JPS6226731Y2 - - Google Patents

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Publication number
JPS6226731Y2
JPS6226731Y2 JP1981131483U JP13148381U JPS6226731Y2 JP S6226731 Y2 JPS6226731 Y2 JP S6226731Y2 JP 1981131483 U JP1981131483 U JP 1981131483U JP 13148381 U JP13148381 U JP 13148381U JP S6226731 Y2 JPS6226731 Y2 JP S6226731Y2
Authority
JP
Japan
Prior art keywords
stage
mounting
semiconductor wafer
slider
microscope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981131483U
Other languages
Japanese (ja)
Other versions
JPS5836711U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13148381U priority Critical patent/JPS5836711U/en
Publication of JPS5836711U publication Critical patent/JPS5836711U/en
Application granted granted Critical
Publication of JPS6226731Y2 publication Critical patent/JPS6226731Y2/ja
Granted legal-status Critical Current

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  • Microscoopes, Condenser (AREA)
  • Drying Of Semiconductors (AREA)

Description

【考案の詳細な説明】 この考案は、基板を載置して観察を行う顕微鏡
において、複数の所定の外形寸法をする基板を載
置できる顕微鏡の載物台に関するものである。以
下、半導体ウエハを被検査物とする場合を例にと
り説明する。
[Detailed Description of the Invention] This invention relates to a stage for a microscope on which a plurality of substrates having predetermined external dimensions can be placed, in a microscope in which a substrate is placed for observation. In the following, a case where a semiconductor wafer is the object to be inspected will be described as an example.

半導体ウエハは、その素子製造において、拡散
処理,写真製版処理,蒸着処理等が行われる。こ
のような処理工程を経て形成された素子パターン
に異状があると、製品の歩留り,信頼性などに影
響する。したがつて、所定の処理工程を終えた後
に、検査を行い所望の素子パターンの形成がなさ
れているかいないかの電気的、光学的のチエツク
が行われる。ここで、光学的な検査においては、
通常、顕微鏡を用いて素子パターンの大きさおよ
び形状のチエツクが行われる。
Semiconductor wafers are subjected to diffusion processing, photolithography processing, vapor deposition processing, and the like during device manufacturing. If there is an abnormality in the element pattern formed through such processing steps, it will affect the yield, reliability, etc. of the product. Therefore, after completing a predetermined processing step, an inspection is performed to check electrically and optically whether the desired element pattern has been formed. Here, in optical inspection,
Usually, a microscope is used to check the size and shape of the element pattern.

第1図は従来の顕微鏡の概略を示す正面図で、
1は顕微鏡、2は移動テーブル、3は載物台であ
る。キヤリアに収納された半導体ウエハをフツ素
樹脂製などのピンセツトで保持して取り出し、顕
微鏡1の載物台3に載置する。この載物台3は、
第2図a,bに示すように上面が平坦なものが使
用されるが、この載物台3Aでは半導体ウエハを
載置した際、半導体ウエハと載物台3Aとの間に
エアが包含されて載物台3A上を滑走する場合が
ある。これを減少させるために、第2図c,dに
示すように載物台3Bの上面部に溝4を形成して
滑走を少なくするように工夫した載物台も使用さ
れている。
Figure 1 is a front view schematically showing a conventional microscope.
1 is a microscope, 2 is a moving table, and 3 is a stage. The semiconductor wafer housed in the carrier is held with tweezers made of fluororesin or the like, taken out, and placed on the stage 3 of the microscope 1. This loading table 3 is
As shown in FIGS. 2a and 2b, a flat top surface is used, but when a semiconductor wafer is placed on this stage 3A, air is trapped between the semiconductor wafer and the stage 3A. It may slide on the stage 3A. In order to reduce this, as shown in FIGS. 2c and 2d, a stage 3B is also used in which a groove 4 is formed in the upper surface of the stage 3B to reduce the sliding.

