KR19980058599A - PCB transfer device for BGA semiconductor package back-end auto-inspection system - Google Patents

Abstract

The present invention relates to a PCB transfer apparatus for a back-and-forth auto inspection system for a BGA semiconductor package, in which a PCB 90 to which a solder ball 91 is fused during a manufacturing process of a BGA semiconductor package is removed from a deflux apparatus 20 And an inspection device (40) for inspecting the presence or absence of the solder ball (91), the position and the ball size, and the like,

A lead screw 44 which is rotated by driving the motor 43 to the right and left above the table T of the inspection device 40;

A feed opening (42) for feeding the PCB (90) in the left and right directions by the rotation of the lead screw (44);

A fixture 42A which is extended and contracted left and right by the operation of the cylinder 42B to fix both longitudinal ends of the PCB 90 to the upper and rear ends of the transporting port 42;

The PCB is supplied to the inspection area and the inspected PCB is transferred to the discharge part, so that it is possible to facilitate the solder ball inspection of the PCB.

Description

PCB transfer device for BGA semiconductor package back-end auto-inspection system

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a PCB transfer apparatus for a back-and-auto inspection system for a BGA semiconductor package, and more particularly, to a PCB transfer apparatus for a BGA semiconductor package in which a solder ball is fused, And more particularly, to a PCB transfer apparatus for a back-and-forth auto inspection system for a BGA semiconductor package.

In recent years, in recent electronic devices, a highly integrated semiconductor chip capable of processing a large amount of information in a short period of time in accordance with miniaturization, thinning, and multifunction is required, and accordingly, a large number of input / We are working hard.

Therefore, while studying only the lead pitch less than 0.3mm, we have been studying only BGA (Ball Grid Array) technology using ball instead of lead, It has succeeded in mounting the output terminal.

These BGA semiconductor packages have been developed to complement the functionality and quality of the high integration limitations of fine pitch surface mount technology (FPT) and pin grid arrays, and this BGA semiconductor technology has been used in high- Minimizes volume, has electrical and thermal characteristics, and has the advantage of minimizing the cycle time from design to production by expanding the package yield and substrate assembly yield and its multichip module. Have.

In addition, it is possible to obtain a high value-added product because it is easy to apply to a variety of electronic peripheral machines required in a very small size and high in cost competitiveness because of the diversity of utilization due to the improvement of the quality reliability of the highly integrated BGA semiconductor package.

Such a BGA semiconductor package is provided with a mounting board on which a pattern and a semiconductor chip are mounted on a PCB in order to have a larger number of highly integrated circuits, a wire is connected to a pattern of a circuit of the semiconductor chip and a PCB, So that the circuit of the semiconductor chip can be connected to the ball.

The PCB has a plane layer inside, a planar layer on the outside, a signal layer on the outside of the epoxy layer, and a solder mask on the outside of the signal layer. Solder Mask layer is provided so that the PCB can be provided as a thin layer with multiple layers.

These PCBs are largely separated during the manufacturing process of BGA semiconductor packages. After attaching semiconductor chips in die attach process through in-line process, they are wire-bonded between semiconductor chip and pattern in wire bonding process. The back-end process is used to form a certain type of package in the molding process to prevent external exposure of semiconductor chips and wires and to protect internal circuit components and functional characteristics.

In the bump process, the solder ball is placed on a land formed on the PCB and the solder ball is fused by the temperature heating. Then, the flux is removed in the deflux process, and the presence or absence of the solder ball in the inspection process The solder ball position, solder ball size, and flux removal status are checked, and the inspected PCB in the inspection process can obtain the completed BGA semiconductor package through the singulation process.

As shown in FIG. 8, the conventional structure of the inspecting device of the BGA semiconductor package completed through the above process is as follows. The PCB 90, which is a raw material, attaches the semiconductor chip to the die attach process (DAP) PMP), and then the solder ball is mounted on the PCB 90 in the bumping process (BPP), and then the solder ball mounted on the PCB 90, the position and the size of the solder ball can be inspected.

The inspecting apparatus 40 is provided with a supply unit 40A in which a plurality of PCBs 90 are mounted on the cassette in the side of the deflux apparatus 20 and the side of the singulation apparatus 60 on the other side of the supply unit 40A is inspected And a discharge portion 40B on which a single PCB 90 is mounted on the cassette.

The inspecting device 40 is provided as a separate device so that the inspecting process can be performed between the degating device 20 and the singulating device 60 during the manufacturing process of the BGA semiconductor package.

After the solder ball 91 is fused and fixed to the land of the PCB 90 in the defusing device 20, the flux is removed and the PCB 90 is sequentially stacked on the cassette An operator manually supplies the cassette to the next feeding section 40A.

The PCB 90 of the cassette supplied to the supply section 40A is moved by the operation of the apparatus for holding the grip device PCB of the floor section 40C and placing the grip device PCB on the floor section, .

The PCB 90 to be inspected is supplied to the lower portion of the vision 45 by the operation of the grip device in a state where the surface of the PCB 90 placed on the floor portion 40C is positioned above the solder ball 91, Set it.

When the PCB 90 is set below the vision 45, the operation of the vision 45 confirms whether or not the solder ball 91 is seated, checks the position of the solder ball 91 and checks the size of the solder ball 91 After the test, check for good products and defects, and then complete the inspection.

The PCB 90 having been inspected in the vision 45 is moved to the discharge unit 40B along the floor unit 40C and sequentially loaded on the cassette provided therein and then manually supplied to the singulation apparatus 60 To obtain a finished BGA semiconductor package of a predetermined type.

However, when inspecting the defect inspection apparatus 40 through the defluxing process in the deflux apparatus 20 after the solder ball 91 is fused and fixed in the Bump device during the manufacturing process of the BGA semiconductor package, the inspector 40 may manually The gripper feeds the PCB 90 supplied to the supply unit 40A of the inspiration apparatus 40 to the inspection position and the PCB 90 having been inspected is loaded on the cassette provided in the discharge unit 40B And can be discharged manually by the singulation apparatus 60, which is a cause of deteriorating the workability of the BGA semiconductor package.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a BGA semiconductor package in which solder balls are soldered, And the inspected PCB can be transferred to the discharge unit so as to be supplied to the singulation apparatus, thereby facilitating inspection workability.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall frontal view of an inventive inspection system. FIG.

2 is an overall plan structural view of an inspection system of the present invention;

3 is a view showing a manufacturing process of a BGA semiconductor package using the inspection system of the present invention.

4 is a PCB structural view of the BGA semiconductor package of the present invention.

5 is a front view of the installation state of the present invention.

6 is a plan view of the installation state of the present invention.

7 is an operating state plan view of the present invention;

8 is a block diagram showing a conventional configuration.

DESCRIPTION OF THE REFERENCE NUMERALS

The present invention relates to an inspecting apparatus for inspecting PCBs and a printed circuit board (PCB)

Hereinafter, the configuration of the present invention will be described in detail.

The solder ball 91 is mounted on the printed circuit board 90 after the deflections are removed from the PCB 90 to which the solder balls 91 are fused in the BGA semiconductor package manufacturing process, In an inspection system equipped with a faction apparatus 40,

A lead screw 44 which is pivoted by driving the motor 43 to the left and right sides of the table T above the inspecting apparatus 40;

A feed opening (42) for feeding the PCB (90) in the left and right directions by the rotation of the lead screw (44);

A fixture 42A which is extended and contracted left and right by the operation of the cylinder 42B to fix both longitudinal ends of the PCB 90 to the upper and rear ends of the transporting port 42;

.

An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view of the present invention. FIG. 2 is a plan view of a deflux device for removing flux of a PCB 90 to which a solder ball 91 is fused in a bumping device And an inspection system 10 for inspecting a solder ball 91 fused to the PCB 90 is provided between the deflux apparatus 20 and the other side singulation apparatus 60. The solder ball 91 is mounted on the PCB 90,

The inspection system 10 includes an inspection device 40 for inspecting a PCB supply device 30 and a PCB 90 for transferring the PCB 90 to the other side of the deflux device 20, And a PCB discharging device 50 for transporting the inspection system 90 to the singulation apparatus 60 so that the inspection system 10 is integrated in the back-end process.

The inspecting system 10 is provided with a discharge port 21 for supplying the PCB 90 to the first transfer device 30 at the tip of the deflux device 20, And a guide 31 for guiding the PCB 90 so that the PCB 90 is aligned with the base 30A of the base 30. The base 30A is provided at a predetermined position rearward with respect to the rotational axis 33 in the free, And a robot A (32) for short-end refraction.

The robot A (32) is provided with a gripper A (34) capable of holding the PCB (90) supplied to the guide (31) at its tip end.

The gripper A 34 has fixing grooves 35 having different sizes on the upper and lower sides so as to grip the PCB 90 having two sizes with respect to the size of the PCB 90 supplied to the guide 31. [ Respectively.

The inspection unit 40 provided on the other side of the PCB feeder 30 is provided with the floor portion 40C in the left and right longitudinal direction of the table T and the rail portion 41 is provided on the floor portion 40C The PCB 40 supplied from the PCB feeder 30 side is moved to a position where it can be inspected in a state where the PCB 90 supplied from the PCB 40 is supplied to the rail 41, (Not shown).

5 and 6, the feed screw 42 is provided with a lead screw 44 rotated in the longitudinal direction by the driving of the motor 43 and the feed screw 42 is connected to the lead screw 44, And a fixture 42A which is extended and contracted left and right by the operation of the cylinder 42B is provided on the upper and lower ends of the transfer opening 42. A vision 45).

The PCB discharging device 50 provided on the other side of the inspiration apparatus 40 is provided with a robot B 51 which performs a multi-stage refraction operation in the upper and lower and right and left directions on the upper part of the base 50A, And a gripper B 63 for gripping the rotating cylinder 54 and the inspected PCB 90 and supplying the rotated cylinder 54 to the turn guide 70. The turn guide 70 includes a base 50A of the PCB discharging device 50, And a fixture 71 for fixing the PCB 90 supplied by the gripper B 53 in a vertically standing state can be operated on the cylinder 72.

Hereinafter, the operation of the present invention will be described.

FIG. 3 is a process diagram showing a manufacturing process of a BGA semiconductor package of the present invention. In FIG. 3, a semiconductor chip is attached in a DAP process of an in-line process in which a PCB 90, which is a raw material, WBP connects the wires between the semiconductor chip and the circuit of the PCB 90.

The PCB 90, which has been wire-bonded in this manner, is used for mounting a semiconductor chip in a molding process (PMP) classified as a back-end process, molding a package to protect circuits and wire patterns inside the semiconductor chip, The solder ball 91 is mounted on the land of the PCB 90 and heated and fused to fix the solder ball 91 on the land of the PCB 90. After the flux of the PCB 90 is removed in the DFP process, A single BGA semiconductor package is obtained by cutting the singulation area of the PCB 90 in the singulation hole SP by performing the faction process (IP) and inspecting the good material (good material) inspected in the inspection process (IP) After completing the following inspection and marking work, finish the manufacturing process.

As shown in FIG. 4, the PCB 90 of the BGA semiconductor completed through such processes shows a state where the solder ball 91 is fused after completion of package molding.

The PCB 90 on which the solder ball 91 is fused and the PCB 90 on which the flux is removed by using the deflux device 20 in the deflux process DFP is provided in the discharge portion of the deflux device 20 The solder ball 91 is aligned and supplied to the guide 31 of the PCB feeder 30 in a state where the solder ball 91 is positioned on the upper side.

When the PCB 90 is aligned and supplied to the guide 31, the gripper A 34 of the robot A 32 descends to ascend while fixing the width of the PCB 90, and then, And then rotated 180 degrees toward the rotating shaft 40 side.

The PCB 90 is positioned such that the floor portion 40C of the inspection device 40 is positioned at the upper portion of the supply portion 40A provided on the rail 41 and then the gripper A 34 is lowered The PCB 90 is placed on the supply unit 40A and the robot A 32 is returned to the initial state to prepare for the next operation.

When the PCB 90 is supplied to the supply unit 40A of the inspiration apparatus 40, the lead screw 44 is rotated by driving the motor 43 provided in the floor unit 40C and the lead screw 44 is rotated The fixture 42A fixes both longitudinal ends of the PCB 90 on the side of the supply portion 40A with the fixture 42A fixed to the PCB 45 while the fixture 42A fixes the PCB 90, So as to set the PCB 90 on the lower portion of the vision 45.

When the PCB 90 is set at the lower portion of the vision 45, the light 46 irradiates the light emitted from the upper surface of the PCB 90, and then the vision 45 is reflected by the seating of the solder ball 91 And the position and the size of the position.

In this way, the PCB 90 having been subjected to the selection in the vision 45 is transferred to the discharge portion 40B side of the rail 41 by the transfer opening 42.

The PCB 90 positioned at the discharge portion 40B is fixed by the gripper B 53 provided on the robot B 51 of the PCB discharging device 50 as shown in FIGS. The PCB 90 supplied to the turn guide 70 is rotated 180 degrees by the robot B 51 and the solder ball 91 of the PCB 90 is moved downward The BGA semiconductor package according to the cutting of the singulation region is obtained by the singulation apparatus 60 in a state where the BGA semiconductor package is located.

As described above, according to the present invention, the PCBs supplied to the supply part of the table of the inspection device capable of checking the presence or absence of the solder balls on the PCB of the solder ball-bonded BGA semiconductor package are sequentially supplied to the inspection area, It is possible to facilitate the solder ball inspection operation of the PCB by transferring the PCB to the discharge unit so as to be supplied to the PCB.

Claims (1)

The PCB 90 on which the solder ball 91 is fused in the manufacturing process of the BGA semiconductor package is removed from the deflux device 20 to remove the deflections and the inspections can be performed to check whether the solder ball 91 is seated, In an inspection system having a device (40) A lead screw 44 which is rotated by driving the motor 43 to the right and left above the table T of the inspection device 40; A feed opening (42) for feeding the PCB (90) in the left and right directions by the rotation of the lead screw (44); A fixture 42A which is extended and contracted left and right by the operation of the cylinder 42B to fix both longitudinal ends of the PCB 90 to the upper and rear ends of the transporting port 42; And the PCB transfer device for the back-and-forth auto inspection system for the BGA semiconductor package.