CN105658027B - Liquid cooling plate for electronic unit cooling - Google Patents
Liquid cooling plate for electronic unit cooling Download PDFInfo
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- CN105658027B CN105658027B CN201510695697.3A CN201510695697A CN105658027B CN 105658027 B CN105658027 B CN 105658027B CN 201510695697 A CN201510695697 A CN 201510695697A CN 105658027 B CN105658027 B CN 105658027B
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- straight trough
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- 238000001816 cooling Methods 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000000110 cooling liquid Substances 0.000 claims abstract description 6
- 230000007704 transition Effects 0.000 claims abstract description 4
- 239000012530 fluid Substances 0.000 abstract description 12
- 239000012809 cooling fluid Substances 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 28
- 238000004088 simulation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000003416 augmentation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
For the liquid cooling plate of electronic unit cooling, including substrate and cover board, multiple parallel straight troughs are offered on substrate, front and rear adjacent straight trough is end to end, is connected between straight trough by link slot, arc transition between straight trough and link slot；Straight trough, link slot and cover board on substrate surround the runner crossed for cooling liquid stream, offer the first groove on the bottom wall of each straight trough, the width of the first groove accounts for the 60%~80% of width of flow path.The present invention have can take into account liquid cooling plate temperature rise and cooling fluid pressure drop, realize liquid cooling plate temperature rise and cool down fluid pressure drop at the same time the advantages of being greatly lowered.
Description
Technical field
Electronic equipment, the heat exchange equipment on generator, particularly a kind of liquid are adapted to mount to the present invention relates to a kind of
Cold plate.
Technical background
Liquid cooling plate has excellent heat dissipation performance, it is centering, the equipment of high power density, and liquid cooling plate can effectively band
Walk the heat dissipation in power device, printed circuit board (PCB) assembly or extension facility.The characteristics of liquid cooling plate cooling system is：(1)
Temperature gradient on cold plate is small, uniform heat distribution, can take away larger concentration heat load；(2) due to using the side cooled down indirectly
Formula, can be such that electronic component is not contacted directly with cooling agent, reduce various pollutions, improve the reliability of work；(3) with directly it is cold
But compare, the consume of cooling agent is lacked, while also allows for using more effective cooling agent, improves cooling effectiveness；(4) cold plate device
Component it is simple, it is compact-sized, it is easy to repair.This series of advantages of summary so that application of the cold plate on radiating element
There is wide prospect.
Liquid cooling plate is to solve the problems, such as the heat of electrical equipment by equably radiating over the whole board surface.Common liquid
Cold plate is the flow passage designed using coil pipe or the plate fin being clipped between at least two tablets.Use coil pipe or plate
Fin is to be made the shortcomings that flow passage (runner)：Coil pipe, which needs to be bent with straight tube, to be formed, and a straight tube can only may be made
Into a part for coil pipe, therefore there is weld on coil pipe, it is possible that leak source.Between two tablets being clipped in plate fin,
Plate fin is brazed to form flow passage (runner) with tablet, and leak source may also occur in soldering part.In addition, bend coil pipe and soldering
All there are the problem of complex process for plate fin and tablet.
In order to overcome disadvantages mentioned above, Chinese patent ZL200580049517.9 discloses a kind of improved heat exchanger and sets
Standby, it is suitable for electronic unit of the cooling at least one outer surface of equipment, which includes：Substrate；Cover board；Cladding
Sheet material, it is plugged between substrate and cover board, and wherein cladded sheet materials are rigidly engaged to form single monoblock type plate；Positioned at institute
One end of the plate of formation or at least one entrance of opposite two ends and at least one outlet, for cooling medium disengaging, base
Plate is configured to have multiple flow channels, and each passage includes the groove of several processing, it has corresponding to electronic unit
The size of the corresponding predetermined change in hot track, so as to optimize heat transfer rate, and the design of multiple interconnections form it is continuous
And between the groove of one of parallel flow passage.In this heat exchanger, flow channel is to be constructed by numerically-controlled machine tool in base
Multiple grooves on plate.Fluid passage has the depth of change and the width of change.By the design to runner, coolant is set to exist
The fluid velocity of high heat flux zones is accelerated, strengthens amount of heat transfer, reduces fluid velocity in low heat flux zones so that fluid pressure
Drop is minimum.
