KR101072614B1 - Led inspection device and method thereof - Google Patents

Abstract

The present invention relates to an LED chip inspection apparatus having a supply unit for supplying an LED chip, and a measuring unit for measuring the characteristics of the LED chip transmitted from the supply unit at an inspection position, wherein the LED chip delivered from the supply unit is seated and the inspection position. A chip seating block having a chip seating area corresponding to the chip seating block and moving to the test position; And an LED chip test position correcting means having a correcting piece for flowing the LED chip and seating it in the chip seating area when the seating state of the LED chip is not in the correct position.
As a result, the inspection position of the LED chip can be accurately corrected to accurately measure the characteristics of the LED chip.

Description

LED chip inspection device and its inspection method

The present invention relates to an LED chip inspection apparatus and an inspection method thereof, wherein the LED chip inspection position correcting means for correcting the position of the LED chip before the LED chip is moved to the inspection position to accurately measure the characteristics of the LED chip at the inspection position. The present invention relates to an LED chip inspection apparatus having and an inspection method thereof.

LED (Light Emitting Diode) is a kind of light emitting device that emits light by power supply and is also called a Luminescent diode.

These LEDs are small, long in life, low in power consumption, and have fast-response advantages. Recently, these LEDs have been widely used as backlight units for various display devices that require light sources, as well as light sources for small lamps and various instruments. .

The LED is manufactured in the form of a small chip using a semiconductor process. A general LED chip manufacturing process is an epitaxial process (EPI) for preparing an epi wafer on a substrate, which is a base material, and a wafer for manufacturing a plurality of LED chips. It consists of a chip process (Fabrication) and a package process (Package) for packaging the LED chip manufactured in the chip process, and an inspection process for inspecting the LED chip that went through the packaging process.

Among them, the LED chip inspection apparatus corresponding to the LED chip inspection process includes a supply unit which loads a wafer supplied from a package process and supplies the LED chip on the wafer to the next inspection process, and a measurement unit which measures characteristics of the LED chip supplied from the supply unit. And a sorting unit for classifying the LED chips whose properties are measured in the measuring unit by grade, and a loading unit for loading the LED chips classified according to the grade in the sorting unit for each class. A picker unit is provided between the supply part, the measurement part, and the sorting part and the loading part to move the LED chip from the previous step to the next step.

The measurement unit 20 of the LED chip inspection apparatus 1 may individually measure the optical characteristics and the current characteristics of the LED chips A based on the inspection criteria of the LED chips A set in advance. To this end, as shown in FIG. 1, between the supply unit 10 and the measurement unit 20, the LED chip A transmitted from the supply unit 10 to the measurement unit 20 is continuously inspected by the measurement unit 20. The rotary index unit 30 is provided to individually move to the position (a "), the measuring unit 20 is the optical characteristics of the LED chip (A) moved to the inspection position (a") by the rotary index unit 30 An optical characteristic measuring unit (not shown) and a current characteristic measuring unit (not shown) for measuring the overcurrent characteristic are provided.

Here, the rotary index unit 30 is a plurality of pivotal arms 31 are arranged at equal intervals along the circumferential direction, and the pivotal arm driving means for rotating the pivotal arms 31 by an angle corresponding to the equal intervals ( 35). In addition, a chip seating block 33 on which the LED chip A supplied from the supply unit 10 is mounted is provided at the free end of the pivotal arm 31.

The process of moving the LED chip A according to the above configuration will be briefly described.

The LED chips A loaded on the supply unit 10 are individually supplied to the chip seating block 33 of the rotary index unit 30 by the picker unit 11. That is, when the pivot arm 31 of the rotary index unit 30 rotates so that the chip seating block 33 moves to the chip supply position a of the supply unit 10, the supply unit is picked up by the picker unit 11. The LED chip (A) of (10) is seated on the chip seating block (33b) of the pivot arm (31b) waiting in the chip supply position (a). Here, the chip mounting blocks 33, 33a, 33b are rotated by the rotational arms 31, 31a, 31b, and the rotation radius thereof is the chip supply position a of the supply unit 10 and the LED chip of the measurement unit 20. It moves along the same radial line as the inspection position (a "). Therefore, the LED chip (A) seated on the chip seating block 33 at the chip supply position (A) of the supply unit 10 has a center and periphery thereof. It should be seated in the seating position (a ') of the chip mounting block (33b), the peripheral end of the LED chip (A) is seated of the chip mounting block 33b corresponding to the inspection position (a ") of the measuring unit 20 It must be accurately seated on the chip seating block 33b so as not to deviate from the position a '.

On the other hand, when the LED chip (A) is seated on the chip seating block 33 in the chip supply position (a) of the supply unit 10, and then the rotation arm 31 is rotated again, the chip on which the LED chip (A) is seated The seating block 33a is moved to the inspection position a "of the measuring unit 20. At this time, the other rotating arm 31 adjacent to the direction opposite to the rotational direction of the rotating arm 31a moves to the supply unit 10. The other chip seating block 33 provided at the free end of the pivot arm 31 is moved to the chip supply position a of the supply unit 10.

