KR102627492B1 - Apparatus for cooling electronic components - Google Patents

Abstract

The present invention relates to a cooling device for electronic components, and the cooling device for electronic components according to one aspect of the present invention includes a plurality of cooling fins arranged at regular intervals from each other, and a first cooling device disposed on the first side among the plurality of cooling fins. An inlet formed on one side of the tip of the fin and through which the refrigerant flows through the space between the cooling fins, and an inlet formed on the other side of the rear end of the second cooling fin disposed on the other side among the plurality of cooling fins and passing through the space between the cooling fins. It is provided between the outlet through which the refrigerant flows, the inlet, and the front end of the plurality of cooling fins, and has a distribution path in which the width of the distribution space becomes smaller as the distance from the inlet increases, and is provided between the rear end of the plurality of cooling fins and the outlet. It is composed of a recovery path in which the width of the recovery space increases as the distance from the outlet increases.

Description

Cooling device for electronic components {APPARATUS FOR COOLING ELECTRONIC COMPONENTS}

The present invention relates to a cooling device for electronic components, and more specifically, to a cooling device for electronic components for removing heat generated from electronic components.

With technological advancements in the microelectronics industry, heat flux generation in electronic components designed for miniaturization and power density has continued to increase.

Commercial cooling methods such as air cooling cannot accommodate heat dissipation of more than 60 W/cm2, so water-cooled heat sinks using microchannels (fins with a hydraulic diameter of 10 μm to 200 μm) have been widely used recently.

However, there are limits to applying the microchannel heat sink to a small heat dissipation system due to the high pressure head requirement, and there is a problem that the volume of the heat dissipation system increases as the microchannel heat sink is applied.

Minichannel (fins with hydraulic diameters from 200 μm to 3 mm) heat sinks have a much lower pressure drop, i.e. lower pressure head requirements, compared to microchannels, making them an effective replacement for microchannels in compact heat dissipation systems. However, to achieve higher heat transfer coefficients, geometric optimization of the minichannel heat sink is required, such as optimizing fin shape, fin parameters, and header design.

Optimizing fin parameters, such as reducing fin spacing, i.e. reducing hydraulic diameter, can significantly improve the heat transfer area at the expense of significantly increasing pressure drop. Therefore, it is necessary to appropriately select fin spacing, thickness, and height parameters to suit design requirements to balance pressure drop and thermal performance.

Flow unevenness is defined as uneven distribution of coolant across the heat sink channels. Previous studies have suggested that the inlet/outlet configuration of a mini-channel heat sink can have a significant impact on flow distribution, and that the basic temperature of the heat sink base can be non-uniform due to flow rate non-uniformity.

Therefore, the development of an optimized heat sink is necessary to improve flow distribution throughout the minichannel and improve thermal and hydraulic performance.

Republic of Korea Patent Application No. 10-2004-0061278 Republic of Korea Patent Application No. 10-2015-0047080

The purpose of the present invention is to solve the above problems, and to provide a cooling device for electronic components that is composed of a distribution passage and a recovery passage with a width designed to allow a uniform flow rate to flow through the cooling fins, thereby reducing pressure drop and making it lightweight and compact. It is provided.

The object of the present invention is not limited to the object mentioned above, and other objects not mentioned can be clearly understood from the description below.

In order to achieve the above-described object, a cooling device for electronic components according to one aspect of the present invention includes a plurality of cooling fins arranged at regular intervals from each other, and a tip of a first cooling fin disposed on the furthest side among the plurality of cooling fins. An inlet is formed so that the refrigerant flows through the space between the cooling fins, and an outlet is formed on the other side of the rear end of the second cooling fin disposed on the most extreme side among the plurality of cooling fins and through which the refrigerant that passes through the space between the cooling fins flows out. , a distribution path provided between the inlet and the front end of the plurality of cooling fins and having a shape in which the width of the distribution space becomes smaller as the distance from the inlet increases, and a distribution path provided between the rear end of the plurality of cooling fins and the outlet and the distance from the outlet. It consists of a recovery path in which the width of the recovery space increases as it gets closer.