Pressure drop and temperature rise are to weigh the important index of cold plate performance, and temperature rise characterizes the heat-sinking capability of cold plate, and pressure drop determines
The power of cold plate coolant transfer tube, cold plate performance Optimized Measures are all based on two performance indicators.Pressure drop and temperature rise it is same
When reduce that there are contradiction, existing optimized technology in theory can cause another index while an index is reduced
It can improve.
By Fourier law：
Cold plate temperature rise：
In formula：Δ t --- cold plate temperature rise
qm--- coolant rate in cold plate
Cp--- coolant specific heat capacity
--- power of heat source
Cold plate pressure drop：
In formula：Δ p --- cold plate pressure drop
F ' --- breathe out root-Bo Yisaili friction coefficient
L --- cold plate pipeline equivalent length
D --- hydraulic diameter
U --- cooling liquid speed in pipe
Ac--- conduit cross-sectional area
It can be obtained by (2.1), (2.2)：
From (3) formula, cold plate temperature rise Δ t is inversely proportional with pressure drop Δ P, and the heat exchange that ZL200580049517.9 is disclosed
In device equipment, the cooling liquid speed of high heat flux zones is accelerated, then fluid-pressure drop will be caused to raise.Its Optimized Measures cannot be taken into account
Pressure drop and temperature rise.
The content of the invention
It is an object of the invention to provide one kind can take into account liquid cooling plate temperature rise and cooling fluid pressure drop, realize liquid cooling plate temperature rise and
The liquid cooling plate for being used for electronic unit cooling being greatly lowered of cooling fluid pressure drop at the same time.
For the liquid cooling plate of electronic unit cooling, including substrate and cover board, multiple parallel straight troughs are offered on substrate, it is preceding
Adjacent straight trough is end to end afterwards, is connected between straight trough by link slot, arc transition between straight trough and link slot；On substrate
Straight trough, link slot and cover board surround the runner crossed for cooling liquid stream, it is characterised in that：Bottom is offered on the bottom wall of each straight trough
Groove, the width of bottom groove account for the 60%~80% of width of flow path.Runner with cover board to push up, using substrate the bottom of as, cover closure
The wall of straight trough is the roof of runner.It is wide in 60%-80% runners by the runner simulation calculation to different in width, recess width
Spend that this section cooling effect is best, the depth of groove is influenced less by channel size.
Further, there are multiple conduits in each straight trough, bottom groove is opened up on the bottom wall of each conduit, each conduit
Top groove is opened up on roof, the 60% of channel width where the width of bottom groove and the width of top groove account for respectively~
80%.
Further, top groove and the depth of bottom groove are 0.2mm.Coolant too in deep groove is not easy and runner
Interior coolant carries out heat exchange, and the degree of streaming in too shallow convection road boundary layer does not reach maximum, and the groove heat of 0.2mm depth is handed over
It is best to change effect.
Further, the runner has two entrances, and one outlet, exports between two entrances.Runner is set
Two entrances are set to, coolant difference two entrances enter, and such coolant only need to flow to outlet, nothing from any entrance
The stroke of whole runner need to be flowed completely through, the pressure drop of coolant is greatly reduced.
Further, outlet is at the 1/2 of runner stroke.The stroke of coolant from the inlet to the outlet is the 1/ of flow channel length
2, the distance that such coolant is walked in cold plate reduces half, and the pressure drop of coolant is greatly reduced.
The advantage of the invention is that：
1st, after increasing groove structure, the bottom wall and roof of fluid passage are uneven, so that coolant boundary layer turbulence
Aggravation, boundary layer thickness is thinning, and heat convection effect is strengthened, and liquid cooling plate temperature rise reduces.Groove structure makes runner at the same time
Cross-sectional area becomes larger, in the case of identical inlet flow rate pressure drop be reduced.So as to take into account liquid cooling plate temperature rise and cooling fluid pressure drop,
Realize liquid cooling plate temperature rise and cool down fluid pressure drop at the same time be greatly lowered.
2nd, by setting two entrances on runner, export between two entrances, flowed through so as to reduce coolant
Stroke, pressure drop is reduced.
Brief description of the drawings
Fig. 1 is the schematic perspective view of substrate.
Fig. 2 is the top view of substrate.