After the LED chip A seated on the chip seating block 33a moved to the measuring unit 20 is measured at the inspection position a "of the measuring unit 20, the optical characteristic and the current sideness are measured, It moves to the sorting part (not shown) by the rotation of 31a. In this case, the measurement part 20 is supplied with the LED chip A seated on the chip seating block 33b of the other rotating arm 31b mentioned above. .

This process continues as the rotational arms 31 rotate, so that the supply and characteristic measurement of the LED chips A are continuously performed.

By the way, in the conventional LED chip inspection apparatus 1 in the process of the LED chip (A) is moved and seated by the picker unit 11 from the supply unit 10 to the chip seating block 33 of the pivot arm 31 The LED chip A is accurately seated at the seating position a 'of the chip mounting block 33 due to a series of transfer errors such as a pickup position error of the picker unit 11 or a pickup strength error and a flow of the picker unit 11. Failure to do so may occur.

As a result, the LED chip moved to the measuring unit is out of the inspection position, the optical characteristic measurement and the current characteristic measurement is not made accurately.

That is, when the LED chip moved to the measuring unit is located out of the correct test position, the current measuring position of the LED chip by the current characteristic measuring unit preset according to the measuring position of the measuring unit is inaccurate and an error of the current measurement value occurs. In other words, the position of the optical spectrum measurement by the optical characteristic unit is incorrect and an error of the optical characteristic value occurs.

Accordingly, it is an object of the present invention to provide an LED chip inspection apparatus having an LED chip inspection position correcting means capable of accurately correcting the inspection position of the LED chip to accurately measure the characteristics of the LED chip, and an inspection method thereof.

According to the present invention, in the LED chip inspection apparatus having a supply unit for supplying the LED chip and a measuring unit for measuring the characteristics of the LED chip transmitted from the supply at the inspection position, the LED chip delivered from the supply unit is seated A chip seating block having a chip seating area corresponding to the test position and moving to the test position; And an LED chip inspection position correcting means having an LED chip inspection position correcting means for flowing the LED chip and seating it in the chip seating area if the seating state of the LED chip is not in the correct position. Is achieved.

Here, the LED chip inspection position correcting means is a sensing unit for detecting the presence or absence of seating on the chip mounting area of the LED chip, and if the mounting state of the LED chip detected by the sensing unit is not in the correct position the LED chip It is preferable to include a correction unit having the correction piece for correcting the seating position of the control unit for controlling the driving of the correction unit in accordance with the presence or absence of the correct position of the LED chip detected by the sensing unit.

The correction unit includes a support block provided in an area adjacent to the chip seating block between the supply unit and the measurement unit, and a Z-axis lift block coupled to the support block so as to be lifted up and down;
A Z-axis driving unit for elevating the Z-axis elevating block, an XY drive block slidably reciprocating in the XY direction with respect to the Z-axis elevating block, and an X-axis driving unit driving the XY drive block in both X-axis directions; A Y-axis driving unit for driving the XY driving block in both Y-axis directions; The correction piece is effectively coupled to the XY drive block having a chip correction sphere that accommodates the LED chip to flow in the XY axis.

In addition, the control unit controls the driving of the Z-axis driving unit, the X-axis driving unit and the Y-axis driving unit when the seating state of the LED chip transmitted from the sensing unit is not in the correct position, and the LED chip is in the correct position in the state accommodated in the chip compensation slot. The correction piece is flowed in the XY direction until it is positioned; When the seating state of the LED chip transmitted from the sensing unit is in the correct position, it is more preferable to control the driving of the Z-axis driving unit so that the correction piece is spaced upwardly from the LED chip.

On the other hand, the chip seating block is coupled to the liftable and comprises a chip block transfer member moving from the supply to the measurement unit; The correction unit includes a support block provided in an area adjacent to the chip seating block between the supply unit and the measurement unit, an XY drive block slidably reciprocated in the XY direction with respect to the support block, and the XY drive block in both directions of the X axis. An X-axis driving unit for driving, a Y-axis driving unit for driving the XY driving block in both directions on the Y-axis, a compensating piece coupled to the XY driving block with a chip compensator for accommodating the LED chip, and a lower region of the compensating piece And a chip seating block lifter configured to elevate the chip seating block so as to elevate an LED chip seated on the chip seating block between a position spaced downwardly with respect to the correction piece and a position accommodated in the chip compensator. More effective.

At this time, if the seating state of the LED chip transmitted from the sensing unit is not in the correct position, the controller controls the driving of the chip seating block lifter, the X-axis driver and the Y-axis driver, so that the LED chip is accommodated in the chip compensator of the correction piece. Flowing the correction piece in the XY direction until it is seated in position; When the seating state of the LED chip transmitted from the sensing unit is in the correct position, it is preferable to control the driving of the chip seat block lift so that the LED chip is spaced downward from the correction piece.

And, the X-Y drive block is formed with an X-axis guide profile groove formed in the X-axis direction, and a Y-axis guide profile groove formed in the Y-axis direction; The X-axis driving unit and the Y-axis driving unit are eccentrically coupled to the stationary motor, the X-axis driving cam and the Y-axis driving cam coupled to the rotating shafts of the respective stationary motors, and the X-axis driving cam and the Y-axis driving cam, respectively. It is effective to have X-axis cam rollers and Y-axis cam rollers in rolling contact with the Y-axis guide profile grooves.