According to the present invention, there is an effect of providing a cooling device for electronic components that is composed of a distribution passage and a recovery passage designed to allow a uniform flow rate to flow through the cooling fins, thereby reducing pressure drop and being manufactured in a lightweight and small size.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Figure 1 is an exploded perspective view showing a cooling device for electronic components according to an embodiment of the present invention.
Figure 2 is a perspective view showing a fin plate of a cooling device for electronic components according to an embodiment of the present invention.
Figure 3 is an exemplary diagram illustrating a distribution path and a recovery path of a cooling device for electronic components according to an embodiment of the present invention.
Figure 4 is a graph showing pressure drop and header area according to shape parameter values.
Figure 5 is a graph showing a distribution path and a recovery path designed according to an embodiment of the present invention.
Figure 6 is a graph showing the change in thermal resistance according to the change in coolant volume flow rate of the cooling device for electronic components according to an embodiment of the present invention under normal and extreme load conditions of SiC heat load.
Figure 7 is a graph showing the pressure drop according to the change in the volumetric flow rate of the refrigerant of the cooling device for electronic components according to an embodiment of the present invention under normal and extreme load conditions of SiC heat load.
Figure 8 is a graph showing the maximum base temperature according to the change in the volumetric flow rate of the refrigerant of the cooling device for electronic components according to an embodiment of the present invention under normal and extreme load conditions of SiC heat load.
Figure 9 is a graph showing the average base temperature according to the change in the volumetric flow rate of the refrigerant of the cooling device for electronic components according to an embodiment of the present invention under normal and extreme load conditions of SiC heat load.
Figure 10 is a graph showing the difference in refrigerant temperature between the inlet and outlet according to the change in the volumetric flow rate of the refrigerant of the cooling device for electronic components according to an embodiment of the present invention under normal and extreme load conditions of SiC heat load.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms, but the present embodiments only serve to ensure that the disclosure of the present invention is complete, and those skilled in the art It is provided to fully inform the person of the scope of the invention, and the present invention is defined only by the claims. Meanwhile, the terms used in this specification are for describing embodiments and are not intended to limit the present invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context.

Referring to FIG. 1, the cooling device 10 for electronic components according to an embodiment of the present invention is for cooling electronic components 20 that are mounted on a printed circuit board and generate heat during operation, such as a SiC module. , It may be composed of a pin plate 110, a cover plate 130, and a gasket 120.

Referring to FIG. 2, cooling fins 111, an inlet 112, an outlet 113, a distribution passage 114, and a recovery passage 115 may be formed on one surface of the fin plate 110.

The electronic component 20 may be installed in close contact with the other surface of the pin plate 110.

The fin plate 110 may be made of aluminum, etc., which has excellent thermal conductivity.

A plurality of cooling fins 111 may be formed on one surface of the fin plate 110, arranged at regular intervals from each other.

The thickness, spacing, height, and length of the cooling fins 111 may be determined depending on the heat or refrigerant generated from the electronic component 20.

내지 3mm일 수 있다.The cooling fin 111 has a hydraulic diameter of 200 according to the spacing of the cooling fin 111 to satisfy the mini channel type.

It may be from 3 mm.

The inlet 112 is formed on one side of the front end of the fin plate 110 through which refrigerant can flow.

The inlet 112 is formed on one side of the tip of the first cooling fin 111a, which is disposed on the furthest side among the plurality of cooling fins 111, to allow refrigerant to pass between the cooling fins 111.

The outlet 113 is formed on the other side of the rear end of one side of the fin plate 110, so that the refrigerant that has passed between the cooling fins 111 can flow out.

The outlet 113 may be formed on the other side of the rear end of the second cooling fin 111c, which is disposed on the other side among the plurality of cooling fins 111.

The distribution passage 114 is formed between the inlet 112 and the tip of the cooling fin 111, and may have a width that becomes smaller as the distance from the inlet 112 increases.

The recovery path 115 is formed between the rear end of the cooling fin 111 and the outlet 113, and may have a width that increases as the distance from the outlet 113 becomes shorter.

On one side of the fin plate 110, a plurality of heat sinks including a plurality of cooling fins 111, an inlet 112, an outlet 113, a distribution passage 114, and a recovery passage 115 may be installed in parallel and successively. there is.

When heat sinks are arranged in parallel, space can be saved by arranging the distribution path 114 of one heat sink and the recovery path 115 of the other adjacent heat sink adjacent to each other.

The inlet 112 of each heat sink communicates with the main inlet 116 formed on the other side of the tip of one side of the fin plate 110 via the inflow distribution path 117, and the outlet 113 of each heat sink is connected to the fin plate ( It can communicate with the main outlet 118 formed on the other side of the rear end of one side of 110 through the outflow distribution path 119.

The cover plate 130 is installed on one side of the fin plate 110 so that the cooling fins 111, the space through which the refrigerant passes between the cooling fins 111, the distribution path 114, and the recovery path 115 are not exposed to the outside. It can be concealed.

The gasket 120 is installed between the fin plate 110 and the cover plate 130 to prevent leakage of refrigerant.

Referring to FIG. 3, the distribution passage 114 has a shape in which the width becomes smaller in a step shape corresponding to the boundary according to the arrangement of the cooling fins 111, and the recovery passage 115 has a shape corresponding to the boundary according to the arrangement of the cooling fins. Correspondingly, the width may be increased in the form of steps.

Here, the boundary according to the arrangement of the cooling fins 111 may correspond to an extension line extending in a straight line along the longitudinal direction of one side or the other side of each cooling fin.

That is, the distribution path 114 may have the same length extending from an extension line on one side of the cooling fin 111 to an extension line on one side of another cooling fin 111 adjacent to it.

Additionally, the distribution path 114 may have a width that gradually decreases along the direction from the cooling fin located on the furthest side to the cooling fin located on the othermost side.

In addition, the recovery passage 115 may have the same length extending from the extension line on the other side of the cooling fin 111 to the extension line on the other side of the other cooling fin 111 adjacent to it.

The recovery path 115 may have a shape in which the width gradually increases along the direction from the cooling fin located on the most extreme side to the cooling fin located on the othermost side.

The distribution passage 114 may be composed of a plurality of unit distribution passages 114a each provided at the tip of the cooling fin 111.

The unit distribution path 114a corresponding to the cooling fin 111a located on the extreme side may have a preset initial width.

The unit distribution path 114a corresponding to each cooling fin 111b except for the cooling fin 111a located on the extreme side may have a width that gradually decreases from the initial width as it moves away from the cooling fin located on the extrememost side. .

Here, the unit distribution path corresponding to each cooling fin refers to a unit distribution path provided at the tip of each cooling fin.

)를 가지는 것일 수 있다.Unit distribution corresponding to the kth cooling fin (111b) after the first cooling fin (111a) along the direction from the first cooling fin (111a) located on the farthest side to the second cooling fin (111c) located on the othermost side. is calculated by dividing the value obtained by subtracting the preset initial value (e.g. 1) from k by the value obtained by subtracting the preset initial value (e.g. 1) from the total number of cooling fins (N) according to the preset shape parameter value. Width based on the value multiplied by the initial width by subtracting the value from the preset initial value (e.g. 1) by multiplying the exponent

) may have.

)를 가지는 것일 수 있다.Unit distribution corresponding to the kth cooling fin (111b) after the first cooling fin (111a) along the direction from the first cooling fin (111a) located on the farthest side to the second cooling fin (111c) located on the othermost side. That is, the unit distribution corresponding to the cooling fin (111b) located at the k+1th position on the extreme side is the width calculated by the equation below (

) may have.

은 제1 냉각핀 이후의 k번째 냉각핀에 대응되는 단위분배로의 너비이고, N은 각 유입구와 유출구 사이에 형성된 냉각핀의 수이며,

은 제1 냉각핀에 대응되는 단위분배로의 너비이고,

은 제2 냉각핀에 대응되는 단위분배로의 너비이며, n는 형상 매개변수값을 의미하는 것일 수 있다.here,

is the width of the unit distribution channel corresponding to the kth cooling fin after the first cooling fin, N is the number of cooling fins formed between each inlet and outlet,

is the width of the unit distribution channel corresponding to the first cooling fin,

is the width of the unit distribution channel corresponding to the second cooling fin, and n may mean a shape parameter value.

