according to an embodiment of the present invention.

4 is a schematic view of a main part of the plasma display manufacturing apparatus shown in FIG.

FIG. 5 is a schematic view showing an example of a base used in the present invention.

FIG. 6 is a schematic view showing another example of the base used in the present invention.

FIG. 7 is a cross-sectional view and a bottom view showing still another example of the base used in the present invention.

FIG. 8 is a schematic view of an apparatus for manufacturing a plasma display according to another embodiment of the present invention.

FIG. 9 is a schematic view of an apparatus for cleaning a discharge port surface of a base in a plasma display manufacturing apparatus of the present invention.

[Explanation of symbols]

 2 base 4 board 6 table 7 suction hole 8 guide groove rail 9 slide leg 10 feed screw 11 connector 12 bearing 16 AC servomotor 20 base 22 holder 24 horizontal bar 26 linear actuator 29 telescopic rod 28 elevating bracket 30 elevating mechanism 32 Y axis Moving bracket 34 Post 36 Width moving mechanism 38 Sensor post 40 Height sensor 41 Manifold 42 Phosphor paste 44 Discharge port 46 Supply hose 48 Discharge electromagnetic switching valve 50 Supply unit 52 Suction hose 54 Suction electromagnetic switching valve 56 Phosphor paste Tank 58 Supply device controller 60 Overall controller 62 Motor controller 64 Sensor bracket 66 Position sensor 68 Position sensor 70 Camera support 72 Camera 74 Image processing device 5 Reference Signs List 1 discharge port 601 pipe 701 phosphor paste supply port 702 phosphor paste storage section 703 pass section 704 discharge port 801 cap 802 cap 901 cleaning device 902 discharge port face 903 wiping member 904 bracket 905 tray 906 discharge port 907 tube 908 rise 909 Guide 910 Moving unit 911 Mount 912 Ball screw

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Takao Sano, 1-1-1, Sonoyama, Otsu-shi, Shiga Prefecture Inside the Shiga Plant of Toray Industries Co., Ltd. (72) Takaki Masaki, 1-1-1 Sonoyama, Otsu-shi, Shiga Prefecture No. Toray Industries, Inc. Shiga Plant

Claims (35)