On the other hand, the above object is according to another aspect of the present invention, the LED chip inspection method for inspecting the characteristics of the LED chip is transferred from the supply to the chip seating area of the chip seating block at the inspection position corresponding to the chip seating area of the measuring unit The method may further include detecting whether the LED chip is seated on the chip seating area of the LED chip, and when the seating state of the LED chip detected in the step of detecting the seating chip is not correct. It is also achieved by the LED chip inspection method comprising the step of flowing in the XY direction to correct in place in the chip seat area.

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According to the present invention, there is provided an LED chip inspection apparatus having an LED chip inspection position correcting means capable of accurately correcting the inspection position of the LED chip and accurately measuring the characteristics of the LED chip.

1 is a plan view schematically showing a part of a conventional LED chip inspection device,
2 is a schematic plan view of an LED chip inspection apparatus having the LED chip inspection position correction means according to the first embodiment of the present invention;
3 is a perspective view of a correction unit of the LED chip inspection position correction means of FIG.
4 and 5 are side views showing the driving state of the correction unit of FIG.
6 is an enlarged plan view of a correction piece of the correction unit of FIG. 3;
7 is a control block diagram of the correction means of FIGS.
8 is a control flow chart of the correction means of FIGS.
9 and 10 are side views showing a driving state of a correction unit of the LED chip test position correcting means according to the second embodiment of the present invention;
11 is a control block diagram of the correction means of FIGS. 9 and 10;
12 is a control flow chart of the correction means of FIGS.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic plan view of the LED chip inspection apparatus having the LED chip inspection position correction means according to the first embodiment of the present invention. As shown in the figure, the LED chip inspection apparatus 101 according to the first embodiment is a supply unit 110 for supplying the LED chip (A) on the wafer to the next inspection process, and is supplied from the supply unit 110 Measurement unit 120 for measuring the characteristics of the LED chip (A), LED chip inspection position correction means 140 for correcting the inspection position of the LED chip (A) moved from the supply unit 110 to the measurement unit 120 It includes.

In addition, a chip transfer between the supply unit 110 and the measurement unit 120 to continuously transfer the LED chip (A) separately transmitted from the supply unit 110 to the inspection position (a ") of the measurement unit 120 to be described later The unit 130 is provided, and the picker unit 111 for picking up the LED chip A from the supply unit 110 and moving it to the chip transfer unit 130 is provided in the region between the supply unit 110 and the chip transfer unit 130. It is prepared.

Here, the chip transfer unit 130 is provided with chip block transfer members 131 having a plurality of female shapes disposed at equal intervals along the circumferential direction, and radial free ends of the respective chip block transfer members 131. The chip seating blocks 133 and the chip block transfer member 131 may be configured to rotate the transfer body driver 135 by an angle corresponding to the equal intervals.

Among these, the chip seating blocks 133 are rotated by the chip block carrier 131, and the rotational radius thereof is the chip supply position (a) of the supply unit 110 and the inspection position (a ") of the measurement unit 120 to be described later. At this time, the height of the radius of rotation of the chip mounting block 133 is located below the correction piece 167 of the LED chip inspection position correction means 140 to be described later, so that the chip mounting blocks 133 are the correction piece ( It moves to the inspection position (a ") of the measuring unit 120 through the lower region of the 167.

In addition, a chip seating area a ′ corresponding to the test position a ″ of the measuring unit 120 may be provided on the chip seating block 133. The chip picker unit 111 may be provided at the picker unit 111. The LED chips A seated on the chip mounting blocks 133, 133a, and 133b from the supply unit 110 must be accurately seated in the chip seating area a 'in the center and the circumferential surface thereof. Can be positioned exactly at position a ".

On the other hand, LED chip inspection position correction means 140 according to the present embodiment, as shown in Figures 2 to 7, the LED chip (A) moving from the supply unit 110 to the measurement unit 120 is a chip seating block When the seating state of the sensing unit 150 and the LED chip (A) detected by the sensing unit 150 and the seating state in the chip seating area (a ') of the (133) is out of the correct position The control unit 170 that controls the driving of the correction unit 160 by receiving the correction unit 160 for correcting the mounting position of the LED chip (A) and the mounting state of the LED chip (A) detected by the detection unit 150 Has)

The sensing unit 150 includes an LED chip A seated on the chip seating block 133 of the chip transfer unit 130 in the region between the supply unit 110 and the measuring unit 120. It detects whether it is seated in the correct position, and transmits the detected data to the controller 170. The sensing unit 150 may be provided as a vision camera for photographing the chip seating area (a '). The vision camera photographs the chip seating area (a') so that the LED chip (A) is the chip seating area (a '). Image data about whether it is deviated from the surface of the chip or the chip seating area (a ') is transferred to the controller 170. Of course, the detection unit 150 may use a variety of detection means, such as a position detection sensor in addition to the vision camera.

The correction unit 160 is provided in an area between the supply unit 110 and the measurement unit 120 and moves from the supply unit 110 to the inspection position a ″ of the measurement unit 120 according to a control signal transmitted from the control unit 170. The position of the LED chip (A) on the chip mounting block 133 is corrected.

