KR19980073902A - CSP package manufacturing method using aluminum sheet - Google Patents
CSP package manufacturing method using aluminum sheet Download PDFInfo
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- KR19980073902A KR19980073902A KR1019970009486A KR19970009486A KR19980073902A KR 19980073902 A KR19980073902 A KR 19980073902A KR 1019970009486 A KR1019970009486 A KR 1019970009486A KR 19970009486 A KR19970009486 A KR 19970009486A KR 19980073902 A KR19980073902 A KR 19980073902A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
알루미늄 박판을 이용한 씨. 에스. 피(CSP: Chip scale package) 패키지의 제조방법에 관하여 개시한다. 이를 위하여 본 발명은, 알루미늄 박판에 적어도 한 개 이상의 홀(hole)을 가공하는 단계와, 상기 홀이 가공된 알루미늄 박판을 부도체화 시키는 단계와, 상기 부도체화 된 알루미늄 박판의 양면에 도전성 접착제를 정해진 패턴에 따라 형성하는 단계와, 상기 도전성 접착제의 표면에 도전물질층을 형성하여 상부에는 솔더볼 패드를, 하부에는 본드핑거를 형성하는 단계와, 상기 도전물질층이 형성된 알루미늄 박판에 칩을 부착하는 단계와, 상기 칩의 본드패드와 알루미늄 박판의 본드핑거를 골드와이어로 연결하는 와이어본딩 단계와, 상기 칩과 골드와이어가 형성된 알루미늄 박판의 하부면을 캡슐화하는 단계 및 상기 알루미늄 박판의 상부에 형성된 솔더볼 패드에 솔더볼을 부착하는 단계를 포함하여 이루어지는 것을 특징으로 하는 알루미늄 박판을 이용한 CSP 패키지 제조방법을 제공한다.Seed using aluminum lamination. s. Disclosed is a method of manufacturing a chip scale package (CSP). To this end, the present invention, the step of processing at least one hole (hole) in the aluminum sheet, the step of non-conducting the aluminum sheet processed the hole, and the conductive adhesive is defined on both sides of the non-conducted aluminum sheet Forming a pattern according to a pattern, forming a conductive material layer on a surface of the conductive adhesive, forming a solder ball pad on an upper portion thereof, and forming a bond finger on a lower portion thereof; and attaching a chip to an aluminum thin plate on which the conductive material layer is formed. And a wire bonding step of connecting the bond pad of the chip and the bond finger of the aluminum thin plate to the gold wire, encapsulating the lower surface of the aluminum thin plate on which the chip and the gold wire are formed, and a solder ball pad formed on the aluminum thin plate. Attaching a solder ball to the aluminum foil, characterized in that it comprises a step Provided is a method of manufacturing a CSP package.
Description
본 발명은 반도체 장치의 패키징 방법에 관한 것으로, 특히 알루미늄 박판을 이용한 씨. 에스. 피(CSP: Chip scale package, 이하 'CSP'라 칭함) 패키지의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a packaging method of a semiconductor device. s. It relates to a method of manufacturing a chip (CSP: Chip scale package, hereinafter referred to as "CSP") package.
반도체 소자의 제조 공정에서 패키징(packaging or assembly) 공정은 반도체 칩을 외부 환경으로부터 보호하고, 사용이 용이하도록 반도체 칩을 형상화시키고, 반도체 칩에 구성된 동작 기능을 보호함으로써 반도체 소자의 신뢰도를 향상시키는 공정이다. 최근 반도체 소자의 집적도가 향상되고 반도체 소자의 기능이 다양해짐에 따라 패키징 공정의 추세는 점차 패키지 핀이 적은 공정에서 많은 공정인 다핀화 공정으로 옮겨가고 있으며, 인쇄 회로 기판(PCB: Print Circuit Board)에 패키지를 끼우는 형태에서 표면에 실장하는 방식의 표면실장형 형태로(surface mounting device)로 전환되고 있다. 이러한 표면실장형 형태의 패키지는 SOP(small outline package), PLCC(plastic leaded chip carrier), QFP(quad flat package), BGA(Ball Grid Array) 및 CSP(chip scale package)등 많은 종류가 소개되고 있는데, 특히, CSP 패키지에서는 세라믹(ceramic)계의 박판을 사영하여 패키지를 형성하는데는 경박 단소화에 한계가 있으며 제조 경비가 많이 소요된다는 문제점이 있다.The packaging or assembly process in the semiconductor device manufacturing process improves the reliability of the semiconductor device by protecting the semiconductor chip from the external environment, shaping the semiconductor chip for ease of use, and protecting the operating functions of the semiconductor chip. to be. Recently, as the degree of integration of semiconductor devices is improved and the functions of semiconductor devices are diversified, the trend of the packaging process is gradually shifting from a process with fewer package pins to a multi-pinning process, which is a process of printing. The transition from package-mounting to surface-mounting is the way of surface mounting. There are many kinds of surface mount packages such as small outline package (SOP), plastic leaded chip carrier (PLCC), quad flat package (QFP), ball grid array (BGA) and chip scale package (CSP). In particular, in the CSP package, there is a problem in that it is difficult to reduce the thickness of the thin film to form a package by projecting a ceramic-based thin plate, and manufacturing cost is high.
