KR0138461Y1 - Dipping apparatus using slit groove - Google Patents
Dipping apparatus using slit groove Download PDFInfo
- Publication number
- KR0138461Y1 KR0138461Y1 KR2019950042766U KR19950042766U KR0138461Y1 KR 0138461 Y1 KR0138461 Y1 KR 0138461Y1 KR 2019950042766 U KR2019950042766 U KR 2019950042766U KR 19950042766 U KR19950042766 U KR 19950042766U KR 0138461 Y1 KR0138461 Y1 KR 0138461Y1
- Authority
- KR
- South Korea
- Prior art keywords
- dipping
- tank
- solution
- pcb substrate
- pcb
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Abstract
디핑 장치에서 용액이 충진된 탱크(50)를 승강시키면서 클램프(52)에 그립된 PCB기판(P)을 함침시키는 것은 탱크(50) 상승 시 하나의 PCB기판(P)만을 함침시킬 수 있게 되어 디핑 공정 능률이 저하됨을 개선하기 위하여, 다수의 PCB기판(P)을 연속적으로 디핑할 수 있도록 구성된 디핑 수단을 탱크(50)에 설치하여 구성함으로써 디핑 효율을 향상시킬 수 있게 된다.Impregnating the PCB substrate P gripped by the clamp 52 while elevating the tank 50 filled with the solution in the dipping apparatus may impregnate only one PCB substrate P when the tank 50 is raised. In order to improve the deterioration of the process efficiency, it is possible to improve the dipping efficiency by installing a dipping means in the tank 50 configured to continuously dipping a plurality of PCB substrates (P).
Description
제1도는 본 고안에 따른 디핑 장치를 도시한 사시도.1 is a perspective view showing a dipping apparatus according to the present invention.
제2도는 제1도의 단면도.2 is a cross-sectional view of FIG.
제3도는 일반적인 디핑 장치를 도시한 개략 단면도.3 is a schematic cross-sectional view showing a general dipping apparatus.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 펌프 2 : 이송홈1: Pump 2: Transfer Groove
3 : 디핑조 50 : 탱크3: dipping tank 50: tank
본 고안은 디핑 장치에 관한 것으로서, 보다 상세하게는 PCB기판 등을 용액에 침전시키는 슬릿 홈을 이용한 디핑 장치에 관한 것이다.The present invention relates to a dipping apparatus, and more particularly, to a dipping apparatus using a slit groove to precipitate a PCB substrate and the like in a solution.
일반적으로, PCB(Printed Circuit Board)는 절연체인 플레이트상에 일정한 패턴을 형성한 후 여기에 각종 부품을 삽입하여 튜너등과 같은 부품을 제작하게 된다.In general, a printed circuit board (PCB) forms a predetermined pattern on a plate which is an insulator, and then inserts various components therein to manufacture a component such as a tuner.
상기한 PCB기판은 통상 베이크라이트판을 사용하게 되고, 상기한 베이크라이트판에 박막 또는 후막 공정을 통해 일정한 형태의 패턴을 형성하게 되는 것이다.The PCB substrate is usually to use a bakelite plate, to form a pattern of a predetermined shape on the bakelite plate through a thin film or a thick film process.
여기서, 상기한 PCB기판은 패턴 형성 공정 및 부품 실장 등의 공정에서 절연 및 세척 등을 위해 표면 장력이 강한 납성분이 포함된 일정한 성분의 용액에 PCB기판을 함침시켜야 한다.Here, the PCB substrate should be impregnated with the PCB substrate in a solution of a certain component containing a lead component having a strong surface tension for insulation and cleaning in the process of pattern formation and component mounting.
즉, 디핑 공정을 통해 PCB기판에 세정 및 절연체 도포 등을 행하게 되는 것이다.In other words, the PCB substrate is cleaned and coated with an insulator through a dipping process.
상기한 디핑 공정은 제3도에 도시된 바와 같이 용액이 충만되어 있는 탱크(50)와, 상기한 탱크(50)의 저면에 설치되어 이를 승강시키게 되는 모터(51)와, 상기한 탱크(50)의 상부에 위치됨과 아울러 PCB기판(P)을 그립하여 탱크(50) 상승시 함침되도록 하는 클램프(52)로 구성된 디핑장치를 사용하게 된다.The dipping process includes a tank 50 filled with a solution as shown in FIG. 3, a motor 51 installed on the bottom surface of the tank 50, and elevating the tank 50, and the tank 50. In addition to being positioned on the top of the), the PCB board (P) is gripped to use a dipping device consisting of a clamp 52 to be impregnated when the tank 50 is raised.
여기서, 상기한 디핑 장치는 클램프(52)에 PCB기판(P)을 이송시킨 후 모터(51)를 사용하여 상기한 탱크(50)를 상승시키게 된다.In this case, the dipping apparatus transfers the PCB substrate P to the clamp 52 and then raises the tank 50 using the motor 51.
탱크(50)가 상승하게 되면 클램프(52)에 그립되어 있는 PCB기판(P)이 탱크(50) 내부의 용액에 함침됨으로써 디핑 공정이 완료되는 것이다.When the tank 50 rises, the PCB substrate P gripped by the clamp 52 is impregnated in the solution inside the tank 50, thereby completing the dipping process.
그러나, 상기한 바와 같이 용액이 충진된 탱크를 승강시키면서 클램프에 그립된 PCB기판을 함침시키는 것은 탱크 상승 시 하나의 PCB기판만을 함침시킬 수 있게 되어 디핑 공정 능률이 저하되며 또한 탱크가 하강할 때 제품과 함침액 사이에 표면장력으로 인한 버(burr)가 발생하여 불량의 원인이 되는 문제점이 있다.However, impregnating the PCB substrate gripped in the clamp while lifting the tank filled with the solution as described above can impregnate only one PCB substrate when the tank is raised, which reduces the dipping process efficiency and the product when the tank is lowered. There is a problem in that a burr caused by the surface tension between the and the impregnation liquid causes the defect.
