CN112768418B - Semiconductor device heat dissipation module and electronic device - Google Patents
Semiconductor device heat dissipation module and electronic device Download PDFInfo
- Publication number
- CN112768418B CN112768418B CN202011635116.4A CN202011635116A CN112768418B CN 112768418 B CN112768418 B CN 112768418B CN 202011635116 A CN202011635116 A CN 202011635116A CN 112768418 B CN112768418 B CN 112768418B
- Authority
- CN
- China
- Prior art keywords
- heat
- face
- rigid substrate
- end surface
- bottom end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a semiconductor device heat dissipation module and an electronic device. The semiconductor device heat dissipation module includes: the heat conduction plate comprises a top end surface and a bottom end surface which are opposite, and the top end surface and the bottom end surface are respectively one of two surfaces with the largest area in all the surfaces of the heat conduction plate; the rigid substrate is provided with a plurality of heating devices and is attached to the top end face and the bottom end face; the flexible substrate is attached to the side face of the heat conducting plate; the flexible substrate part extends to the top end face side, and the part of the flexible substrate extending to the top end face side is connected with the rigid substrate positioned on the top end face; the flexible substrate also partially extends to the side of the bottom end face, and the part of the flexible substrate extending to the side of the bottom end face is connected with the rigid substrate positioned on the bottom end face.
Description
Technical Field
The invention relates to a semiconductor device heat dissipation technology, in particular to a semiconductor device heat dissipation module and an electronic device.
Background
In a semiconductor device, some components release a large amount of heat during operation, thereby affecting the surrounding components and circuits, and the heat release affects the lifetime of the components themselves and the surrounding components. Therefore, how to design the heat dissipation of these devices is an important issue in the field. In a general method, a device is mounted on a ceramic substrate having a good heat conductivity, and auxiliary heat dissipation is performed using the ceramic substrate. Furthermore, a heat dissipation device can be additionally arranged outside the ceramic substrate, so that the heat dissipation capability is further improved. However, in such a method, for a module with many heat generating devices, the area of the substrate to be used is large, and the size of the module is large because the heat dissipating device to be used is correspondingly large.
Disclosure of Invention
The invention provides a semiconductor device heat dissipation module and an electronic device based on the problems, and aims to solve the problem of module heat dissipation of a multi-heat-generating device.
The invention provides a semiconductor device heat radiation module, comprising: the heat conduction plate comprises a top end surface and a bottom end surface which are opposite, and the top end surface and the bottom end surface are respectively one of two surfaces with the largest area in all the surfaces of the heat conduction plate; the rigid substrate is provided with a plurality of heating devices and is attached to the top end face and the bottom end face; the flexible substrate is attached to the side surface of the heat conducting plate; the flexible substrate part extends to the top end face side, and the part of the flexible substrate extending to the top end face side is connected with the rigid substrate positioned on the top end face; the flexible substrate also partially extends to the side of the bottom end face, and the part of the flexible substrate extending to the side of the bottom end face is connected with the rigid substrate positioned on the bottom end face.
Optionally, the plurality of heating devices disposed on the rigid substrate are attached to a surface of the rigid substrate opposite to the side of the heat conducting plate.
Optionally, the surface of the rigid substrate, which faces away from the heat conducting plate, is provided with a plurality of grooves, and the plurality of heating devices arranged on the rigid substrate are respectively attached to the bottom surfaces of the grooves.
Optionally, the rigid substrate has a cavity penetrating through the rigid substrate, and the plurality of heat generating devices disposed on the rigid substrate are disposed in the cavity of the rigid substrate respectively.
Optionally, multiple heating devices are arranged on the rigid substrate, and the heat flux density is higher than 1W/cm2Multiple heating devices arranged on the flexible substrate and having heat flux density lower than 1W/cm2。
Optionally, the flexible substrates are at least two, the at least two flexible substrates are respectively located on two opposite side surfaces of the heat conducting plate, the rigid substrate is connected with the flexible substrates, and a closed pattern is enclosed on at least one section.