본 발명이 이루고자 하는 기술적 과제는 알루미늄 박판을 이용하여 반도체 소자의 패키지 형태를 경박 단소화시키면서 저렴한 제조 비용으로 제조할 수 있는 CSP 패키지의 제조방법을 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method of manufacturing a CSP package, which can be manufactured at a low manufacturing cost while reducing the thickness of a package of a semiconductor device using a thin aluminum plate.
도 1 내지 도 5는 본 발명의 바람직한 실시예에 따라 알루미늄 박판을 이용한 CSP 패키지 제조방법을 설명하기 위하여 공정의 순서에 따라 도시한 단면도들이다.1 to 5 are cross-sectional views illustrating the CSP package manufacturing method using the aluminum sheet according to the preferred embodiment of the present invention in order of the process.
* 도면의 주요부분에 대한 부호의 간단한 설명 *Brief description of symbols for the main parts of the drawings
100: 알루미늄 박판,102: 알루미늄 산화층,100: aluminum lamination, 102: aluminum oxide layer,
104: 도전성 접착제,106: 도전물질층,104: conductive adhesive, 106: conductive material layer,
108: 칩,110: 골드와이어,108: chip, 110: gold wire,
112: 몰드 컴파운드,114: 솔더볼.112: mold compound, 114: solder ball.
상기의 기술적 과제를 달성하기 위하여 본 발명은, 알루미늄 박판에 적어도 한 개 이상의 홀(hole)을 가공하는 단계와, 상기 홀이 가공된 알루미늄 박판을 부도체화 시키는 단계와, 상기 부도체화 된 알루미늄 박판의 양면에 도전성 접착제를 정해진 패턴에 따라 형성하는 단계와, 상기 도전성 접착제의 표면에 도전물질층을 형성하여 상부에는 솔더볼 패드를, 하부에는 본드핑거를 형성하는 단계와, 상기 도전물질층이 형성된 알루미늄 박판에 칩을 부착하는 단계와, 상기 칩의 본드패드와 알루미늄 박판의 본드핑거를 골드와이어로 연결하는 와이어본딩 단계와, 상기 칩과 골드와이어가 형성된 알루미늄 박판의 하부면을 캡슐화하는 단계 및 상기 알루미늄 박판의 상부에 형성된 솔더볼 패드에 솔더볼을 부착하는 단계를 포함하여 이루어지는 것을 특징으로 하는 알루미늄 박판을 이용한 CSP 패키지 제조방법을 제공한다.In order to achieve the above technical problem, the present invention, the step of processing at least one hole (hole) in the aluminum sheet, the step of non-conducting the aluminum sheet processed the hole, and the non-conducted aluminum sheet Forming a conductive adhesive on both sides according to a predetermined pattern; forming a conductive material layer on the surface of the conductive adhesive; forming a solder ball pad on the upper side and a bond finger on the lower side; and an aluminum thin plate on which the conductive material layer is formed. Attaching a chip to the chip, connecting the bond pad of the chip and the bond finger of the aluminum sheet with a gold wire, encapsulating the lower surface of the aluminum sheet on which the chip and the gold wire are formed, and the aluminum sheet Attaching a solder ball to a solder ball pad formed on an upper portion of the The aluminum foil provides a method for producing the package CSP with that.
본 발명의 바람직한 실시예에 따르면, 상기 알루미늄 박판을 부도체화 시키는 방법은 양극산화(anodizing)법을 이용하는 것이 적합하다.According to a preferred embodiment of the present invention, the method of insulating the thin aluminum sheet is preferably using an anodizing method.
바람직하게는, 상기 알루미늄 박판의 양면에 도전성 접착제를 정해진 패턴에 따라 형성하는 방법은 스크린 프린트법(method of screen print)을 이용하는 것이 적합하다.Preferably, the method of forming a conductive adhesive on both surfaces of the thin aluminum sheet according to a predetermined pattern is preferably using a method of screen print.