The correction unit 160 includes a support block 161 for driving the components constituting the unit, a Z-axis lifting block 163 coupled up and down with respect to the support block 161, and Z-axis lifting. X-axis driving unit 175 for lifting and lowering the block 163, XY drive block 165 coupled to the Z-axis lifting block 163 so as to reciprocate sliding in the XY direction, and XY drive block 165 The X-axis driver 171 for driving in both directions of the axis, the Y-axis driver 173 for driving the XY drive block 165 in both directions of the Y-axis, and the XY drive block 165 are coupled to one side of the LED chip A. It has the correction piece 167 which corrects a position.

The support block 161 has a predetermined height and an inner space for accommodating the Z-axis driving unit 175 and is coupled with the Z-axis lifting block 163 so as to be able to slide relative to each other.

In addition, the Z-axis lifting block 163 is formed with an XY axis driving support portion 163a extending toward the rear. The X-axis driving unit 171 and the Y-axis driving unit 173 are supported by the XY-axis driving support unit 163a. In this case, the X-axis driving unit 171 and the Y-axis driving unit 173 are supported in the area to be described later. A cam receiving tool 163b is formed in which the cam 171b and the Y-axis driving cam 173b are accommodated. The Z-axis lifting block 163 moves up and down while supporting the X-axis driving unit 171, the Y-axis driving unit 173, and the XY driving block 165 when the Z-axis driving unit 175 moves up and down.

The Z-axis driver 175 is composed of a Z-axis driver 175a and a lifting shaft 175b for elevating the Z-axis lifting block 163 by driving the Z-axis driver 175a. It can be installed in. Here, the Z-axis driver 175a and the lifting shaft 175b may be provided as a screw cam shaft for raising and lowering the Z-axis lifting block 163 by rotating forward and backward according to the rotation of the forward and reverse motors and the forward and reverse motors, and the Z axis drivers 175a. ) May be provided as a hydraulic or pneumatic cylinder, and the lifting shaft 175b may be provided as a cylinder shaft which is lifted by driving of the Z-axis driver 175a.

The X-Y driving block 165 is coupled to the Z-axis lifting block 163 so as to reciprocally slide in the X-Y axis direction. To this end, the multi-stage sliding coupling structure 180 may be provided in the X-axis direction and the Y-axis direction, respectively, below the X-Y driving block 165 and the Z-axis lifting block 163. That is, the sliding coupling structure in the X-axis direction is provided between the XY driving block 165 and the Z-axis lifting block 163, and the XY driving block 165 and Z corresponding to the upper or lower portion of the X-axis sliding block structure. Y-axis sliding coupling structure may be provided in the area between the lifting block 163. In this case, a rolling roller or the like may be interposed in the sliding coupling structure in the X and Y axis directions so that the sliding movement is performed smoothly.

In addition, an XY axis driving guide part 177 extending in parallel with the XY axis driving support part 163a of the Z axis lifting block 163 is formed at the rear of the XY driving block 165. An X-axis guide profile groove 177a in contact with the X-axis cam roller 171c of the X-axis drive cam 171b to be described later is formed in the X-axis direction below the XY-axis drive guide portion 177. A Y-axis guide profile groove 177b in contact with the Y-axis cam roller 173c of the Y-axis drive cam 173b to be described later is formed in the Y-axis direction.

The X-axis driving unit 171 and the Y-axis driving unit 173 are forward / reverse motors 171a and 173a supported by the lower part of the XY-axis drive supporter 163a of the Z-axis lifting block 163, and respective forward / reverse motors 171a and 173a. It may be provided with an X-axis drive cam (171b) and Y-axis drive cam (173b) coupled to the rotary shaft of the. At this time, the X-axis drive cam (171b) and the Y-axis drive cam (173b) X-axis cam roller in contact with the X-axis guide profile groove (177a) and Y-axis guide profile groove (177b) of the above-described XY drive block (165b) 171c and the Y-axis cam roller 173c are eccentrically coupled with respect to the axis of the stationary motors 171a and 173a.

On the other hand, the correction piece 167 is coupled to extend forward in the upper region of the X-Y drive block 165. In the extended end region of the correcting piece 167, a chip correction tool 167a having a larger area than the circumferential area of the LED chip A is formed so as to penetrate the plate surface.

The correction piece 167 is located in the upper region of the chip seating block 133 that moves from the supply unit 110 toward the measurement unit 120, and then when the position correction signal of the LED chip A is transmitted from the control unit 170. The correction piece 167 descends toward the LED chip A by the lowering of the Z-axis lifting block 163 by the driving of the Z-axis driving unit 175.

At this time, the LED chip (A) is accommodated in the chip compensation sphere (167a) of the correction piece 167, in this state, the X-axis driver 171 and the Y-axis driver 173 is driven to drive the XY drive block 165. When the XY direction is moved, the circumferential end of the LED chip A comes into contact with the inner circumferential end of the chip compensator 167a so that the LED chip A is placed in the correct chip seating area a 'of the chip mounting block 133. It is in place.

When the seating position of the LED chip A is corrected to the correct position according to the detection signal of the sensing unit 150, the Z-axis driving unit 175 raises the Z-axis driving block to raise the chip correction tool of the correction piece 167. The acknowledgment state of the LED chip A is released from 167a.

Meanwhile, the controller 170 controls the Z-axis driver 175, the X-axis driver 171, and the Y-axis of the correction unit 160 according to the seat position presence signal of the LED chip A transmitted from the sensing unit 150. By controlling the driving of the eastern part 173, the seating position of the LED chip A on the chip seating block 133 from the supply unit 110 toward the inspection position a ″ of the measuring unit 120 is determined by the inspection position a ″. Maintain and correct it in the correct position.

That is, the control unit 170 is a signal transmitted from the detection unit 150 is a positional deviation signal of the LED chip (a detection signal of the LED chip is out of the chip seating area (a ') of the chip mounting block 133). In this case, the Z-axis driving unit 175, the X-axis driving unit 171, and the Y-axis driving unit 173 of the correction unit 160 are driven to provide the chip mounting block 133 in the chip correction hole 167a of the correction piece 167. The X-axis driving unit 171 and the Y-axis driving unit 173 are driven again while the LED chip A on the side is accommodated so that the inner circumferential end of the chip compensator 167a is connected to the outer circumferential end of the LED chip A. The LED chip A is positioned in the chip seating area a 'of the chip seating block 133 at the contact price.

If the signal transmitted from the sensing unit 150 is a signal of the right position of the LED chip A, the Z-axis driving unit 175 is driven so that the correction piece 167 is spaced apart from the upper side of the LED chip A.

The LED chip inspection position correcting process by the LED chip inspection position correcting means 140 of the LED chip inspection apparatus 101 according to the first embodiment having such a configuration will be described in detail with reference to FIGS. 2 and 4 to 8. see.

The LED chip A loaded on the supply unit 110 by the picking operation of the picker unit 111 is individually seated on the chip seating blocks 133, 133a, and 133b of the chip transfer unit 130 to measure the measurement unit 120. When moving toward, the sensing unit 150 moves the LED chip A to the chip mounting block 133 before the chip mounting blocks 133, 133a and 133b are moved to the inspection position a ″ of the measuring unit 120. In step S01, the control unit 170 detects the presence of a seating position (S01).

At this time, the determination of the seating position of the LED chip (A) is, as described above, whether the center and the circumference of the LED chip (A) is accurately seated in the chip seating area (a ') formed on the chip seating block 133 It may be to determine.

Then, the control unit 170, if the signal for the presence or absence of the right position mounting of the LED chip (A) detected by the detection unit 150, the chip seating block 133 of the measurement unit 120 as it is As shown in FIG. 4, the driving stop state of the X-axis driving unit 171, the Y-axis driving unit 173, and the Z-axis driving unit 175 is maintained so as not to drive the correction unit 160 so as to move to the inspection position a ″. (S02).

On the other hand, if the signal transmitted from the sensing unit 150 is a signal that the LED chip (A) is out of the chip seating area (a ') of the chip mounting block 133, the control unit 170 is transmitted from the sensing unit 150 The LED chip (A) is a chip mounting block (133) by driving the Z-axis driver 175, the X-axis driver 171 and the Y-axis driver 173 of the correction unit 160 until the signal is a correct seating signal. The correction unit 160 is driven to be located in the chip seating area a '(S03, S04).

At this time, the driving of the correction unit 160, first, as shown in Figure 5, by driving the Z-axis driving unit 175, the X-axis driving unit 171 and the Y-axis driving unit 173, the chip compensation sphere of the correction piece 167 ( The LED chip A is accommodated in 167a. Thereafter, the X-axis driving unit 171 and the Y-axis driving unit 173 are driven and corrected until the chip compensator 167a coincides with the chip seating area a 'of the chip seating block 133 as shown in FIG. When the piece 167 flows in the XY axis direction, the circumferential end of the LED chip A seated on the chip seating block 133 is in contact with the inner circumferential surface of the chip compensator 167a so that the LED chip A is moved. It is positioned in the chip seating area a '.

Then, the sensing unit 150 detects this and transmits a fixed position mounting signal to the control unit 170, and the control unit 170 is the Z-axis driving unit 175 and the X-axis driving unit 171 and Y of the correction unit 160. The soccer eastern part 173 is driven to return and the correction piece 167 is spaced apart from the LED chip A as shown in FIG. 4 (S05).

Then, the chip seating block 133 on which the position-corrected LED chip A is seated by driving the chip transfer unit 130 is moved to the inspection position a "of the measuring unit 120, and the inspection position ( The LED chip A moved to “a”) is accurately measured by the measuring unit 120 with the optical characteristics and the current characteristics.

9 and 10 are side views of the LED chip inspection apparatus having the LED chip inspection position correction means according to the second embodiment of the present invention. As shown in these figures, the LED chip inspection apparatus according to the second embodiment of the present invention is described above except for the configuration of the chip seating block 133 'and the correction means 140' of the chip transfer unit 130 '. It has almost the same configuration as that of the first embodiment.

Accordingly, hereinafter, the description of the same configuration as in the first embodiment will be omitted.

The chip transfer unit 130 ′ of the LED chip inspection apparatus according to the present embodiment includes the chip block transfer members 131 ′ having a plurality of female shapes arranged at equal intervals along the circumferential direction as in the first embodiment. And a conveying body driver (not shown) for rotating the chip block conveying member 131 'by an angle corresponding to the equal interval, and being capable of lifting up and down at a radial free end of each chip block conveying member 131'. The chip mounting block 133 ′ is further included.

The elevating structure of the chip seating block 133 ′ is preferably an elastic return lowering structure using an elastic member (not shown) such as a spring after an increase by an external force. To this end, the coupling structure between the free end of the chip block carrier 131 ′ and the chip seating block 133 ′ may be provided as a coupling structure capable of sliding and moving relative to each other.

These chip seating blocks 133 'also have a rotational radius thereof as the chip block carrier 131' rotates, and a chip supply position (a in FIG. 2) of the supply unit 110 (in FIG. It is formed so as to pass the inspection position (a 'of Fig. 2) of the 120'. At this time, the height of the rotation radius of the chip mounting block 133 'is the correction piece 167' of the LED chip inspection position correction means 140 ' ), The chip seating blocks 133 ′ move to the inspection position (a ′ in FIG. 2) of the measurement unit 120 ′ through the lower region of the correction piece 167 ′. In addition, on the chip seating block 133 ′, a chip seating area (see a ′ in FIG. 2) corresponding to the inspection position (a ′ in FIG. 2) of the measurement unit 120 ′ may be provided.

On the other hand, the LED chip inspection position correction means (140 '), as in the first embodiment described above, the LED chip A moving from the supply unit (110 in FIG. 2) to the measurement unit (120 in FIG. The sensing unit 150 'for detecting whether the chip is mounted in the chip seating area (a' of FIG. 2) at the position 133 'and the mounting state of the LED chip A detected by the sensing unit 150' is fixed. Correction unit 160 'that corrects the seating position of the LED chip A when the position is out of position, and receives the seating state of the LED chip A sensed by the sensing unit 150' and receives the correction unit 160 ' Has a control unit 170 'for controlling the driving of the " Since the sensing unit 150 'is the same as the first embodiment described above, its description will be omitted below.

The correction unit 160 'includes a support block 161' for supporting the components constituting the unit, an XY drive block 165 'coupled to the support block 161' in a reciprocating sliding direction in the XY direction, An X-axis driver 171 'for driving the XY drive block 165' in both X-axis directions, a Y-axis driver 173 'for driving the XY drive block 165' in both Y-axis directions, and an XY drive block ( 165 ') is coupled to one side of the correction piece 167' for correcting the position of the LED chip A, and the chip seating block 133 'of the chip transfer unit 130' in the lower region of the correction piece 167 '. It has a chip mounting block elevator 175 'for lifting up and down.

The support block 161 'has an XY axis drive support portion 163a' extending rearward in its upper region. The X-axis driving unit 171 'and the Y-axis driving unit 173' are supported by the XY-axis driving support unit 163a ', and at this time, an area supporting the X-axis driving unit 171' and the Y-axis driving unit 173 '. The cam receiving tool (not shown) is accommodated in the X-axis drive cam (171b ') and Y-axis drive cam (173b') to be described later.

The XY drive block 165 'is coupled to the support block 161' to reciprocally slide in the XY axis direction. To this end, the multi-stage sliding coupling structure 180 'may be provided in the X-axis direction and the Y-axis direction, as in the first embodiment, above the XY driving block 165' and the support block 161 '. A XY axis drive guide part 177 'extending in parallel with the XY axis drive support part 163a' of the support block 161 'is formed at the rear of the XY drive block 165'. An X-axis guide profile groove (not shown) in contact with the X-axis cam roller 171c 'of the X-axis drive cam 171b', which will be described later, is formed in the X-axis direction below the XY-axis drive guide portion 177 '. Further, a Y-axis guide profile groove (not shown) in rolling contact with the Y-axis cam roller 173c 'of the Y-axis drive cam 173b', which will be described later, is formed in the Y-axis direction.

The X-axis driving unit 171 'and the Y-axis driving unit 173' respectively include the stationary motors 171a 'and 173a' supported under the XY axis driving support unit 163a 'of the support block 161', and each stationary motor. X-axis driving cam (171b ') and Y-axis driving cam (173b') coupled to the rotation shaft of the (171a ', 173a') may be provided. At this time, the X-axis drive cam (171b ') and the Y-axis drive cam (173b') X-axis cam roller (171c ') in contact with the X-axis guide profile groove and the Y-axis guide profile groove of the XY drive block 165' described above. And Y-axis cam rollers 173c 'are eccentrically coupled to the axes of the stationary motors 171a' and 173a '.

On the other hand, the correction piece 167 ′ is coupled to the upper region of the XY drive block 165 ′ in the forward direction as in the first embodiment described above. In the extended end region of the correction piece 167 ', a chip correction tool 167a having a larger area than the circumferential area of the LED chip A is formed so as to penetrate the plate surface. The correction piece 167 'is located in the upper region of the chip seating block 133' moving from the supply part 110 (110 in Fig. 2) toward the measurement part (120 in Fig. 2).

