KR19980058601A - PCB turn guide for back and auto inspection system for BGA semiconductor package - Google Patents

Abstract

The present invention relates to a PCB turn guide for a back and auto inspection system for a BGA semiconductor package, in which a PCB 90 to which a solder ball 91 is fused during the manufacturing process of a BGA semiconductor package is removed from a deflux device 20 And an inspection device (40) for inspecting the presence or absence of the solder ball (91), the position and the ball size, and the like,

A turn guide 70 for placing the PCB 90 in a vertical position on the base 50A of the PCB ejection apparatus 50;

A groove 70A on which the PCB 90 is placed on the turn guide 70;

A process tool 71 for fixing both side surfaces of the PCB 90 placed in the groove 70A;

A cylinder (72) capable of expanding and contracting the fixture (71) left and right;

Thereby facilitating the feeding and feeding of the inspected PCB.

Description

PCB turn guide for back and auto inspection system for BGA semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a PCB turn guide for a back-and-auto inspection system for a BGA semiconductor package, and more particularly, to an inspection device for checking the presence or absence of a solder ball in a BGA semiconductor package, To a PCB turn guide for a back and auto inspection system for a BGA semiconductor package, which can be provided when the PCB rotates in the direction of the PCB so as to be supplied at a lower position.

In recent years, in recent electronic devices, a highly integrated semiconductor chip capable of processing a large amount of information in a short period of time in accordance with miniaturization, thinning, and multifunction is required, and accordingly, a large number of input / We are working hard.

Therefore, while studying only the lead pitch less than 0.3mm, we have been studying only BGA (ball grid array) technology using ball instead of lead, It has succeeded in mounting the output terminal.

These BGA semiconductor packages have been developed to complement the functionality and quality of the high integration limitations of fine pitch surface mount technology (FPT) and pin grid arrays, and this BGA semiconductor technology has been used in high- , Minimizes volume, has electrical and thermal characteristics, and has the advantage of minimizing the cycle time from design to production by expanding package yield, substrate assembly yield, and other multi-chip modules. Have.

In addition, it is easy to apply to a variety of electronic peripheral machines which are required to be very small in size due to the diversity of utilization due to the improvement of the quality reliability of the highly integrated BGA semiconductor package, and the price competitiveness is high, so that high value-added products can be obtained.

Such a BGA semiconductor package is provided with a mounting board on which a pattern and a semiconductor chip are mounted on a PCB in order to have a larger number of highly integrated circuits, a wire is connected to a pattern of a circuit of the semiconductor chip and a PCB, So that the circuit of the semiconductor chip can be connected to the ball.

The PCB includes a plane layer, an epoxy layer on the outside of the plane layer, a signal layer on the outside of the epoxy layer, and a solder mask on the outside of the signal layer. ) Layer is provided so that the PCB can be provided as a multi-layered thin sheet.

These PCBs are largely separated during the manufacturing process of BGA semiconductor packages. After attaching semiconductor chips in die attach process through in-line process, they are wire-bonded between semiconductor chip and pattern in wire bonding process. The back-end process is used to form a certain type of package in the molding process to prevent external exposure of semiconductor chips and wires and to protect internal circuit components and functional characteristics.

In the bump process, the solder ball is placed on a land formed on the PCB and the solder ball is fused by the temperature heating. Then, the flux is removed in the deflux process, and the presence or absence of the solder ball in the inspection process The solder ball position, solder ball size, and flux removal status are checked, and the inspected PCB in the inspection process can obtain the completed BGA semiconductor package through the singulation process.

As shown in FIG. 8, the conventional structure of the inspecting device of the BGA semiconductor package completed through the above process is as follows. As shown in FIG. 8, the PCB 90, which is a raw material, An inspecting device 40 is provided to inspect the mounting state, the position and the size of the solder ball provided on the PCB 90 after the solder ball is seated in the bumping process (BPP) .

The inspecting apparatus 40 is provided with a supply unit 40A in which a plurality of PCBs 90 are mounted on the cassette in the side of the deflux apparatus 20 and the side of the singulation apparatus 60 on the other side of the supply unit 40A is inspected And a discharge portion 40B on which a single PCB 90 is mounted on the cassette.

The inspecting device 40 is provided as a separate device so that the inspecting process can be performed between the degating device 20 and the singulating device 60 during the manufacturing process of the BGA semiconductor package.

After the flux is removed in a state where the solder ball 91 is fused and fixed to the land of the PCB 90 in the diffusion device 20 in the exposing device 40, the PCB 90 is sequentially stacked on the cassette An operator manually supplies the cassette to the next feeding section 40A.

The PCB 90 of the cassette supplied to the supply section 40A is moved by the operation of the apparatus for holding the grip device PCB of the floor section 40C and placing the grip device PCB on the floor section, .

The PCB 90 to be inspected is supplied to the lower portion of the vision 45 by the operation of the grip device in a state where the surface of the PCB 90 placed on the floor portion 40C is positioned above the solder ball 91, Set it.