또한, 상기 도전성 접착제의 표면에 형성된 도전물질층은 은(Ag), 팔라듐(Pd) 및 금(Au)중에서 선택된 하나를 사용하여 전기도금을 이용하여 형성하는 것이 바람직하다.In addition, the conductive material layer formed on the surface of the conductive adhesive is preferably formed using electroplating using one selected from silver (Ag), palladium (Pd) and gold (Au).
상기 알루미늄 박판의 하부면을 캡슐화하는 방법은 플라스틱이나 세라믹계의 재질을 사용하여 형성하는 것이 바람직하다.The method of encapsulating the lower surface of the aluminum thin plate is preferably formed using a plastic or ceramic material.
본 발명에 따르면, 칩 크기의 패키지를 형성함에 있어서 알루미늄 박판을 종래의 세라막계의 리드프레임 대신에 사용하여 패키지의 크기를 보다 경박 단소화시킬 수 있으며, 제조 원가를 낮게 할 수 있다.According to the present invention, in forming a chip size package, aluminum thin plates may be used in place of a conventional ceramic film lead frame to reduce the size of the package to be lighter and thinner, and to reduce manufacturing costs.
이하, 첨부된 도면을 참조하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1 내지 도 5는 본 발명의 바람직한 실시예에 의한 알루미늄 박판을 이용한 CSP 패키지 제조방법을 설명하기 위하여 공정의 순서에 따라 도시한 단면도들이다.1 to 5 are cross-sectional views illustrating the CSP package manufacturing method using the aluminum sheet according to the preferred embodiment of the present invention in order of the process.
도 1을 참조하면, 알루미늄 박판(100)에 다수의 홀(hole)을 형성하고, 상기 홀(hole)이 가공된 알루미늄 박판(100)을 양극산화(anodizing)법을 이용하여 알루미늄 박판의 표면에 알루미늄 산화층(102)을 형성함으로써 알루미늄 박판(100) 전체를 부도체화 시킨다. 이어서, 상기 양극산화가 완료된 알루미늄 박판(100)의 양면에 도전성 접착제(conductive paste, 104)를 미리 설계된 형상을 따라 스크린 프린프법(method of screen print)으로 형성한다.Referring to FIG. 1, a plurality of holes are formed in the aluminum thin plate 100, and the aluminum thin plate 100 having the holes processed is formed on the surface of the aluminum thin plate by using an anodizing method. By forming the aluminum oxide layer 102, the entire aluminum thin plate 100 is insulated. Subsequently, a conductive paste 104 is formed on both surfaces of the thin anodized aluminum sheet 100 by a method of screen print along a previously designed shape.
도 2를 참조하면, 상기 도전성 접착제(104)가 스크린 프린트법으로 형성된 알루미늄 박판(100)에서 도전성 접착제(104)의 표면에 금(Au), 은(Ag) 및 팔라늄(Pd)과 같은 전도성이 뛰어난 물질중에서 선택된 하나를 이용하여 전기도금법으로 도전물질층(106)을 형성한다.Referring to FIG. 2, in the aluminum thin plate 100 on which the conductive adhesive 104 is formed by screen printing, conductive such as gold (Au), silver (Ag), and palladium (Pd) may be formed on the surface of the conductive adhesive 104. A conductive material layer 106 is formed by electroplating using one selected from these superior materials.
도 3을 참조하면, 상기 도전물질층(106)이 도전성 접착제(104)의 표면에 형성된 결과물에서, 알루미늄 박판(100)의 하부면에 칩(108)을 부착(chip attach)하고, 연속해서 칩(108)에 형성되어 있는 본드패드(bond pad, 도면에 도시되지 않음)와 알루미늄 박판(100)에 형성되어 있는 본드 핑거(bond finger)를 골드와이어(gold wire, 110)를 사용하여 본딩(bonding)함으로써 연결한다. 여기서 본드패드는 칩(108)에 구성되어 있는 회로기능을 외부로 확장할 때 쓰이는 단자를 말하며, 본드 핑거(bond finger)는 알루미늄 박판(100) 상에 형성된 상기 본드패드와 연결된 골드와이어(110)를 최종 연결단자인 솔더볼에 연결시키는 중간 연결단자를 나타낸다.Referring to FIG. 3, in the result of the conductive material layer 106 formed on the surface of the conductive adhesive 104, the chip 108 is attached to the lower surface of the aluminum thin plate 100, and the chip is continuously formed. Bonding the bond pads (not shown) formed on the 108 and the bond fingers formed on the aluminum thin plate 100 using gold wires 110. To connect. Herein, the bond pad refers to a terminal used when extending a circuit function configured in the chip 108 to the outside, and a bond finger is a gold wire 110 connected to the bond pad formed on the aluminum sheet 100. Represents an intermediate connector connecting the solder ball, the final connector.
