KR19980058598A - Inspection device for back-and-auto inspection system for BGA semiconductor package - Google Patents

Abstract

The present invention relates to an inspection apparatus of a back-and-auto inspection system for a BGA semiconductor package, in which a PCB 90 to which a solder ball 91 is fused during a manufacturing process of a BGA semiconductor package is removed from a deflux apparatus 20 And an inspection device (40) for inspecting the presence or absence of the solder ball (91), the position and the ball size, and the like,

A floor part 40C for guiding the PCB 90 in the lateral direction on the table T of the inspection device 40;

A rail (41) for allowing the PCB (90) to be moved and moved to the floor part (40C);

A conveyance port 42 for conveying the PCB 90 placed on the rail 41;

A lead screw 44 for moving the feed opening 42 in the left-right direction;

A motor 43 for rotating the lead screw 44;

Thereby improving the inspection workability of the PCB and increasing the reliability of the inspection.

Description

Inspection device for back-and-auto inspection system for BGA semiconductor package

The present invention relates to an inspection apparatus for a back-and-auto inspection system for a BGA semiconductor package, and more particularly, to a solder ball inspection apparatus for inspecting a state of a solder ball when a PCB of a BGA semiconductor package to which a solder ball is fused is supplied from a deflux apparatus to a singulation apparatus And more particularly to an inspection apparatus of a back-and-auto inspection system for a BGA semiconductor package, which enables an inspection apparatus to be easily equipped with an inspection apparatus.

In recent years, in recent electronic devices, a highly integrated semiconductor chip capable of processing a large amount of information in a short period of time in accordance with miniaturization, thinning, and multifunction is required, and accordingly, a large number of input / We are working hard.

Therefore, while studying only the lead pitch less than 0.3mm, BGA (Ball Grid Array) technology using ball instead of lead has emerged, and a lot of packages It has succeeded in mounting the output terminal.

These BGA semiconductor packages have been developed to complement the functionality and quality of the high integration limitations of fine pitch surface mount technology (FPT) and pin grid arrays, and this BGA semiconductor technology has been used in high- , Minimizes volume, has electrical and thermal characteristics, and has the advantage of minimizing the cycle time from design to production by expanding package yield, substrate assembly yield, and other multi-chip modules. Have.

In addition, it is easy to apply to a variety of electronic peripheral machines which are required to be very small in size due to the diversity of utilization due to the improvement of the quality reliability of the highly integrated BGA semiconductor package, and the price competitiveness is high, so that high value-added products can be obtained.

Such a BGA semiconductor package is provided with a mounting board on which a pattern and a semiconductor chip are mounted on a PCB in order to have a larger number of highly integrated circuits, a wire is connected to a pattern of a circuit of the semiconductor chip and a PCB, So that the circuit of the semiconductor chip can be connected to the ball.

The planar PCB has a plane layer, the planar layer has an epoxy layer on the outside thereof, the signal layer on the outside of the epoxy layer, and the solder mask on the outside of the signal layer. mask layer is provided so that a thin layer of PCB can be provided in multiple layers.

These PCBs are largely separated during the manufacturing process of BGA semiconductor packages. After attaching semiconductor chips in die attach process through in-line process, they are wire-bonded between semiconductor chip and pattern in wire bonding process. The back-end process is used to form a certain type of package in the molding process to prevent external exposure of semiconductor chips and wires and to protect internal circuit components and functional characteristics.

In the bump process, the solder ball is placed on the land formed on the PCB in the bumping process, and the solder ball is fused by the temperature heating. Then, the plus is removed in the deflux process, and the presence or absence of the solder ball in the inspection process The solder ball position, solder ball size, and flux removal status are checked, and the inspected PCB in the inspection process can obtain the completed BGA semiconductor package through the singulation process.

As shown in FIG. 7, the conventional structure of the inspecting device of the BGA semiconductor package completed through the above process is as follows. As shown in FIG. 7, the PCB 90, which is a raw material, An inspecting device 40 is provided to inspect the mounting state, the position and the size of the solder ball provided on the PCB 90 after the solder ball is seated in the bumping process (BPP) .

The inspecting apparatus 40 is provided with a supply unit 40A in which a plurality of PCBs 90 are mounted on the cassette in the side of the deflux apparatus 20 and the side of the singulation apparatus 60 on the other side of the supply unit 40A is inspected And a discharge portion 40B on which a single PCB 90 is mounted on the cassette.

The inspecting device 40 is provided as a separate device so that the inspecting process can be performed between the degating device 20 and the singulating device 60 during the manufacturing process of the BGA semiconductor package.

After the solder ball 91 is fused and fixed to the land of the PCB 90 in the defusion device 20 as described above, the flux is removed and the PCB 90 is sequentially stacked on the cassette, The cassette is manually supplied and set by the operator.