따라서, 본 고안의 목적은 상기한 문제점을 해결하기 위한 것으로서, PCB기판을 한 번에 하나씩 디핑하는 데 따른 작업 능률 저하를 방지하고 버(burr)가 발생을 방지할 수 있는 슬릿홈을 이용한 디핑 장치를 제공함에 있다.Accordingly, an object of the present invention is to solve the above problems, a dipping apparatus using a slit groove that can prevent the deterioration of work efficiency caused by dipping PCB boards one at a time and prevent the occurrence of burrs In providing.
상기한 목적을 실현하기 위하여 본 고안은 PCB기판을 연속적으로 디핑할 수 있도록 구성된 디핑 수단을 탱크에 설치하여 구성함을 특징으로 한다.In order to achieve the above object, the present invention is characterized in that the dipping means configured to continuously dipping the PCB substrate is installed in the tank.
이하, 첨부 도면을 참조하여 본 고안의 바람직한 실시예를 도시하면 다음과 같다.Hereinafter, preferred embodiments of the present invention with reference to the accompanying drawings as follows.
제1도와 제2도는 본 고안에 따른 디핑 장치를 도시한 사시도와 단면도로서, PCB기판(P)을 연속적으로 디핑할 수 있도록 구성된 디핑 수단이 탱크(50)에 설치되어 있다.1 and 2 are a perspective view and a cross-sectional view showing a dipping apparatus according to the present invention, the dipping means configured to continuously dipping the PCB substrate (P) is provided in the tank (50).
상기한 디핑 수단은 탱크(50)에 안착되어 용액에 함침되어 있는 펌프(1)와, 상기한 펌프(1)가 저면에 연결되어 용액이 이송될 수 있고 탱크(50)의 중간에 고정되어 있을 뿐만 아니라 다수의 PCB기판(P)이 용액에 함침되면서 이동할 수 있도록 다수의 이송홈(2)이 형성되어 있는 디핑조(3)로 구성되어 있다.The dipping means is a pump (1) seated in the tank 50 and impregnated with the solution, and the pump (1) is connected to the bottom so that the solution can be transferred and fixed in the middle of the tank (50) In addition, a plurality of PCB substrates (P) is composed of a dipping tank (3) is formed with a plurality of transfer grooves (2) to be moved while being impregnated in the solution.
즉, 상기한 클램프(52)에 그립되어 있는 다수의 PCB기판(P)이 수평 이동하면서 상기한 다수의 이송홈(2)을 통과하게 되고, 상기한 디핑조(3)에 충만되어 양측으로 흘러 내리는 용액에 함침되는 것이다.That is, the plurality of PCB substrates P gripped by the clamp 52 pass through the plurality of transfer grooves 2 while horizontally moving, and are filled in the dipping tank 3 and flow to both sides. It is impregnated with the falling solution.
상기한 바와 같은 본 고안의 작용 효과를 설명하면 펌프(1)가 동작되면서 탱크(50) 내부의 용액을 디핑조(3)에 공급하게 된다.Referring to the operation and effect of the present invention as described above, the pump 1 is operated to supply the solution in the tank 50 to the dipping tank (3).
디핑조(3)에 용액을 공급할 때에는 이송홈(2)을 통해서 흘러 내릴뿐만 아니라 디핑조(3)의 상단을 넘쳐서 흘러내리도록 공급하여 준다. 용액 표면에 있던 슬러지들이 흘러서 제거가 된다.When supplying the solution to the dipping tank (3) not only flows down through the transfer groove (2) but also supplies to flow over the top of the dipping tank (3). The sludge on the surface of the solution flows and is removed.
이때, 상기한 PCB기판(P)이 클램프(52)에 의해 이송되면서 이송홈(2)을 통과하게 되면 상기한 PCB기판(P)이 용액에 함침된 상태가 되는 것이다.At this time, when the PCB substrate P passes through the transfer groove 2 while being transferred by the clamp 52, the PCB substrate P is impregnated in the solution.
물론, 상기한 용액은 펌프(1)를 통해 연속 공급됨과 아울러 탱크(50)에 흘러내리게 되는 바, 상기한 용액은 연속적으로 디핑조(3)에 공급하여 정화시킬 수 있게 된다.Of course, the solution is continuously supplied through the pump 1 and flows down into the tank 50, so that the solution can be continuously supplied to the dipping tank 3 to be purified.
이상과 같이 본 고안은 다수의 PCB기판을 연속적으로 이송하면서 디핑하게 됨으로써 디핑 공정 효율이 향상되는 잇점이 있는 것이다.As described above, the present invention is advantageous in that the dipping process efficiency is improved by dipping while continuously transferring a plurality of PCB substrates.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950042766U KR0138461Y1 (en) | 1995-12-18 | 1995-12-18 | Dipping apparatus using slit groove |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950042766U KR0138461Y1 (en) | 1995-12-18 | 1995-12-18 | Dipping apparatus using slit groove |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970048491U KR970048491U (en) | 1997-07-31 |
KR0138461Y1 true KR0138461Y1 (en) | 1999-05-15 |
Family
ID=19435104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950042766U KR0138461Y1 (en) | 1995-12-18 | 1995-12-18 | Dipping apparatus using slit groove |
Country Status (1)
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KR (1) | KR0138461Y1 (en) |
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1995
- 1995-12-18 KR KR2019950042766U patent/KR0138461Y1/en not_active IP Right Cessation
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Publication number | Publication date |
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KR970048491U (en) | 1997-07-31 |
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