KR19990024868A - Robot arm positioning device for wafer transfer unit - Google Patents

Robot arm positioning device for wafer transfer unit Download PDF

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Publication number
KR19990024868A
KR19990024868A KR1019970046240A KR19970046240A KR19990024868A KR 19990024868 A KR19990024868 A KR 19990024868A KR 1019970046240 A KR1019970046240 A KR 1019970046240A KR 19970046240 A KR19970046240 A KR 19970046240A KR 19990024868 A KR19990024868 A KR 19990024868A
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South Korea
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wafer
robot arm
light emitting
sensor
transfer unit
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KR1019970046240A
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Korean (ko)
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KR100257788B1 (en
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최진영
박경대
강희영
강성윤
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김광교
한국디엔에스 주식회사
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Priority to KR1019970046240A priority Critical patent/KR100257788B1/en
Priority to US09/139,270 priority patent/US6089763A/en
Priority to JP10254321A priority patent/JP3056468B2/en
Publication of KR19990024868A publication Critical patent/KR19990024868A/en
Application granted granted Critical
Publication of KR100257788B1 publication Critical patent/KR100257788B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

본 발명은 웨이퍼를 파지하여 이송시키는 반송유니트의 로봇암의 이동위치를 간편하고 정확하게 조정할 수 있도록 한 것으로, 반도체 제조설비용 반송유니트의 일측에 이동가능하게 설치되어 웨이퍼를 파지하여 이송시키는 로봇암에 있어서, 상기 웨이퍼의 위치를 확인하는 검출부를 형성하되 로봇암에 의해서 이동되는 웨이퍼가 안착되는 지지판의 상면에 발광센서를 설치하고 이의 직상방에 발광센서에서 발생되는 빔을 수광하는 수광센서를 설치한 것과, 상기 로봇암으로 파지하는 웨이퍼와 동일하게 형성되며 빔이 이동하는 통공이 중앙부에 형성된 지그 웨이퍼로 구성된 것이다.The present invention is to enable easy and accurate adjustment of the movement position of the robot arm of the transfer unit for gripping and transferring a wafer. The present invention is installed on one side of a transfer unit for semiconductor manufacturing equipment and is provided on a robot arm for holding and transferring a wafer. In this case, the detection unit for identifying the position of the wafer is formed, but the light emitting sensor is installed on the upper surface of the support plate on which the wafer moved by the robot arm is mounted and a light receiving sensor for receiving the beam generated by the light emitting sensor directly above And a jig wafer, which is formed in the same manner as the wafer held by the robot arm and has a through hole through which the beam moves.

Description

웨이퍼 이송용 반송유니트의 로봇암 위치조정장치Robot arm positioning device for wafer transfer unit

본 발명은 웨이퍼 이송용 반송유니트의 로봇암 위치조정장치에 관한 것으로서, 더욱 상세하게는 웨이퍼를 파지하여 이송시키는 반송유니트용 로봇암의 이동위치를 간편하고 정확하게 조정할 수 있도록 한 것이다.The present invention relates to a robot arm position adjusting device for a wafer transfer unit, and more particularly, to easily and accurately adjust the movement position of the robot arm for a transfer unit to hold and transfer a wafer.

일반적으로, 반도체 제조설비는 도 1에 도시된 바와같이 웨이퍼를 적재하고 상기 웨이퍼를 선택적으로 분리시키는 인덱서(1)와, 분리된 웨이퍼를 이동시키는 반송유니트(2)와, 상기 웨이퍼의 상면에 일정한 두께의 감광액이 도포되도록 회전시키는 스핀유니트(3)와, 웨이퍼를 일정온도로 가열 및 냉각시키는 베이트유니트(4)로 구성되어 있다.In general, semiconductor manufacturing equipment includes an indexer 1 for loading a wafer and selectively separating the wafer, a transfer unit 2 for moving the separated wafer, and a top surface of the wafer as shown in FIG. It consists of a spin unit 3 which rotates to apply a photosensitive liquid of thickness, and a bait unit 4 which heats and cools the wafer at a constant temperature.

이와같은 반도체 제조설비에서 웨이퍼를 제조하기 위하여 상기 웨이퍼를 각 공정으로 이동시키고자 할 때에는 반송유니트(2)에 설치된 로봇암(4)으로 상기 웨이퍼를 파지하여 이동시키고 있으며 상기 로봇암(4)의 이동위치는 웨이퍼의 종류에 따라 로봇암(4)이 이동하는 거리 및 정지위치를 정확하게 조정하여야 하므로 상기 조정작업을 간편하고 정확하게 수행할 수 있는 조정장치가 절실히 요구되고 있는 실정이다.In order to move the wafer to each process in order to manufacture the wafer in such a semiconductor manufacturing facility, the wafer is gripped and moved by the robot arm 4 installed in the transfer unit 2. Since the movement position must accurately adjust the distance and stop position of the robot arm 4 according to the type of wafer, there is an urgent need for an adjustment device capable of easily and accurately performing the adjustment operation.

종래에는 웨이퍼를 교환하여 로봇암(4)의 이동거리 및 정지위치를 조정하기위해서는 작업자가 조작부를 조작하면서 상기 조작부에 의해서 이동되는 로봇암(4)을 육안으로 확인하여 상기 로봇암(4)에 파지된 웨이퍼가 정확하게 안착될 수 있도록 조정을 하였으므로 작업자의 숙련도에 따라 조정작업의 정확도가 다르게 조정되었음은 물론 작업시간이 많이 소요되었다.Conventionally, in order to adjust the moving distance and the stop position of the robot arm 4 by exchanging wafers, the robot arm 4 visually checks the robot arm 4 moved by the operation unit while the operator manipulates the operation unit, and then attaches to the robot arm 4. Since the gripped wafer was adjusted to be accurately seated, the accuracy of the adjustment work was adjusted differently according to the skill of the operator, and the work time was taken a lot.

그리고 상기 로봇암(4)이 설비의 내부로 인입되어 작업자가 육안으로 확인할 수 없는 위치에서의 조정작업은 정확도가 더욱 저하된다.And the robot arm (4) is drawn into the interior of the facility adjustment work in the position that the operator can not see with the naked eye, the accuracy is further lowered.

따라서 상기 로봇암(4)의 위치조정작업 불량으로 인하여 웨이퍼의 안착이 불안정하게 됨에 따라 불량품이 제조되었음은 물론 심할 경우에는 웨이퍼 및 제조설비가 파손되는 등의 문제점이 있었다.Therefore, as the mounting of the wafer becomes unstable due to the poor positioning operation of the robot arm 4, the defective product was manufactured, and in some cases, the wafer and the manufacturing equipment were damaged.

본 발명은 상기한 문제점을 해결하기 위하여 안출한 것으로서, 지그 웨이퍼에 통공을 형성하고 상기 통공으로 통과되는 빗을 감지하여 웨이퍼를 파지하여 이송시키는 로봇암의 위치조정 작업을 신속하고 간편하게 할 수 있는 웨이퍼 이송용 반송유니트의 로봇암 위치조정장치를 제공하는데 그 목적이 있다.The present invention has been made in order to solve the above problems, the wafer transfer to form a hole in the jig wafer and to detect the comb passing through the hole to grip and transfer the robot arm to quickly and easily perform the positioning operation It is an object of the present invention to provide a robot arm position adjusting device for a transport unit.

상기 목적을 달성하기 위한 본 고안은 반도체 제조설비용 반송유니트의 일측에 이동가능하게 설치되어 웨이퍼를 파지하여 이송시키는 로봇암에 있어서, 상기 웨이퍼의 위치를 확인하는 검출부를 형성하되 로봇암에 의해서 이동되는 웨이퍼가 안착되는 지지판의 상면에 발광센서를 설치하고 이의 직상방에 발광센서에서 발생되는 빔을 수광하는 수광센서를 설치한 것과, 상기 로봇암으로 파지하는 웨이퍼와 동일하게 형성되며 빔이 이동하는 통공이 중앙부에 형성된 지그 웨이퍼로 구성된 것이다.The present invention for achieving the above object is a robot arm installed to be movable on one side of the transfer unit for semiconductor manufacturing equipment to hold and transfer the wafer, forming a detection unit for confirming the position of the wafer is moved by the robot arm The light emitting sensor is installed on the upper surface of the support plate on which the wafer is seated, and the light receiving sensor is installed on the upper side of the support plate to receive the beam generated by the light emitting sensor, and the beam is formed in the same way as the wafer held by the robot arm. The through hole is composed of a jig wafer formed in the center portion.

도 1은 일반적인 반도체 제조설비를 도시한 사시도,1 is a perspective view showing a general semiconductor manufacturing equipment,

도 2는 본 발명에 따른 위치조정장치를 도시한 사시도,2 is a perspective view showing a position adjusting device according to the present invention;

도 3a 및 도 3b는 본 발명 위치조정장치로 로봇암의 위치를 조정하는 상태의 평면도,3A and 3B are plan views of a state in which the position of the robot arm is adjusted by the position adjusting device of the present invention;

도 4는 본 고안의 다른 실시예를 도시한 평면도.Figure 4 is a plan view showing another embodiment of the present invention.

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

4 : 로봇암 5 : 플레이트4: robot arm 5: plate

6 : 발광센서 7 : 수광센서6: light emitting sensor 7: light receiving sensor

9 : 웨이퍼 9a : 통공9: wafer 9a: through hole

이하 본 발명을 도시한 첨부도면 도 2 및 도 3을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to FIGS. 2 and 3.

도 2는 본 발명에 따른 위치조정장치를 도시한 사시도이고, 도 3a 및 도 3b는 본 발명 위치조정장치로 로봇암의 위치를 조정하는 상태의 평면도로서, 본 발명은 웨이퍼가 안착되는 지지판(5)의 상면에 빔이 발생되는 발광센서(6)가 설치되어 있고 상기 발광센서(6)의 둘레면에는 웨이퍼를 이동시키는 다수의 핀(8)이 설치되어 있으며 상기 핀은 고정 또는 승강가능하게 설치할 수도 있다.Figure 2 is a perspective view showing a position adjusting device according to the present invention, Figures 3a and 3b is a plan view of the position of adjusting the position of the robot arm with the position adjusting device of the present invention, the present invention is a support plate (5) on which the wafer is seated A light emitting sensor 6 for generating a beam is installed on the upper surface of the), and a plurality of pins 8 for moving the wafer are installed on the circumferential surface of the light emitting sensor 6, and the pins are fixed or liftable. It may be.

상기 발광센서(6)의 직상방에는 빔을 수광하는 수광센서(7)가 설치되어 있고 상기 발광센서(6) 및 수광센서(7)를 제거하고 발광센서(6)가 설치되는 위치에 반사센서(6a)를 설치할 수도 있다.A light receiving sensor 7 for receiving a beam is provided directly above the light emitting sensor 6, and the light emitting sensor 6 and the light receiving sensor 7 are removed and the reflecting sensor is positioned at the position where the light emitting sensor 6 is installed. (6a) can also be provided.

한편 상기 반도체 제조설비에서 제조하고자하는 웨이퍼와 동일하게 형성된 지그 웨이퍼(9)의 중심부에는 발광센서(6)에서 발생된 빔이 이동하는 통공(9a)이 형성되어 있다.In the center of the jig wafer 9 formed in the same manner as the wafer to be manufactured in the semiconductor manufacturing facility, a through hole 9a through which the beam generated by the light emitting sensor 6 moves is formed.

이와같은 본 발명 위치조정장치로 웨이퍼의 종류가 변경되어 로봇암(4)의 이동거리 및 정지위치를 조정할 때에는 변경된 웨이퍼와 동일하게 형성된 지그 웨이퍼(9)를 로봇암(4)으로 파지한 상태에서 도 3a와 같이 지그 웨이퍼(9)가 플레이트(5)의 상부로 위치되도록 상기 로봇암(4)을 이동시킨다.When the type of wafer is changed by the present position adjusting device as described above, and the moving distance and the stop position of the robot arm 4 are adjusted, the jig wafer 9 formed in the same manner as the changed wafer is held by the robot arm 4. As shown in FIG. 3A, the robot arm 4 is moved such that the jig wafer 9 is positioned above the plate 5.

상기 로봇암(4)의 이동이 완료된후 플레이트(5)의 상면에 설치된 발광센서(6)를 작동시키면 상기 발광센서(6)에서 발생된 빔은 지그 웨이퍼(9)에 의해서 차단되어 수광센서(7)에서는 감지하지 못하게 된다.After the movement of the robot arm 4 is completed, when the light emitting sensor 6 installed on the upper surface of the plate 5 is operated, the beam generated by the light emitting sensor 6 is blocked by the jig wafer 9 to receive the light receiving sensor ( In 7) it is not detected.

이때 작업자는 조작부를 조작하여 상기 로봇암(4)에 파지된 지그 웨이퍼(9)의 통공(9a)이 도 3b에 도시된 바와같이 발광센서(6)와 수광센서(7)의 사이에 일치되어 상기 발광센서(6)에서 발생된 빔이 통공(9a)을 통해서 수광센서(7)가 수광하도록 로봇암(4)을 이동시키면 로봇암(4)의 조정작업이 완료된다.At this time, the operator manipulates the operation unit so that the through hole 9a of the jig wafer 9 held by the robot arm 4 is aligned between the light emitting sensor 6 and the light receiving sensor 7 as shown in FIG. 3B. When the beam generated by the light emitting sensor 6 moves the robot arm 4 so that the light receiving sensor 7 receives the light through the through hole 9a, the adjustment operation of the robot arm 4 is completed.

따라서 발광센서(6)에서 발생된 빔이 수광센서(7)로 수광되도록 조작부를 조작하는 간단한 작업으로 또한 상기 로봇암(4)의 조정작업이 완료되므로 상기 로봇암(4)이 제조설비의 내부로 인입되어 육안으로 확인할 수 없을 때에도 정확하게 위치조정작업을 수행할 수 있게 된다.Therefore, the robot arm 4 is inside the manufacturing facility because the robot arm 4 is completed by the simple operation of manipulating the operation unit so that the beam generated by the light emitting sensor 6 is received by the light receiving sensor 7. Even when it is not visible to the naked eye, the position adjustment can be performed accurately.

한편 도 4에 도시된 바와같이 발광센서(6)를 지지판(5)의 상면 다수곳에 설치하고 이와 동일한 수의 수광센서(7)를 설치하고 상기 발광센서(6)에서 발생된 빗이 통과되는 통공(9a)을 지그 웨이퍼(9)에 형성하되 발광센서(6) 및 수광센서(7)와 동일한 수만큼 형성할 수도 있다.Meanwhile, as shown in FIG. 4, the light emitting sensor 6 is installed at a plurality of upper surfaces of the support plate 5, the same number of light receiving sensors 7 are installed, and the comb generated from the light emitting sensor 6 passes. 9a may be formed on the jig wafer 9, but the same number as the light emitting sensor 6 and the light receiving sensor 7 may be formed.

그리고 상기 발광센서(6) 및 수광센서(7) 그리고 통공(9a)의 배열은 삼각형 또는 사각형등의 다각형을 이루도록 배열하거나 원형을 이루도록 배열할 수도 있다.The light emitting sensor 6, the light receiving sensor 7, and the through hole 9a may be arranged to form a polygon such as a triangle or a square, or may be arranged to form a circle.

이상에서와 같이 본 발명은 웨이퍼의 종류를 변경할 때 로봇암(4)의 위치를 간편하고 정확하게 조정하여 작업시간을 단축할 수 있게 됨은 물론 조정불량에 의한 웨이퍼 및 제조설비의 파손을 미연에 방지하여 생산성 향상에 따른 수율을 향상시킬 수 있게 되는 효과가 있다.As described above, the present invention can shorten the work time by simply and accurately adjusting the position of the robot arm 4 when changing the type of wafer, as well as preventing damage to the wafer and manufacturing equipment due to misalignment. There is an effect that can improve the yield according to the productivity.

Claims (3)

반도체 제조설비용 반송유니트의 일측에 이동가능하게 설치되어 웨이퍼를 파지하여 이송시키는 로봇암(4)에 있어서, 상기 웨이퍼(W)의 위치를 확인하는 검출부를 형성하되 로봇암(4)에 의해서 이동되는 웨이퍼가 안착되는 지지판(5)의 상면에 발광센서(6)를 설치하고 이의 직상방에 발광센서(6)에서 발생되는 빔을 수광하는 수광센서(7)를 설치한 것과, 상기 로봇암(4)으로 파지하는 웨이퍼와 동일하게 형성되며 빔이 이동하는 통공(9a)이 중앙부에 형성된 지그 웨이퍼(9)로 구성됨을 특징으로하는 웨이퍼 이송용 반송유니트의 로봇암 위치조정장치.In the robot arm (4) which is installed on one side of the transfer unit for semiconductor manufacturing equipment to hold and transfer the wafer, a detection unit for confirming the position of the wafer (W) is formed but moved by the robot arm (4). The light emitting sensor 6 is installed on the upper surface of the support plate 5 on which the wafer is to be seated, and a light receiving sensor 7 is installed above the light receiving sensor 6 to receive beams generated by the light emitting sensor 6, and the robot arm ( 4) The robot arm positioning device of the transfer unit for wafer transfer, which is formed in the same way as the wafer to be gripped by the wafer and comprises a jig wafer 9 formed in the center of the through hole 9a through which the beam moves. 제 1 항에 있어서, 지지판(5)의 상면에 반사센서(6a)를 설치하여서 됨을 특징으로하는 웨이퍼 이송용 반송유니트의 로봇암 위치조정장치.2. The robot arm positioning device according to claim 1, wherein a reflection sensor (6a) is provided on an upper surface of the support plate (5). 제 1 항에 있어서, 지지판(5)의 상면에 다수의 발광센서(6)를 설치하고 이의 직상방에 발광센서(6)에서 발생되는 빔을 수광하는 수광센서(7)를 설치한 것과, 상기 로봇암(4)으로 파지하는 웨이퍼와 동일하게 형성되며 상기 발광센서(6)에 대응하는 다수의 통공(9a)이 형성된 지그 웨이퍼(9)로 구성됨을 특징으로하는 웨이퍼 이송용 반송유니트의 로봇암 위치조정장치.According to claim 1, wherein a plurality of light emitting sensors (6) is provided on the upper surface of the support plate (5) and a light receiving sensor (7) for receiving the beam generated by the light emitting sensor (6) above the above, The robot arm of the transfer unit for wafer transfer, which is formed in the same manner as the wafer held by the robot arm 4 and comprises a jig wafer 9 having a plurality of through holes 9a corresponding to the light emitting sensor 6. Positioning device.
KR1019970046240A 1997-09-09 1997-09-09 Apparatus for controlling robot position using laser sensor and or optic sensor KR100257788B1 (en)

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KR1019970046240A KR100257788B1 (en) 1997-09-09 1997-09-09 Apparatus for controlling robot position using laser sensor and or optic sensor
US09/139,270 US6089763A (en) 1997-09-09 1998-08-25 Semiconductor wafer processing system
JP10254321A JP3056468B2 (en) 1997-09-09 1998-09-08 Semiconductor wafer processing system

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010081473A (en) * 2000-02-15 2001-08-29 황인길 Device for transferring wafer of semiconductor manufacturing unit
KR100462894B1 (en) * 2002-12-13 2004-12-17 삼성전자주식회사 Wafer transfer arm access position calibration apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102345669B1 (en) 2020-12-24 2021-12-30 하나 마이크론(주) A standard collaboration mobile apparatus for semiconductor post-processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010081473A (en) * 2000-02-15 2001-08-29 황인길 Device for transferring wafer of semiconductor manufacturing unit
KR100462894B1 (en) * 2002-12-13 2004-12-17 삼성전자주식회사 Wafer transfer arm access position calibration apparatus

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