The PCB 90 of the cassette supplied to the supply section 40A is moved by the operation of the apparatus for holding the grip device PCB of the floor section 40C and placing the grip device PCB on the floor section, .

The PCB 90 to be inspected is supplied to the lower portion of the vision 45 by the operation of the grip device in a state where the surface of the PCB 90 placed on the floor portion 40C is positioned above the solder ball 91, Set it.

When the PCB 90 is set in the lower part of the vision 45, the operation of the vision 45 confirms whether or not the solder ball 91 is seated, confirms the position of the fused hollow 91 and the size of the solder ball 91 After confirming good products and defects, the inspection is completed.

The PCB 90 inspected and completed in the vision 45 is moved along the floor part 40C to the discharge part 40B and sequentially loaded on the cassette provided therein and then manually supplied by the operator to the singulation apparatus 60 To obtain a finished BGA semiconductor package of a predetermined type.

However, in the inspection apparatus 40, when the solder ball 91 is fused and fixed in the bumping apparatus during the manufacturing process of the BGA semiconductor package and the deflux apparatus 20 performs the deflux operation, the operator manually The PCB 90 is supplied to the supply unit 40A of the inspiration apparatus 40 and the PCB 90 which has been inspected is loaded on the cassette having the discharge unit 40B and manually handed over to the singulation apparatus 60 So that the workability of the BGA semiconductor package is lowered.

In addition, when the PCB 90, which is hand-welded with the solder ball 91, is handled through a multistage process, it causes breakage and failure at the portion contacting with the PCB 90 due to the operator's carelessness, .

Disclosure of the Invention The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide an apparatus for inspecting the state of a solder ball when supplying a PCB of a BGA semiconductor package to which a solder ball is fused from a deflux apparatus to a singulation apparatus Thereby facilitating inspection of the PCB, thereby increasing the productivity and reliability of the inspection.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall frontal view of an inventive inspection system. FIG.

2 is an overall plan structural view of an inspection system of the present invention;

3 is a view showing a manufacturing process of a BGA semiconductor package using the inspection system of the present invention.

4 is a PCB structural view of the BGA semiconductor package of the present invention.

FIG. 5 is a front view showing the operation of the inspecting apparatus of the present invention. FIG.

Figure 6 is a planar view of the operation of the inventive inspecting device.

Fig. 7 is a block diagram of the conventional art; Fig.

DESCRIPTION OF THE REFERENCE NUMERALS

The present invention relates to an inspection system and a method of manufacturing the same, and more particularly, to a PCB inspection system,

Hereinafter, the configuration of the present invention will be described in detail.

The PCB 90 on which the solder ball 91 is fused in the manufacturing process of the BGA semiconductor package is removed from the deflux device 20 to remove the deflections and the inspections can be performed to check whether the solder ball 91 is seated, In an inspection system having a device (40)

A floor part 40C for guiding the PCB 90 in the lateral direction on the table T of the inspection device 40;

A rail (41) for allowing the PCB (90) to be moved and moved to the floor part (40C);

A conveyance port 42 for conveying the PCB 90 placed on the rail 41;

A lead screw 44 for moving the feed opening 42 in the left-right direction;

A motor 43 for rotating the lead screw 44;

.

An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view of the present invention. FIG. 2 is a plan view of a deflux device for removing flux of a PCB 90 to which a solder ball 91 is fused in a bumping device on one side And an inspection system 10 for inspecting a solder ball 91 fused to the PCB 90 is provided between the deflux apparatus 20 and the other side singulation apparatus 60. The solder ball 91 is mounted on the PCB 90,

The inspection system 10 includes an inspection device 40 for inspecting a PCB supply device 30 and a PCB 90 for transferring the PCB 90 to the other side of the deflux device 20, And a PCB discharging device 50 for transporting the inspection system 90 to the singulation apparatus 60 so that the inspection system 10 is integrated in the back-end process.

The inspecting system 10 is provided with a discharge port 21 for supplying the PCB 90 to the first transfer device at the tip of the deflux device 20 and a base 21 And a guide 31 for guiding the PCB 90 to be aligned with the base 30A so as to be aligned with the base 30. The robot 30A is provided at a predetermined position rearward of the base 30A with a robot A 32).

The robot A (32) is provided at the tip thereof with a gripper A (34) capable of holding the PCB (90) supplied to the guide (31).

The gripper A 34 has fixing grooves 35 having different sizes on the upper and lower sides so as to grip the PCB 90 having two sizes with respect to the size of the PCB 90 supplied to the guide 31. [ Respectively.

As shown in FIGS. 5 and 6, the PCB 40 is provided on the other side of the PCB feeder 30 with a floor portion 40C in the left and right longitudinal direction of the table T, And the rail 41 is moved to a position where it can be inspected while the PCB 90 supplied from the PCB feeder 30 side is supplied to the feeder 40A, 90 to the discharge portion 40B side.