도 4를 참조하면, 상기 골드와이어(110)가 형성된 결과물에서, 칩(108)이 있는 하부면을 열경화성 몰드 컴파운드(112)를 사용하여 캡슐화시킴으로 외부의 충격에 의해 손상이 되기 쉬운 내부의 칩(108)과 골드와이어(110)와 같은 구조물을 보호한다. 연속하여 상기 열경화성 몰드 컴파운드(112)를 경화시키기 위한 오븐 큐어링(oven curing) 공정을 몰드 컴파운드의 재질에 따라 달리하여 수행한다. 여기서 캡슐화 물질은 통상으로 쓰이는 플라스틱 패키지 형성을 위한 몰드 컴파운드를 일예로 설명하였지만, 내부에 내장되는 칩(108)이 작동중에 열을 많이 발생시키는 마이크로 프로세서(micro-processor)와 같은 칩(chip)인 경우에는 플라스틱 몰드 컴파운드 대신에 내열성이 강한 세라믹계의 재질을 사용하여 캡슐화를 시키면 CSP 패키지의 내열성이 높아져서 신뢰도를 보다 향상시킬 수 있다.Referring to FIG. 4, in the result of the formation of the gold wire 110, the lower surface with the chip 108 is encapsulated using the thermosetting mold compound 112, so that the chip is easily damaged by an external impact. 108) and gold wire 110 to protect the structure. An oven curing process for successively curing the thermosetting mold compound 112 is performed depending on the material of the mold compound. Here, the encapsulating material has been described as an example of a mold compound for forming a commonly used plastic package, but a chip such as a micro-processor that generates a lot of heat during operation of the chip 108 embedded therein is used. In the case of encapsulating using a ceramic material having a high heat resistance instead of a plastic mold compound, the heat resistance of the CSP package is increased, thereby improving reliability.
도 5를 참조하면, 상기 캡슐화기 끝난 결과물에 솔더볼(114) 부착공정을 진행하여 칩(108)에 본드패드의 최종적인 외부 확장 형태인 솔더볼(114)을 칩(108)이 부착된 타면의 솔더폴 패드에 형성한다. 이러한 솔더볼 패드(solder ball pad)는 이면(backside)에 있는 본드핑거와 서로 연결되어서 칩에 형성된 본드패드를 솔더볼로 연결시킨다. 여기서 상기 솔더볼을 부착하는 공정 이전에 플럭스(flux) 전처리를 실시하여 솔더볼(114)이 부착되는 영역에 잔존하는 이물질을 제거하여 솔더볼(114)의 부착을 용이하게 하는 것이 바람직하다.Referring to FIG. 5, the solder ball 114 is attached to the finished product of the encapsulator, and the solder ball 114, which is the final external expansion form of the bond pad, is attached to the chip 108. Form on the pole pad. These solder ball pads are connected to the bond fingers on the backside and connect the bond pads formed on the chip with solder balls. In this case, it is preferable to perform flux pretreatment prior to attaching the solder balls to remove foreign substances remaining in the region where the solder balls 114 are attached, thereby facilitating the attachment of the solder balls 114.
본 발명은 상기한 실시예에 한정되지 않으며, 본 발명이 속한 기술적 사상 내에서 당 분야의 통상의 지식을 가진 자에 의해 많은 변형이 가능함은 명백하다.The present invention is not limited to the above-described embodiments, and it is apparent that many modifications are possible by those skilled in the art within the technical spirit to which the present invention belongs.
따라서, 상술한 본 발명에 따르면,칩크기의 패키지를 제조하는 공정에서 종래에 쓰이던 세라믹 박판 대신에 알루미늄 박판을 산화시켜 사용함으로써, CSP 패키지를 좀더 경박단소화시킴과 동시에 제조원가 낮출 수 있다.Therefore, according to the present invention described above, by oxidizing the aluminum thin plate in place of the conventional ceramic thin plate in the process of manufacturing a chip size package, it is possible to reduce the manufacturing cost of the CSP package more thin and short.
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KR1019970009486A KR100215119B1 (en) | 1997-03-20 | 1997-03-20 | Csp package making method using aluminium thin plate |
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WO2006057480A1 (en) * | 2004-11-29 | 2006-06-01 | Wavenics, Inc. | Package using selectively anodized metal and manufacturing method thereof |
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WO2006057480A1 (en) * | 2004-11-29 | 2006-06-01 | Wavenics, Inc. | Package using selectively anodized metal and manufacturing method thereof |
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