KR19990056349A - Connector of plating equipment for semiconductor manufacturing - Google Patents
Connector of plating equipment for semiconductor manufacturing Download PDFInfo
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- KR19990056349A KR19990056349A KR1019970076344A KR19970076344A KR19990056349A KR 19990056349 A KR19990056349 A KR 19990056349A KR 1019970076344 A KR1019970076344 A KR 1019970076344A KR 19970076344 A KR19970076344 A KR 19970076344A KR 19990056349 A KR19990056349 A KR 19990056349A
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- roller
- connector
- lead frame
- plating
- manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
반도체 제조용 도금장치의 커넥터에 관해 개시된다. 개시된 반도체 제조용 도금장치의 커넥터는 제1롤러와, 상기 제1롤러에 인접되게 설치되어 제1롤러와의 사이에 도금될 리드프레임이 가압되도록 설치되며 제1롤러와 더불어 전류를 공급해주는 제2롤러를 포함하며, 상기 제1롤러와 제2롤러의 내부에 전해질용액이 리드프레임으로 분출되도록 분출통로가 형성된 것을 특징으로 한다. 이로써, 리드프레임과의 접촉 부위에 전해질 용액의 다중 접촉을 실현하여 도금이 균일하게 되는 이점이 있다.A connector of a plating apparatus for manufacturing a semiconductor is disclosed. The connector of the plating apparatus for semiconductor manufacturing disclosed herein is installed so as to press a first roller and a lead frame to be plated between the first roller and adjacent to the first roller, and to supply a current together with the first roller. It includes, characterized in that the ejection passage is formed so that the electrolyte solution is ejected into the lead frame in the first roller and the second roller. As a result, multiple contacts of the electrolyte solution are realized at the contact portion with the lead frame, so that the plating is uniform.
Description
본 발명은 반도체 제조용 도금장치에 관한 것으로, 특히, 릴타입의 리드프레임을 도금하기 위하여 전류를 공급하는 도금장치의 커넥터에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for semiconductor manufacturing, and more particularly, to a connector of a plating apparatus for supplying a current for plating a reel type lead frame.
반도체 리드프레임 제조공정중의 하나인 도금공정에서는 릴투릴(reel to reel) 및 컷스트립(cut strip)등의 자동화 도금장치를 사용한다. 이러한 자동화 장치는 각종 전처리액 및 다단계의 기능성 도금액 및 후처리액을 이용하여 연속 전해 도금을 실시하게 된다. 이러한 기기 특성으로 인하여 순차적으로 도금진행시 전류를 공급해주는 커넥터가 필요하게 되는데, 도 1에 종래의 반도체 제조용 도금장치에 채용되는 커넥터를 나타내었다.In the plating process, one of the semiconductor lead frame manufacturing processes, an automated plating apparatus such as reel to reel and cut strip is used. The automated device performs continuous electroplating using various pretreatment liquids, multi-stage functional plating liquids, and post-treatment liquids. Due to such device characteristics, a connector for supplying a current at the time of plating progress is required. FIG. 1 shows a connector employed in a plating apparatus for manufacturing a semiconductor.
도면을 참조하면, 반도체 제조용 도금장치는 제1롤러(12)와, 상기 제1롤러(12)에 인접되게 설치된 제2롤러(13)로 이루어진다. 도금될 리드프레임(11)은 상기 제1롤러(12)와 제2롤러(13)사이에 위치하며, 두 롤러와의 기계적인 접촉으로 전류를 공급받는다. 이때, 공급되는 전류의 양에 따라 리드프레임의 도금두께가 결정되어 진다.Referring to the drawings, the plating apparatus for manufacturing a semiconductor includes a first roller 12 and a second roller 13 provided adjacent to the first roller 12. The lead frame 11 to be plated is located between the first roller 12 and the second roller 13 and is supplied with current by mechanical contact with the two rollers. At this time, the plating thickness of the lead frame is determined according to the amount of current supplied.