Optionally, the heat conducting plate is a liquid cooling plate, the liquid cooling plate has a first side end face and a second side end face which are opposite to each other, the first side end face and the second side end face are respectively perpendicular to the top end face and the bottom end face, and the at least two flexible substrates are respectively attached to the first side end face and the second side end face; a cavity is arranged in the liquid cooling plate, a plurality of heat exchange structures are arranged in the cavity, and a heat exchange flow passage is defined by the plurality of heat exchange structures and the wall surface of the cavity; the liquid cooling plate is also provided with a third side end surface and a fourth side end surface which are opposite, and the third side end surface and the fourth side end surface are respectively vertical to the top end surface and the bottom end surface; the third side end surface is provided with a liquid inlet, the fourth side end surface is provided with a liquid outlet, and the liquid inlet and the liquid outlet are respectively communicated with the heat exchange flow channel; the distance between the liquid inlet and the bottom end surface is less than or equal to the distance between the liquid outlet and the bottom end surface.
Optionally, each of the plurality of heat exchange structures extends into the cavity from the wall surface of the cavity, the plurality of heat exchange structures may be one or more of a cylindrical body, a fin, and a prism, and a distance between the wall surfaces of the cavity at which the vertex distances of the plurality of heat exchange structures in the extending direction are opposite is greater than zero;
optionally, the plurality of heat exchange structures are arranged in an array or staggered manner;
optionally, the distance between adjacent heat exchange structures is 0.1mm to 10mm, and the distance between the vertexes of the plurality of heat exchange structures in the extending direction and the wall surface of the cavity opposite to each other is 0.1mm to 10 mm.
Optionally, the plurality of heating devices are arranged on the rigid substrate, and the heat flux density of each heating device is different, wherein the distance between the heating device with higher heat flux density and the liquid inlet is smaller than the distance between the heating device with lower heat flux density and the liquid inlet;
optionally, the heat generating device may be a bare chip, a package, or a package module.
The invention also provides an electronic device which is characterized by comprising the semiconductor device heat dissipation module.
The technical scheme of the invention has the following advantages:
1. according to the semiconductor device heat dissipation module, the rigid substrate provided with the heating devices and the flexible substrate provided with the heating devices are pasted to the top end face, the bottom end face and the side face of the heat conduction plate, so that multiple surfaces of the heat conduction plate are effectively utilized to conduct heat to the multiple heating devices at the same time, and efficient heat dissipation of the multiple heating devices can be achieved at the same time. Meanwhile, the plurality of substrates are respectively arranged on the plurality of surfaces of the heat conducting plate, the bottom end surface and the side surface are utilized besides the top end surface, and the plurality of substrates share one heat conducting plate, so that the number of heating devices which can be supported by one heat conducting plate is increased, and compared with the scheme that a heat radiating device is arranged on one side of a single substrate, the module is smaller in size, saves space and is beneficial to miniaturization of the device. In addition, the rigid substrate on the top end face and the rigid substrate on the bottom end face are connected through the flexible substrate on the side face, heat emitted by the heating device in a single position can be jointly born by the substrates and conducted to the heat conducting plate, so that the heat dissipation of the whole heat conducting plate is relatively balanced, all surfaces of the heat conducting plate are effectively utilized, and the heat dissipation efficiency of the single heat conducting plate is high.
2. The semiconductor device heat dissipation module is arranged on the heating device of the rigid substrate and can be arranged on the surface of the rigid substrate, which is back to one side of the heat conducting plate; further, the rigid substrate may have a groove, and the heating device is disposed in the groove; further, the rigid substrate may be provided with a cavity penetrating the rigid substrate, and the heat generating device is disposed in the cavity. The heating device is arranged in the groove of the rigid substrate, so that the heating device is closer to the heat conducting plate, and the heat conducting efficiency is higher. The heating device is arranged in the cavity penetrating through the rigid substrate, so that the heating device is further close to the heat conducting plate, and the heat conducting efficiency is higher.
