KR20040038494A - Electrodeposition resist coating apparatus - Google Patents

Abstract

PURPOSE: An apparatus for coating electrodeposition resist is provided to greatly improve productivity by uniformly forming a photoresist layer on a flexible conductive material or all kinds of electronic components, and to reduce the fabricating cost and an installation space by making the apparatus compact. CONSTITUTION: An uncoiler part(10) supplies a conductive material(M) for applying a photoresist layer and has a conductive material supplying reel(12) and an interleaf collecting reel(14) that rotate to remove the interleaf from the conductive material. An electrode part(20) has a plurality of electrode contact reels(22,24) for applying current to the conductive material supplied from the conductive material supplying reel. An electrodeposition part(30) applies an electrodeposition solution(L) to the conductive material passing through the electrode contact reels. A collection cleaning part(40) and a cleaning part(50) clean the conductive material coated with the electrodeposition solution. A dry unit(60) dries the cleaned conductive material. A drive reel(72) is provided with the power of a motor and rotates to perform a process on the conductive material, installed in a driver part(70). A coiler part(80) has a conductive material collecting reel(82) and an interleaf supplying reel(84), collecting the conductive material coated with the photoresist layer while rotating to attach an interleaf so that the conductive materials don't directly contact each other.

Description

Electrodeposition Resist Coating Device {ELECTRODEPOSITION RESIST COATING APPARATUS}

The present invention relates to an electrodeposition resist coating apparatus, and more particularly, a flexible printed circuit board, an inner layer, in addition to a lead frame and a semiconductor package, which are manufactured in a reel to reel manner using an electrodeposition resist coating apparatus of a reel to reel type. The photoresist film can be uniformly coated on a flexible conductive material such as a printed circuit board or all electronic components.

In general, the electrodeposition coating method is a coating solution in which a resin having a solid content of about 10% is dispersed in water, and deposits the adherend as a conductor with an anode or a cathode, and then passes the direct current to electrically coat the equipment and process. It is similar to the electroplating equipment, and the non-electric part is not coated, so it can be easily coated in through-holes and 3D shapes such as PCB, and the formed film is thin and uniform because it does not conduct electricity as an insulator. It is mainly used as a base coating for automobiles or home appliances because it can be coated.

Electrodeposition Resist (ED), which is widely used as a base coating for automobiles or home appliances, is prepared by emulsifying the resin for coating to produce a water-soluble type and coating the adhered material by applying electricity in a solution. There are anion type and cation type according to the electrode applied to the adherend, and the anion type refers to an electrodeposition resist of a type in which an adherend is coated by being coated on an anode.

In addition, the electrodeposition resist and the coating process is the same, but the electrodeposition resist that the coating layer itself has a responsiveness to light is called electrodeposition photoresist, classified as negative and forge according to the reactivity to light, In the case of a part exposed to light, the type is hardened, and in the case of a forge, the part exposed to light is referred to as a type that is removed in the developing process.

Until now, applications in the field of electronic materials have been limited to rigid printed circuit boards (Rigid PCB), using equipment similar to sheet-fed plating lines, process-to-process mixing, large and expensive equipment, and equipment Problems such as the enlargement of the electrodeposition resist tank due to the enormous size have occurred and despite the advantages of high resolution, adhesion, etc. of the electrodeposition photoresist is not widely used.

In addition, products with flexible printed circuit boards and thin substrates require jigs to fix the adherends in the electrodeposition tank when the existing electrodeposition equipment is used, and when the size of the adherends is small and flexible, manpower is required to reduce productivity. Indeed, due to this problem, related companies have generally used dry films or liquid resists as photoresists.

However, in the case of the dry film described above, the dry film of various widths should be retained as the size of the adherend changes, and the thickness of the coating film of the dry film is mainly defined as 50 μm, 35 μm, 18 μm, and the like. In the case of thin products, it is expensive and there is a problem that it is difficult to manage due to the meandering phenomenon during lamination, and the liquid resist sheet is difficult to coat both sides at the same time, uniform film such as the viscosity of the coating liquid, the thickness of the coating roller and the material There are many variables that need to be managed to obtain the thickness, and uniform coating is difficult to use in the process of via hole, through hole, etc., and organic solvent is used in the working environment. Of workability is low.

In other words, despite the advantages of high resolution, adhesion, and easy workability, the electrodeposition photoresist moves to the next process in the state where the solution is on the surface during the movement between the processes when the conventional single batch plating equipment is used. Therefore, it is difficult to manage the solution, especially in the case of electrodeposited resist, water enters the solution, causing problems in concentration change and solution stability, and it is not managed by constant voltage, so it is usually managed by constant current. However, in the case of the constant current management, the current value should be calculated by calculating the surface area of the injected material.If the electrode area is not constant, the variation of thickness occurs, and if the thickness is not constant, there is a possibility of residue in the developing process. It is large, and a problem arises also in etching, and productivity fell.