)는 기설정된 초기너비(예를 들어 10mm)로 고정되는 것일 수 있다.Width of the unit distribution channel corresponding to the first cooling fin (111a) (

) may be fixed to a preset initial width (for example, 10 mm).

)는 기설정된 기본값(예를 들어 0.1mm)으로 초기화되는 것일 수 있다.Width of the unit distribution channel corresponding to the second cooling fin (111c) (

) may be initialized to a preset default value (for example, 0.1 mm).

)는 기설정된 기본값으로 초기화된 이후 사용자의 입력에 따라 다른 값으로 업데이트 되는 것일 수 있다.Width of the unit distribution channel corresponding to the second cooling fin (111c) (

) may be initialized to a preset default value and then updated to a different value depending on the user's input.

If the shape parameter value n = 1, the cooling fins may be formed linearly, if n < 1, the cooling fins may be formed in a concave shape, and if n > 1, the cooling fins may be formed in a convex shape.

Referring to FIG. 4, it can be seen that when n is reduced to less than 1.0, the pressure drop in headers increases and the area of headers decreases. Additionally, if n is set to a value greater than 1.0, it can be seen that the pressure drop decreases but the size of the header increases.

Since an increase in the size of the header leads to an increase in the size of the heat sink, in the present invention, the shape parameter value n is set to 1 to minimize the pressure drop and make the heat sink lighter and more compact.

By applying n = 1 to Equation 1 above, the width of the unit distribution path corresponding to each cooling fin is gradually reduced in the direction from the first cooling fin located on the most extreme side to the second cooling fin located on the othermost side. It can be designed.

The recovery passage 115 may be composed of a plurality of unit recovery passages 115a each provided at the rear end of the cooling fin 111.

The unit recovery passage 115a corresponding to each cooling fin 111 is obtained by substituting the width of the unit distribution passage 114a corresponding to each cooling fin 111 into an equation based on the assumption that the pressure drops of adjacent cooling fins are the same. It may have a width calculated according to the width.

The unit recovery passage 115a corresponding to each cooling fin 111 has a hydraulic pressure obtained by dividing the value obtained by multiplying the preset fin height and the width of each unit recovery passage by the sum of the fin height and the width of each unit recovery passage. Distribution according to the width of the unit distribution channel provided at the tip of the cooling fin whose diameter corresponds to each unit recovery channel. The hydraulic pressure drop value and the preset number of times correspond to the value obtained by dividing the cross-sectional area by the preset Poissine flow number and taking the square root. It may have a width that is

That is, the unit recovery passage 115a corresponds to the value calculated by substituting the width of the unit distribution passage 114a formed at the tip of each cooling fin 111 into an equation based on the assumption that the hydraulic pressure drops of adjacent cooling fins are the same. By being formed with a width that is 111, the refrigerant flows at a uniform flow rate through the plurality of cooling fins 111.

Accordingly, the flow distribution of the refrigerant can be improved and thermal and hydraulic performance can be improved.

Hereinafter, in embodiments of the present invention, it will be described in more detail how the width is calculated at a unit number of times to ensure that the pressure drops of adjacent cooling fins are the same.

The fluid flow rate passing between cooling fins arranged in parallel is similar to the current passing through a resistor connected in parallel, and the flow resistance due to pressure drop and friction force in the cooling fins is similar to the potential drop and electrical resistance in an electric circuit.

Using Ohm's law, the pressure drop can be expressed as follows.

는 압력 강하,

은 마찰력에 의한 흐름저항(resistance to flow),

는 유체 유량을 의미한다.here

is the pressure drop,

Resistance to flow due to friction,

means the fluid flow rate.

Additionally, the following equation can be obtained by assuming that the pressure drops of adjacent cooling fins (kth cooling fin and k+1th cooling fin) are the same.

는 k+1번째 냉각핀에 대응되는 단위분배로의 압력 강하를 의미하고,

는 k+1번째 냉각핀의 압력 강하를 의미하며,

은 k번째 냉각핀에 대응되는 단위회수로의 압력 강하를 의미하고,

는 k번째 냉각핀의 압력 강하를 의미한다.here

means the pressure drop in the unit distribution corresponding to the k+1th cooling fin,

means the pressure drop of the k+1th cooling fin,

means the pressure drop in the unit recovery path corresponding to the kth cooling fin,

means the pressure drop of the kth cooling fin.

)는 완전발달유동 조건(fully developed flow condition)의 가정 하에 아래의 수학식으로 나타낼 수 있다.Pressure drop in the unit distribution corresponding to the k+1th cooling fin (

) can be expressed by the equation below under the assumption of a fully developed flow condition.

는 마찰계수이며,

는 레이놀즈 수이고,

은 k+1번째 단위분배로의 포아죄유수이며,

는 동적점성도이고,

는 k+1번째 냉각핀에 대응되는 단위분배로의 유압 직경(hydraulic diameter)이며,

는 유체의 평균 속도이고,

는 단위분배로의 길이이다.here

is the friction coefficient,

is the Reynolds number,

is the Pois sin coefficient for the k+1th unit distribution,

is the dynamic viscosity,

is the hydraulic diameter of the unit distribution corresponding to the k+1th cooling fin,

is the average velocity of the fluid,

is the length of the unit distribution.

는 아래의 수학식을 이용해 산출될 수 있다.Pois sin coefficient for k+1th unit distribution

can be calculated using the equation below.

은 냉각핀의 높이와 너비의 비에 따른 종횡비로, k+1번째 단위분배로에 대응하여 항상 1보다 작은 것일 수 있다.here,

is the aspect ratio according to the ratio of the height and width of the cooling fin, and may always be smaller than 1 corresponding to the k+1th unit distribution path.

)는 k+1번째 냉각핀의 일측에서 k+2번째 냉각핀의 일측까지의 거리로 냉각핀의 두께와 냉각핀의 간격을 합함에 따른 값을 가질 수 있다. Length of unit distribution (

) is the distance from one side of the k+1th cooling fin to one side of the k+2th cooling fin, and can have a value that is the sum of the thickness of the cooling fin and the spacing between the cooling fins.

)은 아래의 수학식으로 나타낼 수 있다.Hydraulic diameter of the unit distribution corresponding to the k+1th cooling fin (

) can be expressed by the equation below.

는 k+1번째 냉각핀에 대응되는 단위분배로의 너비이고,

는 냉각핀의 높이이다.here,

is the width of the unit distribution channel corresponding to the k+1th cooling fin,

is the height of the cooling fin.

)는 완전발달유동 조건의 가정하에 아래의 수학식으로 나타낼 수 있다.Pressure drop in the unit recovery path corresponding to the kth cooling fin (

) can be expressed in the equation below under the assumption of fully developed flow conditions.

는 마찰계수이고,

는 레이놀즈 수이며,

는 동적점성도이고,

는 k번째 냉각핀에 대응되는 단위회수로의 유압 직경이며,

는 유체의 평균 속도이고,

는 단위회수로의 길이이다.here

is the friction coefficient,

is the Reynolds number,

is the dynamic viscosity,

is the hydraulic diameter of the unit recovery channel corresponding to the kth cooling fin,

is the average velocity of the fluid,

is the length of the unit recovery path.

)는 k번째 냉각핀의 타측에서 k+1번째 냉각핀의 타측까지의 거리를 의미하는 것으로 냉각핀의 두께와 냉각핀의 간격을 합함에 따른 값을 가질 수 있다.Length of unit recovery path (

) means the distance from the other side of the kth cooling fin to the other side of the k+1th cooling fin, and can have a value that is the sum of the thickness of the cooling fin and the spacing between the cooling fins.

)와 단위분배로의 길이(

)는 냉각핀의 두께와 냉각핀의 간격을 합함에 따른 값으로, 동일한 값을 가지는 것일 수 있다.That is, the length of the unit recovery path (

) and the length of the unit distribution (

) is a value obtained by adding the thickness of the cooling fin and the spacing between the cooling fins, and may have the same value.

)은 아래의 수학식으로 나타낼 수 있다.Hydraulic diameter of the unit recovery path corresponding to the kth cooling fin (

) can be expressed by the equation below.

는 k번째 냉각핀에 대응되는 단위회수로의 너비이고,

는 냉각핀의 높이이다.here,

is the width of the unit recovery path corresponding to the kth cooling fin,

is the height of the cooling fin.

)는 아래의 수학식에 의해 산출될 수 있다.Pressure drop of the kth cooling fin (

) can be calculated by the equation below.

는 마찰계수이고,

는 레이놀즈 수이며,

는 동적점성도이고,

는 k번째 냉각핀의 유압 직경이며,

는 유체의 평균 속도이고,

는 냉각핀의 길이이고,

는 하겐바흐 인수이고,

는 밀도이다.here,

is the friction coefficient,

is the Reynolds number,

is the dynamic viscosity,

is the hydraulic diameter of the kth cooling fin,

is the average velocity of the fluid,

is the length of the cooling fin,

is the Hagenbach factor,

is the density.

가 되어 수학식3에서

와

를 제거할 수 있다.The parameters of the cooling fins are preset by the user, and the hydraulic diameter and length of the cooling fins are the same.

In Equation 3,

and

can be removed.

와

를 제거하며,

항에 수학식 4를

에 수학식 7을 대입하고, 양변에서 동일한 값을 가지는 상수(

,

,

)를 제거하며, 양변의 유속(

,

)을 각각 수직 단면적에 대한 유량의 비(

,

)로 치환함에 따라 아래와 같은 식을 얻을 수 있다.In equation 3:

and

removes,

Add equation 4 to the term

Substitute Equation 7 into and enter a constant with the same value on both sides (

,

,

) is removed, and the flow velocity on both sides (

,

) is the ratio of flow rate to vertical cross-sectional area (

,

), the following equation can be obtained.

은 k+1번째 냉각핀에 대응되는 단위분배로의 수직 단면적이고,

는 k+1번째 냉각핀에 대응되는 단위분배로의 유량이며,

는 k번째 냉각핀에 대응되는 단위회수로의 수직 단면적이고,

는 k번째 냉각핀에 대응되는 단위회수로의 유량이다.here,

is the vertical cross-sectional area of the unit distribution corresponding to the k+1th cooling fin,

is the flow rate to the unit distribution corresponding to the k+1th cooling fin,

is the vertical cross-sectional area of the unit recovery channel corresponding to the k-th cooling fin,

is the flow rate of the unit recovery path corresponding to the kth cooling fin.

가 N개의 냉각핀을 포함하는 히트싱크로 들어가는 총 유량인 경우, 각 냉각핀의 사이에 형성된 유로에 균일한 유량이 통과한다는 조건을 적용하여 아래와 같이 추론할 수 있다.

If is the total flow rate entering the heat sink including N cooling fins, it can be deduced as follows by applying the condition that a uniform flow rate passes through the flow path formed between each cooling fin.

Flow rate of each flow path formed between cooling fins =

Flow rate in unit recovery path corresponding to kth cooling fin

Flow rate to unit distribution corresponding to k+1th cooling fin

)과 단위분배로의 유량(

)을 수학식9에 적용하면 아래와 같이 정리할 수 있다.Inferred, flow rate to unit recovery (

) and the flow rate to the unit distribution (

) can be summarized as follows by applying Equation 9.

)은 수학식 1에서 산출되는 k+1번째 단위분배로의 너비(

)를 수학식 5에 적용함에 따라 산출될 수 있다.Hydraulic diameter of the k+1th unit distribution (

) is the width of the k+1th unit distribution calculated in Equation 1 (

) can be calculated by applying Equation 5.

,

,

,

는 핀 매개변수에 따라 정해지는 상수이므로, k번째 단위회수로의 유압직경(

)은 상기 수학식 11에 k+1번째 단위분배로의 유압직경(

)을 대입함에 따라 산출될 수 있다.In Equation 11, k is a variable,

,

,

,

is a constant determined according to the pin parameters, so the hydraulic diameter of the kth unit number of times (

) is the hydraulic diameter of the k+1th unit distribution in Equation 11 (

) can be calculated by substituting.

)는 수학식 8에 k번째 단위회수로의 유압직경(

)과 기설정된 냉각핀의 높이(

)를 대입함에 따라 산출될 수 있다.Width of the kth unit recovery path (

) is the hydraulic diameter of the kth unit recovery channel in Equation 8 (

) and the height of the preset cooling fins (

) can be calculated by substituting.

The width of the unit recovery path has a value calculated from an equation assuming that the hydraulic pressure drops of adjacent cooling fins are the same, thereby allowing a uniform flow rate of refrigerant to flow through the plurality of cooling fins.

That is, according to the above-described configuration, thermal and hydraulic performance can be improved by improving the flow distribution of the refrigerant flowing through the plurality of cooling plates.

Referring to FIG. 5, the distribution path designed according to an embodiment of the present invention may decrease in width in a stepwise manner corresponding to the boundary of the cooling fins, and the width of the recovery path may increase in a stepwise manner in response to the boundary of the cooling fins.

Hereinafter, an experiment was performed to confirm the performance of the cooling device for electronic components according to an embodiment of the present invention.

Since heat sinks each composed of a plurality of cooling fins and arranged in parallel have the same operating characteristics, experiments were performed on one heat sink for a single SiC heat load.

), 압력 강하(Pressure Drop,

), 최대 기저 온도(Max. Base Temperature), 평균 기저 온도(Avg. Base Temperature), 유입구와 유출구의 온도 차이(

)를 확인하였다.The thermal resistance (

), Pressure Drop,

), Max. Base Temperature, average base temperature (Avg. Base Temperature), temperature difference between inlet and outlet (

) was confirmed.

Referring to Figure 6, it can be seen that the thermal resistance decreased from 0.0117 [K/W] to 0.0108 [k/W] as the volumetric flow rate of the refrigerant increased from 1.5 LPM to 3.0 LPM in each of the normal and extreme load conditions of SiC heat load. I was able to.

In addition, referring to FIG. 7, under normal and extreme load conditions of SiC heat load, the pressure drop is the smallest at 0.017 bar when the volume flow rate of the refrigerant is 1.5 LPM, and increases to 0.053 bar when the volume flow rate of the refrigerant changes to 3.0 LPM. I was able to confirm.

In other words, it was confirmed that a significantly lower pressure drop occurred compared to existing commercial heat sinks (pressure drop of 0.3 bar at 1.5 LPM) under both normal and extreme load conditions.

Referring to Figure 8, the maximum basal temperature is 74.76°C when the volumetric flow rate of the refrigerant is 1.5 LPM at 1300W and 65.25°C when the volumetric flow rate of the refrigerant is 3.0LPM, and at 900W, it is 63.45°C when the volumetric flow rate of the refrigerant is 1.5LPM and 57.35°C when the volumetric flow rate of the refrigerant is 1.5LPM. It was confirmed that it was ℃.

Additionally, referring to Figure 9, the average base temperature is 61.85°C when the volumetric flow rate of the refrigerant is 1.5 LPM at 1300W, 57.05°C when the volumetric flow rate of the refrigerant is 3.0 LPM, and 55.05°C when the volumetric flow rate of the refrigerant is 1.5 LPM at 900W, 3.0 It was confirmed that the temperature was 51.75℃ in LPM.

In other words, it was confirmed that both the maximum base temperature and the average base temperature were lower than 90°C, which is the threshold for SiC module performance.

Referring to Figure 10, the refrigerant temperature difference is 12.16°C when the volumetric flow rate of the refrigerant is 1.5LPM at 1300W, 5.77°C when the volumetric flow rate of the refrigerant is 3.0LPM, and 8.29°C when the volumetric flow rate of the refrigerant is 1.5LPM at 900W, 3.0LPM It was confirmed that the temperature was 3.95℃.