3. The heat dissipation module of the semiconductor device of the invention enables the heat flow density to be higher than 1W/cm2The heating device is arranged on the rigid substrate, and the heat flux density is lower than 1W/cm2Disposed on a flexible substrate, since the heat flux density is positively correlated with the heat generation of the device, while rigid substrates are disposed on the top and bottom faces of a heat-conducting plate, which are typically heat-conducting plate guidesThe higher surface of thermal efficiency, the relative heat conduction efficiency of the top face of the heat conduction plate's side and the heat conduction efficiency of bottom face are lower, consequently set up the higher device that generates heat of thermal current density in the rigid substrate of top face and bottom face, set up the lower device that generates heat of thermal current density in the flexible substrate of side for the higher device that generates heat corresponds more efficient heat conduction, is favorable to the radiating equilibrium of module whole.
4. According to the semiconductor device heat dissipation module, the heat conduction plate is a liquid cooling plate, the distance between the liquid inlet and the bottom end face of the liquid cooling plate is smaller than the distance between the liquid outlet and the bottom end face, so that the horizontal position of the liquid inlet is lower than that of the liquid outlet, a heat exchange medium entering the flow channel in unit time can be stored in the flow channel as long as possible and fills the flow channel as long as possible, the heat exchange medium cannot be rapidly discharged from the liquid outlet, the heat exchange time is long, and the heat conduction capability of the liquid cooling plate is higher.
5. According to the semiconductor device heat dissipation module, the arrangement of the plurality of heat exchange structures in the liquid cooling plate and the array or staggered arrangement can increase the contact area between the wall surface of the liquid cooling plate and a heat exchange medium, and improve the heat exchange efficiency.
6. According to the semiconductor device heat dissipation module, the temperature is lowest when the heat exchange medium just enters the cavity, and the heat exchange efficiency is strongest, so that the heat conduction capability of the position, which is closer to the liquid inlet, on the liquid cooling plate is stronger, and the heat dissipation effect is better, and therefore the heating device with higher heat flow density is arranged closer to the liquid inlet, so that the heating device with higher heat flow density can correspond to the higher heat conduction capability, and the heat dissipation of the whole module is more balanced.
7. The electronic device comprises the semiconductor device heat dissipation module, wherein the rigid substrate provided with the heating devices and the flexible substrate provided with the heating devices are pasted on the multiple surfaces of the heat conduction plate, so that the multiple surfaces of the heat conduction plate are effectively utilized to conduct heat on the multiple heating devices simultaneously, and the efficient heat dissipation of the multiple heating devices can be realized. Meanwhile, the plurality of substrates are respectively arranged on the plurality of surfaces of the heat conducting plate, and the bottom end surface and the side surface are utilized besides the top end surface, so that the number of heating devices which can be supported by one heat conducting plate is increased, and compared with the scheme that a single substrate is provided with a heat dissipation device, the module is smaller in size, saves space and is beneficial to miniaturization of the device. In addition, the rigid substrate of the top end face and the rigid substrate of the bottom end face are connected through the flexible substrates of the side faces, heat emitted by the heating device at a single position can be jointly born by the substrates and conducted to the heat conducting plate, so that the heat dissipation capacity of each position on each surface of the heat conducting plate is relatively balanced, each surface of the heat conducting plate is effectively utilized, and the heat dissipation efficiency of the single heat conducting plate is high.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor device heat dissipation module according to an embodiment of the invention;
FIG. 2a is a cross-sectional view of section AA' of FIG. 1;
FIG. 2b is a cross-sectional view of the cross-sectional location of FIG. 2 in another embodiment;
FIG. 2c is a cross-sectional view of the cross-sectional location of FIG. 2 in a further embodiment;
FIG. 3 is a cross-sectional view of section BB' in FIG. 1.