In addition, because the trolley (Trolley) method of moving to the conveyor proceeds because of the high cost of the equipment, because it is bulky and occupies a large area of installation, it is difficult to introduce it is not widely used, especially the reel to reel method Because there is no professional reel-to-reel coating device for all the electronic components or flexible conductive materials such as lead frames or semiconductor packages, which are manufactured by using the electrode, the electrodeposition photoresist can not be used because the electrodeposition photoresist is not available. The emergence of equipment was desired.

Accordingly, the present invention has been made to solve the above problems, a lead frame, a semiconductor package, a flexible printed circuit board, inner layer printing in addition to the reel-to-reel method using a reel-to-reel electrodeposition photoresist coating apparatus It is possible to coat the photoresist film uniformly on flexible conductive materials such as circuit boards or all electronic components, which not only increases productivity by improving work efficiency, but also makes the device compact in unit size. It is an object of the present invention to provide an electrodeposition resist coating apparatus capable of saving and reducing installation space.

Another object of the present invention is to provide an electrodeposition resist coating apparatus that can easily manage a solution, obtain a constant film thickness, and control coating on one or both sides due to less mixing of electrodeposition solution between processes. .

Figure 1 is an overall configuration showing an electrodeposition resist coating apparatus of the present invention

Explanation of symbols on the main parts of the drawings

10; Uncoiler section 12; Conductive Material Supply Reel

14; Interleaf reel 16,86; Tension adjustment reel

20; Electrode portions 22 and 24; Electrode contact reel

30; Electrodeposition 40; Collection

50; Flush head 60; Drying part

70; A driving unit 72; Driving reel

80; Coiler portion 82; Conductive Material Recovery Reel

84; Interleaver feed reel M; Conductive material

L; Electrodeposition solution

In order to achieve the above object, the present invention provides an uncoiler portion which is provided with a conductive material supply reel and a separator paper recovery reel, which are rotated to supply a conductive material for coating a photoresist film and to separate the sheet from the conductive material. An electrode portion provided with a plurality of electrode contact reels for applying a current to the conductive material supplied from the conductive material supply reel, an electrodeposition portion for applying an electrodeposition solution to the conductive material passing through the electrode contact reel, and the electrodeposition solution A recovery washing part and a washing part for washing the stained conductive material, a drying part for drying the washed conductive material, and a driving reel which is rotated by the power of the motor to advance the process of the conductive material is installed. The drive unit and the process are completed to recover the conductive material to which the photoresist film is applied. The conductive material recovery reel and the coiler part are installed in a coil reel to install the repellent material so as to prevent the damage of the conductive materials which have been completely applied by the direct contact with each other. An electrodeposition resist coating apparatus is provided.

In addition, the inside of each of the uncoiler and the coiler is characterized in that the tension adjustment reel for adjusting the tension of the conductive material in the process is installed to be elevated by sensing the upper and lower limit sensors.

In addition, the recovery water washing portion and the water washing portion is characterized in that installed integrally or separately between the electrodeposition portion and the drying portion.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention for achieving the above object will be described in detail.

1 is an overall configuration diagram showing an electrodeposition photoresist coating apparatus of the present invention.

The electrodeposition photoresist coating apparatus of the present invention supplies a conductive material (M) for applying a photoresist film, and at the same time, rotates a conductive material supply reel which is rotated to remove the sheet of paper or PET film from the conductive material (M). (12) and the uncoiler part (10) in which the interleaver collection reel (14) is provided, and a plurality of electrode contact reels (22) for applying current to the conductive material (M) supplied from the conductive material supply reel (12). 24, the electrode portion 20 is provided, the electrodeposition portion 30 for applying the electrodeposition solution (L) to the conductive material (M) passed through the electrode contact reels 22, 24, and the electrodeposition A recovery washing part 40 and a washing part 50 for washing the conductive material M on which the solution L is buried, a drying part 60 for drying the washed conductive material M, and the conductive A sphere that rotates under the power of a motor (not shown) to advance the process of material M The drive unit 70 in which the copper reel 72 is installed and the conductive material M to which the photoresist film is applied after the process is completed are recovered, and the conductive material M to which the coating is completed is directly contacted and damaged. Conductive material recovery reel 82 and the coiler 80 is installed to install the interleaver feed reel 84 to prevent the interleave to prevent the coating process by the reel-to-reel method.

In addition, in each of the uncoiler 10 and the coiler 80, tension adjusting reels 16 and 86 for adjusting the tension of the conductive material undergoing the process are detected by the upper and lower limit sensors. It is installed and configured to be movable.

As shown in FIG. 1, the present invention configured as described above has a flexible conductive material such as a flexible printed circuit board, an inner layer printed circuit board, etc., in addition to a lead frame and a semiconductor package manufactured in a reel-to-reel manner using an electrodeposition photoresist coating apparatus. When the photoresist film is to be applied to the material or all the electronic components by a reel to reel method, first, as the driving reel 72 installed in the driving unit 70 is rotated by the driving of the motor, the uncoiler unit 10 is rotated. While the installed conductive material supply reel 12 and the interleaver recovery reel 14 rotate, the conductive material M passes through the tension control reel 16 from the conductive material supply reel 12 via the tension control reel 16 and the electrode portion 20. Into the electrode contact reels 22 and 24 of the < RTI ID = 0.0 >), a sheet of paper, PET film, or the like removed from the conductive material M is wound on the sheet of paper.

At the same time, the conductive material M that has passed through the electrode portion 20 passes through the electrodeposition solution L contained in the electrodeposition portion 30 and circulated by the pump to which the electrodeposition solution L is applied. M) after one or more washing operations according to the process in the recovery water washing unit 40 and the water washing unit 50, and dried the conductive material (M) washed in the drying unit 60 and then The conductive material M, which is sequentially coated with the photoresist film through the driving reel 72 of the driving unit 70 and the tension adjusting reel 86 of the coiler 80, is sequentially formed on the coiler 80. The work can be completed by being wound around the conductive material recovery reel 82 of.

At this time, when the conductive material M, which has been coated with the photoresist film, is wound on the conductive material recovery reel 82, the coiler part may be prevented from being damaged by direct contact with each other. The slip sheet supplied from the slip sheet feeding reel 84 of 80 is wound up in a state of being attached.

On the other hand, the coating process described for the case of coating by using a slip sheet, for example, according to the coating process may be carried out without using a slip sheet coating process.

In addition, since the tension control reels 16 and 86 are installed in each of the uncoiler 10 and the coiler 80 so as to be liftable by sensing the upper and lower limit sensors, during the coating process. The tension of the conductive material M can always be adjusted in a smooth state.

In addition, when the conductive material M is coated on both sides of the plurality of electrode contact reels 22 and 24 installed inside the electrode unit 20, electricity is applied to the entire plurality of electrode contact reels, and the single side coating may be performed. In this case, electricity is applied to the electrode contact reel in contact with the corresponding material surface. In this case, the thickness and property of the coated film are controlled by changing the voltage and line speed in the constant voltage method, and the thickness of the film is controlled under a constant voltage. The lower the speed, ie, the longer the contact time with the electrodeposition solution L, the thicker. At a constant speed, the higher the voltage, the thicker the film.

In addition, the collected water washing part 40 and the water washing part 50 may be integrally installed between the electrodeposition part 30 and the drying part 60, or separately installed to perform washing operation a plurality of times or more according to a process. In addition, the drying in the drying unit 60 may be carried out separately, and the drying method may adopt various drying methods such as a heater method or a hot air method.

As described above, the present invention provides a flexible conductive material such as a flexible printed circuit board, an inner layer printed circuit board, etc., in addition to a lead frame and a semiconductor package manufactured in a reel to reel method using a reel to reel electrodeposition photoresist coating apparatus. By uniformly coating the photoresist film on the material or all electronic parts, productivity can be greatly increased by improving work efficiency, and the size of the device can be made compact, thereby reducing the manufacturing cost of the device and reducing the installation space. In addition, due to the small amount of electrodeposition solution mixed between processes, the solution can be easily managed, a constant film thickness can be obtained, and the coating can be controlled by controlling one or both sides, thereby greatly improving the efficiency and reliability of the device. Invention.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (3)

An uncoiler part provided with a conductive material supply reel 12 and a separator paper recovery reel 14, which are rotated to supply the conductive material M for coating the photoresist film and to remove the interlayer from the conductive material M ( 10) with, An electrode portion 20 provided with a plurality of electrode contact reels 22 and 24 for applying a current to the conductive material M supplied from the conductive material supply reel 12, An electrodeposition part 30 for coating the electrodeposition solution L on the conductive material M passing through the electrode contact reels 22 and 24; A recovery water washing part 40 and a water washing part 50 for washing the conductive material M on which the electrodeposition solution L is buried; A drying unit 60 for drying the washed conductive material M, A driving unit 70 in which a driving reel 72 is rotated by receiving power of a motor to advance the process of the conductive material M; The conductive material recovery reel is rotated to attach an interlayer to recover the conductive material M to which the photoresist film is applied to which the process is completed and to prevent damage of the conductive material M to which the coating is completed. The electrodeposition resist coating apparatus, characterized in that consisting of a coiler unit 80 is installed 82 and the interleaver feed reel (84) to proceed the coating process by a reel-to-reel method. The upper and lower limit sensors according to claim 1, wherein tension control reels (16) (86) for adjusting the tension of the conductive material undergoing the process are formed in each of the uncoiler (10) and the coiler (80). Electrodeposited resist coating apparatus, characterized in that the lifting is installed by the detection of. The electrodeposition resist coating apparatus according to claim 1, wherein the recovery washing part (40) and the washing part (50) are integrally or separately installed between the electrodeposition part (30) and the drying part (60).