When the PCB 90 is set below the vision 45, the operation of the vision 45 confirms whether or not the solder ball 91 is seated, checks the position of the solder ball 91 and checks the size of the solder ball 91 After the test, check for good products and defects, and then complete the inspection.

In the vision 45, the inspected PCB 90 is moved along the floor part 40C to the discharging part 40B, and is sequentially stacked on the cassette provided in the discharge part 40B. Then, the operator manually supplies the PCB 90 to the singulation device 60 So as to obtain a finished BGA semiconductor package of a certain type.

However, in the inspection apparatus 40, when the solder ball 91 is fused and fixed in the bumping apparatus during the manufacturing process of the BGA semiconductor package and the deflux apparatus 20 performs the deflux operation, the operator manually The PCB 90 is supplied to the supply unit 40A of the inspection apparatus 40 and the PCB 90 having been inspected is loaded on the cassette provided in the discharge unit 40B, This is because it causes the workability of the BGA semiconductor package to be lowered by manually supplying the PCB 90 in a positioned state, and when the PCB 90 is handled, the product is damaged and defective due to the operator's carelessness, There was a weakening problem.

SUMMARY OF THE INVENTION The present invention has been accomplished in order to solve the above problems, and it is an object of the present invention to provide an inspecting apparatus for inspecting the solder ball of a BGA semiconductor package for supplying an inspected PCB to a singulating apparatus, The purpose of the PCB is to move the PCB up and down so that it can be fed, thereby improving the transportability of the PCB.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall frontal view of an inventive inspection system. FIG.

2 is an overall plan structural view of an inspection system of the present invention;

3 is a view showing a manufacturing process of a BGA semiconductor package using the inspection system of the present invention.

4 is a PCB perspective view of the BGA semiconductor package of the present invention.

5 is a configuration diagram of the installation state of the present invention.

6 is an operating state plan view of the present invention;

7 is an operating state plan view of the present invention;

8 is a block diagram showing a conventional configuration.

DESCRIPTION OF THE REFERENCE NUMERALS

The present invention relates to an apparatus and a method for manufacturing a PCB having a PCB and a method of manufacturing the same. , 90: PCB

Hereinafter, the configuration of the present invention will be described in detail.

The PCB 90 on which the solder ball 91 is fused in the manufacturing process of the BGA semiconductor package is removed from the deflux device 20 to remove the deflections and the inspections can be performed to check whether the solder ball 91 is seated, In an inspection system having a device (40)

A turn guide 70 for placing the PCB 90 in a vertical position on the base 50A of the PCB ejection apparatus 50;

A groove 70A on which the PCB 90 is placed on the turn guide 70;

A fixture 71 for fixing both side surfaces of the PCB 90 placed in the groove 70A;

A cylinder (72) capable of expanding and contracting the fixture (71) left and right;

.

An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a front view of the entire inspection system of the present invention. FIG. 2 is a plan view of the present invention. FIG. 2 is a plan view of a deflux apparatus for removing a flux of a PCB 90 to which a solder ball 91 is fused in a bumping apparatus. And an inspection system 10 for inspecting a solder ball 91 fused to the PCB 90 is provided between the deflux apparatus 20 and the other side singulation apparatus 60. The solder ball 91 is mounted on the PCB 90,

The inspection system 10 includes an inspection device 40 for inspecting a PCB supply device 30 and a PCB 90 for transferring the PCB 90 to the other side of the deflux device 20, And a PCB discharging device 50 for transporting the inspection system 90 to the singulation apparatus 60 so that the inspection system 10 is integrated in the back-end process.

The inspecting system 10 is provided with a discharge port 21 for supplying the PCB 90 to the first transfer device 30 at the tip of the deflux device 20, And a guide 31 for guiding the PCB 90 so that the PCB 90 is aligned with the base 30A of the base 30. The base 30A is provided at a predetermined position rearward with respect to the rotational axis 33 in the free, And a robot A (32) for multi-stage refraction.

The robot A (32) is provided at the tip thereof with a gripper A (34) capable of holding the PCB (90) supplied to the guide (31).

The gripper A 34 has fixing grooves 35 having different sizes on the upper and lower sides so as to grip the PCB 90 having two sizes with respect to the size of the PCB 90 supplied to the guide 31. [ Respectively.

A floor portion 40C is provided in the left and right longitudinal direction on the table T of the inspection device 40 provided on the other side of the PCB feeder 30 and a rail 41 is provided on the floor portion 40C, The PCB 40 supplied from the PCB feeder 30 side is moved to a position where inspection can be performed while the PCB 40 supplied from the PCB 40 is supplied to the rail 41, (Not shown).

The feed port 42 is provided on the lead screw 44 rotated by driving the motor 43 and a vision 45 for inspecting the PCB 90 is provided on the table T.

The PCB discharging device 50 provided on the other side of the inspiration apparatus 40 is provided with a robot B 51 which performs a multi-stage refraction operation in the upper and lower and right and left directions on the upper part of the base 50A, And a gripper B (53) for gripping the rotating cylinder (54) and the inspected PCB (90) and supplying the grip to the turn guide (70).

5, the turn guide 70 is provided in the base 50A of the PCB discharging device 50 and includes a groove 70A which can vertically raise the PCB 90 supplied by the gripper B 53 And a fixture 71 for fixing the PCB 90 held in the groove 70A is provided so as to be operated by driving the cylinder 72. [

Hereinafter, the operation of the present invention will be described.

FIG. 3 is a process diagram showing a manufacturing process of a BGA semiconductor package of the present invention. In FIG. 3, a semiconductor chip is attached in a DAP process of an in-line process in which a PCB 90, which is a raw material, WBP connects the wires between the semiconductor chip and the circuit of the PCB 90.

The PCB 90, which has been wire-bonded in this manner, is used for mounting a semiconductor chip in a molding process (PMP) classified as a back-end process, molding a package to protect circuits and wire patterns inside the semiconductor chip, The solder ball 91 is mounted on the land of the PCB 90 and heated and fused to fix the solder ball 91 on the land of the PCB 90. After the flux of the PCB 90 is removed in the DFP process, In the singulation process (SP), a single BGA semiconductor package is obtained by cutting the singulation area of the PCB 90 by performing the process (IP) and inspecting the good material (good material) inspected in the inspection process (IP) After completing various inspection and marking work, finish the manufacturing process.

As shown in FIG. 4, the PCB 90 of the BGA semiconductor completed through such processes shows a state where the solder ball 91 is fused after completion of package molding.

The PCB 90 on which the solder ball 91 is fused and the PCB 90 on which the flux is removed by using the deflux device 20 in the deflux process DFP is provided in the discharge portion of the deflux device 20 The solder ball 91 is aligned and supplied to the guide 31 of the PCB feeder 30 in a state where the solder ball 91 is positioned on the upper side.

When the PCB 90 is aligned and supplied to the guide 31, the gripper A 34 of the robot A 32 descends to ascend while fixing the width of the PCB 90, and then, And then rotated 180 degrees toward the rotating shaft 40 side.

At this time, the PCB 90 is supplied to the upper part of the supply part 40A provided on the rail 41 of the floor part 40C of the inspection device 40, and then the driving of the motor 43 provided to the floor part 40C The PCB 90 is set at the lower portion of the vision 45 when the lead screw 44 is pivoted to move the feed port 42 to the lower center of the vision 45.

When the PCB 90 is set at the lower portion of the vision 45, the vision 45 is checked for the presence or absence of the solder ball 91, the position and size of the solder ball 91 by the program system, And is conveyed to the discharge portion 40B side of the rail 41 by the conveying port 42. [

The PCB 90 positioned at the discharge portion 40B is fixed by the gripper B 53 provided on the robot B 51 of the PCB discharging device 50. When the PCB 90 is fixed to the upper portion of the turn guide 70 Lt; / RTI >

The gripper B (53) fed to the top of the turn guide (70) is kept rotated by the rotary cylinder (54) so that the PCB (90) is positioned at 90 degrees.

When the PCB 90 is placed on the turn guide 70 in this state, the fixture 71 provided under the turn guide 70 moves the PCB 90 to both sides of the PCB 90 by the operation of the cylinder 72 Grip.

When the PCB 90 grips the PCB 90 on the fixture 71 of the turn guide 70, the gripper B 53 of the robot B 51 rotates about the rotary shaft 52 on the side of the singing apparatus 60 When the PCB 90 is moved to the outside of the turn guide 70, the PCB 90 is supplied to the next singulation apparatus 60.

At this time, the fixture 71 releases the PCB 90, and the PCB 90 is supplied with the solder ball 91 positioned on the lower side, so that the BGA semiconductor package 90, which is cut in the singulation region of the PCB 90, .

As described above, according to the present invention, when inspecting an abnormality of a solder ball of a BGA semiconductor package, when the inspected PCB is supplied to the singulation apparatus, the PCB is vertically oriented so that the solder ball can be supplied at a lower position So that it is possible to feed the inspection PCBs with ease.

Claims (1)

The PCB 90 on which the solder ball 91 is fused in the manufacturing process of the BGA semiconductor package is removed from the deflux device 20 to remove the deflections and the inspections can be performed to check whether the solder ball 91 is seated, In an inspection system having a device (40) A turn guide 70 for placing the PCB 90 in a vertical position on the base 50A of the PCB ejection apparatus 50; A groove 70A on which the PCB 90 is placed on the turn guide 70; A fixture 71 for fixing both side surfaces of the PCB 90 placed in the groove 70A; A cylinder (72) capable of extending and operating the fixture (71) to the left and right; And a PCB turn guide for a back and auto inspection system for a BGA semiconductor package.