しかし、上記の載物台3Aおよび3Bは、周囲
部に半導体ウエハが落下するのを防止するストツ
パ5を備えているが、半導体ウエハの外形寸法に
応じて一定位置に固定できないため、載置位置お
よび載置方向が一定できず。検査の際、半導体ウ
エハの平行出しあるいは同一行あるいは列の検査
位置選択が難しく、その設定には時間もかかるな
どの不都合がある。また、場合によつては、半導
体ウエハの外形寸法に応じて専用の載物台に交換
する必要があるといつた不都合もある。
However, although the above-mentioned mounting tables 3A and 3B are equipped with a stopper 5 to prevent the semiconductor wafer from falling around the periphery, it cannot be fixed at a fixed position depending on the external dimensions of the semiconductor wafer. and the loading direction cannot be fixed. During inspection, it is difficult to align the semiconductor wafers in parallel or to select inspection positions in the same row or column, and the setting takes time. Further, in some cases, there is a disadvantage that it is necessary to replace the stage with a dedicated stage depending on the external dimensions of the semiconductor wafer.

この考案は、上記の欠点を除去するためになさ
れたもので、複数の外径寸法を有する基板につい
てそれぞれの寸法に対応する載物部が設けられて
おり、載物台を交換することなしに載置できるよ
うにした顕微鏡の載物台を提供するものである。
以下、この考案について説明する。
This idea was made in order to eliminate the above-mentioned drawbacks, and for substrates having multiple outer diameter dimensions, a mounting part corresponding to each dimension is provided, so that it is possible to eliminate the need to replace the mounting stage. To provide a stage for a microscope on which a stage can be mounted.
This idea will be explained below.

第3図、第4図および第5図はこの考案の一実
施例の各部分をそれぞれ示すもので、第3図は載
置固定台、第4図はスライダ、第5図は載物台で
ある。
Figures 3, 4, and 5 show each part of an embodiment of this invention. Figure 3 shows the mounting and fixing table, Figure 4 shows the slider, and Figure 5 shows the stage. be.

まず、第1図の顕微鏡1に対しX方向およびY
方向に移動する移動テーブル2に第3図に示す載
置固定台6をセツトする。載置固定台6にはガイ
ド溝7が設けられており、これに沿つて挿入,取
り外しができる第4図に示すガイド9を有するス
ライダ8を取り付ける。スライダ8には第5図に
示す載物台11を取り付けるための固定ピン10
が中心部に設けられている。一方、載物台11は
第5図に示すように、スライダ8に取り付けるた
め固定ピン10と回転自在に係合するため係合穴
14が中心部に設けており、これにより載物台1
1をスライダ8に取り付ける。この載物台11は
半導体ウエハの外形寸法に応じた大きさ(例えば
3インチ,4インチなど)よりそれぞれ約2〜3
mm余裕をもつた大きさの寸法に形成し、かつ、中
心部から端部に向けて高くなる段差を有する載置
部12を形成してある。また、載置部12の上面
には半導体ウエハの載置の際、浮き上りを防止す
るための溝13が形成されている。さらに半導体
ウエハを把持するための切欠き15が4個形成さ
れており、その載置部12は十字形をしている。
First, with respect to the microscope 1 in Fig. 1,
A mounting and fixing table 6 shown in FIG. 3 is set on the moving table 2 which moves in the direction. The mounting and fixing table 6 is provided with a guide groove 7, along which a slider 8 having a guide 9 shown in FIG. 4, which can be inserted and removed, is attached. The slider 8 has a fixing pin 10 for attaching the stage 11 shown in FIG.
is located in the center. On the other hand, as shown in FIG. 5, the stage 11 is provided with an engagement hole 14 in the center for rotatably engaging the fixing pin 10 for attachment to the slider 8.
1 to the slider 8. This stage 11 has a size corresponding to the external dimensions of the semiconductor wafer (for example, 3 inches, 4 inches, etc.), and is approximately 2 to 3 inches long.
The mounting portion 12 is formed to have dimensions with a margin of mm, and has a step that becomes higher from the center toward the ends. Furthermore, a groove 13 is formed on the upper surface of the mounting portion 12 to prevent the semiconductor wafer from floating when it is mounted. Furthermore, four notches 15 are formed for gripping semiconductor wafers, and the mounting portion 12 thereof has a cross shape.