Detailed Description
Therefore, the invention provides a semiconductor device heat dissipation module and an electronic device to solve the heat dissipation problem of a multi-heat-generating device.
The invention provides a semiconductor device heat radiation module, comprising: the heat conduction plate comprises a top end surface and a bottom end surface which are opposite, and the top end surface and the bottom end surface are two surfaces with the largest area in all the surfaces of the heat conduction plate respectively; the rigid substrate is provided with a plurality of heating devices and is attached to the top end face and the bottom end face; the flexible substrate is attached to the side surface of the heat conducting plate; the flexible substrate part extends to the top end face side, and the part of the flexible substrate extending to the top end face side is connected with the rigid substrate positioned on the top end face; the flexible substrate also partially extends to the side of the bottom end face, and the part of the flexible substrate extending to the side of the bottom end face is connected with the rigid substrate positioned on the bottom end face.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
Referring to fig. 1 to 3, the present invention provides a semiconductor device heat dissipation module, including:
the heat conducting plate 100, the heat conducting plate 100 includes opposite top and bottom end faces, which are respectively one of two faces with the largest area in each face of the heat conducting plate 100.
A rigid substrate 200 provided with a plurality of heat generating devices 400, the rigid substrate 200 being attached to the top and bottom end faces.
A flexible substrate 300, wherein a plurality of heating devices 400 are mounted on the surface of the flexible substrate 300, and the flexible substrate 300 is mounted on the side surface of the heat conducting plate 100; the flexible substrate 300 is partially extended to the top end face side, and the portion of the flexible substrate 300 extended to the top end face side is connected to the rigid substrate 200 located on the top end face; the flexible substrate 300 also partially extends to the bottom end face side, and the portion of the flexible substrate 300 extending to the bottom end face side is connected to the rigid substrate 200 at the bottom end face.
The rigid substrate may be a ceramic substrate, a Bismaleimide Triazine (BT) resin substrate, a glass fiber epoxy (FR4) substrate, or a composite substrate of these substrates and copper. The flexible substrate may be a polyimide substrate.
The semiconductor device heat dissipation module of the present embodiment can realize efficient heat dissipation of a plurality of heat generating devices 400 simultaneously by mounting the rigid substrate 200 provided with the heat generating devices 400 and the flexible substrate 300 provided with the heat generating devices 400 to the top end face, the bottom end face and the side face of the heat conductive plate 100, and effectively utilizing a plurality of surfaces of the heat conductive plate 100 to conduct heat to the plurality of heat generating devices 400 simultaneously. Meanwhile, the plurality of substrates are respectively arranged on the plurality of surfaces of the heat conducting plate 100, the plurality of substrates share one heat conducting plate 100, and the bottom end surface and the side surface are utilized in addition to the top end surface, so that the number of heating devices 400 which can be supported by one heat conducting plate 100 is increased, and compared with the scheme that a heat radiating device is arranged on one side of a single substrate, the module is smaller in size, saves space and is beneficial to miniaturization of the device. In addition, the rigid substrate 200 at the top end surface and the rigid substrate 200 at the bottom end surface are connected through the flexible substrate 300 at the side surface, and heat emitted by the heat generating device 400 at a single position can be jointly borne by a plurality of substrates and conducted to the heat conducting plate 100, so that the heat dissipation of the whole heat conducting plate 100 is relatively balanced, each surface of the heat conducting plate is effectively utilized, and the heat dissipation efficiency of the single heat conducting plate 100 is high.
Referring to fig. 1 and 2a, in the present embodiment, a plurality of heat generating devices 400 provided on the rigid substrate 200 are attached to a surface of the rigid substrate 200 facing away from the heat conductive plate 100.
