KR102820850B1 - 질화 붕소 입자, 질화 붕소 분말, 수지 조성물, 및 수지 조성물의 제조 방법 - Google Patents

질화 붕소 입자, 질화 붕소 분말, 수지 조성물, 및 수지 조성물의 제조 방법 Download PDF

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KR102820850B1
KR102820850B1 KR1020237005815A KR20237005815A KR102820850B1 KR 102820850 B1 KR102820850 B1 KR 102820850B1 KR 1020237005815 A KR1020237005815 A KR 1020237005815A KR 20237005815 A KR20237005815 A KR 20237005815A KR 102820850 B1 KR102820850 B1 KR 102820850B1
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boron nitride
nitride particles
load
particles
powder
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KR20230051670A (ko
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마나 야마모토
겐지 미야타
유스케 사사키
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덴카 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0648—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/74—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by peak-intensities or a ratio thereof only
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/45—Aggregated particles or particles with an intergrown morphology
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Products (AREA)
KR1020237005815A 2020-08-20 2021-08-19 질화 붕소 입자, 질화 붕소 분말, 수지 조성물, 및 수지 조성물의 제조 방법 Active KR102820850B1 (ko)

Applications Claiming Priority (3)

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JPJP-P-2020-139486 2020-08-20
JP2020139486 2020-08-20
PCT/JP2021/030451 WO2022039240A1 (ja) 2020-08-20 2021-08-19 窒化ホウ素粒子、窒化ホウ素粉末、樹脂組成物、及び樹脂組成物の製造方法

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KR20230051670A KR20230051670A (ko) 2023-04-18
KR102820850B1 true KR102820850B1 (ko) 2025-06-13

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Country Status (5)

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US (1) US20240253989A1 (https=)
JP (2) JP7259137B2 (https=)
KR (1) KR102820850B1 (https=)
CN (1) CN115605428B (https=)
WO (1) WO2022039240A1 (https=)

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Publication number Priority date Publication date Assignee Title
US20240217819A1 (en) * 2021-03-25 2024-07-04 Denka Company Limited Boron nitride powder and resin composition

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN109704296A (zh) * 2019-02-22 2019-05-03 中国科学院苏州纳米技术与纳米仿生研究所 柔性氮化硼纳米带气凝胶及其制备方法

Family Cites Families (12)

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JP4971836B2 (ja) * 2007-03-05 2012-07-11 帝人株式会社 窒化ホウ素ナノチューブ分散液、及びそれより得られる不織布
MY170639A (en) * 2011-11-29 2019-08-21 Mitsubishi Chem Corp Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
CN104470873B (zh) * 2012-06-27 2016-11-02 水岛合金铁株式会社 带凹部的bn球状烧结粒子及其制造方法以及高分子材料
US9656868B2 (en) * 2013-03-07 2017-05-23 Denka Company Limited Boron-nitride powder and resin composition containing same
JP6447205B2 (ja) * 2015-02-09 2019-01-09 住友電気工業株式会社 立方晶窒化ホウ素多結晶体、切削工具、耐摩工具、研削工具、および立方晶窒化ホウ素多結晶体の製造方法
JP6516509B2 (ja) 2015-03-02 2019-05-22 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法
EP3575369A4 (en) * 2017-01-30 2020-09-02 Sekisui Chemical Co., Ltd. RESIN AND LAMINATE MATERIAL
WO2018139642A1 (ja) * 2017-01-30 2018-08-02 積水化学工業株式会社 樹脂材料及び積層体
JP6734239B2 (ja) * 2017-08-31 2020-08-05 デンカ株式会社 六方晶窒化ホウ素粉末及び化粧料
CN110240130A (zh) * 2018-03-07 2019-09-17 罗杰斯公司 通过模板化制备六方氮化硼的方法
WO2020090240A1 (ja) * 2018-10-29 2020-05-07 日立金属株式会社 窒化ホウ素ナノ物質の製造方法および窒化ホウ素ナノ物質、複合材料の製造方法および複合材料、ならびに窒化ホウ素ナノ物質の精製方法
CN113412235A (zh) * 2019-02-27 2021-09-17 三菱化学株式会社 氮化硼聚集粉末、散热片及半导体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109704296A (zh) * 2019-02-22 2019-05-03 中国科学院苏州纳米技术与纳米仿生研究所 柔性氮化硼纳米带气凝胶及其制备方法

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Publication number Publication date
JP2023083333A (ja) 2023-06-15
WO2022039240A1 (ja) 2022-02-24
JP7606559B2 (ja) 2024-12-25
KR20230051670A (ko) 2023-04-18
JPWO2022039240A1 (https=) 2022-02-24
CN115605428B (zh) 2024-11-15
US20240253989A1 (en) 2024-08-01
JP7259137B2 (ja) 2023-04-17
CN115605428A (zh) 2023-01-13

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