CN203827683U - Locally-enhanced heat transfer type high-performance water-cooling plate - Google Patents

Locally-enhanced heat transfer type high-performance water-cooling plate Download PDF

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Publication number
CN203827683U
CN203827683U CN201420265824.7U CN201420265824U CN203827683U CN 203827683 U CN203827683 U CN 203827683U CN 201420265824 U CN201420265824 U CN 201420265824U CN 203827683 U CN203827683 U CN 203827683U
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China
Prior art keywords
export
heat transfer
import
performance water
fin
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Expired - Fee Related
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CN201420265824.7U
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Chinese (zh)
Inventor
杨志刚
孙丽
谭晓东
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Dalian Jiaotong University
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Dalian Jiaotong University
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Priority to CN201420265824.7U priority Critical patent/CN203827683U/en
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Abstract

The utility model discloses a locally-enhanced heat transfer type high-performance water-cooling plate. The locally-enhanced heat transfer type high-performance water-cooling plate is characterized in that the locally-enhanced heat transfer type high-performance water-cooling plate comprises a groove plate (1), a flat plate (3) and a brass soldering composite plate (2) located at the middle portion, one side of the groove plate (1) is provided with a plurality of groove channels (9), the side is provided with a flow channel (11), a fin installation groove (10) for installing fins is formed in the flow channel (11), a flow guide column (8) is further arranged in the flow channel (11), the side of the groove plate (1) which is provided with the plurality of groove channels (9) is in brass soldering connection with the lower end surface of the flat plate (3) through the brass soldering composite plate (2). According to the utility model, the structure layout of the water-cooling plate is configured flexibly and reasonably according to performance requirements of different power elements so as to perform effective cooling on the power elements to ensure the safe operation of the power elements.