그러나, 상기한 반도체 제조용 도금장치의 커넥터는 단순 기계식 접촉방식이므로 접촉불량시 커넥터의 롤러와 리드프레임 사이에서 전기 스파크가 발생하여 롤러의 표면이 타는 현상이 발생하며 이것은 전류의 진행을 방해하여 리드프레임에 적정 전류가 전달되지 못해 도금두께의 불량을 초래한다. 또한, 리드프레임과 커넥터의 롤러 사이의 물리적 접촉에 의해 리드프레임 표면에 스크래치가 발생되어 도금불량의 원인을 초래한다.However, since the connector of the plating apparatus for semiconductor manufacturing is a simple mechanical contact method, an electrical spark occurs between the roller of the connector and the lead frame during contact failure, causing the surface of the roller to burn. Inappropriate current cannot be delivered to the substrate, resulting in poor plating thickness. In addition, a scratch occurs on the surface of the lead frame by the physical contact between the lead frame and the roller of the connector, causing the plating failure.
본 발명은 상기 문제점을 해결하기 위하여 창출된 것으로서, 리드프레임 제조공정중의 하나인 도금공정에서 물 또는 전해질용액을 이용하여 리드프레임의 전면에 걸쳐 도금이 균일하게 되고 리드프레임의 표면 손상이 적도록 구조를 개선한 반도체 제조용 도금장치의 커넥터를 제공함에 그 목적이 있다.The present invention has been made to solve the above problems, the plating is one of the lead frame manufacturing process using a water or an electrolyte solution to uniform plating over the entire surface of the lead frame and less damage to the surface of the lead frame An object of the present invention is to provide a connector of a plating apparatus for manufacturing a semiconductor having an improved structure.
도 1은 종래의 반도체 제조용 도금장치의 커넥터를 도시한 도면이다.1 is a view showing a connector of a conventional plating apparatus for manufacturing a semiconductor.
도 2는 본 발명에 따른 반도체 제조용 도금장치의 커넥터를 도시한 도면이다.2 is a view showing a connector of the plating apparatus for manufacturing a semiconductor according to the present invention.
< 도면의 주요 부분에 대한 부호 설명 ><Explanation of Signs of Major Parts of Drawings>
111...리드프레임 112...제1롤러111 ... Lead frame 112 ... 1st roller
113...제2롤러 112a, 113a...분출통로113 second roller 112a, 113a
상기 목적을 달성하기 위하여 본 발명은 제1롤러와, 상기 제1롤러에 인접되게 설치되어 제1롤러와의 사이에 도금될 리드프레임이 가압되도록 설치되며 제1롤러와 더불어 전류를 공급해주는 제2롤러를 포함하며, 상기 제1롤러와 제2롤러의 내부에 전해질용액이 리드프레임으로 분출되도록 분출통로가 형성된 것을 특징으로 한다.In order to achieve the above object, the present invention provides a second roller and a lead frame which is installed adjacent to the first roller to be plated between the first roller and pressurized to supply current together with the first roller. It comprises a roller, characterized in that the injection passage is formed in the interior of the first roller and the second roller so that the electrolyte solution is ejected to the lead frame.
이하, 첨부된 도면을 참조하여 본 발명에 따른 반도체 제조용 도금장치의 커넥터의 일 실시예를 상세히 설명한다. 도 2는 본 발명에 따른 반도체 제조용 도금장치의 커넥터를 도시한 도면이다.Hereinafter, an embodiment of a connector of a plating apparatus for manufacturing a semiconductor according to the present invention will be described in detail with reference to the accompanying drawings. 2 is a view showing a connector of the plating apparatus for manufacturing a semiconductor according to the present invention.
반도체 제조용 도금장치는 도금될 리드프레임에 전류를 공급해주는 커넥터를 구비한다. 이 커넥터는 두 개의 롤러(112)(113)로 이루어진다. 제1롤러(112)는 그 내부에 물 또는 전해질을 통과시키는 분출통로(112a)가 형성된다. 제1롤러(112)와 인접되게 설치된 제2롤러(113)도 그 내부에 물 또는 전해질을 통과시키는 분출통로(113a)가 형성된다. 이 분출통로(112a)(113a)들은 두 롤러(112)(113) 사이에 개재되는 리드프레임(111)으로 물 또는 전해질용액이 향하도록 형성된다.The plating apparatus for manufacturing a semiconductor has a connector for supplying current to a lead frame to be plated. This connector consists of two rollers 112 and 113. The first roller 112 has a jet passage 112a through which water or an electrolyte passes. The second roller 113 installed adjacent to the first roller 112 also has a spray passage 113a through which water or an electrolyte passes. The jet passages 112a and 113a are formed such that water or an electrolyte solution is directed to the lead frame 111 interposed between the two rollers 112 and 113.