Referring to fig. 1 and 2b, in other embodiments, the surface of the rigid substrate 200 'facing away from the heat-conducting plate 100 has a plurality of grooves, and a plurality of heat-generating devices 400 disposed on the rigid substrate 200' are respectively attached to the bottom surfaces of the grooves.
The heat generating device 400 is disposed in the groove of the rigid substrate 200', so that the heat generating device 400 is closer to the heat conductive plate 100, and the heat conductive efficiency is higher.
Referring to fig. 1 and 2c, in some other embodiments, the rigid substrate 200 "has a cavity penetrating through the rigid substrate 200", and the plurality of heat generating devices disposed on the rigid substrate 200 "are respectively disposed in the cavity of the rigid substrate 200".
In particular, the rigid substrate is provided with a circuit for interconnecting the devices, and each of the heat generating devices 400 is electrically connected to the rigid substrate (including the rigid substrate 200, the rigid substrate 200', and the rigid substrate 200 ″), and the connection between the heat generating device and the rigid substrate is not shown in the above-mentioned drawings for the sake of simplicity. Those skilled in the art can select appropriate means to implement the connection, and the detailed description of the invention is omitted here.
In the present embodiment, the plurality of heat generating devices disposed on the rigid substrate 200 have a heat flux density higher than 1W/cm2A plurality of heat generating devices arranged on the flexible substrate 300, the heat flux density is lower than 1W/cm2. Since the heat flux density is positively correlated with the heat generation of the device, and the rigid substrate 200 is disposed on the top and bottom surfaces of the heat conducting plate 100, the top and bottom surfaces are generally surfaces with higher heat conducting efficiency of the heat conducting plate, and the heat conducting efficiency of the side surface of the heat conducting plate 100 is lower than that of the top and bottom surfaces, so that the heat generating device with higher heat flux density is provided400 are arranged on the rigid substrates 200 of the top end surface and the bottom end surface, and the heating device 400 with lower heat flux density is arranged on the flexible substrate 300 of the side surface, so that the device with higher heating corresponds to heat conduction with higher efficiency, and the heat dissipation balance of the whole module is facilitated.
The number of the flexible substrates 300 is at least two, and in the present embodiment, the number of the flexible substrates 300 is two. The two flexible substrates 300 are respectively located at two opposite sides of the heat conducting plate 100, and the rigid substrate 200 and the flexible substrate 100 are connected to enclose a closed figure on at least one section.
In this embodiment, the heat conducting plate 100 is a liquid cooling plate having a first side end surface and a second side end surface opposite to each other, the first side end surface and the second side end surface are respectively perpendicular to the top end surface and the bottom end surface, and the two flexible substrates 300 are respectively attached to the first side end surface and the second side end surface; a cavity is arranged in the liquid cooling plate, a plurality of heat exchange structures are arranged in the cavity, and a heat exchange flow passage is defined by the plurality of heat exchange structures and the wall surface of the cavity; the liquid cooling plate is also provided with a third side end surface and a fourth side end surface which are opposite, and the third side end surface and the fourth side end surface are respectively vertical to the top end surface and the bottom end surface; a liquid inlet 110 is arranged on the third side end face, a liquid outlet 120 is arranged on the fourth side end face, and the liquid inlet 110 and the liquid outlet 120 are respectively communicated with the heat exchange flow channel; the distance between the liquid inlet 110 and the bottom end surface is smaller than or equal to the distance between the liquid outlet 120 and the bottom end surface.
The distance between the liquid inlet 110 and the bottom end face of the liquid cooling plate is smaller than the distance between the liquid outlet 120 and the bottom end face, so that the horizontal position of the liquid inlet 110 is lower than the horizontal position of the liquid outlet 120, heat exchange media entering the flow channel in unit time can be retained in the flow channel as long as possible, the flow channel is filled as far as possible, the heat exchange media cannot be discharged from the liquid outlet rapidly, the heat exchange time is long, and the heat conduction capability of the liquid cooling plate is higher.
