KR102789381B1 - 오버레이를 위한 측정 모드 - Google Patents

오버레이를 위한 측정 모드 Download PDF

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Publication number
KR102789381B1
KR102789381B1 KR1020227045266A KR20227045266A KR102789381B1 KR 102789381 B1 KR102789381 B1 KR 102789381B1 KR 1020227045266 A KR1020227045266 A KR 1020227045266A KR 20227045266 A KR20227045266 A KR 20227045266A KR 102789381 B1 KR102789381 B1 KR 102789381B1
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South Korea
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overlay
pupil
illumination
sample
metrology tool
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KR20230014766A (ko
Inventor
암논 마나센
앤드류 브이 힐
길라드 라레도
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케이엘에이 코포레이션
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/26Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706849Irradiation branch, e.g. optical system details, illumination mode or polarisation control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706851Detection branch, e.g. detector arrangements, polarisation control, wavelength control or dark/bright field detection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020227045266A 2020-05-22 2021-05-17 오버레이를 위한 측정 모드 Active KR102789381B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063028568P 2020-05-22 2020-05-22
US63/028,568 2020-05-22
US17/068,328 2020-10-12
US17/068,328 US11346657B2 (en) 2020-05-22 2020-10-12 Measurement modes for overlay
PCT/US2021/032655 WO2021236470A1 (en) 2020-05-22 2021-05-17 Measurement modes for overlay

Publications (2)

Publication Number Publication Date
KR20230014766A KR20230014766A (ko) 2023-01-30
KR102789381B1 true KR102789381B1 (ko) 2025-03-31

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KR1020227045266A Active KR102789381B1 (ko) 2020-05-22 2021-05-17 오버레이를 위한 측정 모드

Country Status (7)

Country Link
US (1) US11346657B2 (https=)
EP (1) EP4115172A4 (https=)
JP (1) JP7527400B2 (https=)
KR (1) KR102789381B1 (https=)
CN (1) CN115552228B (https=)
TW (1) TWI862840B (https=)
WO (1) WO2021236470A1 (https=)

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US20220189023A1 (en) * 2020-12-10 2022-06-16 FEV Group GmbH Systems, methods and computer program products for detecting individuals with fever in view of acute infection of the individual
US11460783B2 (en) * 2021-01-07 2022-10-04 Kla Corporation System and method for focus control in extreme ultraviolet lithography systems using a focus-sensitive metrology target
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US11841621B2 (en) * 2021-10-29 2023-12-12 KLA Corporation CA Moiré scatterometry overlay
KR102875946B1 (ko) * 2021-11-27 2025-10-23 케이엘에이 코포레이션 회절 기반 오버레이 오차 계측을 위한 개선된 타겟
US11796925B2 (en) * 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
CN114354627B (zh) * 2022-01-04 2022-11-22 浙江大学 一种用于表面缺陷检测的环形均匀准直照明装置及方法
US12032300B2 (en) * 2022-02-14 2024-07-09 Kla Corporation Imaging overlay with mutually coherent oblique illumination
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US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
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KR102546552B1 (ko) * 2022-11-14 2023-06-22 (주)오로스테크놀로지 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio
JP2024127783A (ja) * 2023-03-09 2024-09-20 レーザーテック株式会社 照明装置及び照明方法
US12504697B2 (en) 2023-06-02 2025-12-23 Kla Corporation Single grab pupil landscape via broadband illumination
KR102742571B1 (ko) * 2023-06-26 2024-12-16 (주) 오로스테크놀로지 필터 조립체 및 이를 구비한 오버레이 측정 장치
US12360463B2 (en) * 2023-09-26 2025-07-15 Tokyo Electron Limited Fiber bundle based optical spot size selector
US20250139814A1 (en) * 2023-11-01 2025-05-01 Kla Corporation Overlay mark design enabling large overlay measurement
US12373936B2 (en) 2023-12-08 2025-07-29 Kla Corporation System and method for overlay metrology using a phase mask
US20250306477A1 (en) * 2024-03-27 2025-10-02 Kla Corporation Single grab pupil landscape via outside the objective lens broadband illumination
US20250314973A1 (en) * 2024-04-09 2025-10-09 Kla Corporation METHODS FOR MEASUREMENT OF rAIM
US20260023269A1 (en) * 2024-07-22 2026-01-22 Kla Corporation Dark field imaging system with twice-diffracted light for overlay metrology
US20260064017A1 (en) * 2024-09-05 2026-03-05 Kla Corporation Systems and methods for dual-conjugate imaging for overlay metrology
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Also Published As

Publication number Publication date
WO2021236470A1 (en) 2021-11-25
CN115552228B (zh) 2024-10-18
EP4115172A4 (en) 2024-04-24
KR20230014766A (ko) 2023-01-30
JP2023526864A (ja) 2023-06-23
US11346657B2 (en) 2022-05-31
US20210364279A1 (en) 2021-11-25
CN115552228A (zh) 2022-12-30
TWI862840B (zh) 2024-11-21
TW202208812A (zh) 2022-03-01
EP4115172A1 (en) 2023-01-11
JP7527400B2 (ja) 2024-08-02

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