KR102641538B1 - Micro led display bad pixel el inspection and repair method - Google Patents

Abstract

The present invention relates to a method for inspecting and repairing defective pixel EL in a micro LED display. According to an embodiment of the present invention, the method for inspecting and repairing defective pixel EL in a micro LED display includes an EL probe module (Electroluminescence Probe Module) including a micro spring tip. A first step of selecting replacement target micro LEDs on the micro LED display through EL (Electroluminescence) inspection; and a second step of mounting a replacement micro LED stamped with a bonding material at the repair location where the replacement micro LED was removed.

Description

Micro LED display bad pixel EL inspection and repair method {MICRO LED DISPLAY BAD PIXEL EL INSPECTION AND REPAIR METHOD}

The present invention relates to a method for inspecting and repairing defective pixel EL in a micro LED display, and relates to a method for inspecting and repairing defective pixel EL in a micro LED display that can more efficiently and accurately inspect and repair micro LEDs.

Micro LED is an ultra-small LED with a size of tens of microns. When used as a display, micro LED has the advantages of high power efficiency, short response time, high brightness, and long lifespan compared to existing displays, so it is emerging as a core technology for next-generation displays that will replace OLED and LCD. there is.

The micro LED market began to form in 2017, and is expected to grow at an average annual rate of 70%, creating a large market worth $4.5 billion to $20 billion in 2025. Competition among companies to secure market and technological superiority is fierce.

Currently, display panels using micro LED are being commercialized and developed by various groups such as domestic Samsung Electronics, LG Electronics, and overseas PlayNitride, AUO, and Apple, but due to their smaller size, the production process and inspection/evaluation process are completely different from the existing LED industry. New process technology and equipment development are needed, and due to the smaller size, it is necessary to introduce new process technology that is completely different from the existing LED industry, from the production process to the inspection/evaluation/repair process.

Pixels for micro LED display panels require uniformity that is stricter than the optical quality of LEDs used for general lighting.

Therefore, a stabilized process line is required to prevent defective pixels from occurring according to strict standards during the manufacturing process stage, and processes and equipment to repair micro LEDs at locations where defective pixels are generated are also essential.

At this time, in order to avoid creating another defective pixel, it is important to inspect and verify the micro LED transferred on a random substrate to avoid creating a repeat defect rate after the repair process. In the process of repairing defective pixels of a display using general LED PKG, the defective pixel is Repairs are carried out for 10 or less panels, but for more than 10 panels, they are judged to be defective and discarded.

The current repair process does not separately measure the characteristics of the LED, but instead applies the LED PKG provided by the manufacturer to determine whether the LED PKG used is defective after the repair process is completed. At this time, if a defect occurs again, the LED PKG must be replaced again. Repeat the repair process of removing and attaching.

In this way, when a repair process is performed, a problem arises in which the copper plate of the panel falls off, and this is treated as a defective panel and has to be discarded, resulting in time and cost problems. However, in the case of display panels using micro LED, repair processes such as small pixel control, selective transfer, and bonding are complicated and not easy to repair, so repairs must be performed using micro LED chips with verified characteristics.

However, EL inspection equipment has micro LED chips that are too small, so scratches or cracks can form on the p and n electrodes during probing, and it is difficult to apply it to mass production because it is difficult to probe at high speeds. Development is needed.

The present invention was devised to solve the above-described problem. The present invention seeks to provide inspection and repair of defective pixels of a display at the same time. More specifically, for the commercialization of micro LED, the present invention aims to facilitate the removal of defective pixels from a display. In order to repair and reduce the re-repair process, we aim to verify the electrical characteristics (EL: Electroluminescence) of micro LEDs and provide optimized EL inspection and repair methods and devices that can repair defective pixels.

In order to easily measure the micro LED on the transferred film, the present invention applies a probe card module with a micro spring structure that can analyze multiple micro LEDs instead of the existing probe station, minimizing damage and resistance to the device and providing accurate analysis. We want to be able to proceed.