Description

Local strengthening heat transfer high-performance water cold drawing
Technical field
The utility model relates to a kind of cooled plate, specifically a kind of local strengthening heat transfer high-performance water cold drawing.
Background technology
The working method of cooled plate: the mounting surface of cooled plate is coated with to one deck heat-conducting silicone grease, power model is fastened on the installed surface of cooled plate by bolt; Coolant flows to the outlet of cooled plate from the import of cooled plate, the heat that power model is passed to cooled plate passes to external environment, coolant can be the mixed solution of deionized water, ethylene glycol or ethylene glycol and water, methyl alcohol etc., according to the different coolant of field different choice of application.
Existing problems: along with the high power of electronic devices and components, high integrated develop rapidly, the heat dissipating when its work is increasing, the heat flux distribution of different capacity element is inhomogeneous, more and more harsher to the requirement of radiator, by its for cooled plate require all the more so, for ensure each power component within the scope of normal working temperature, need to there is according to the distribution design of the density of heat flow rate of power component the high-performance water cold drawing of the controlled coolant temperature of local strengthening heat exchange.
Utility model content
According to the inhomogeneous technical problem of heat flux distribution of the different capacity element of above-mentioned proposition, and provide a kind of local strengthening heat transfer high-performance water cold drawing.
The technological means that the utility model adopts is as follows:
A kind of local strengthening heat transfer high-performance water cold drawing, it is characterized in that: comprise frid, flat board and be positioned at middle soldering composite plate, the one side of described frid is provided with multiple conduits, this face is provided with runner, in described runner, be provided with the fin mounting groove that fin is installed, the position of described fin mounting groove is designed according to the distribution of the density of heat flow rate of power component, in described runner, be also provided with diversion column, described frid is provided with the one side of described multiple conduits and the lower surface of described flat board by described soldering composite plate brazing.
Further, between described multiple conduits, be parallel to each other, and arrange along the length direction of described frid.Other positions in described runner except described fin mounting groove and described diversion column also retain the structure of described conduit.Further, described diversion column, between described multiple fins, in the time that described runner exists bending, is also provided with diversion column in the bending place of described runner, and the described conduit of the bending place of described runner is washed off by milling cutter.
Further, described cooled plate is provided with the import and export one of the one end that is communicated with described runner and is communicated with the import and export two of the other end of described runner, described import and export one are respectively equipped with in described import and export two joint that is connected cooling fluid pipeline, described import and export one and described import and export two venting during also for soldering.
Further, described import and export one are positioned on described flat board, and described import and export two are positioned on described frid.
Further, described import and export one and described import and export two lay respectively on described flat board.
Further, described joint adopts and is threaded or welds with described import and export one; Described joint adopts and is threaded or welds with described import and export two.
Further, described cooled plate is provided with power component installing zone.
Further, described fin is flat type fin, serrated fin, rippled fin, porous type fin, one or more in flap type fin and ladder type interleaving type fin.
Compared with prior art, the utility model advantage is: play the fin that strengthens heat exchange effect in high-power density of heat flow rate power component installation site arranged beneath, then do not need to arrange fin in the gap of each power component, or only process some and play the effect of gaining in strength and the diversion column of guide functions, can control like this temperature of the installed position cooling fluid that enters next power component, reach according to different performance requirements, flexibly reasonably configuration cooled plate topology layout.
The utility model can be applied in the fields such as power transformation, wind-powered electricity generation, electric locomotive and motor-car for the foregoing reasons, for high heat flux power component in its equipment effectively dispels the heat, the trouble free service of guaranteed output element, for structural requirement compactness, power component install intensive and heat flux distribution when uneven this kind of cooled plate advantage more obvious.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the perspective view of cooled plate of the present utility model.
Fig. 2 is cooled plate structural representation of the present utility model.
Fig. 3 is serrated fin structural representation of the present utility model.
Fig. 4 is flat type fin structure schematic diagram of the present utility model.
Fig. 5 is porous type fin structure schematic diagram of the present utility model.
Fig. 6 is rippled fin structural representation of the present utility model.
Fig. 7 is ladder type interleaving type fin structure schematic diagram of the present utility model.
Fig. 8 is flap type fin structure schematic diagram of the present utility model.
Fig. 9 be in Fig. 8 A-A to schematic diagram.
Figure 10 is slab construction schematic diagram of the present utility model.
Wherein, 1, frid 2, soldering composite plate 3, dull and stereotyped 4, power component installing zone 5, joint 6, import and export 1, import and export 28, diversion column 9, conduit 10, fin mounting groove 11, runner.
Embodiment
First find out the power component installation site that density of heat flow rate is large, it is generally acknowledged that density of heat flow rate exceedes 90000W/m 2for high heat flux, judge that density of heat flow rate size is relative comparison, without fixing decision content, when normal arrangement power component, the arrangements of elements of large density of heat flow rate can approached to the import department of cooled plate, the power component of low density of heat flow rate is arranged in the exit of cooled plate, play the fin that strengthens heat exchange effect in high-power density of heat flow rate power component installation site arranged beneath, then do not need to arrange fin in the gap of each power component, or only process some and play the effect of gaining in strength and the fin of guide functions, can control like this temperature of the installed position cooling fluid that enters next power component, reach according to different performance requirements, reasonably configuration cold drawing topology layout flexibly.
According to the heat flux distribution of power component, adopt following radiator structure:
As Fig. 1, shown in Fig. 2 and Figure 10, local strengthening heat transfer high-performance water cold drawing, comprise frid 1, soldering composite plate 2, dull and stereotyped 3, power component installing zone 4 and multiple fin, in described frid, be provided with along described frid length direction the conduit 9 being parallel to each other, the one side that is provided with conduit 9 of described frid 1 is provided with runner 11, described runner 11 is U-shaped runner, described U-shaped runner arranges along described frid length direction, in described U-shaped runner, be provided with the fin mounting groove 10 that described fin is installed, the quantity of described fin mounting groove 10 is consistent with the quantity of described fin, the position of described fin mounting groove 10 is designed according to the distribution of the density of heat flow rate of power component, and be positioned at the below of the power component installing zone 4 of high heat flux, be positioned at the locational conduit 10 of described fin mounting groove 10 by milling cutter mill off, the bending place of described U-shaped runner is also provided with diversion column (8), described diversion column 8 and described frid brazing, the described conduit 9 of the bending place of described U-shaped runner is washed off by milling cutter.And for the power component of low density of heat flow rate, the below of its power component installing zone 4 still retains former channel structure, other positions in described U-shaped runner except described fin mounting groove 10 and described diversion column 8 also retain the structure of the described conduit 9 of described frid, the one side that is provided with described conduit 9 of described frid 1 with described dull and stereotyped 3 lower surface by described soldering composite plate 2 brazings.
Described cooled plate is provided with the import and export 1 of the one end that is communicated with described U-shaped runner and is communicated with the import and export 27 of the other end of described U-shaped runner, the joint 5 of the connection cooling fluid pipeline being threaded connection respectively in described import and export 1 and described import and export 27, described import and export 1 and described import and export 27 venting during also for soldering.Described import and export 1 are positioned on described dull and stereotyped 3, and described import and export 27 are positioned on described frid 1, and described import and export 1 are cooling fluid input port, and described import and export 27 are cooling fluid delivery outlet.
As shown in Fig. 3-Fig. 9, the type of alternative described fin comprises: flat type fin, serrated fin, rippled fin, porous type fin, flap type fin and ladder type interleaving type fin.
The above; it is only preferably embodiment of the utility model; but protection range of the present utility model is not limited to this; any be familiar with those skilled in the art the utility model disclose technical scope in; be equal to replacement or changed according to the technical solution of the utility model and utility model design thereof, within all should being encompassed in protection range of the present utility model.

Claims (9)

1. a local strengthening heat transfer high-performance water cold drawing, it is characterized in that: comprise frid (1), dull and stereotyped (3) and be positioned at the soldering composite plate (2) of centre, the one side of described frid (1) is provided with multiple conduits (9), this face is provided with runner (11), in described runner (11), be provided with the fin mounting groove (10) that fin is installed, in described runner (11), be also provided with diversion column (8), described frid (1) is provided with the one side of described multiple conduit (9) and the lower surface of described flat board (3) by described soldering composite plate (2) brazing.
2. local strengthening heat transfer high-performance water cold drawing according to claim 1, is characterized in that: between described multiple conduits (9), be parallel to each other, and arrange along the length direction of described frid.
3. local strengthening heat transfer high-performance water cold drawing according to claim 1, is characterized in that: described diversion column (8) is between described multiple fins.
4. local strengthening heat transfer high-performance water cold drawing according to claim 1, it is characterized in that: described cooled plate is provided with the import and export one (6) of the one end that is communicated with described runner (11) and is communicated with the import and export two (7) of the other end of described runner (11), and described import and export one (6) are respectively equipped with in described import and export two (7) joint (5) that is connected cooling fluid pipeline.
5. local strengthening heat transfer high-performance water cold drawing according to claim 4, it is characterized in that: it is upper that described import and export one (6) are positioned at described flat board (3), and described import and export two (7) are positioned on described frid (1).
6. local strengthening heat transfer high-performance water cold drawing according to claim 4, is characterized in that: described import and export one (6) and described import and export two (7) lay respectively on described flat board (3).
7. according to the local strengthening heat transfer high-performance water cold drawing described in arbitrary claim in claim 4 to 6, it is characterized in that: described joint (5) adopts and is threaded or welds with described import and export one (6); Described joint (5) adopts and is threaded or welds with described import and export two (7).
8. according to the local strengthening heat transfer high-performance water cold drawing described in arbitrary claim in claim 1 to 6, it is characterized in that: described cooled plate is provided with power component installing zone (4).
9. according to the local strengthening heat transfer high-performance water cold drawing described in arbitrary claim in claim 1 to 6, it is characterized in that: described fin is flat type fin, serrated fin, rippled fin, porous type fin, one or more in flap type fin and ladder type interleaving type fin.
CN201420265824.7U 2014-05-22 2014-05-22 Locally-enhanced heat transfer type high-performance water-cooling plate Expired - Fee Related CN203827683U (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105806134A (en) * 2014-12-29 2016-07-27 中国兵器装备研究院 Water cooling plate
CN106877786A (en) * 2017-04-26 2017-06-20 广东梅赛能源科技有限公司 Heavy-duty motor governing system with intelligent water-cooled heat abstractor
CN107396600A (en) * 2017-07-16 2017-11-24 中车永济电机有限公司 Bidirectional screw runner water-cooling heat radiating device
CN110779373A (en) * 2019-11-12 2020-02-11 山东大学 Water-cooled tube plate heat exchanger
CN110779372A (en) * 2019-11-12 2020-02-11 山东大学 Water-cooled tube plate heat exchanger with variable cylindrical fin spacing
CN110779371A (en) * 2019-11-12 2020-02-11 山东大学 Water-cooling tube-plate heat exchanger with optimally distributed fluid inlet and outlet
CN110793370A (en) * 2019-11-12 2020-02-14 山东大学 Design method of water-cooled tube plate heat exchanger
CN111918520A (en) * 2019-05-08 2020-11-10 华为技术有限公司 Heat sink and heat radiator
CN112768418A (en) * 2020-12-31 2021-05-07 华进半导体封装先导技术研发中心有限公司 Semiconductor device heat dissipation module and electronic device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105806134A (en) * 2014-12-29 2016-07-27 中国兵器装备研究院 Water cooling plate
CN106877786A (en) * 2017-04-26 2017-06-20 广东梅赛能源科技有限公司 Heavy-duty motor governing system with intelligent water-cooled heat abstractor
CN107396600A (en) * 2017-07-16 2017-11-24 中车永济电机有限公司 Bidirectional screw runner water-cooling heat radiating device
CN111918520A (en) * 2019-05-08 2020-11-10 华为技术有限公司 Heat sink and heat radiator
CN111918520B (en) * 2019-05-08 2022-02-18 华为技术有限公司 Heat sink and heat radiator
CN110779373A (en) * 2019-11-12 2020-02-11 山东大学 Water-cooled tube plate heat exchanger
CN110779372A (en) * 2019-11-12 2020-02-11 山东大学 Water-cooled tube plate heat exchanger with variable cylindrical fin spacing
CN110779371A (en) * 2019-11-12 2020-02-11 山东大学 Water-cooling tube-plate heat exchanger with optimally distributed fluid inlet and outlet
CN110793370A (en) * 2019-11-12 2020-02-14 山东大学 Design method of water-cooled tube plate heat exchanger
CN110793370B (en) * 2019-11-12 2020-10-02 山东大学 Design method of water-cooled tube plate heat exchanger
CN112768418A (en) * 2020-12-31 2021-05-07 华进半导体封装先导技术研发中心有限公司 Semiconductor device heat dissipation module and electronic device
CN112768418B (en) * 2020-12-31 2022-07-19 华进半导体封装先导技术研发中心有限公司 Semiconductor device heat dissipation module and electronic device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140910

Termination date: 20150522

EXPY Termination of patent right or utility model