That is, according to the present invention, a low base temperature can be efficiently maintained while minimizing the increase in refrigerant temperature from the inlet to the outlet even with a small amount of refrigerant.

According to the present invention, taking into account the pressure drop and area of the cooling fins, the distribution passages for distributing the refrigerant to the cooling fins gradually decrease in width corresponding to each cooling fin, and each recovery passage for recovering the refrigerant that has passed through the cooling fins is provided. By designing the width to gradually increase in response to the cooling fins, it is possible to provide a cooling device for electronic components that reduces pressure drop and is ultra-small and lightweight.

Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the scope of the claims described below rather than the detailed description above, and all changes or modified forms derived from the scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

10: Cooling device for electronic components
110: pin plate
111: Cooling fin
112: inlet
113: outlet
114: distribution road
115: recovery path
116: Fuel inlet
117: Inflow distribution path
118: Fuel outlet
119: Outflow distribution channel

Claims (5)

A plurality of cooling fins arranged at regular intervals from each other;
an inlet formed on one side of the tip of a first cooling fin disposed at the farthest side among the plurality of cooling fins, through which the refrigerant flows through to allow the refrigerant to pass between the cooling fins;
an outlet formed on the other side of the rear end of a second cooling fin disposed on the other side among the plurality of cooling fins and through which refrigerant passing between the cooling fins flows out;
a distribution path provided between the inlet and the tip of the plurality of cooling fins and having a width of the distribution space that becomes smaller as the distance from the inlet increases; and
A recovery passage is provided between the rear end of the plurality of cooling fins and the outlet and has a shape in which the width of the recovery space increases as the distance from the outlet becomes closer,
With the above distribution,
It consists of a plurality of unit distribution channels each provided at the tip of the cooling fin,
The unit distribution channel corresponding to the first cooling fin has a preset initial width,
The unit distribution corresponding to each cooling fin except the first cooling fin has a width that gradually decreases from the initial width as the corresponding cooling fin moves away from the first cooling fin,
With the above number of times
It consists of a plurality of unit recovery channels each provided at a rear end of the cooling fin,
The unit frequency corresponding to each cooling fin is
The hydraulic diameter obtained by multiplying the preset cooling fin height and the width of each unit recovery passage and dividing it by the sum of the cooling fin height and the width of each unit recovery passage is the tip of the cooling fin corresponding to each unit recovery passage. Distribution according to the width of the unit distribution channel provided in the unit distribution channel has a width corresponding to the value obtained by dividing the cross-sectional area by the hydraulic pressure drop value and the preset number of times and taking the square root.
Cooling device for electronic components. delete delete delete A plurality of cooling fins arranged at regular intervals from each other;
an inlet formed on one side of the tip of a first cooling fin disposed at the farthest side among the plurality of cooling fins, through which the refrigerant flows through to allow the refrigerant to pass between the cooling fins;
an outlet formed on the other side of the rear end of a second cooling fin disposed on the other side among the plurality of cooling fins and through which refrigerant passing between the cooling fins flows out;
a distribution path provided between the inlet and the tip of the plurality of cooling fins and having a width of the distribution space that becomes smaller as the distance from the inlet increases; and
A recovery passage is provided between the rear end of the plurality of cooling fins and the outlet and has a shape in which the width of the recovery space increases as the distance from the outlet becomes closer,
With the above distribution,
It consists of a plurality of unit distribution channels each provided at the tip of the cooling fin,
The unit distribution channel corresponding to the first cooling fin has a preset initial width,
The unit distribution corresponding to each cooling fin except the first cooling fin has a width that gradually decreases from the initial width as the corresponding cooling fin moves away from the first cooling fin,
With the above number of times
It has a shape where the width increases in a step shape corresponding to the boundary according to the arrangement of the cooling fins,
The unit distribution corresponding to the kth cooling fin after the first cooling fin along the direction from the first cooling fin to the second cooling fin is
The value obtained by subtracting the preset initial value from k is divided by the total number of cooling fins minus the preset initial value, multiplied by an exponent according to the preset shape parameter value, and the value subtracted from the preset initial value is added to the initial width. Having a width based on the multiplied value
Cooling device for electronic components.