KR102691110B1 - 경화성 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판 - Google Patents
경화성 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판 Download PDFInfo
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- KR102691110B1 KR102691110B1 KR1020247004227A KR20247004227A KR102691110B1 KR 102691110 B1 KR102691110 B1 KR 102691110B1 KR 1020247004227 A KR1020247004227 A KR 1020247004227A KR 20247004227 A KR20247004227 A KR 20247004227A KR 102691110 B1 KR102691110 B1 KR 102691110B1
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- 239000000203 mixture Substances 0.000 title claims abstract description 190
- 229920005989 resin Polymers 0.000 title claims description 107
- 239000011347 resin Substances 0.000 title claims description 107
- -1 prepregs Substances 0.000 title claims description 82
- 229910052751 metal Inorganic materials 0.000 title claims description 42
- 239000002184 metal Substances 0.000 title claims description 42
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- 229920001296 polysiloxane Polymers 0.000 claims abstract description 142
- 229920003986 novolac Polymers 0.000 claims abstract description 78
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 claims abstract description 76
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical compound N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 claims abstract description 56
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 99
- 125000000217 alkyl group Chemical group 0.000 claims description 59
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 59
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 47
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 47
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- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 claims description 2
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- 239000006087 Silane Coupling Agent Substances 0.000 description 10
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- 238000010438 heat treatment Methods 0.000 description 10
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- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 8
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 8
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- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical group C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 7
- 125000003545 alkoxy group Chemical group 0.000 description 7
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- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 6
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 4
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 4
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- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- Compositions Of Macromolecular Compounds (AREA)
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Applications Claiming Priority (3)
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| JP2021128728 | 2021-08-05 | ||
| JPJP-P-2021-128728 | 2021-08-05 | ||
| PCT/JP2022/029880 WO2023013716A1 (ja) | 2021-08-05 | 2022-08-04 | 硬化性組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 |
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| KR20240023445A KR20240023445A (ko) | 2024-02-21 |
| KR102691110B1 true KR102691110B1 (ko) | 2024-08-05 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012007007A (ja) * | 2010-06-22 | 2012-01-12 | Shin-Etsu Chemical Co Ltd | ダイボンド剤組成物及び半導体装置。 |
| JP2012149154A (ja) | 2011-01-18 | 2012-08-09 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
| WO2018124164A1 (ja) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH044213A (ja) * | 1990-04-23 | 1992-01-08 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂の製造方法 |
| JPH06136093A (ja) * | 1992-09-08 | 1994-05-17 | Fujitsu Ltd | エポキシ樹脂組成物 |
| JP2809885B2 (ja) * | 1990-12-25 | 1998-10-15 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物 |
| JPH04314723A (ja) * | 1991-04-15 | 1992-11-05 | Fujitsu Ltd | エポキシ樹脂組成物 |
| KR100536091B1 (ko) * | 2000-07-27 | 2005-12-12 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
| JP2005097448A (ja) * | 2003-09-25 | 2005-04-14 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物及び半導体装置 |
| JP5101026B2 (ja) * | 2005-11-04 | 2012-12-19 | 富士フイルム株式会社 | 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法 |
| JP2009007467A (ja) | 2007-06-28 | 2009-01-15 | Shin Etsu Chem Co Ltd | 実装用難燃性サイドフィル材及び半導体装置 |
| KR20120039962A (ko) * | 2010-10-18 | 2012-04-26 | 유니플러스 일렉트로닉스 컴퍼니 리미티드 | 비할로겐계 및 비인계 열경화성 수지 조성물 |
| SG11201503925QA (en) * | 2012-11-28 | 2015-06-29 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board |
| WO2019114493A1 (en) * | 2017-12-14 | 2019-06-20 | Basf Se | Copolymer of polyalkylenimine and polysiloxane and compositions con-taining the same |
| CN108997714B (zh) * | 2018-07-23 | 2020-12-01 | 深圳职业技术学院 | 用于环氧树脂的反应型阻燃剂及其阻燃环氧树脂 |
| US11499005B2 (en) * | 2018-07-26 | 2022-11-15 | Mitsubishi Gas Chemical Company, Inc. | Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board |
| CN113150494A (zh) * | 2021-03-24 | 2021-07-23 | 深圳市百柔新材料技术有限公司 | Pcb微发泡塞孔树脂及其制备方法与应用 |
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- 2023-10-26 JP JP2023183622A patent/JP2024024630A/ja not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012007007A (ja) * | 2010-06-22 | 2012-01-12 | Shin-Etsu Chemical Co Ltd | ダイボンド剤組成物及び半導体装置。 |
| JP2012149154A (ja) | 2011-01-18 | 2012-08-09 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
| WO2018124164A1 (ja) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 |
Non-Patent Citations (1)
| Title |
|---|
| 일본 공개특허공보 평4-4213호 |
Also Published As
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| KR20240023445A (ko) | 2024-02-21 |
| JP7428981B2 (ja) | 2024-02-07 |
| TW202321376A (zh) | 2023-06-01 |
| CN118251458B (zh) | 2025-08-05 |
| CN118251458A (zh) | 2024-06-25 |
| JPWO2023013716A1 (https=) | 2023-02-09 |
| WO2023013716A1 (ja) | 2023-02-09 |
| JP2024024630A (ja) | 2024-02-22 |
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