The transfer opening 42 is provided in the lead screw 44 which is rotated by the drive of the motor 43 and a vision 45 for inspecting the PCB 90 is provided on the table T .

The PCB discharging device 50 provided on the other side of the inspiration apparatus 40 is provided with a robot B 51 which performs a multi-stage refraction operation in the upper and lower and right and left directions on the upper part of the base 50A, And a gripper B (53) for gripping the rotating cylinder (54) and the inspected PCB (90) and supplying the grip to the turn guide (70).

The turn guide 70 includes a fixture 71 provided on the base 50A of the PCB ejection apparatus 50 for fixing the PCB 90 supplied by the gripper B 53 in a vertical state, And the like.

Hereinafter, the operation of the present invention will be described.

FIG. 3 is a process diagram showing a manufacturing process of a BGA semiconductor package of the present invention. In FIG. 3, a semiconductor chip is attached in a DAP process of an in-line process in which a PCB 90, which is a raw material, PMP) connects the wires between the semiconductor chip and the circuit of the PCB 90.

The PCB 90, which has been wire-bonded, forms a package to mount a semiconductor chip in a molding process (PMP) classified as a back-end process, protect circuits and wire patterns inside the semiconductor chip, The solder ball 91 is mounted on the land of the PCB 90 and heated and fused to fix the solder ball 91 on the land of the PCB 90. After the flux of the PCB 90 is removed in the DFP process, In the case of the good material (good material) inspected in the IP process, the PCB 90 cuts the singulation area to obtain a single BGA semiconductor package. After completing various inspection and marking work, finish the manufacturing process.

As shown in FIG. 4, the PCB 90 of the BGA semiconductor completed through such processes shows a state where the solder ball 91 is fused after completion of package molding.

The PCB 90 on which the solder ball 91 is fused is removed from the PCB 90 in which the flux is removed by using the deflux device 20 in the DFP process DFP, The solder ball 91 is aligned and supplied to the guide 31 of the PCB feeder 30 in a state where the solder ball 91 is positioned on the upper side.

When the PCB 90 is aligned and supplied to the guide 31, the gripper A 34 of the robot A 32 descends to ascend while fixing the width of the PCB 90, and then, And then rotated 180 degrees toward the rotating shaft 40 side.

The PCB 90 is positioned on the upper portion of the supply portion 40A provided on the rail 41 of the floor portion 40C of the inspection device 40 and then the gripper A 34 is lowered simultaneously with the fixing of the PCB 90 The PCB 90 is placed on the supply unit 40A and the robot A 32 is returned to the initial state to prepare for the next operation.

When the PCB 90 is supplied to the supply unit 40A of the inspiration apparatus 40, the lead screw 44 is rotated by driving the motor 43 provided in the floor unit 40C as shown in FIGS. 5 and 6, The feed screw 42 that fixes both ends of the PCB 90 in the longitudinal direction of the PCB 90 on the side of the supply unit 40A by the rotation of the lead screw 44 is moved to the lower center of the vision 45, (90) to the bottom of the vision (45).

When the PCB 90 is set at the lower portion of the vision 45, the light 46 irradiates light on the upper surface of the PCB 90, and then the vision 45 is detected by the program system as to whether or not the solder ball 91 is seated And the position and the size of the position are checked to select good products and defects.

In this way, the PCB 90 having been subjected to the selection in the vision 45 is transferred to the discharge port 40B side of the rail 41 by the transfer port 42.

The PCB 90 positioned at the discharge portion 40B is moved to the position where the solder ball 91 is positioned at the lower side by the operation of the gripper B 53 provided in the robot B 51 of the PCB discharging device 50 60 to obtain a BGA semiconductor package according to cutting in the singulation region.

As described above, according to the present invention, in the deflux device after the bumping device of the inspection system, a single PCB is fed between the singulation devices so that the solder ball is positioned on the upper side as an inspection device, A back-end auto-inspection system including a PCB discharging device for supplying a PCB to a solder ball at a lower side with a singulation device is provided, thereby improving inspection workability of a PCB and improving reliability of inspection.

Claims (1)

The PCB 90 on which the solder ball 91 is fused in the manufacturing process of the BGA semiconductor package is removed from the deflux device 20 to remove the deflections and the inspections can be performed to check whether the solder ball 91 is seated, In an inspection system having a device (40) A floor part 40C for guiding the PCB 90 in the lateral direction on the table T of the inspection device 40; A rail (41) for allowing the PCB (90) to be moved and moved to the floor part (40C); A conveyance port 42 for conveying the PCB 90 placed on the rail 41; A lead screw 44 for moving the feed opening 42 in the left-right direction; A motor 43 for rotating the lead screw 44; And a controller for controlling the operation of the back-and-forth auto inspection system.