The method for inspecting and repairing defective pixel EL in a micro LED display according to an embodiment of the present invention to solve the above-described problem is through EL (Electroluminescence) inspection using an EL probe module (Electroluminescence Probe Module) including a micro spring tip, A first step of selecting micro LEDs to be replaced on the micro LED display; and a second step of mounting a replacement micro LED stamped with a bonding material at the repair location where the replacement micro LED was removed.

According to another embodiment of the present invention, the first step may be performed using an EL probe module including a micro spring tip to which silicon rubber, silicon, or a conductive powder tip is bonded.

According to another embodiment of the present invention, the micro spring tip may include at least one curved surface for shock absorption.

According to another embodiment of the present invention, the EL probe module may include a plurality of micro spring tips arranged in a row to simultaneously inspect a plurality of micro LEDs to be replaced on each line on the micro LED display.

According to another embodiment of the present invention, the first step may select a micro LED to be replaced on the micro LED display through analysis of R, G, and B levels captured by the image sensor module.

According to another embodiment of the present invention, the second step is to move the head tool to the selected location of the micro LED to be replaced, melt the bonding material of the micro LED to be replaced using a laser, and use the head tool to melt the bonding material of the micro LED to be replaced. The micro LED to be replaced can be adsorbed and removed.

According to another embodiment of the present invention, in the second step, after adsorbing and removing the micro LED to be replaced, the replacement micro LED is moved to the stamping position, and the terminal of the replacement micro LED is attached to the bonding material. Lowering to the position to be locked and stamping, moving the replacement micro LED stamped with the bonding material to the repair position where the replacement target micro LED was removed, placing the replacement micro LED at the repair position and using the laser The bonding material can be cured using .

According to another embodiment of the present invention, a third step of verifying the replacement micro LED and its mounting state may be further included after the second step.

The micro LED display defective pixel EL inspection and repair device according to an embodiment of the present invention detects replacement target micros on the micro LED display through EL (Electroluminescence) inspection using an EL probe module (Electroluminescence Probe Module) including a micro spring tip. An inspection unit that selects LEDs; and a repair unit that mounts a replacement micro LED stamped with a bonding material at the repair location where the replacement micro LED was removed.

According to another embodiment of the present invention, the inspection unit includes an EL probe module (Electroluminescence Probe Module) including a micro spring tip to which a silicon rubber, silicon, or conductive powder tip is bonded; and an LED determination module that selects a micro LED to be replaced on the micro LED display by extracting the R, G, and B levels of the micro LED photographed by the image sensor module through the EL probe module.

According to another embodiment of the present invention, the micro spring tip may include at least one curved surface for shock absorption.

According to another embodiment of the present invention, the EL probe module may include a plurality of micro spring tips arranged in a row to simultaneously inspect a plurality of micro LEDs to be replaced on each line on the micro LED display.

According to another embodiment of the present invention, the repair unit moves to the selected position of the micro LED to be replaced, melts the bonding material of the micro LED to be replaced using a laser, and uses it to adsorb and remove the micro LED to be replaced. coaxial head tool; a stamping module that lowers and stamps the removed replacement micro LED onto a bonding material to a position where the terminal of the replacement micro LED is locked; and an alignment vision module that aligns the replacement micro LED stamped with the bonding material to the repair position and corrects errors.

According to another embodiment of the present invention, the coaxial head tool can move the replacement micro LED stamped with the bonding material to the repair position and harden the bonding material using a laser.

According to the present invention, inspection and repair of defective pixels of a display can be provided at the same time. More specifically, in order to commercialize micro LED, pixels of a display with defective pixels can be easily repaired, and in order to reduce the re-repair process, micro LED After verifying the electrical characteristics (EL) of , optimized EL inspection and repair methods and devices that can repair defective pixels can be provided.

According to the present invention, in order to easily measure the micro LED on the transferred film, a probe card module with a micro spring structure that can analyze multiple micro LEDs is applied instead of the existing probe station to minimize damage and resistance to the device and provide accurate measurement. Analysis can proceed.