半導体ウエハを検査する場合、半導体ウエハを
フツ素樹脂製のピンセツトでキヤリアより取り出
し、引き出されたスライダ8上の載物台11の所
定外形寸法の載置部12に載置する。この際、半
導体ウエハは載置部12の溝13により浮き上り
が防止され、しかも、周囲が高くなつているため
載置部12上を滑走して逸脱することもない。な
お、載置部12の周囲部の高さhは、半導体ウエ
ハの厚みないしは約1/2の厚み寸法に設定してお
けばよい。
When inspecting a semiconductor wafer, the semiconductor wafer is taken out from the carrier using fluororesin tweezers and placed on a mounting portion 12 of predetermined external dimensions on a mounting stage 11 on the slider 8 that has been pulled out. At this time, the semiconductor wafer is prevented from floating up by the groove 13 of the mounting section 12, and since the periphery is raised, it will not slide on the mounting section 12 and come off. Note that the height h of the peripheral portion of the mounting portion 12 may be set to the thickness of the semiconductor wafer or approximately 1/2 of the thickness.

また、載物台11はピンセツトによる半導体ウ
エハの載置および取り外しが容易に行えるように
第5図aに示すような切欠き15を形成し十字形
にしてある。なお、上記溝13の形状,数および
切欠き15の形状などは特に規定されるものでは
ない。また、載物台11などの材質も適宜選定す
れば良い。
Further, the stage 11 has a notch 15 formed in the shape of a cross as shown in FIG. 5A so that the semiconductor wafer can be easily placed and removed using tweezers. Note that the shape and number of the grooves 13 and the shape of the notches 15 are not particularly limited. Furthermore, the material of the stage 11 and the like may be selected as appropriate.

半導体ウエハを載置部12に載置後、スライダ
8を載置固定台6上を所定位置まで押し込む。し
かる後、所定パターンにより焦点合わせを行い、
次に、必要に応じて素子パターンの平行出しある
いは検査行,列を選定する場合の半導体ウエハ上
の所定チツプへの位置合わせなどを行い検査を行
う。ここで、載物台11は固定ピン10により保
持されているが、回転が自由に行えるようになつ
ているため、所望の方向に向きを変えられ平行の
設定あるいは検査行,列の設定が容易に行える。
After placing the semiconductor wafer on the placing section 12, the slider 8 is pushed onto the placing and fixing table 6 to a predetermined position. After that, focusing is performed according to a predetermined pattern,
Next, inspection is performed by aligning the element patterns in parallel or aligning them to predetermined chips on the semiconductor wafer when selecting inspection rows and columns, as necessary. Here, the stage 11 is held by a fixing pin 10, but it is designed to be able to rotate freely, so it can be turned in a desired direction, making it easy to set parallel or to set inspection rows and columns. can be done.

なお、この考案の載物台11のように半導体ウ
エハを載置してから所望位置まで押し込む方法を
とれば、従来のような、半導体ウエハを直接載物
台11上に載置する際に対物レンズに当てて、半
導体ウエハに傷をつける等のことも防止される。
また、ある半導体ウエハの検査が終了し、次に前
回とは異なる外形寸法の半導体ウエハを検査する
場合には各種寸法の載置部12を備えてあるの
で、載物台11を交換することなしに、上記と同
様の操作で検査を行うことができる。
Note that if the method of placing the semiconductor wafer on the stage 11 of this invention and then pushing it to the desired position is used, the objective object will be It also prevents the semiconductor wafer from being damaged by contact with the lens.
Furthermore, when a semiconductor wafer has been inspected and a semiconductor wafer with external dimensions different from the previous one is to be inspected, there is no need to replace the mounting table 11 since the mounting sections 12 of various sizes are provided. In addition, the test can be performed using the same operations as above.