[Claims] 1. A plasma display in which a phosphor layer containing a phosphor powder and an organic compound is continuously discharged from a base having a plurality of discharge ports on a substrate on which a plurality of partition walls are formed to form a phosphor layer. Production method. 2. A method in which three kinds of phosphor pastes containing phosphor powders emitting red, green and blue light are applied in stripes from a base having an ejection port to partition walls on a substrate, and then heated. 2. The method according to claim 1, wherein the phosphor layer is formed by the following method. 3. An interval (S) between partition walls and an average pore diameter (D) of a discharge port.
3. The method according to claim 1, wherein the following conditions are satisfied. 10 μm ≦ D ≦ S ≦ 500 μm 4. The method according to claim 1, wherein the discharge port is a flat plate, a nozzle or a needle. 5. The method for manufacturing a plasma display according to claim 1, wherein a die having 20 to 2,000 discharge ports is used. 6. The method according to claim 5, wherein a die having 150 to 2,000 discharge ports is used. 7. The plasma display manufacturing apparatus according to claim 1, wherein a base having a discharge port number of 16n ± 5 (n is a natural number) is used. 8. The method for manufacturing a plasma display according to claim 1, wherein a base having a discharge port pitch of 0.12 to 3 mm is used. 9. A plasma display according to claim 1, wherein a base having a discharge port pitch of 3 m times the partition wall pitch (m is an integer of 1 to 10) is used. Manufacturing method. 10. The plasma display according to claim 1, wherein a base satisfying the following formula is used for the length (L) of the discharge port and the average hole diameter (D) of the discharge port. Manufacturing method. L / D = 0.1-600 11. The discharge port has an average pore diameter (D) of 60 to 40.
2. The coating method according to claim 1, wherein the coating is performed with a base having a thickness of 0 .mu.m.
A method for manufacturing a plasma display according to claim 10. 12. The phosphor paste is applied in a state where the distance between the upper end of the partition wall formed on the glass substrate and the tip of the outlet of the die is 0.01 to 2 mm. A method for manufacturing a plasma display according to claim 11. 13. A paste containing phosphors emitting different colors from one base is ejected, and the shortest interval between the ejection openings for ejecting the phosphor pastes of different colors is 600 μm.
13. The method according to claim 1, wherein:
The method for manufacturing a plasma display according to any one of the above. 14. The method of manufacturing a plasma display according to claim 1, wherein the plasma display device has two or more independent bases, and the two or more bases are applied simultaneously. 15. The method according to claim 14, wherein two or more bases are run at the same speed to apply the coating. 16. The method for manufacturing a plasma display according to claim 2, wherein a coating process is performed for each color and a drying process is performed each time one color is coated. 17. The method for manufacturing a plasma display according to claim 1, wherein the base and the substrate are relatively moved in parallel to a partition on the glass substrate. 18. The method of manufacturing a plasma display according to claim 1, wherein when the discharge of the phosphor paste is stopped, the inside of the base is kept under a negative pressure. 19. The method according to claim 19, wherein the discharge of the phosphor paste is started after the relative movement of the base and the substrate is started in parallel with the partition on the substrate, and the discharge is stopped before the end of the relative movement. 19. The method for manufacturing a plasma display according to any one of items 1 to 18. 20. A phosphor powder having a 50% by weight particle size of 0.5 to 10 μm and a specific surface area of 0.1 to ² m ² / g as a phosphor powder. 20. The method for manufacturing a plasma display according to any one of 19 to 19. 21. A phosphor comprising 30 to 60% by weight of a phosphor powder, 5 to 20% by weight of a binder resin and a solvent, wherein the weight ratio of the phosphor powder to the binder resin is 6: 1 to 3: 1. 22. The method of manufacturing a plasma display according to claim 1, wherein a paste is used. 22. The method according to claim 21, wherein the binder resin is a cellulose compound. 23. The method according to claim 21, wherein the solvent is a solvent containing terpineol. 24. A method for manufacturing a plasma display in which a phosphor screen is formed by applying three kinds of phosphor pastes containing phosphor powders emitting red, green and blue light, respectively, between partition walls on a glass substrate. 24. The method for manufacturing a plasma display according to claim 2, wherein the phosphor present at a position other than a predetermined application position is removed by attaching the phosphor to an adhesive. 25. The method according to claim 1, wherein the phosphor located at the upper end of the partition is removed by attaching the phosphor to an adhesive. 26. A phosphor paste which satisfies the following relationship among the partition wall height H μm, the partition wall pitch P μm, the partition line width W μm, and the ratio a (vol%) of the phosphor powder contained in the phosphor paste. The method for manufacturing a plasma display according to any one of claims 1 to 25, characterized in that: (2H + P−W) × 5 ≦ H × (P−W) × a / 100 ≦
(2H + P−W) × 30 27. A phosphor paste having a viscosity of 2 to 50.
2. The method according to claim 1, wherein a paste of Pa.s is used.
27. The method of manufacturing a plasma display according to claim 26. 28. The method of manufacturing a plasma display according to claim 1, wherein the phosphor paste is a photosensitive phosphor paste. 29. The method according to claim 28, wherein a paste having the following composition is used as the photosensitive phosphor paste. Organic component: 15 to 60 parts by weight Phosphor powder: 40 to 85 parts by weight Solvent: 10 to 50 parts by weight 30. The method according to claim 1, wherein the partition layer has a stripe shape having the following dimensions. Pitch: 100-250 μm Line width: 15-40 μm Height: 60-170 μm 31. The method according to claim 1, wherein the upper surface of the partition is black. 32. The following relationship is shown between the side thickness (T1) and the bottom thickness (T2) at half the height of the partition wall of the phosphor layer. The method for manufacturing a plasma display according to any one of the above. 10 ≦ T1 ≦ 50 μm 10 ≦ T2 ≦ 50 μm 0.2 ≦ T1 / T2 ≦ 5 33. A table for fixing a substrate having a plurality of partition walls formed on a surface thereof, a base having a plurality of discharge ports facing the partition walls of the substrate, and a table including the table and the base.
An apparatus for manufacturing a plasma display, comprising a moving means for performing a relative movement in a three-dimensional manner. 34. The plasma display manufacturing apparatus according to claim 33, wherein the average hole diameter (D) of the discharge port of the die satisfies the following condition with respect to the partition wall spacing (S). 10 μm ≦ D ≦ S ≦ 500 μm 35. The plasma display manufacturing apparatus according to claim 33, wherein the number of discharge ports of the base is 20 to 2,000.