JP7524736B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP7524736B2
JP7524736B2 JP2020195422A JP2020195422A JP7524736B2 JP 7524736 B2 JP7524736 B2 JP 7524736B2 JP 2020195422 A JP2020195422 A JP 2020195422A JP 2020195422 A JP2020195422 A JP 2020195422A JP 7524736 B2 JP7524736 B2 JP 7524736B2
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Japan
Prior art keywords
processing
substrate
block
processing block
carrier
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JP2020195422A
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English (en)
Japanese (ja)
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JP2022083851A (ja
Inventor
剛史 渡邊
正志 土山
卓 榎木田
太郎 山本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2020195422A priority Critical patent/JP7524736B2/ja
Priority to CN202111347980.9A priority patent/CN114551281A/zh
Priority to KR1020210158595A priority patent/KR102825180B1/ko
Publication of JP2022083851A publication Critical patent/JP2022083851A/ja
Priority to JP2024113570A priority patent/JP7804867B2/ja
Application granted granted Critical
Publication of JP7524736B2 publication Critical patent/JP7524736B2/ja
Priority to KR1020250081854A priority patent/KR20250105321A/ko
Priority to JP2025265752A priority patent/JP2026040525A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2020195422A 2020-11-25 2020-11-25 基板処理装置、基板処理方法及び記憶媒体 Active JP7524736B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020195422A JP7524736B2 (ja) 2020-11-25 2020-11-25 基板処理装置、基板処理方法及び記憶媒体
CN202111347980.9A CN114551281A (zh) 2020-11-25 2021-11-15 基片处理装置、基片处理方法和存储介质
KR1020210158595A KR102825180B1 (ko) 2020-11-25 2021-11-17 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP2024113570A JP7804867B2 (ja) 2020-11-25 2024-07-16 基板処理装置、基板処理方法及び記憶媒体
KR1020250081854A KR20250105321A (ko) 2020-11-25 2025-06-20 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP2025265752A JP2026040525A (ja) 2020-11-25 2025-12-18 基板処理装置、基板処理方法及び記憶媒体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020195422A JP7524736B2 (ja) 2020-11-25 2020-11-25 基板処理装置、基板処理方法及び記憶媒体

Related Child Applications (1)

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JP2024113570A Division JP7804867B2 (ja) 2020-11-25 2024-07-16 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

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JP2022083851A JP2022083851A (ja) 2022-06-06
JP7524736B2 true JP7524736B2 (ja) 2024-07-30

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JP2020195422A Active JP7524736B2 (ja) 2020-11-25 2020-11-25 基板処理装置、基板処理方法及び記憶媒体
JP2024113570A Active JP7804867B2 (ja) 2020-11-25 2024-07-16 基板処理装置、基板処理方法及び記憶媒体
JP2025265752A Pending JP2026040525A (ja) 2020-11-25 2025-12-18 基板処理装置、基板処理方法及び記憶媒体

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JP2024113570A Active JP7804867B2 (ja) 2020-11-25 2024-07-16 基板処理装置、基板処理方法及び記憶媒体
JP2025265752A Pending JP2026040525A (ja) 2020-11-25 2025-12-18 基板処理装置、基板処理方法及び記憶媒体

Country Status (3)

Country Link
JP (3) JP7524736B2 (https=)
KR (2) KR102825180B1 (https=)
CN (1) CN114551281A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025162275A (ja) 2024-04-15 2025-10-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2025167466A (ja) 2024-04-26 2025-11-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021440A (ja) 2007-07-12 2009-01-29 Tokyo Electron Ltd 基板処理装置及び基板処理方法並びに記憶媒体
JP2010161407A (ja) 2010-03-29 2010-07-22 Tokyo Electron Ltd 基板処理システム
JP2012054469A (ja) 2010-09-02 2012-03-15 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2013069916A (ja) 2011-09-22 2013-04-18 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2015039019A (ja) 2014-10-08 2015-02-26 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
US20160351430A1 (en) 2015-05-29 2016-12-01 Semes Co., Ltd. Apparatus for processing substrate
JP2019004072A (ja) 2017-06-16 2019-01-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5381592B2 (ja) * 2009-10-06 2014-01-08 東京エレクトロン株式会社 基板処理装置
JP5880247B2 (ja) * 2012-04-19 2016-03-08 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021440A (ja) 2007-07-12 2009-01-29 Tokyo Electron Ltd 基板処理装置及び基板処理方法並びに記憶媒体
JP2010161407A (ja) 2010-03-29 2010-07-22 Tokyo Electron Ltd 基板処理システム
JP2012054469A (ja) 2010-09-02 2012-03-15 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2013069916A (ja) 2011-09-22 2013-04-18 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2015039019A (ja) 2014-10-08 2015-02-26 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
US20160351430A1 (en) 2015-05-29 2016-12-01 Semes Co., Ltd. Apparatus for processing substrate
JP2019004072A (ja) 2017-06-16 2019-01-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Also Published As

Publication number Publication date
KR20220072762A (ko) 2022-06-02
JP2024138513A (ja) 2024-10-08
JP2026040525A (ja) 2026-03-09
KR20250105321A (ko) 2025-07-08
JP7804867B2 (ja) 2026-01-23
CN114551281A (zh) 2022-05-27
JP2022083851A (ja) 2022-06-06
KR102825180B1 (ko) 2025-06-25

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