The chip seat block elevator 175 'may be constituted by a lift driver 175a' and a lift shaft 175b 'that presses the chip seat block 133' in the upward direction by driving the lift driver 175a '. have. Here, the elevating driver 175a 'and the elevating shaft 175b' may be provided as a screw cam shaft for elevating the chip seat block 133 'by rotating forward and reverse according to the rotation of the stationary motor and the stationary motor. ') May be provided as a hydraulic or pneumatic cylinder, and the lifting shaft 175b' may be provided as a cylinder shaft which is lifted by driving of the lifting driver 175a '. The chip seat block elevator 175 'presses the chip seat block 133' upward by upward driving to raise the chip seat block 133 ', and the chip seat block 133' presses upwardly when the chip seat block 133 'is driven downward. By releasing it, the chip seating block 133 'is elastically returned and lowered.

On the other hand, the control unit 170 'is the chip mounting block lift 175' and the X-axis driving unit (1) of the compensation unit 160 'in accordance with the presence or absence of the seating position of the LED chip (A) transmitted from the sensing unit 150' ( 171 ') and the Y-axis driving unit 173', thereby controlling the chip mounting block 133 from the supply section (110 in FIG. 2) to the inspection position (a "in FIG. 2) of the measurement section (120 in FIG. 2). The mounting position of the LED chip A on ') is corrected to the correct position corresponding to the inspection position (a "in FIG. 2).

That is, the control unit 170 'is a signal transmitted from the sensing unit 150' is a positional deviation signal of the LED chip (the LED chip A is the chip seating area of the chip mounting block 133 '(Fig. 2). (A ') outside the a'), the chip mounting block elevator 175 ', the X-axis driver 171' and the Y-axis driver 173 'of the compensation unit 160' are driven to correct the correction piece 167. The chip compensation is performed by driving the X-axis driver 171 'and the Y-axis driver 173' again while the LED chip A on the chip mounting block 133 'is accommodated in the chip holder 167a of The inner circumferential end of the sphere 167a contacts the outer circumferential end of the LED chip A so that the LED chip A is positioned in the chip seating region (a 'in FIG. 2) of the chip seating block 133'.

If the signal transmitted from the sensing unit 150 'is an exact position signal of the LED chip A, the driving of the chip seat block elevator 175' is controlled to adjust the compensation piece 167 'to the upper portion of the LED chip A. Spaced apart.

The LED chip inspection position correction process by the LED chip inspection position correction means 140 ′ of the LED chip inspection apparatus according to the second embodiment having the above configuration will be described in detail with reference to FIGS. 2 and 9 to 12.

By the pick-up action of the picker unit 111, the LED chip A loaded on the supply unit 110 (FIG. 2) is individually seated on the chip seating block 133 ′ of the chip transfer unit 130 ′. 2 toward 120), the sensing unit 150 'moves to the chip seating block before the chip seating block 133' is moved to the inspection position (a "in FIG. 2) of the measuring section (120 in FIG. 2). In operation S01 ', the control unit 170' detects whether the LED chip A is seated in position S133 '.

At this time, the determination of the seating position of the LED chip (A) is, as described above, the center and the circumference of the LED chip (A) in the chip seating area (a 'of FIG. 2) formed on the chip seating block 133' It may be to determine whether it is seated correctly.

Then, the control unit 170 'is a signal for the presence or absence of the right position mounting of the LED chip (A) detected by the sensing unit 150', the chip seating block 133 'is measured as it is ( The driving stop state of the correction unit 160 'is maintained as shown in FIG. 9 so as to move to the inspection position (a "in FIG. 2) of 120 of FIG. 2 (S02').

On the other hand, when the signal transmitted from the sensing unit 150 'is the signal outside the chip seating area (a' in Fig. 2) of the LED chip (A) chip mounting block 133 ', the control unit 170' The chip mounting block elevator 175 ', the X-axis driver 171' and the Y-axis driver 173 'of the correction unit 160' are driven until the signal transmitted from the unit 150 'is a fixed seat signal. As shown in FIG. 10, the LED chip A drives the correction unit 160 ′ so as to be located within the chip seating region (a ′ in FIG. 2) of the chip seating block 133 ′ (S03 ′ and S 04 ′).

At this time, the driving of the correction unit 160 ′ first drives the chip seat block lift 175 ′, the X axis driver 171 ′, and the Y axis driver 173 ′ to drive the LED chip on the chip seat block 133 ′. (A) is accommodated in the chip correction tool 167a of the correction piece 167 '. Thereafter, the X-axis driving unit 171 'and the Y-axis driving unit 173' are driven until the chip compensator 167a coincides with the chip seating area (a 'in FIG. 2) of the chip seating block 133'. When the compensating piece 167 'flows in the XY axis direction, the circumferential end of the LED chip A seated on the chip mounting block 133' is in contact with the inner circumferential surface of the chip compensator 167a. A) is positioned in the chip seating area (a 'in FIG. 2).

Then, the sensing unit 150 ′ detects this and transmits a fixation position signal to the controller 170 ′, and the controller 170 ′ drives the chip seating block lift 175 ′ of the correction unit 160 ′ downward. As shown in FIG. 9, the chip seating block 133 ′ on which the LED chip A is seated is spaced below the correction piece 167 ′ (S05 ′).

Then, the chip seating block 133 ′ on which the LED chip A corrected by the driving of the chip transfer unit 130 ′ is seated is the inspection position of the measuring unit (120 in FIG. 2) (a ”in FIG. 2). ) And the LED chip A moved to the inspection position (a "in FIG. 2), the optical characteristics and the current characteristics are accurately measured in the measurement unit (120 of FIG. 2).

As described above, the LED chip inspection apparatus according to the present invention can accurately measure the characteristics of the LED chip by correcting the inspection position of the LED chip in the process of moving the LED chip from the supply unit to the measurement unit by the LED chip inspection position correction means. have.

110: supply unit 120: measuring unit
130: chip transfer unit 133: chip seating block
150: detection unit 160: correction unit
161: support block 163: Z-axis lifting block
165: XY drive block 167: correction
171: X axis driving unit 173: Y axis driving unit
175: Z axis drive section 177: XY axis drive guide section

Claims (9)

In the LED chip inspection apparatus having a supply unit for supplying an LED chip, and a measuring unit for measuring the characteristics of the LED chip transmitted from the supply unit at the inspection position,
A chip seating block on which the LED chip transferred from the supply unit is seated and moves to the test position with a chip seating area corresponding to the test position;
And an LED chip inspection position correcting means having a correcting piece for allowing the LED chip to flow and seated in the chip seating region when the seating state of the LED chip is not in the correct position. The method of claim 1,
LED chip inspection position correction means
A sensing unit for detecting whether the LED chip is seated on the chip seating area;
A correction unit having the correction piece for correcting the seating position of the LED chip when the seating state of the LED chip detected by the sensing unit is not the correct position;
And a controller for controlling driving of the correction unit according to whether the LED chip sensed by the sensing unit is seated or not. The method of claim 2,
The correction unit
A support block provided in an area adjacent to the chip seating block between the supply unit and the measurement unit;
Z-axis lifting block coupled to the lifting block with respect to the support block,
A Z-axis driving unit for elevating the Z-axis lifting block;
An XY driving block coupled to the Z-axis lifting block so as to be slidably reciprocated in the XY direction;
X-axis driving unit for driving the XY drive block in both X-axis direction,
A Y-axis driving unit for driving the XY drive block in both Y-axis directions;
The compensation piece is an LED chip inspection device, characterized in that having a chip compensation sphere that accommodates the LED chip is coupled to the XY drive block and flows in the XY axis. The method of claim 3,
The controller
If the seating state of the LED chip transmitted from the sensing unit is not in the correct position, the driving of the Z-axis driving unit, the X-axis driving unit and the Y-axis driving unit is controlled so that the LED chip is placed in the correct position in the state where the LED chip is accommodated in the chip compensating unit. Flowing the correction piece in the XY direction;
When the seating state of the LED chip transmitted from the sensing unit is in the correct position, the LED chip inspection apparatus, characterized in that for controlling the driving of the Z-axis driving unit at least so that the correction piece is spaced upwardly from the LED chip. The method of claim 2,
The chip seating block is coupled to be liftable and includes a chip block carrier moving from the supply part to the measuring part;
The correction unit
A support block provided in an area adjacent to the chip seating block between the supply unit and the measurement unit;
An XY drive block coupled to the support block so as to slidably move in the XY direction;
X-axis driving unit for driving the XY drive block in both X-axis direction,
A Y-axis driving unit for driving the XY drive block in both Y-axis directions;
The correction piece is coupled to the XY drive block having a chip correction sphere that can accommodate the LED chip,
The chip seat is provided in the lower region of the correction piece to raise and lower the chip seat block so that the LED chip seated on the chip seat block spaced apart from the downwardly spaced with respect to the correction piece and the position accommodated in the chip correction sphere LED chip inspection device comprising a block lift. The method of claim 5,
The controller
If the seating state of the LED chip transmitted from the sensing unit is not in the correct position, the driving of the chip mounting block lifter and the X-axis driving unit and the Y-axis driving unit is controlled to allow the LED chip to be seated in the correct position while being accommodated in the chip compensator of the compensation piece. The correction piece is flowed in the XY direction until it is held;
LED chip inspection device characterized in that for controlling the driving of at least the chip seat block lift so that the LED chip is spaced downward from the correction piece when the seating state of the LED chip transmitted from the sensing unit is in the correct position. The method according to any one of claims 3 to 6,
An XY drive block is formed with an X axis guide profile groove formed in the X axis direction and a Y axis guide profile groove formed in the Y axis direction;
The X-axis driving unit and the Y-axis driving unit are eccentrically coupled to the stationary motor, the X-axis driving cam and the Y-axis driving cam coupled to the rotating shafts of the respective stationary motors, and the X-axis driving cam and the Y-axis driving cam, respectively. And an LED chip inspection device having an X-axis cam roller and a Y-axis cam roller in contact with the Y-axis guide profile groove. In the LED chip inspection method for inspecting the characteristics of the LED chip is transferred from the supply to the chip seating area of the chip seating block at an inspection position corresponding to the chip seating area of the measuring unit,
Detecting whether the LED chip is seated on the chip seating area;
LED chip inspection method comprising the step of correcting the position of the LED chip in the chip seating area by moving the LED chip in the XY direction if the seated state of the LED chip detected in the step of detecting the seating position is not in the right position . delete

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