KR102652218B1 - 비선형 도즈 및 블러 의존 에지 배치 보정 - Google Patents

비선형 도즈 및 블러 의존 에지 배치 보정 Download PDF

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KR102652218B1
KR102652218B1 KR1020190002719A KR20190002719A KR102652218B1 KR 102652218 B1 KR102652218 B1 KR 102652218B1 KR 1020190002719 A KR1020190002719 A KR 1020190002719A KR 20190002719 A KR20190002719 A KR 20190002719A KR 102652218 B1 KR102652218 B1 KR 102652218B1
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South Korea
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pattern
pixel
dose
exposure
value
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Korean (ko)
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KR20190084899A (ko
Inventor
엘마르 플라츠구머
크리스토프 스팽글러
울프 나에타
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아이엠에스 나노패브릭케이션 게엠베하
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H01J37/3023—Programme control
    • H01J37/3026—Patterning strategy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31752—Lithography using particular beams or near-field effects, e.g. STM-like techniques
    • H01J2237/31754—Lithography using particular beams or near-field effects, e.g. STM-like techniques using electron beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31764—Dividing into sub-patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31769—Proximity effect correction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020190002719A 2018-01-09 2019-01-09 비선형 도즈 및 블러 의존 에지 배치 보정 Active KR102652218B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18150797.1 2018-01-09
EP18150797 2018-01-09

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KR20190084899A KR20190084899A (ko) 2019-07-17
KR102652218B1 true KR102652218B1 (ko) 2024-03-28

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KR1020190002719A Active KR102652218B1 (ko) 2018-01-09 2019-01-09 비선형 도즈 및 블러 의존 에지 배치 보정

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Country Link
EP (1) EP3518272B1 (enExample)
JP (1) JP7299705B2 (enExample)
KR (1) KR102652218B1 (enExample)

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Publication number Priority date Publication date Assignee Title
CN112172155A (zh) * 2020-08-04 2021-01-05 深圳市创必得科技有限公司 3d打印的边缘柔化方法、装置、存储介质及3d打印机
CN113529533A (zh) * 2021-07-12 2021-10-22 江苏三叶人造草坪有限公司 一种自带缓冲垫的免填充草坪
CN114093956A (zh) * 2021-11-03 2022-02-25 通威太阳能（合肥）有限公司 一种网格栅线胶水印刷质量检测方法

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US20090168043A1 (en) 2007-12-31 2009-07-02 Samsung Electronics Co., Ltd. Exposing method using variable shaped beam, and pattern forming method using the same
US20120329289A1 (en) 2011-06-25 2012-12-27 D2S, Inc. Method and System for Forming Patterns with Charged Particle Beam Lithography

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US6269472B1 (en) * 1996-02-27 2001-07-31 Lsi Logic Corporation Optical proximity correction method and apparatus
JP2000239923A (ja) * 1999-02-19 2000-09-05 Unitika Ltd 抗菌性人工芝用ヤーン及び抗菌性人工芝
US6665856B1 (en) * 2000-12-01 2003-12-16 Numerical Technologies, Inc. Displacing edge segments on a fabrication layout based on proximity effects model amplitudes for correcting proximity effects
US7302111B2 (en) 2001-09-12 2007-11-27 Micronic Laser Systems A.B. Graphics engine for high precision lithography
GB2399676B (en) 2003-03-21 2006-02-22 Ims Ionen Mikrofab Syst Apparatus for enhancing the lifetime of stencil masks
GB2414111B (en) 2004-04-30 2010-01-27 Ims Nanofabrication Gmbh Advanced pattern definition for particle-beam processing
US20130070222A1 (en) * 2011-09-19 2013-03-21 D2S, Inc. Method and System for Optimization of an Image on a Substrate to be Manufactured Using Optical Lithography
JP5495540B2 (ja) * 2008-09-18 2014-05-21 株式会社ニューフレアテクノロジー 描画方法及び描画装置
EP2187427B1 (en) 2008-11-17 2011-10-05 IMS Nanofabrication AG Method for maskless particle-beam exposure
EP2190003B1 (en) * 2008-11-20 2014-10-01 IMS Nanofabrication AG Constant current multi-beam patterning
US8198601B2 (en) 2009-01-28 2012-06-12 Ims Nanofabrication Ag Method for producing a multi-beam deflector array device having electrodes
JP2010250286A (ja) * 2009-03-23 2010-11-04 Toshiba Corp フォトマスク、半導体装置、荷電ビーム描画装置
JP5256106B2 (ja) * 2009-04-16 2013-08-07 ダイヤテックス株式会社 難燃性人工芝生
JP5743955B2 (ja) * 2012-05-28 2015-07-01 株式会社日立ハイテクノロジーズ パターン検査装置およびパターン検査方法
JP5960557B2 (ja) * 2012-09-04 2016-08-02 積水樹脂株式会社 人工芝生
EP2830083B1 (en) 2013-07-25 2016-05-04 IMS Nanofabrication AG Method for charged-particle multi-beam exposure
EP2913838B1 (en) 2014-02-28 2018-09-19 IMS Nanofabrication GmbH Compensation of defective beamlets in a charged-particle multi-beam exposure tool
EP2950325B1 (en) 2014-05-30 2018-11-28 IMS Nanofabrication GmbH Compensation of dose inhomogeneity using overlapping exposure spots
JP6399880B2 (ja) * 2014-09-26 2018-10-03 泉州敷物株式会社 抗菌用人工芝生
US9653263B2 (en) * 2015-03-17 2017-05-16 Ims Nanofabrication Ag Multi-beam writing of pattern areas of relaxed critical dimension
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JP2016225357A (ja) * 2015-05-27 2016-12-28 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
EP3258479B1 (en) 2016-06-13 2019-05-15 IMS Nanofabrication GmbH Method for compensating pattern placement errors caused by variation of pattern exposure density in a multi-beam writer
JP6838301B2 (ja) * 2016-06-27 2021-03-03 住友ゴム工業株式会社 人工芝
CN107190617A (zh) * 2017-06-30 2017-09-22 青岛青禾人造草坪股份有限公司 仿天然草的人造草坪

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090168043A1 (en) 2007-12-31 2009-07-02 Samsung Electronics Co., Ltd. Exposing method using variable shaped beam, and pattern forming method using the same
US20120329289A1 (en) 2011-06-25 2012-12-27 D2S, Inc. Method and System for Forming Patterns with Charged Particle Beam Lithography

Also Published As

Publication number Publication date
JP7299705B2 (ja) 2023-06-28
KR20190084899A (ko) 2019-07-17
EP3518272A1 (en) 2019-07-31
EP3518272B1 (en) 2025-06-25
JP2019165199A (ja) 2019-09-26

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