1 is a flowchart illustrating a method for inspecting and repairing defective EL pixels in a micro LED display according to an embodiment of the present invention.
2 to 6 are diagrams for explaining a method for inspecting and repairing defective pixel EL in a micro LED display according to an embodiment of the present invention.
Figure 7 is a block diagram of a micro LED display defective pixel EL inspection and repair device according to an embodiment of the present invention.
8 to 23 are diagrams to explain in more detail the configuration and repair method of a micro LED display defective pixel EL inspection and repair device according to an embodiment of the present invention.
Figures 24 to 28 are diagrams for explaining a method of evaluating repair of defective pixels in a micro LED display according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings. However, in describing the embodiments, if it is determined that specific descriptions of related known functions or configurations may unnecessarily obscure the gist of the present invention, detailed descriptions thereof will be omitted. Additionally, the size of each component in the drawings may be exaggerated for explanation and does not mean the actual size.

1 is a flowchart illustrating a method for inspecting and repairing defective EL pixels in a micro LED display according to an embodiment of the present invention.

Additionally, FIGS. 2 to 6 are diagrams for explaining a method for inspecting and repairing defective EL pixels in a micro LED display according to an embodiment of the present invention.

From now on, a method for inspecting and repairing defective pixel EL in a micro LED display according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.

According to the EL inspection and repair method for micro LED display defective pixels according to an embodiment of the present invention, through EL (Electroluminescence) inspection using an EL probe module including a micro spring tip (S110), the micro LED Select the micro LED to be replaced on the display (S120).

Referring to Figure 2, in order to reduce the rework rate during repair, micro LED defect inspection can be performed through an EL probe module, and the probing speed can be increased by configuring a micro probe card MEMS (Micro Electro Mechanical System) module for micro LED. It can be improved and is composed of a micro spring tip with an anode and cathode spacing of 50 um or less. In this case, the micro spring probe tip is composed of a width of at least 50 micro or less, and is a vision device capable of high-precision aligner control and error compensation of the substrate. Through the system, the RGB level of the micro LED can be extracted, and cross-verification can be performed between defective judgment through EL analysis of the micro LED to be replaced and the measured electrical characteristic data. At this time, since the micro LED has a thickness of less than 10 um, it is very important not to apply shock, and since the size of the electrode is small (less than 20 um), the surface area of the tip of the tip must be small. In addition, since the spacing between pn electrodes is small (less than 50 um), the spacing between micro spring probe tips must also be made small (less than 50 um) to correspond to this.

Referring to Figure 3, according to the present invention, in order to improve the performance of the micro probe card MEMS (Micro Electro Mechanical System) module for micro LED, damage cushioning is provided through a micro spring probe tip bonded to silicon rubber, silicon, or conductive powder tips. In addition, it can provide high-precision aligner control and error correction of the alignment vision module, improvement of micro LED brightness extraction algorithm and software, field application of panel repair, and correction and optimization of EL analysis results of micro LED.

That is, as shown in FIGS. 2 and 3, according to the present invention, the micro spring tip can be configured to include at least one curved surface for shock absorption, and the EL probe module can be configured to include multiple replacements on each line on the micro LED display. It can be configured to inspect one or multiple chips simultaneously by arranging a plurality of micro spring tips in a line so that each target micro LED can be inspected simultaneously.

At this time, in the EL current injection state, the image sensor module 114 can be placed at the bottom penetrating the lower transparent stage and the micro LED bonded transparent sheet to measure and extract the R, G, and B levels of the micro LED display.

In this way, according to the present invention, the micro probe card MEMS module is used to receive information such as the electrical characteristics of the micro LED, driving voltage, leakage, and optical output according to the current applied value, and analyze the electrical and optical characteristics to determine the defective chip. By determining which chips are normal, defective chips on the panel can be removed, and chips determined to be good can be transferred or bonded onto the panel.

In addition, as shown in Figure 4, the RGB level of the micro LED is extracted, the RGB level data for each coordinate of the micro LED chip to be replaced is serialized from the measurement results of the image sensor module, and the light output pass or fail is determined from the RGB data level table for each coordinate. Through this, you can select the micro LED to be replaced.

In addition, referring to FIG. 5, for EL inspection and analysis, EL inspection standards for transfer sheet array micro LEDs are established, and as conditions for measuring the optical output image of the micro LED under current injection into a probe consisting of a micro springing tip, By configuring current injection conditions to block ambient light and enabling relative comparison of light output brightness between chips, the RGB level of the micro LED is extracted through image signal processing from the image sensor measurement results under current injection using a micro probe, and the micro LED to be replaced is identified. LEDs can be selected.

At this time, as a standard for EL inspection of micro LED, the RGB level for the brightness of each position of the micro LED light output image in the optimal current injection state using the micro spring tip (probe) and the I/V measured from the EL inspection equipment in the single chip LED. Through comparative analysis between characteristics and light output results, it is possible to establish conditions for judging whether a micro LED is normal or defective.

In addition, by using the R, G, and B levels in a database as a result of the EL inspection of the transfer sheet array micro LED, the accuracy of selecting replacement target micro LEDs through EL (Electroluminescence) can be further improved.

Thereafter, the coaxial head tool is moved to the selected location of the micro LED to be replaced (S130), the bonding material of the micro LED to be replaced is melted using a laser (S140), and the pixel vacuum adsorption unit of the coaxial head tool is used to melt the bonding material of the micro LED to be replaced (S140). The micro LED to be replaced is adsorbed and removed to remove defective pixels (S150).

Afterwards, the coaxial head tool moves the replacement micro LED to the stamping position, descends to the position where the terminal of the replacement micro LED is locked in the bonding material and stamps it (S160), and then the bonding material is stamped. The replacement micro LED is moved and placed to the repair location where the replacement target micro LED was removed, and the bonding material is cured using a laser (S170).

From now on, with reference to FIG. 6, the repair process will be described in more detail.

Referring to FIG. 6, the edge of the PCB is recognized as a guide mark using vision (S131), and the coaxial head tool is moved to the position to be repaired based on the guide mark (S132). Afterwards, the surface coating material and the bonding material of the micro LED are melted using a laser (S141), and the LED chip is adsorbed and removed using the pixel vacuum adsorption unit of the coaxial head tool (S151).

Afterwards, the coaxial head tool is moved to the loading position where a new micro LED will be picked up (S161), the micro LED chip is picked up, and then moved to the stamping position of the bonding material (S162). At this time, the joining material may be composed of 10,000 to 20,000 cps solder or SAP (Self Assembly Anisotropic Conductive Paste), or ACF (Anisotropic Conductive Film) material.

Thereafter, stamping is performed by lowering the coaxial head tool only to a position where the terminal of the micro LED is locked in the bonding material (S163), and the stamping state of the bonding material on the micro LED can be confirmed (S164). After that, the micro LED stamped with the bonding material is moved to a position to be repaired (S171), the micro LED is placed in the position to be repaired, and then the micro LED can be mounted through vacuum breaking and laser curing (S172).

Figure 7 is a block diagram of a micro LED display defective pixel EL inspection and repair device according to an embodiment of the present invention.

From now on, the configuration of the micro LED display defective pixel EL inspection and repair device will be described with reference to FIG. 7.

The micro LED display defective pixel EL inspection and repair device 100 according to an embodiment of the present invention may be configured to include an inspection unit 110 and a repair unit 120.

The inspection unit 110 selects micro LEDs to be replaced on the micro LED display through EL (Electroluminescence) inspection using an EL probe module (Electroluminescence Probe Module) including a micro spring tip, and the repair unit 120 selects the micro LED to be replaced. A replacement micro LED stamped with bonding material is mounted at the repair location where the replacement micro LED was removed.

More specifically, the inspection unit 110 may be configured to include an EL probe module (Electroluminescence Probe Module: 111) and an LED determination module (112).

