KR19980014275A - Flux removing device for ball grid array semiconductor package and method therefor - Google Patents

Abstract

The present invention relates to a flux removing apparatus and method for a ball grid array semiconductor package, and more particularly to a flux removing apparatus and method for a ball grid array semiconductor package, which comprises a conveyor belt, a hot tap fresh water rinse portion, a first washing portion, , An air cleaning unit, a drying unit, a control panel unit, and the like, and the ball grid array semiconductor package is loaded on the conveyor belt and is moved, washed with fresh water and recycled to the ball grid array semiconductor package A flux removing apparatus and method for a ball grid array semiconductor package capable of easily removing fluxes and various foreign substances by blowing high pressure air again to the material and using heat of the heater.

Description

Flux removing device for ball grid array semiconductor package and method therefor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux removing apparatus and method for a ball grid array semiconductor package, and more particularly, to a ball grid array semiconductor package having a ball grid To an apparatus and method for removing flux for an array semiconductor package.

BACKGROUND ART [0002] Generally, a manufacturing process of a ball grid array (BGA) package includes bonding a semiconductor chip (Semi-Conductor Chip) to a printed circuit board (PCB) A wire bonding step of bonding a wiring formed on the PCB and an input / output pad of a semiconductor chip by a wire, a step of bonding the semiconductor chip to an external environment A solder ball, which is an input / output terminal, is mounted on a PCB so as to be electrically operated by mounting the BGA package on a mother board or the like so as to protect the BGA package from encapsulant by using an encapsulant, And a reflow step of reflowing the mounted solder ball in a furnace, and the like. When the solder ball is mounted on the BGA package, flux is applied to the PCB, which is one of the components of the BGA package. This is because the solder ball is temporarily prevented from moving in the PCB, So that it does not become. However, in the case of the BGA package in which the reflow step is completed and the solder ball is completely mounted on the PCB, the flux is not needed, and thus a cleaning process is required to remove the flux and various foreign substances on the surface of the BGA package .

Conventionally, a plurality of BGA packages are housed in a magazine for cleaning, and the magazine is inserted into a centrifugal separator, which is similar to a washing machine, and then washed with water and detergent. However, such a method has a high probability of causing damage to the BGA package, lowering the yield, lowering the production amount, and deteriorating the reliability of the BGA package.

It is an object of the present invention to provide a method and apparatus for cleaning a BGA package by loading a BGA package on a conveyor belt and cleaning the BGA package by recycling the fresh water, The present invention also provides a flux removing apparatus and method for a BGA package, which can remove flux and various foreign substances easily by injecting high-pressure air again to the material and applying heat to the heater.

FIGS. 1A and 1B are a plan view and a front view, respectively, showing a configuration of a flux removal device for a ball grid array semiconductor package according to the present invention;

2 is a partial cutaway front view showing a configuration of a flux removal device for a ball grid array semiconductor package according to the present invention;

3 is a partial cut-away plan view showing a configuration of a flux removal device for a ball grid array semiconductor package according to the present invention.

4A and 4B are detailed views showing a water jet nozzle of a flux removal device for a ball grid array semiconductor package according to the present invention.

5 is a detailed view showing an air injection nozzle of a flux removal apparatus for a ball grid array semiconductor package according to the present invention.

6 is a detailed view of a conveyor belt of a flux removal device for a ball grid array semiconductor package according to the present invention.

FIG. 7 is a piping diagram showing a piping state of a flux removal apparatus for a ball grid array semiconductor package according to the present invention. FIG.

8A and 8B are an assembling view and a piping construction view showing a flux removing device for a ball grid array semiconductor package according to the present invention.

9 is a flowchart showing a flux removal method of a ball grid array semiconductor package according to the present invention.

Description of the Related Art [0002]

100, a conveyor belt 110,

120, a roller 130,

200, a hot tap fresh water rinse unit 300,

310, a primary pump 400,

410, a secondary pump 500, a hot dia fresh water rinse part

600, an air cleaning unit 610, an air blower

700, a drying unit 710, a heater

800, a control panel unit 810, an alarm indicator

820; pressure gauge 830; electrical control box

900, a pipe 910, a water spray nozzle

915, an air injection nozzle 920, a recycle tube

930; a drain pipe 940;

950; Hot Dia Fresh Water Tank

960; Hot tap fresh water tank

According to an aspect of the present invention, there is provided an apparatus for removing a flux of a BGA package according to the present invention, comprising: a conveyor belt for moving the BGA package until the BGA package is loaded and unloaded; And a hot tap fresh water rinse portion for spraying hot tap water through the lower water spray nozzle, and a second tap for spraying the first clean water to the upper and lower water spray nozzles using the first pump in the BGA package A second cleaning part for spraying a second clean water to the upper and lower water jet nozzles using a second pump in the BGA package; and a second cleaning part for applying a hot diaphragm to the BGA package through upper and lower water jet nozzles, A hot dias fresh water rinse portion for last rinsing by spraying water, and an air blower for removing water from the BGA package, And an air cleaning unit for spraying high-pressure air to the lower air injection nozzle, and a drying unit for applying heat to the BGA package to remove moisture and foreign matter from the BGA package, thereby removing the flux of the BGA package. .

Here, the conveyor belt is made of a wire net so that water and air can pass through the upper and lower portions of the conveyor belt, and a guide rail is formed to prevent the BGA package from escaping during conveyance. The bottom surface of the hot tap fresh water rinse portion Drainpipes were installed to transport dirty water after the rinse to the wastewater treatment plant. Also, a drain pipe is provided on the bottom surface of the first washing unit to transfer the diaphragm fresh water supply pipe and the dirty water after washing to the wastewater treatment plant, and the water after washing is sprayed again onto the bottom surface of the first washing unit by the upper and lower water spray nozzles The recycle pipe was further connected to the primary pump. Likewise, a drain pipe is connected to the second pump for transferring the diaphragm fresh water supply pipe and the dirty water after washing to the wastewater treatment plant on the bottom surface of the second cleaning part, and the water after washing is again supplied to the bottom part of the second cleaning part, A recycle tube was installed for spraying with the lower spray nozzle. Also, the heater uses an infrared heater that radiates infrared rays and heat simultaneously to the BGA package, and the upper and lower water (or secondary water) in which the primary clean water (or the secondary clean water) A pressure gauge indicating water pressure was installed in the injection nozzle. In addition, a pressure gauge showing the pressure of air was also provided in the upper and lower air injection nozzles through which the high-pressure air was blown by the air blower.

Then, the conveying speed of the conveyor belt, the hot tap fresh water rinse portion, the first and second washing portions, the hot diasic fresh water rinse portion, the jet nozzle pressure of the air washing portion, A control panel unit is provided so that it can be adjusted according to characteristics, and the infrared heater of the drying unit controls the infrared rays and the heat amount thereof by using a sensor.

In order to achieve the above object, the present invention provides a method for removing a flux of a BGA package, comprising: loading a BGA package with a conveyor belt to remove flux and various foreign substances from the reflowed BGA package; A hot tap fresh water rinse step of spraying hot tap fresh water on top and bottom of the BGA package to perform rinsing; a first cleaning step of spraying primary clean water from above and below the BGA package; A second cleaning step of spraying a secondary cleaner on the upper and lower sides of the package, a hot dias fresh water rinse step of spraying hot diaphragm water at the top and the bottom of the BGA package to finally rinse the BGA package, An air cleaning step of blowing high-pressure air from above and below the package to remove moisture and the like from the BGA package; In the addition of high temperature drying step and made of an unloading step for transferring to the next process by unloading the BGA packages from the conveyor belt to remove the flux and the foreign material of the BGA package is characterized in that on the way.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

1A and 1B are a plan view and a front view showing a configuration of a flux removing apparatus for a BGA package according to the present invention. Referring to FIG. 1A, a conveyor belt 100 for conveying a BGA package and a hot A first washing unit 300 and a second washing unit 400 for recirculating and discharging hot tap fresh water and a hot tap fresh water rinse 200 already used, A hot dias fresh water rinse part 500 for spraying unused clean water, an air spray part 600 for blowing water on the surface of the BGA package with high-pressure air, And a drying unit (700). 1B, a control panel 800 is provided on one side of the control panel 800, and an alarm indicator 810 is provided on the upper side of the control panel 800 to inform the user of abnormality of the device. In addition, various pressure gauges 820, Is installed on the upper surface of the apparatus, and an electric control box 830 is provided at one end for organically operating the respective parts.

2 is a partial cutaway front view showing a configuration of a flux removing apparatus for a BGA package according to the present invention. It can be seen that the conveyor belt 100 is driven by a motor 130 and a plurality of rollers 120, The water spray nozzles 910 are installed on the rinsing unit 200 with the conveyor belt 100 as a center and the first and second washing units 300 and 400 are connected to the hot dias fresh water rinse unit 500, The first and second cleaning units 300 and 400 and the hot dias fresh water rinse unit 500 are also provided with water jet nozzles 910 and 910. The water jet nozzles 910 are installed on the conveyor belt 100, Are installed on the conveyor belt 100 in the up and down direction. A plurality of air nozzles 915 of the air cleaning unit 600 are also provided on the upper and lower sides of the conveyor belt 100 with a slight inclination. And an infrared heater 710 is installed under the infrared heater 710.

FIG. 3 is a partial cutaway plan view showing a configuration of a flux removing apparatus for a BGA package according to the present invention, showing the shapes of the water jetting nozzle 910 and the air jetting nozzle 915. In the hot tap fresh water rinse unit 200, a plurality of water spray nozzles 910 are formed in the straight pipe 900 where clean hot tap water not yet used is injected. A plurality of pipes 900 and a plurality of water injection nozzles 910 are formed to inject the first and second clean water, which are already used hot tap water, In addition, a clean hot diaphragm fresh water that has not been used yet is injected into the straight pipe 900 and is injected into the plurality of water injection nozzles 910 in the hot dias fresh water rinse part 500. The air cleaning unit 600 is provided with a plurality of pipes 900 and an air blower 610 is installed on one side of the pipe for injecting high pressure air into the pipe.

4A and 4B are enlarged views of a pipe 900 of the first and second cleaning units 300 and 400 and a water spray nozzle 910 installed in the pipe, which are components of the BGA package flux removing apparatus according to the present invention A plurality of pipes 900 are provided with injection ports on one pipe 900 and the water injection nozzles 910 of the pipe 900 are arranged to face each other with the conveyor belt 100 interposed therebetween.

5 shows an air jet nozzle 915 for jetting high pressure air to a BGA package in the air cleaning unit 600 of the flux removing apparatus for a BGA package according to the present invention. As shown in the cross-sectional view, the end of the air injection nozzle 915 is formed as a very narrow tube so as to be capable of injecting high-pressure air.

FIG. 6 is a detailed view of a conveyor belt 100 of a flux removing apparatus for a BGA package according to the present invention, wherein the conveyor belt 100 is quickly moved to a BGA package without blocking heat of various kinds of water, air, It was formed as a wire mesh because it could be transmitted. In addition, the guide rail 110 is formed so that the BGA package can be safely transported without being dropped on the conveyor belt 100 during transportation.

FIG. 7 is a piping diagram showing the piping state of the flux removing apparatus for a BGA package according to the present invention. In the hot tap fresh water rinse section 200, a pipe is directly connected to the hot tap fresh water tank 960, And is connected to the water pipe of the water pipe 930 so that the used water is directly discharged to the wastewater treatment plant.

The first cleaning part 300 is connected to a supply pipe 940 on the bottom so as to receive the hot diaphragm water from the hot diaphragm water tank 950. In order to discharge the dirty water after cleaning on the same bottom surface, (Not shown). On the other hand, a recycle pipe 920 is connected to the first pump 310 to reuse some of the water after washing, and the water is connected to the upper and lower water injection nozzles 910 as primary clean water So that it can be sprayed.

In addition, a supply pipe 940 is connected to the bottom surface of the second cleaning unit 400 so as to receive the hot diaphragm water from the hot diaphragm water tank 950, and in order to discharge the dirty water after cleaning on the same bottom surface, (Not shown). On the other hand, a recycle pipe 920 is connected to the secondary pump 410 to reuse some of the water after cleaning, and the water is connected to the upper and lower water jet nozzles 910 as secondary clean water So that it can be sprayed.

On the other hand, the hot dias fresh water rinse unit 500 is installed to receive water directly from the hot dia fresh water tank 950 and to inject the water through the upper and lower water injection nozzles 910, 2 cleaning unit 400 and is used as a part of the second clean water through the recycle pipe 920.

Finally, a plurality of air injection nozzles 915 are connected to the air blower 610 to generate high-pressure air. In order to remove water flowing down from the BGA package, a drain pipe 930 Respectively.

Each of the injection nozzles 910 and 915 located in the first and second washing units 300 and 400 and the air washing unit 600 is provided with a pressure gauge 820 indicating a water pressure for confirming the spraying pressure of the spray nozzle, A pressure gauge 820 indicating the pressure is provided.

8A and 8B are an assembling view and a piping construction diagram showing the flux removing device of the BGA package described so far as a whole.

The present invention may be applied to the conveying speed of the conveyor belt 100, the hot tap fresh water rinsing unit 200, the first and second washing units 300 and 400, the hot dias fresh water rinsing unit 500, The injection pressure of each of the injection nozzles 910 and 915 of the drying unit 600 and the amount of heat of the infrared heater 710 of the drying unit 700 can be adjusted in accordance with the characteristics of the BGA package to be cleaned, And the amount of heat of the infrared heater 710 of the drying unit 700 is automatically controlled by a sensor (not shown in the figure). As described above, the BGA package flux removing device The control panel unit 800 displays a warning to the user through the alarm indicator 810 and can immediately stop the operation.

9 is a flowchart illustrating a method of removing a flux of the BGA package according to the present invention. The BGA package is loaded on the conveyor belt 100 to remove flux and various foreign substances from the reflowed BGA package (step S1 A hot tap fresh water rinsing step (S2) of spraying hot tap fresh water on the upper and lower sides of the BGA package to rinse; and a second step of spraying the first clean water A second cleaning step (S4) for spraying a second clean water on the upper and lower sides of the BGA package; and a second cleaning step (S4) for spraying hot DIA fresh water from above and below the BGA package An air cleaning step (S6) of spraying high-pressure air onto upper and lower portions of the BGA package to remove moisture and the like of the BGA package, It consists of applying a high temperature to the unit drying step to remove the flux and the foreign material of the BGA package (S7), and an unloading step (S8) for transferring to the next process by unloading the BGA packages from the conveyor belt 100.

Here, the hot tap fresh water has a general constant of about 40 ° C, and the hot diary fresh water has a general constant of warming to about 50 ° C to 60 ° C and removing the mineral. The first and second cleaning steps may be a clean water that is recirculated in order to reuse water in the hot diatomite fresh water injection step. In the hot tap fresh water injection step, the flux between the flux and the hot tap fresh water in the BGA package It may further include removing the bubbles by injecting a small amount of the defoamer because there is a possibility that many bubbles are generated due to the action of the defoaming agent to contaminate the BGA package on the conveyor belt 100 again.

As described above, the BGA package flux removing device of the present invention comprises a conveyor belt, a hot tap fresh water rinse portion, a first cleaning portion, a second cleaning portion, a hot dia fresh water rinse portion, And a drying unit. The BGA package is loaded on the conveyor belt, and the BGA package is moved while being cleaned with fresh water. Further, the used fresh water is recycled to clean the BGA package again, The present invention can provide a BGA package flux removing apparatus and method capable of easily removing flux and various foreign substances by using heat of the BGA package.

Claims (11)

A conveyor belt for moving the ball grid array semiconductor package until the ball grid array semiconductor package is loaded and unloaded; and hot tapped fresh water is sprayed through the upper and lower water jet nozzles to the loaded ball grid array semiconductor package A first cleaning section for spraying primary clean water to the upper and lower water jet nozzles by using a first pump in the ball grid array semiconductor package; A second cleaning unit for spraying the second clean water to the upper and lower water jet nozzles by using a second pump, and a hot diaphragm water spraying unit for spraying the hot water through the upper and lower water jet nozzles to the ball grid array semiconductor package A hot-water fresh rinse portion for rinsing with the above-mentioned ball grid array half An air cleaning unit for injecting high-pressure air into the upper and lower air-jet nozzles using an air blower to remove moisture from the sieve package; and an air cleaning unit for applying heat to the heater to completely remove moisture and foreign substances from the ball grid array semiconductor package And removing the flux of the ball grid array semiconductor package, wherein the flux is removed from the ball grid array semiconductor package. The ball grid array as claimed in claim 1, wherein the conveyor belt is made of a wire mesh so that water and air can pass through at an upper portion and a lower portion thereof, and a guide rail is formed to prevent the ball grid array semiconductor package from being separated during transportation. Flux removal device for semiconductor package. [3] The apparatus of claim 1, wherein a recycle pipe is connected to the primary pump and the secondary pump to spray the washed water back to the upper and lower water spray nozzles on the bottom surfaces of the first washing unit and the second washing unit, Flux removal device for array semiconductor package. The flux removing apparatus for a ball grid array semiconductor package according to claim 1, wherein the heater is an infrared heater for simultaneously radiating infrared rays and heat to a ball grid array semiconductor package. The method of claim 1, wherein the conveying speed of the conveyor belt, the hot tap fresh water rinse portion, the first and second washing portions, the hot diatonic fresh water rinse portion, the jet nozzle pressure of the air cleaning portion, Wherein a control panel unit is provided so as to be adjustable according to a material characteristic of the grid array semiconductor package. The flux removing apparatus for a ball grid array semiconductor package according to any one of claims 1 to 4, wherein the infrared heater of the drying unit controls infrared rays and heat using a sensor. A loading step of loading the ball grid array semiconductor package with a conveyor belt to remove flux and various foreign substances from the ball grid array semiconductor package after the reflow process; A first cleaning step of spraying primary clean water from above and below the ball grid array semiconductor package, and a second cleaning step of spraying primary clean water from above and below the ball grid array semiconductor package, A second cleaning step of spraying a secondary cleaner; a hot dias fresh water rinse step in which hot dia fresh water is sprayed from above and below the ball grid array semiconductor package to finally rinse; High-pressure air is sprayed from the top and bottom of the package, An air cleaning step for removing moisture and the like of the ball grid array semiconductor package, a drying step for completely removing flux and foreign matter from the ball grid array semiconductor package by applying high heat to the top and bottom of the ball grid array semiconductor package, Wherein the unloading step comprises unloading the package from the conveyor belt and transferring the unloaded package to the next process. The method of claim 7, wherein the hot tap fresh water uses a general constant of about 40 ° C. The flux removal method of claim 7, wherein the hot diaphragm water is warmed to about 50 ° C to 60 ° C and a general constant is used which removes the inorganic material. [Claim 7] The method of claim 7, wherein the first and second cleaning steps comprise cleaning water recirculated in the hot diaphragm water injection step. The method of any one of claims 7 and 8, wherein the hot tap fresh water injection step further comprises a step of administering a defoaming agent.