Fig. 3 is the B-B direction sectional view of Fig. 2.
Fig. 4 is the A portions enlarged drawing of Fig. 3.
Fig. 5 is the axial, cross-sectional view for the runner for not opening up groove.
Fig. 6 is the axial, cross-sectional view for opening up reeded runner.
Fig. 7 is temperature boundary layer schematic diagram.
Fig. 8 is pressure drop and the temperature simulation cloud atlas for the runner for not opening up groove.
Fig. 9 is pressure drop and the temperature simulation cloud atlas for opening up reeded runner.
Figure 10 is the schematic diagram for the runner longitudinal cross-section A-A for not opening up groove.
Figure 11 is the runner Section A-A temperature isogram for not opening up groove.
Figure 12 is to open up reeded runner Section A-A temperature isogram.
Figure 13 is the runner Section A-A contoured velocity figure for not opening up groove.
Figure 14 is to open up reeded runner Section A-A contoured velocity figure.
Figure 15 is the runner Section A-A field synergy angle isogram for not opening up groove.
Figure 16 is to open up reeded runner Section A-A field synergy angle isogram.
Figure 17 is the schematic diagram that runner has two entrance single outlets.
Figure 18 is pressure drop and the temperature simulation cloud atlas for the single entry single exit runner for not opening up groove.
Figure 19 is pressure drop and the temperature simulation cloud atlas for two entrance channels for not opening up groove.
Figure 20 is pressure drop and the temperature simulation cloud atlas for opening up reeded single entry single exit runner.
Figure 21 is the emulation cloud atlas for the pressure drop and temperature for opening up reeded two entrance channel.
Embodiment
Embodiment 1
As depicted in figs. 1 and 2, the liquid cooling plate for electronic unit cooling, including substrate 1 and cover board, offer on substrate 1
Multiple parallel straight troughs 11, front and rear adjacent straight trough 11 is end to end, is connected between straight trough 11 by link slot 12, straight trough 11 with
Arc transition between link slot 12；Straight trough 11, link slot 12 and cover board on substrate 1 surround the runner crossed for cooling liquid stream, often
Bottom groove 13 is offered on the bottom wall of a straight trough 11, the width of bottom groove 13 accounts for the 60%~80% of width of flow path.Runner
It is bottom with substrate 1 with cover board to push up, the wall of cover closure straight trough 11 is the roof of runner.Pass through the runner to different in width
Simulation calculation, this section cooling effect is best in 60%-80% width of flow path for recess width, and the depth of groove is by channel size
Influence little.
As shown in Figure 3 and Figure 4, there are multiple conduits 111 in each straight trough 11, bottom is opened up on the bottom wall of each conduit 111
Portion's groove, opens up top groove on the roof of each conduit 111, the width of bottom groove and the width of top groove account for institute respectively
The 60%~80% of 111 width of conduit.As depicted in figs. 1 and 2, conduit 111 is due to be put at equal intervals in each straight trough 11
Floor 112 is put to be split to form.
As shown in fig. 6, top groove and the depth of bottom groove are 0.2mm.Coolant too in deep groove be not easy with
Coolant in runner carries out heat exchange, and the degree of streaming in too shallow convection road boundary layer does not reach maximum, the groove of 0.2mm depth
Heat exchange effect is best.
The present embodiment increases 3.9mm wide, the top groove 14 of 0.2mm depths, bottom wall surface increase with the top of 5mm wide runners
Illustrate exemplified by the bottom groove 13 of 3.9mm wide, 0.2mm depth, as shown in Figure 5 and Figure 6.
Fig. 5 is the axial sectional diagrammatical view illustration for 3 conduits of runner one group for not opening up groove, as shown in Figure 5, does not open up groove
Flow passage structure depth 15mm, wide 5mm.Fig. 6 is the runner axial cross section for opening up groove, is not opening up the upper following table of the runner of groove
Face increases width 3.9mm, deep 0.2mm groove structures.
Theoretical according to convection current augmentation of heat transfer, when fluid temperature (F.T.) is different from wall surface temperature, tube wall and fluid must have heat friendship
Change.The thin layer of significant changes occurs temperature boundary layer by fluid temperature (F.T.) near wall.Fluid temperature (F.T.) reaches in the boundary layer
The 99% of main flow area temperature, as shown in Figure 7.
Thermal resistance concept is introduced, thermal resistance is defined by formula (4.1)：
In formula：θ --- thermal resistance
T1 --- heat source temperature
T2 --- heat-conducting system outlet temperature
P --- power of heat source
Boundary layer thermal resistance accounts for the 99% of whole diabatic process as available from the above equation, therefore the improvement to boundary layer heat transfer boundary condition is
Lift the key of cold plate heat exchange property.
After the bottom wall and roof of runner increase groove respectively, boundary layer turbulence aggravation, boundary layer thickness is thinning, and convection current is changed
Thermal effect is strengthened, and cold plate temperature rise reduces.Groove makes the cross-sectional area of runner become larger at the same time, and identical inlet flow rate situation pushes
Drop is reduced.The runner that does not open up groove and open up groove runner in identical entry condition (inlet flow rate：3.15m/s enter
Mouth temperature：45 DEG C) temperature and pressure drop cloud atlas contrast as shown in Figure 8, Figure 9.
From Fig. 8 and Fig. 9, opening up runner pressure drop of the runner of groove than not opening up groove reduces 0.03bar, maximum
Temperature rise reduces 1.74 DEG C.
To better illustrate the superiority for the runner for opening up groove, take the flow passage structure for not opening up groove and open up groove
The longitudinal cross-section A-A (Figure 10) of flow passage structure is analyzed inside fluent, shows temperature equivalent curve, the speed of cross section of fluid channel
Spend equivalent curve and field synergy angle distribution such as Figure 11, Figure 12, Figure 13.
It can be seen that the temperature entrance developed regime for the runner for opening up groove is elongated by Figure 11 and Figure 12, by not opening up groove
The 0.29m of flow passage structure rises to 0.34m.Temperature entrance developed regime is elongated, temperature boundary in the case that axial coordinate value is equal
Thinner layer thickness, heat convection are strengthened.
The runner central speed for not opening up groove it can be seen from figure 13 above and Figure 14 is 2.6m/s, opens up the stream of groove
Road central speed is 2.8m/s.Coolant speed is big, can carry out more heat exchanges at the same time, take away more heat
Amount.
As knowable to Figure 15 and Figure 16, the runner central area field synergy angle value for opening up groove diminishes, and distribution is more uniform.
Collaboration angle is the important indicator for weighing temperature gradient and velocity gradient concertedness, and the concertedness of the smaller explanation of the value therebetween is got over
It is good.It can thus be appreciated that the thermal diffusivity for opening up the runner of groove is better than the runner for not opening up groove.
Embodiment 2
The present embodiment in place of the difference of embodiment one with being：The runner has two entrances I1, I2, one outlet
E, E is between two entrances I1, I2 for outlet, as shown in figure 17.Runner is arranged to two entrances I1, I2, coolant difference
Two entrances I1, I2 enter, and such coolant only need to flow to outlet from any entrance, without flowing completely through whole runner
Stroke, the pressure drop of coolant is greatly reduced.
Outlet E is located at the 1/2 of runner stroke.Coolant is the 1/ of flow channel length from entrance I1, I2 to the stroke of outlet E
2, the distance that such coolant is walked in cold plate reduces half, and the pressure drop of coolant is greatly reduced.
Imitated in Figure 18 and Figure 19 in really runner and do not open up groove, be only the different pressure drop of entry number and temperature simulation
Cloud atlas.
After runner sets two entrances, coolant walks distance in cold plate and reduces half, and pressure drop is reduced.Such as Figure 18
It is shown, the runner pressure drop 1.2bar of groove, 59.34 DEG C of maximum temperature are not opened up.As shown in figure 19, two entrance channel pressure drop
1.03bar, 58.94 DEG C of maximum temperature.
Contrasted from Figure 18 and Figure 19, pressure drop of two entrance channels than single entry runner reduces 0.17bar, maximum temperature
Rising also slightly reduces.
As shown in figure 20, do not open up groove but entrance channel pressure drop 1.2bar, 59.34 DEG C of maximum temperature, temperature rise 14.34
℃。
As shown in figure 21,2 entrances open up the runner pressure drop 0.98bar of groove, 56.67 DEG C of maximum temperature, temperature rise 11.67
℃。
Contrasted from Figure 20 and Figure 21,2 entrances open up two entrance streams of the single entry runner of groove than not opening up groove
Road pressure drop reduces 0.22bar, and maximum temperature rise reduces 2.67 DEG C.Pressure drop reduces 18.3%, and temperature rise reduces 18.6%, cold
Plate overall performance is increased dramatically.
Content described in this specification embodiment is only enumerating to the way of realization of inventive concept, protection of the invention
Scope is not construed as being only limitted to the concrete form that embodiment is stated, protection scope of the present invention is also and in art technology
Personnel conceive according to the present invention it is conceivable that equivalent technologies mean.
Claims (5)
1. for the liquid cooling plate of electronic unit cooling, including substrate and cover board, multiple parallel straight troughs are offered on substrate, it is front and rear
Adjacent straight trough is end to end, is connected between straight trough by link slot, arc transition between straight trough and link slot；It is straight on substrate
Groove, link slot and cover board surround the runner crossed for cooling liquid stream, it is characterised in that：It is recessed that bottom is offered on the bottom wall of each straight trough
Groove, the width of bottom groove account for the 60%~80% of width of flow path.
2. the liquid cooling plate for electronic unit cooling as claimed in claim 1, it is characterised in that：Have in each straight trough multiple
Conduit, opens up bottom groove on the bottom wall of each conduit, top groove, the width of bottom groove is opened up on the roof of each conduit
The 60%~80% of channel width where being accounted for respectively with the width of top groove.
3. the liquid cooling plate for electronic unit cooling as claimed in claim 2, it is characterised in that：Top groove and bottom groove
Depth be 0.2mm.
4. the liquid cooling plate for being used for electronic unit cooling as described in one of claim 1-3, it is characterised in that：The runner tool
There are two entrances, one outlet, exports between two entrances.
5. the liquid cooling plate for electronic unit cooling as claimed in claim 4, it is characterised in that：Outlet is positioned at runner stroke
At 1/2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510695697.3A CN105658027B (en) | 2015-10-22 | 2015-10-22 | Liquid cooling plate for electronic unit cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510695697.3A CN105658027B (en) | 2015-10-22 | 2015-10-22 | Liquid cooling plate for electronic unit cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105658027A CN105658027A (en) | 2016-06-08 |
| CN105658027B true CN105658027B (en) | 2018-04-13 |
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ID=56481797
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510695697.3A Active CN105658027B (en) | 2015-10-22 | 2015-10-22 | Liquid cooling plate for electronic unit cooling |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106384856A (en) * | 2016-11-16 | 2017-02-08 | 东莞市文轩五金制品有限公司 | Circular-flow-channel liquid cooling plate applied to power battery and processing method thereof |
| CN106450573A (en) * | 2016-11-16 | 2017-02-22 | 东莞市文轩五金制品有限公司 | Sealed flow channel liquid cooling plate for power battery and processing method of sealed flow channel liquid cooling plate |
| CN106384857A (en) * | 2016-11-16 | 2017-02-08 | 东莞市文轩五金制品有限公司 | Multi-flow-channel liquid cooling plate applied to power battery and processing method thereof |
| KR102030143B1 (en) * | 2017-09-18 | 2019-10-08 | 현대자동차(주) | Double side water cooler |
| CN108495516B (en) * | 2018-04-26 | 2023-12-19 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on fluid medium heat dissipation and equipment for mounting board card assembly |
| CN108598053A (en) * | 2018-05-16 | 2018-09-28 | 湖北工程学院 | A kind of efficient microchannel jet stream is heat sink |
| CN108617148A (en) * | 2018-06-06 | 2018-10-02 | 张家港首驱动力科技有限公司 | A kind of heat sink of Trapezoidal water channel |
| CN108811447B (en) * | 2018-06-26 | 2020-03-31 | 西安交通大学 | Liquid cooling plate with channel |
| US10959352B1 (en) * | 2020-01-03 | 2021-03-23 | Quanta Computer Inc. | Cooling system with floating cold plate with single pipes |
| CN115768040B (en) * | 2022-10-29 | 2023-12-26 | 深圳市瀚强科技股份有限公司 | Heat abstractor, electronic equipment and consumer |
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| CN105658027A (en) | 2016-06-08 |
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