The EL probe module (Electroluminescence Probe Module: 111) is configured to include a micro spring tip (113), and the LED determination module (112) detects the image captured by the image sensor module (114) through the EL probe module (111). Extracts the R, G, and B levels of the micro LED and selects the micro LED for replacement on the micro LED display. At this time, in the EL current injection state, the image sensor module 114 can be placed at the bottom penetrating the lower transparent stage and the micro LED bonded transparent sheet to measure R, G, and B levels.

Meanwhile, the repair unit 120 may be configured to include a coaxial head tool 121 and an alignment vision module 122.

The coaxial head tool 121 moves to the selected location of the micro LED to be replaced and uses a laser to melt the bonding material of the micro LED to be replaced, and the laser light irradiation unit 123 to melt the bonding material of the micro LED to be replaced (defective LED). It may be configured to include a pixel vacuum adsorption unit 124 that adsorbs and removes the pixel.

In addition, the pixel vacuum adsorption unit 124 of the coaxial head tool 121 can be lowered to a position where the terminal of a replacement micro LED (normal LED) is locked to the bonding material for stamping. In addition, the coaxial head tool 121 can move the replacement micro LED stamped with the bonding material to the repair position and harden the bonding material using the laser of the laser light irradiation unit 123.

The alignment vision module 122 can align the replacement micro LED stamped with the bonding material to the repair position and correct errors.

8 to 23 are diagrams to explain in more detail the configuration and repair method of a micro LED display defective pixel EL inspection and repair device according to an embodiment of the present invention.

From now on, the configuration and repair method of the micro LED display defective pixel EL inspection and repair device will be described in more detail with reference to FIGS. 8 to 23.

Referring to FIG. 8, the micro LED for defective pixel repair according to an embodiment of the present invention can be configured to have a size of 80 × 120 ㎛, a thickness of 10 ㎛ or less, an electrode size of 30 ㎛ or less, and an inter-chip gap of 60 ㎛ or less. As shown in Figure 9, the transfer module of the micro LED display for replacing and mounting defective pixels has a maximum transfer length of X-axis and Y-axis (X-axis) of 300 mm or more, (Y-axis) ±25 mm, It can be configured with Y-axis maximum/minimum transfer speed of 1 ㎛/s or less, 150 mm/s or more, Theta-axis maximum rotation angle ± 5.5°, and Theta-axis position correction repetition accuracy ± 2 arcsec.

In addition, as shown in Figure 10, the coaxial head tool for micro LED repair is designed to be coaxial in the vacuum adsorption direction of the pixel vacuum adsorption part and the laser irradiation direction using transparent quartz material for ultra-small micro LED repair, thereby applying non-coaxial direction repair. Interference between adjacent pixels can be eliminated.

Figure 11 shows the defective pixel vacuum adsorption head structure of the coaxial head tool (left) and the method of controlling the maximum viscosity change point of the bonding material (right). The coaxial head tool is a head structure that includes a laser light irradiation unit and a vacuum adsorption unit coaxially coupled, and can provide micro LED vacuum adsorption pressure control and vacuum adsorption start and end point control according to melting of the bonding material. Through this, control can be optimized to ensure removal and mounting of micro LEDs according to the timing when the bonding material is melted or hardened by laser irradiation.

Meanwhile, as shown in Figure 12, the coaxial head tool can optimize the laser melting conditions of the bonding material for removing defective pixels through pulse control, and as shown in Figure 13, the laser irradiation and adsorption process is used as a defective pixel repair process. Through this, only defective pixels can be adsorbed, removed, and replaced without interfering with adjacent pixels, and the vacuum adsorption/laser irradiation process conditions that enable mounting through coaxial laser irradiation can be optimized.

At this time, as shown in Figure 14, the transfer film can be selected and transferred by arranging the transfer film at a pitch that allows vacuum adsorption in a single micro LED unit, and as shown in Figure 15, the adhesion control temperature conditions of the sheet for micro LED transfer are set, The temperature conditions of the LED vacuum adsorption process of the replacement single micro on the transfer film can be set.

In addition, as shown in Figure 16, after removing the defective pixel and mounting the replacement pixel by applying a new bonding material through a stamping process, repair reliability can be secured through connection resistance evaluation after repair. In other words, by optimizing the laser output and lens magnification of the repair equipment using the laser light irradiation section of the coaxial head tool and the pixel vacuum adsorption section, the laser irradiation area is spaced more than 50 ㎛ from adjacent non-defective pixels for replacement mounting of micro LEDs. Damage to adjacent pixels can be minimized.

Figure 17 shows a more detailed structure of the laser light irradiation part of the coaxial head tool, and Figure 18 explains the stamping process of the bonding material using the coaxial head tool. As shown in FIG. 17, the coaxial head tool is a structure capable of vision and lighting control for monitoring the laser irradiation status of the laser light irradiation unit, and the light irradiation area applied to the 980 nm semiconductor laser source is a passively variable optical structure to vertically adjust the head tool. Uniformity of the laser irradiated surface can be improved, and as shown in Figure 18, mounting for micro LED replacement is performed after dispensing the bonding material. The alignment vision module capable of such vision and lighting control may be configured as a structure included in the coaxial head tool, or may be configured as a separate module.

At this time, in order to optimize the repair laser irradiation area as shown in FIG. 19, interference with adjacent pixels can be removed by designing an area laser irradiation optical system that extends 50 ㎛ on one side compared to the 80 × 120 micro LED.

In addition, as shown in FIG. 20, PID (Proportional-Integral-Differential Controller) load control of the coaxial head tool can be performed for precision replacement mounting when replacing defective pixels.

Referring to Figure 21, the coaxial head tool can be controlled by optimizing the bonding material viscosity and stamping depth to prevent short circuits between micro LED terminals, and as shown in Figure 22, it is possible to control the defective pixel repair process that may occur. Mounting load conditions and coaxial melting/adsorption methods can be controlled to prevent misalignment, tilting, breaking, and terminal dropping defects.

In addition, as shown in Figure 23, it is possible to correct the error in the replacement position of the defective pixel of the head tool using a UVW stage and two alignment vision modules, and through this, the alignment precision is less than 3 ㎛. Implementation is possible.

From now on, an evaluation method for repairing defective pixels of a micro LED display will be described with reference to FIGS. 24 to 28.

Referring to Figure 24, mounting evaluation when replacing defective pixels can be performed through a 30 PPI panel with 80 Evaluation can be made.

In addition, as shown in Figure 26, a high-temperature lifespan test is performed on the repaired micro LED using a high-temperature chamber. At this time, the high-temperature lifespan test is performed by exposing it to high temperature and high humidity conditions, specifically, a high temperature of 70 degrees or more for 24 hours and a high temperature of 80 degrees Celsius or more. Exposure to humidity conditions above % and check the status of the micro LED as shown in Figure 27. Through this, it is possible to verify the repair process through a reliability test after mounting the replacement pixel.

In addition, according to the present invention, the actual chips are objectified and arranged in the entire area image acquired from the image sensor module, data such as individual inspection data, location data, and alignment are serialized in a form suitable for operation, and the serialized data is preserved and stored. Analysis is possible, and a DB Scheme with an optimized structure can be designed to enable linkage with motion control for application to selection and repair processes.

Through this, it is possible to compensate for positional changes that may occur irregularly depending on repeated contact of the probe (micro spring tip) of the EL probe module and the environment (temperature, humidity, etc.) when inspecting and repairing defective pixel EL of a micro LED display. Image processing may be performed. As shown in Figure 28, the judgment conditions of normal or defective (good or bad) can be optimized according to the R, G, and B brightness level results during EL inspection, and PD measurement and image sensor measurement can be used to improve the accuracy of EL inspection. The pass/fail judgment results can be mapped.

In the detailed description of the present invention as described above, specific embodiments have been described. However, various modifications are possible without departing from the scope of the present invention. The technical idea of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined not only by the claims but also by equivalents to the claims.