Specifically, each of the plurality of heat exchange structures extends into the cavity from the wall surface of the cavity, the plurality of heat exchange structures may be one or more of a column, a fin and a prism, and the distance between the wall surfaces of the cavity, at which the vertex distances of the plurality of heat exchange structures in the extending direction are opposite, is greater than zero.
Specifically, the plurality of heat exchange structures are arranged in an array or staggered manner. Through the arrangement of a plurality of heat exchange structures in the liquid cooling plate and the array or staggered arrangement, the contact area between the wall surface of the liquid cooling plate and a heat exchange medium can be increased, and the heat exchange efficiency is improved.
Specifically, the distance between adjacent heat exchange structures is 0.1 mm-10 mm, and the distance between the vertexes of the plurality of heat exchange structures in the extending direction and the wall surfaces of the cavity opposite to each other is 0.1 mm-10 mm.
In this embodiment, the plurality of heat generating devices 400 are disposed on the rigid substrate 200, and the heat flow density of each heat generating device 400 is different, wherein the distance between the heat generating device 400 with the higher heat flow density and the liquid inlet 110 is smaller than the distance between the heat generating device 400 with the lower heat flow density and the liquid inlet 110.
Because the temperature is the lowest when the heat exchange medium just gets into the cavity, and heat exchange efficiency is the strongest, therefore the position heat-conducting capacity that is closer to inlet 110 on the liquid cooling board is stronger, and the radiating effect is better, so through setting up the higher device 400 that generates heat of heat flux density to be closer to inlet 110 more, can make the bigger device 400 that generates heat correspond stronger heat-conducting capacity that generates heat, make the holistic heat dissipation of module more balanced.
In this embodiment, the wall surface of the liquid cooling plate can be selected from aluminum, copper, tungsten copper, molybdenum copper, ceramic, silicon or their composite materials. The heat exchange medium may be water, ethylene glycol, or a phase change coolant such as 1,1,1, 2-tetrafluoroethane (R134a), 2,3,3, 3-tetrafluoropropene (R1234 yf). In other embodiments, the heat exchange medium may be air.
In other embodiments, the liquid cooling plate may be connected to a compressor/micro pump, a condenser, a throttle valve, etc. to form a heat dissipation system, and the system is filled with water/coolant to perform refrigeration by single-phase or phase-change cooling.
In this embodiment, the heat generating device may be a die, a package, or a package module. The mounting of the heating device is realized by welding with solder or bonding with sintered metal. The mounting of the rigid substrate 200 and the flexible substrate 300 to the heat conductive plate 100 is achieved by a thermal interface material. In the present embodiment, the thermal interface material may include a thermal conductive paste, solder, or the like.
Example 2
The present invention also provides an electronic device, which is characterized by comprising the semiconductor device heat dissipation module in the above embodiment 1. Through pasting the rigid substrate that will be provided with the device that generates heat and the flexible substrate that is provided with the device that generates heat to top face, bottom face and the side of heat-conducting plate, effectively utilize a plurality of surfaces of heat-conducting plate to carry out the heat conduction to a plurality of devices that generate heat simultaneously, can realize the high-efficient heat dissipation to a plurality of devices that generate heat simultaneously. Meanwhile, the plurality of substrates are respectively arranged on the plurality of surfaces of the heat conducting plate, the bottom end surface and the side surface are utilized besides the top end surface, and the plurality of substrates share one heat conducting plate, so that the number of heating devices which can be supported by one heat conducting plate is increased, and compared with the scheme that a heat radiating device is arranged on one side of a single substrate, the module is smaller in size, saves space and is beneficial to miniaturization of the device. In addition, the rigid substrate of the top end face and the rigid substrate of the bottom end face are connected through the flexible substrates of the side faces, heat emitted by the heating device at a single position can be jointly born by the substrates and conducted to the heat conducting plate, so that the heat radiation of the whole heat conducting plate is relatively balanced, all surfaces of the heat conducting plate are effectively utilized, and the heat radiation efficiency of the single heat conducting plate is high.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A semiconductor device heat dissipation module, comprising:
the heat conduction plate comprises a top end surface and a bottom end surface which are opposite, and the top end surface and the bottom end surface are respectively one of two surfaces with the largest area in all the surfaces of the heat conduction plate;
the rigid substrate is provided with a plurality of heating devices and is attached to the top end face and the bottom end face;
the surface of the flexible substrate is attached with a plurality of heating devices, and the flexible substrate is attached to the side surface of the heat conducting plate; the flexible substrate extends to the top end face side partially, and the part of the flexible substrate extending to the top end face side is connected with the rigid substrate positioned on the top end face; the flexible substrate also extends to one side of the bottom end face partially, and the part of the flexible substrate extending to one side of the bottom end face is connected with the rigid substrate positioned on the bottom end face;
the flexible substrates are respectively positioned on two opposite side surfaces of the heat conducting plate, the rigid substrate is connected with the flexible substrates, and a closed pattern is enclosed on at least one section;
the heat conducting plate is a liquid cooling plate, the liquid cooling plate is provided with a first side end face and a second side end face which are opposite, the first side end face and the second side end face are respectively perpendicular to the top end face and the bottom end face, and the at least two flexible substrates are respectively attached to the first side end face and the second side end face;
a cavity is arranged in the liquid cooling plate, a plurality of heat exchange structures are arranged in the cavity, and a heat exchange flow channel is defined by the heat exchange structures and the wall surface of the cavity; the liquid cooling plate is also provided with a third side end surface and a fourth side end surface which are opposite, and the third side end surface and the fourth side end surface are respectively vertical to the top end surface and the bottom end surface; the third side end face is provided with a liquid inlet, the fourth side end face is provided with a liquid outlet, and the liquid inlet and the liquid outlet are respectively communicated with the heat exchange flow channel; the distance between the liquid inlet and the bottom end surface is smaller than or equal to the distance between the liquid outlet and the bottom end surface;
the heating devices are arranged on the rigid substrate, the heat flux density of each heating device is different, and the distance between the heating device with higher heat flux density and the liquid inlet is smaller than the distance between the heating device with lower heat flux density and the liquid inlet.
2. The semiconductor device heat dissipation module of claim 1,
the plurality of heating devices arranged on the rigid substrate are attached to the surface of the rigid substrate, which is back to the side of the heat conducting plate.
3. The semiconductor device heat dissipation module of claim 1,
the surface of the rigid substrate, which is back to one side of the heat conducting plate, is provided with a plurality of grooves, and the plurality of heating devices arranged on the rigid substrate are respectively attached to the bottom surfaces of the grooves.
4. The semiconductor device heat dissipation module of claim 1,
the rigid substrate is provided with a cavity penetrating through the rigid substrate, and the plurality of heating devices arranged on the rigid substrate are respectively arranged in the cavity of the rigid substrate.
5. The semiconductor device heat dissipation module of any one of claims 1-4,
the plurality of heating devices are arranged on the rigid substrate, and the heat flow density is higher than 1W/cm2A plurality of heating devices arranged on the flexible substrate and having a heat flux density lower than 1W/cm2。
6. The semiconductor device heat dissipation module of claim 1,
each of the plurality of heat exchange structures extends into the cavity from the wall surface of the cavity, the plurality of heat exchange structures can be one or more of a column, a fin and a prism, and the distance between the top points of the plurality of heat exchange structures in the extending direction and the wall surface of the cavity opposite to each other is larger than zero.
7. The semiconductor device heat dissipation module of claim 6,
the plurality of heat exchange structures are arranged in an array or staggered manner.
8. The semiconductor device heat dissipation module of claim 6,
the distance between the adjacent heat exchange structures is 0.1 mm-10 mm, and the distance between the vertexes of the heat exchange structures in the extending direction and the wall surfaces of the cavity opposite to each other is 0.1 mm-10 mm.