以上説明したように、この考案は、各種の基板
の外形寸法に応じて該当する大きさの載置部が形
成されており、載物台を交換することなしに同一
の載物台を用いて種々の大きさの基板を検査する
ことができる。しかも、載物台が回転できるよう
にしてあるため、平行合わせを行うために基板を
直接動かす必要もなく、また、検査位置を決定す
る場合にも同一のX方向あるいはY方向の検査
行,列を選択することが容易であるとともに、載
置部は段差を形成して周囲が高くなつているた
め、半導体ウエハが逸脱することがない。さら
に、載置された被検査物を把持するための切欠き
を載置部に有するため、被検査物の把持がきわめ
て容易である等の実用的効果の大きいものであ
る。
As explained above, this invention has a mounting section of a size corresponding to the external dimensions of various substrates, and allows the use of the same mounting stage without replacing the mounting stage. Substrates of various sizes can be inspected. Moreover, since the stage is rotatable, there is no need to directly move the substrate for parallel alignment, and when determining the inspection position, the same inspection row or column in the X or Y direction can be used. It is easy to select the mounting area, and since the mounting part has a step and the surrounding area is raised, the semiconductor wafer does not fall out. Furthermore, since the mounting portion has a notch for gripping the placed test object, it has great practical effects such as extremely easy grip of the test object.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の顕微鏡を示す概略正面図、第2
図a〜dは載物台の従来例を示すもので、第2図
a,cは平面図、第2図b,dは側面図、第3図
〜第5図はそれぞれこの発明の一実施例を示すも
ので、第3図a,bは載置固定台の平面図および
側面図、第4図a,bはスライダの平面図および
側面図、第5図a,bは載物台の平面図およびA
−A線による側断面図である。 図中、1は顕微鏡、2は移動テーブル、6は載
置固定台、7はガイド溝、8はスライダ、9はガ
イド、10は固定ピン、11は載物台、12は載
置部、13は溝、14は係合穴、15は切欠きで
ある。なお、図中の同一符号は同一または相当部
分を示す。
Figure 1 is a schematic front view of a conventional microscope;
Figures a to d show conventional examples of the stage; Figures 2 a and c are plan views, Figures 2 b and d are side views, and Figures 3 to 5 are one embodiment of the present invention. Examples are shown in Figures 3a and b, a top view and a side view of the mounting and fixing table, Figures 4a and b are a top view and side view of the slider, and Figures 5a and b of the mounting table. Plan view and A
- It is a side sectional view taken on the A line. In the figure, 1 is a microscope, 2 is a moving table, 6 is a mounting/fixing base, 7 is a guide groove, 8 is a slider, 9 is a guide, 10 is a fixing pin, 11 is a stage, 12 is a mounting part, 13 14 is a groove, 14 is an engagement hole, and 15 is a notch. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 顕微鏡の移動テーブル上に載置する載置固定台
と、この載置固定台のガイド溝に係合してスライ
ドするガイド部を有するスライダと、このスライ
ダに着脱自在かつ中心部において回転自在に取り
付けられ前記中心部より端部に向けて高くなり所
定内径寸法をそれぞれ有する複数の段差が形成さ
れるとともに載置された被検査物を把持するため
の切欠きを有する載置部とからなることを特徴と
する顕微鏡の載物台。
A mounting/fixing base to be placed on the moving table of the microscope, a slider having a guide portion that slides by engaging with a guide groove of the mounting/fixing base, and detachably attached to the slider and rotatably at the center. A plurality of steps are formed, each having a predetermined inner diameter dimension, and are higher from the center toward the ends, and a mounting portion has a notch for grasping the test object placed thereon. Features a microscope stage.
JP13148381U 1981-09-03 1981-09-03 microscope stage Granted JPS5836711U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13148381U JPS5836711U (en) 1981-09-03 1981-09-03 microscope stage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13148381U JPS5836711U (en) 1981-09-03 1981-09-03 microscope stage

Publications (2)

Publication Number Publication Date
JPS5836711U JPS5836711U (en) 1983-03-10
JPS6226731Y2 true JPS6226731Y2 (en) 1987-07-09

Family

ID=29925058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13148381U Granted JPS5836711U (en) 1981-09-03 1981-09-03 microscope stage

Country Status (1)

Country Link
JP (1) JPS5836711U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5539021A (en) * 1978-09-14 1980-03-18 Hitachi Electronics Eng Co Ltd Automatic plate tester

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS507055U (en) * 1973-05-18 1975-01-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5539021A (en) * 1978-09-14 1980-03-18 Hitachi Electronics Eng Co Ltd Automatic plate tester

Also Published As

Publication number Publication date
JPS5836711U (en) 1983-03-10

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