Claims (14)

A first step of selecting replacement target micro LEDs on the micro LED display through EL (Electroluminescence) inspection using an EL probe module including a micro spring tip; and
A second step of mounting a micro LED stamped with a bonding material at the repair location where the micro LED to be replaced was removed,
The second step is,
Move the head tool to the location of the selected micro LED to be replaced,
Using a laser, melt the bonding material of the micro LED to be replaced,
Using the head tool, adsorb and remove the micro LED to be replaced,
Move the micro LED to the stamping position,
Lower and stamp the terminal of the micro LED on the bonding material to a position where it will be locked,
Move the micro LED stamped with the bonding material to the repair position where the micro LED to be replaced is removed,
Place the micro LED at the repair position and cure the bonding material using a laser,
The bonding material is:
Consisting of 10,000 to 20,000 cps solder, SAP (Self Assembly Anisotropic Conductive Paste), or ACF (Anisotropic Conductive Film) material,
The head tool is,
A method for inspecting and repairing defective pixel EL in a micro LED display, including a pixel vacuum adsorption unit made of a transparent quartz material as a coaxial head tool, and the vacuum adsorption direction of the pixel vacuum adsorption unit and the laser irradiation direction are coaxial.
In claim 1,
The first step is,
A method for EL inspection and repair of defective pixels in a micro LED display that performs EL inspection using an EL probe module containing a micro spring tip bonded to silicone rubber, silicone, or conductive powder tip.
In claim 1,
The micro spring tip is,
Method for inspecting and repairing defective pixel EL of a micro LED display including at least one curved surface for shock absorption.
In claim 1,
The EL probe module is,
A micro LED display defective pixel EL inspection and repair method comprising a plurality of micro spring tips arranged in a row to simultaneously inspect a plurality of micro LEDs to be replaced on each line of the micro LED display.
In claim 1,
The first step is,
A micro LED display defective pixel EL inspection and repair method that selects micro LEDs for replacement on the micro LED display through analysis of R, G, and B levels captured by the image sensor module.
delete delete In claim 1,
After the second step,
A third step of verifying the micro LED and mounting state;
A micro LED display defective pixel EL inspection and repair method further comprising:
An inspection unit that selects micro LEDs to be replaced on the micro LED display through EL (Electroluminescence) inspection using an EL probe module (Electroluminescence Probe Module) including a micro spring tip; and
A repair unit that mounts a micro LED stamped with a bonding material at the repair location where the micro LED to be replaced is removed;
Including,
A coaxial head tool that moves to the selected position of the micro LED to be replaced, melts the bonding material of the micro LED to be replaced using a laser, and uses it to adsorb and remove the micro LED to be replaced;
a stamping module that lowers and stamps the terminal of the micro LED into the bonding material to a position where it is locked; and
It includes an alignment vision module that aligns the micro LED stamped with the bonding material to the repair position and corrects errors,
The coaxial head tool is,
It includes a pixel vacuum adsorption unit using a transparent quartz material, the vacuum adsorption direction of the pixel vacuum adsorption unit and the irradiation direction of the laser are coaxial, moving the micro LED stamped with the bonding material to the repair position, and the laser Curing the bonding material using
The bonding material is:
Micro LED display defective pixel EL inspection and repair device consisting of 10,000 to 20,000 cps solder, SAP (Self Assembly Anisotropic Conductive Paste), or ACF (Anisotropic Conductive Film) material.
In claim 9,
The inspection department,
EL probe module (Electroluminescence Probe Module) containing a micro spring tip bonded to silicone rubber, silicone or conductive powder tip; and
An LED determination module that selects a micro LED to be replaced on the micro LED display by extracting the R, G, and B levels of the micro LED photographed by the image sensor module through the EL probe module;
A micro LED display defective pixel EL inspection and repair device.
In claim 9,
The micro spring tip is,
A micro LED display defective pixel EL inspection and repair device that includes at least one curved surface for shock absorption.
In claim 9,
The EL probe module is,
A micro LED display defective pixel EL inspection and repair device comprising a plurality of micro spring tips arranged in a row to simultaneously inspect a plurality of micro LEDs to be replaced on each line of the micro LED display.
delete delete

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