9. The semiconductor device heat dissipation module of claim 1,
the heating device is a bare chip, a packaging body or a packaging module.
10. An electronic device comprising the semiconductor device heat dissipation module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011635116.4A CN112768418B (en) | 2020-12-31 | 2020-12-31 | Semiconductor device heat dissipation module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011635116.4A CN112768418B (en) | 2020-12-31 | 2020-12-31 | Semiconductor device heat dissipation module and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112768418A CN112768418A (en) | 2021-05-07 |
| CN112768418B true CN112768418B (en) | 2022-07-19 |
Family
ID=75699668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011635116.4A Active CN112768418B (en) | 2020-12-31 | 2020-12-31 | Semiconductor device heat dissipation module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112768418B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6175497B1 (en) * | 1998-09-30 | 2001-01-16 | World Wiser Electronics Inc. | Thermal vias-provided cavity-down IC package structure |
| CN203827683U (en) * | 2014-05-22 | 2014-09-10 | 大连交通大学 | Locally-enhanced heat transfer type high-performance water-cooling plate |
| CN105489573A (en) * | 2016-01-18 | 2016-04-13 | 池州容尔电气科技有限责任公司 | Water-cooled heat radiator |
| CN105743323A (en) * | 2014-11-28 | 2016-07-06 | 财团法人工业技术研究院 | Power module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040233641A1 (en) * | 2003-05-19 | 2004-11-25 | Mark Moshayedi | Processor/memory module with foldable substrate |
-
2020
- 2020-12-31 CN CN202011635116.4A patent/CN112768418B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6175497B1 (en) * | 1998-09-30 | 2001-01-16 | World Wiser Electronics Inc. | Thermal vias-provided cavity-down IC package structure |
| CN203827683U (en) * | 2014-05-22 | 2014-09-10 | 大连交通大学 | Locally-enhanced heat transfer type high-performance water-cooling plate |
| CN105743323A (en) * | 2014-11-28 | 2016-07-06 | 财团法人工业技术研究院 | Power module |
| CN105489573A (en) * | 2016-01-18 | 2016-04-13 | 池州容尔电气科技有限责任公司 | Water-cooled heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112768418A (en) | 2021-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11915996B2 (en) | Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling | |
| US7888786B2 (en) | Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device | |
| US9412680B2 (en) | Semiconductor module and electrically-driven vehicle | |
| US20190206764A1 (en) | Thermal management component | |
| JP2002270743A (en) | Mounting structure of semiconductor element | |
| US20040188064A1 (en) | Channeled flat plate fin heat exchange system, device and method | |
| US20100117209A1 (en) | Multiple chips on a semiconductor chip with cooling means | |
| US9263365B2 (en) | Electronic component and electronic component cooling method | |
| US20130020053A1 (en) | Low-profile heat-spreading liquid chamber using boiling | |
| CN101840914A (en) | Power model with double-sided cooled of power overlay | |
| CN106558563B (en) | Power module and vehicle with same | |
| JP2008227150A (en) | Electronic apparatus | |
| US10388540B2 (en) | High-performance compliant heat-exchanger comprising vapor chamber | |
| WO2019194089A1 (en) | Electronic apparatus | |
| WO2011058622A1 (en) | Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device | |
| JP7176615B2 (en) | Electronics | |
| CN112768418B (en) | Semiconductor device heat dissipation module and electronic device | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN110043974B (en) | Radiator, air conditioner outdoor unit and air conditioner | |
| CN210014477U (en) | Radiator, air condensing units and air conditioner | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| JP2022524616A (en) | Cooling of electronic components by electrohydrodynamic flow unit | |
| CN111933600A (en) | DBC substrate, DBC substrate manufacturing method and power module | |
| US12027445B2 (en) | System for cooling semiconductor component, method of manufacturing the same, and semiconductor package having the system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |