KR102851778B1 - 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 - Google Patents

판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

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Publication number
KR102851778B1
KR102851778B1 KR1020257016919A KR20257016919A KR102851778B1 KR 102851778 B1 KR102851778 B1 KR 102851778B1 KR 1020257016919 A KR1020257016919 A KR 1020257016919A KR 20257016919 A KR20257016919 A KR 20257016919A KR 102851778 B1 KR102851778 B1 KR 102851778B1
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South Korea
Prior art keywords
workpiece
plate
cutout
hole
laser beam
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KR1020257016919A
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English (en)
Korean (ko)
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KR20250079054A (ko
Inventor
노르베르트 암브로지우스
로만 오슈트홀트
Original Assignee
엘피케이에프 레이저 앤드 일렉트로닉스 에스이
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54072638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102851778(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from DE102014113339.0A external-priority patent/DE102014113339A1/de
Application filed by 엘피케이에프 레이저 앤드 일렉트로닉스 에스이 filed Critical 엘피케이에프 레이저 앤드 일렉트로닉스 에스이
Priority to KR1020257028228A priority Critical patent/KR20250133802A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020257016919A 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 Active KR102851778B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257028228A KR20250133802A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102014113339.0A DE102014113339A1 (de) 2014-09-16 2014-09-16 Verfahren zur Erzeugung von Ausnehmungen in einem Material
DE102014113339.0 2014-09-16
DE102014116291 2014-11-07
DE102014116291.9 2014-11-07
PCT/DE2015/100333 WO2016041544A1 (de) 2014-09-16 2015-08-07 Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück
KR1020237018486A KR102813417B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237018486A Division KR102813417B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257028228A Division KR20250133802A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Publications (2)

Publication Number Publication Date
KR20250079054A KR20250079054A (ko) 2025-06-04
KR102851778B1 true KR102851778B1 (ko) 2025-09-01

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ID=54072638

Family Applications (6)

Application Number Title Priority Date Filing Date
KR1020257016919A Active KR102851778B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020197015976A Ceased KR20190065480A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020217005121A Ceased KR20210022773A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020257028228A Pending KR20250133802A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020177007041A Ceased KR20170044143A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020237018486A Active KR102813417B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Family Applications After (5)

Application Number Title Priority Date Filing Date
KR1020197015976A Ceased KR20190065480A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020217005121A Ceased KR20210022773A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020257028228A Pending KR20250133802A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020177007041A Ceased KR20170044143A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020237018486A Active KR102813417B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Country Status (11)

Country Link
US (2) US11610784B2 (cg-RX-API-DMAC7.html)
EP (2) EP3195706B2 (cg-RX-API-DMAC7.html)
JP (2) JP6782692B2 (cg-RX-API-DMAC7.html)
KR (6) KR102851778B1 (cg-RX-API-DMAC7.html)
CN (1) CN107006128B (cg-RX-API-DMAC7.html)
ES (1) ES2923764T5 (cg-RX-API-DMAC7.html)
LT (1) LT3195706T (cg-RX-API-DMAC7.html)
MY (1) MY196621A (cg-RX-API-DMAC7.html)
SG (2) SG10201902331XA (cg-RX-API-DMAC7.html)
TW (1) TWI616939B (cg-RX-API-DMAC7.html)
WO (1) WO2016041544A1 (cg-RX-API-DMAC7.html)

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EP4011846A1 (en) 2020-12-09 2022-06-15 Schott Ag Method of structuring a glass element and structured glass element produced thereby
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DE102022127259A1 (de) 2022-10-18 2024-04-18 Lpkf Laser & Electronics Aktiengesellschaft Verfahren sowie Vorrichtung zur Abbildung eines Strahls auf ein Objekt und Verfahren zum Einbringen einer Öffnung in ein Werkstück mittels dieses Verfahrens
DE102023125725A1 (de) * 2023-09-22 2025-03-27 Schott Ag Laser-strukturiertes optisches Element
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