KR102825180B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDF

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KR102825180B1
KR102825180B1 KR1020210158595A KR20210158595A KR102825180B1 KR 102825180 B1 KR102825180 B1 KR 102825180B1 KR 1020210158595 A KR1020210158595 A KR 1020210158595A KR 20210158595 A KR20210158595 A KR 20210158595A KR 102825180 B1 KR102825180 B1 KR 102825180B1
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processing
substrate
block
processing block
carrier
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Korean (ko)
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KR20220072762A (ko
Inventor
츠요시 와타나베
마사시 츠치야마
스구루 에노키다
타로 야마모토
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도쿄엘렉트론가부시키가이샤
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Priority to KR1020250081854A priority Critical patent/KR20250105321A/ko
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    • H01L21/67178—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H01L21/67017—
    • H01L21/6715—
    • H01L21/67173—
    • H01L21/6773—
    • H01L21/67742—
    • H01L21/67766—
    • H01L21/67775—
    • H01L22/10—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020210158595A 2020-11-25 2021-11-17 기판 처리 장치, 기판 처리 방법 및 기억 매체 Active KR102825180B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020250081854A KR20250105321A (ko) 2020-11-25 2025-06-20 기판 처리 장치, 기판 처리 방법 및 기억 매체

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020195422A JP7524736B2 (ja) 2020-11-25 2020-11-25 基板処理装置、基板処理方法及び記憶媒体
JPJP-P-2020-195422 2020-11-25

Related Child Applications (1)

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KR1020250081854A Division KR20250105321A (ko) 2020-11-25 2025-06-20 기판 처리 장치, 기판 처리 방법 및 기억 매체

Publications (2)

Publication Number Publication Date
KR20220072762A KR20220072762A (ko) 2022-06-02
KR102825180B1 true KR102825180B1 (ko) 2025-06-25

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KR1020210158595A Active KR102825180B1 (ko) 2020-11-25 2021-11-17 기판 처리 장치, 기판 처리 방법 및 기억 매체
KR1020250081854A Pending KR20250105321A (ko) 2020-11-25 2025-06-20 기판 처리 장치, 기판 처리 방법 및 기억 매체

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Country Status (3)

Country Link
JP (3) JP7524736B2 (https=)
KR (2) KR102825180B1 (https=)
CN (1) CN114551281A (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025162275A (ja) 2024-04-15 2025-10-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2025167466A (ja) 2024-04-26 2025-11-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069916A (ja) 2011-09-22 2013-04-18 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4830995B2 (ja) 2007-07-12 2011-12-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに記憶媒体
JP5381592B2 (ja) * 2009-10-06 2014-01-08 東京エレクトロン株式会社 基板処理装置
JP4906140B2 (ja) 2010-03-29 2012-03-28 東京エレクトロン株式会社 基板処理システム
JP5338777B2 (ja) 2010-09-02 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5880247B2 (ja) * 2012-04-19 2016-03-08 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5893705B2 (ja) 2014-10-08 2016-03-23 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
KR101736855B1 (ko) 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
JP6863114B2 (ja) 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069916A (ja) 2011-09-22 2013-04-18 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体

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Publication number Publication date
KR20220072762A (ko) 2022-06-02
JP2024138513A (ja) 2024-10-08
JP2026040525A (ja) 2026-03-09
KR20250105321A (ko) 2025-07-08
JP7524736B2 (ja) 2024-07-30
JP7804867B2 (ja) 2026-01-23
CN114551281A (zh) 2022-05-27
JP2022083851A (ja) 2022-06-06

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