KR102652202B1 - 대전 입자 소스 및 후방산란을 이용한 대전 입자 소스를 세정하는 방법 - Google Patents
대전 입자 소스 및 후방산란을 이용한 대전 입자 소스를 세정하는 방법 Download PDFInfo
- Publication number
- KR102652202B1 KR102652202B1 KR1020190011633A KR20190011633A KR102652202B1 KR 102652202 B1 KR102652202 B1 KR 102652202B1 KR 1020190011633 A KR1020190011633 A KR 1020190011633A KR 20190011633 A KR20190011633 A KR 20190011633A KR 102652202 B1 KR102652202 B1 KR 102652202B1
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- electrode
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- charged particle
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/06—Electron sources; Electron guns
- H01J37/073—Electron guns using field emission, photo emission, or secondary emission electron sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/304—Field-emissive cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/06—Electron sources; Electron guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/06—Electron sources; Electron guns
- H01J37/063—Geometrical arrangement of electrodes for beam-forming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/063—Electron sources
- H01J2237/06308—Thermionic sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/063—Electron sources
- H01J2237/06308—Thermionic sources
- H01J2237/06316—Schottky emission
-
- H01J2237/3173—
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Sources, Ion Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18154140 | 2018-01-30 | ||
| EP18154140.0 | 2018-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190092308A KR20190092308A (ko) | 2019-08-07 |
| KR102652202B1 true KR102652202B1 (ko) | 2024-03-28 |
Family
ID=61094315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190011633A Active KR102652202B1 (ko) | 2018-01-30 | 2019-01-30 | 대전 입자 소스 및 후방산란을 이용한 대전 입자 소스를 세정하는 방법 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3518268B1 (enExample) |
| JP (1) | JP7183056B2 (enExample) |
| KR (1) | KR102652202B1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210132599A (ko) | 2020-04-24 | 2021-11-04 | 아이엠에스 나노패브릭케이션 게엠베하 | 대전 입자 소스 |
| EP4095882A1 (en) | 2021-05-25 | 2022-11-30 | IMS Nanofabrication GmbH | Pattern data processing for programmable direct-write apparatus |
| US11830699B2 (en) * | 2021-07-06 | 2023-11-28 | Kla Corporation | Cold-field-emitter electron gun with self-cleaning extractor using reversed e-beam current |
| US12154756B2 (en) | 2021-08-12 | 2024-11-26 | Ims Nanofabrication Gmbh | Beam pattern device having beam absorber structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110084219A1 (en) | 2009-10-13 | 2011-04-14 | Ict Integrated Circuit Testing Gesellschaft Fur Halbleiterpruftechnik Mbh | Method and apparatus of pretreatment of an electron gun chamber |
| JP2012174691A (ja) | 2011-02-22 | 2012-09-10 | Fei Co | 安定な冷陰極電界放出型電子源 |
| JP2017027917A (ja) * | 2015-07-28 | 2017-02-02 | 株式会社ニューフレアテクノロジー | 電子源のクリーニング方法及び電子ビーム描画装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6943351B2 (en) * | 2000-02-19 | 2005-09-13 | Multibeam Systems, Inc. | Multi-column charged particle optics assembly |
| US6768125B2 (en) | 2002-01-17 | 2004-07-27 | Ims Nanofabrication, Gmbh | Maskless particle-beam system for exposing a pattern on a substrate |
| JP2007172862A (ja) * | 2005-12-19 | 2007-07-05 | Hitachi High-Technologies Corp | 荷電粒子線源用清浄化装置及びそれを用いた荷電粒子線装置 |
| ATE527678T1 (de) | 2008-11-17 | 2011-10-15 | Ims Nanofabrication Ag | Verfahren zur maskenlosen teilchenstrahlbelichtung |
| JP2011199279A (ja) | 2010-03-18 | 2011-10-06 | Ims Nanofabrication Ag | ターゲット上へのマルチビーム露光のための方法 |
| EP2779204A1 (en) * | 2013-03-15 | 2014-09-17 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Electron gun arrangement |
| EP2830083B1 (en) | 2013-07-25 | 2016-05-04 | IMS Nanofabrication AG | Method for charged-particle multi-beam exposure |
| US9653263B2 (en) | 2015-03-17 | 2017-05-16 | Ims Nanofabrication Ag | Multi-beam writing of pattern areas of relaxed critical dimension |
| EP3096342B1 (en) | 2015-03-18 | 2017-09-20 | IMS Nanofabrication AG | Bi-directional double-pass multi-beam writing |
-
2019
- 2019-01-29 EP EP19154110.1A patent/EP3518268B1/en active Active
- 2019-01-30 KR KR1020190011633A patent/KR102652202B1/ko active Active
- 2019-01-30 JP JP2019013721A patent/JP7183056B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110084219A1 (en) | 2009-10-13 | 2011-04-14 | Ict Integrated Circuit Testing Gesellschaft Fur Halbleiterpruftechnik Mbh | Method and apparatus of pretreatment of an electron gun chamber |
| JP2012174691A (ja) | 2011-02-22 | 2012-09-10 | Fei Co | 安定な冷陰極電界放出型電子源 |
| JP2017027917A (ja) * | 2015-07-28 | 2017-02-02 | 株式会社ニューフレアテクノロジー | 電子源のクリーニング方法及び電子ビーム描画装置 |
| US20170032926A1 (en) | 2015-07-28 | 2017-02-02 | Nuflare Technology, Inc. | Method of cleaning electron source and electron beam writing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019149370A (ja) | 2019-09-05 |
| KR20190092308A (ko) | 2019-08-07 |
| JP7183056B2 (ja) | 2022-12-05 |
| EP3518268B1 (en) | 2024-09-25 |
| EP3518268A1 (en) | 2019-07-31 |
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Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20190130 |
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Patent event code: PA02012R01D Patent event date: 20211118 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20190130 Comment text: Patent Application |
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Comment text: Notification of reason for refusal Patent event date: 20230719 Patent event code: PE09021S01D |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20240122 |
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