상기한 구성의 반도체 제조용 도금장치의 커넥터는 두 롤러(112)(113) 내부에 형성된 분출통로를 통해 전해질용액을 도금될 리드프레임(111)에 공급시켜 리드프레임의 전면에 걸쳐 전류가 일정하게 공급되도록 하였기 때문에 리드프레임의 도금두께기 일정하게 유지된다.The connector of the plating apparatus for manufacturing a semiconductor having the above configuration supplies an electrolyte solution to the lead frame 111 to be plated through the ejection passages formed inside the two rollers 112 and 113 so that the current is uniformly supplied over the entire surface of the lead frame. Since the plating thickness of the lead frame is kept constant.
상기한 반도체 제조용 도금장치의 커넥터는 다음과 같은 효과가 수반된다.The connector of the plating apparatus for manufacturing a semiconductor is accompanied with the following effects.
첫째, 리드프레임의 전면에 걸쳐서 도금이 균일하게 이루어진다.First, plating is uniformly carried out over the entire surface of the leadframe.
본 발명에 따른 반도체 제조용 도금장치의 커넥터에서는 두 롤러의 내부에 리드프레임으로 향하는 전해질 용액의 분출통로를 형성하였다. 따라서, 롤러에 의한 접점식 방법에서 발생되는 전압강하를 전해질용액으로 방지하기 때문에 리드프레임에 일정한 전류가 공급되어 리드프레임의 전면에 걸쳐서 도금이 균일하게 이루어진다.In the connector of the plating apparatus for manufacturing a semiconductor according to the present invention, the ejection passage of the electrolyte solution toward the lead frame is formed inside the two rollers. Therefore, since the voltage drop generated by the contact method by the roller is prevented by the electrolyte solution, a constant current is supplied to the lead frame, and plating is uniformly performed over the entire surface of the lead frame.
둘째, 리드프레임의 표면의 손상이 종래에 비해 적어진다.Second, the damage of the surface of the lead frame is less than in the prior art.
상기 도금장치의 커넥터에 구비되는 롤러의 분출통로를 통해 리드프레임에 공급되는 전해질 용액은 리드프레임의 외면을 감싸주는 윤활작용을 하므로 리드프레임의 표면 손상이 종래에 비해 적어지는 이점이 있다.Since the electrolyte solution supplied to the lead frame through the ejection passage of the roller provided in the connector of the plating apparatus has a lubricating action surrounding the outer surface of the lead frame, there is an advantage that the surface damage of the lead frame is less than in the prior art.
본 발명은 도면에 도시된 일 실시예를 참고로 설명되었으나, 이는 예시적인 것에 불과하며, 당해 분야에서 통상적 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호 범위는 첨부된 특허 청구범위에 한해서 정해져야 할 것이다.Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention should be defined only by the appended claims.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970076344A KR100254276B1 (en) | 1997-12-29 | 1997-12-29 | Connector of plating apparatus of manufacturing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970076344A KR100254276B1 (en) | 1997-12-29 | 1997-12-29 | Connector of plating apparatus of manufacturing semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990056349A true KR19990056349A (en) | 1999-07-15 |
| KR100254276B1 KR100254276B1 (en) | 2000-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970076344A KR100254276B1 (en) | 1997-12-29 | 1997-12-29 | Connector of plating apparatus of manufacturing semiconductor |
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| KR (1) | KR100254276B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100712143B1 (en) * | 2003-05-20 | 2007-04-27 | 임근호 | Connector for lead frame plating |
-
1997
- 1997-12-29 KR KR1019970076344A patent/KR100254276B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100712143B1 (en) * | 2003-05-20 | 2007-04-27 | 임근호 | Connector for lead frame plating |
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| Publication number | Publication date |
|---|---|
| KR100254276B1 (en) | 2000-05-01 |
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