KR19990072243A - 단일측연마장치용캐리어및단일측연마장치 - Google Patents
단일측연마장치용캐리어및단일측연마장치 Download PDFInfo
- Publication number
- KR19990072243A KR19990072243A KR1019990000660A KR19990000660A KR19990072243A KR 19990072243 A KR19990072243 A KR 19990072243A KR 1019990000660 A KR1019990000660 A KR 1019990000660A KR 19990000660 A KR19990000660 A KR 19990000660A KR 19990072243 A KR19990072243 A KR 19990072243A
- Authority
- KR
- South Korea
- Prior art keywords
- workpiece
- carrier
- pressure plate
- wafer
- suction
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 67
- 238000004891 communication Methods 0.000 claims description 11
- 230000004044 response Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 126
- 238000003825 pressing Methods 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920004943 Delrin® Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5141198A JPH11235662A (ja) | 1998-02-17 | 1998-02-17 | 片面研磨装置用キャリア及び片面研磨装置 |
| JP98-51411 | 1998-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990072243A true KR19990072243A (ko) | 1999-09-27 |
Family
ID=12886198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990000660A KR19990072243A (ko) | 1998-02-17 | 1999-01-13 | 단일측연마장치용캐리어및단일측연마장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH11235662A (ja) |
| KR (1) | KR19990072243A (ja) |
| TW (1) | TW379160B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001338901A (ja) | 2000-05-26 | 2001-12-07 | Hitachi Ltd | 平坦化加工方法及び、装置並びに，半導体装置の製造方法 |
| JP2015193065A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| CN115990825A (zh) * | 2022-12-27 | 2023-04-21 | 西安奕斯伟材料科技股份有限公司 | 一种硅片双面抛光用的载具、双面抛光装置及硅片 |
-
1998
- 1998-02-17 JP JP5141198A patent/JPH11235662A/ja active Pending
- 1998-12-18 TW TW087121128A patent/TW379160B/zh not_active IP Right Cessation
-
1999
- 1999-01-13 KR KR1019990000660A patent/KR19990072243A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11235662A (ja) | 1999-08-31 |
| TW379160B (en) | 2000-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |