KR102624601B1 - High strength printed circuit board with breakgae, warpage prvention and restoration function and method of manufacturing the same, and semiconductor package thereof - Google Patents

Abstract

A high-strength printed circuit board and its manufacturing method that can dramatically reduce or eliminate board bending by increasing dimensional stability, and have damage, bending prevention and restoration functions that can suppress damage such as tearing and creasing of the product during the work process. and, the semiconductor package is disclosed.
A high-strength printed circuit board with damage, bending prevention and restoration functions according to the present invention includes a core layer having an upper and lower surface; A first strength reinforcement pattern disposed on an edge of the lower surface of the core layer; Internal circuit patterns disposed on the top, bottom, and inside of the core layer; an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer; an external circuit pattern disposed on and inside the insulating layer and connected to the internal circuit pattern; a second strength reinforcement pattern disposed at an edge of the upper surface of the insulating layer; and a third strength reinforcement pattern disposed on an edge of the lower surface of the core layer and laminated on the first strength reinforcement pattern.

Description

High-strength printed circuit board having damage, bending prevention and restoration functions, manufacturing method thereof, and semiconductor package thereof

The present invention relates to a high-strength printed circuit board having damage, warping prevention and restoration functions, a method of manufacturing the same, and a semiconductor package thereof. More specifically, the present invention relates to a semiconductor package that can dramatically reduce or eliminate warpage of the board by increasing dimensional stability, etc. It relates to a high-strength printed circuit board with damage, bending prevention and restoration functions that can suppress damage such as tearing and creasing of products during work processes, a manufacturing method thereof, and a semiconductor package thereof.

Recently, due to the increased performance of electrical and electronic products, thinning, high density, and high mounting of semiconductor packages are emerging as important factors in response to the demand for lightness and miniaturization of electronic devices with reduced volume and weight.

Currently, as the memory capacity of computers, laptops, and mobile phones increases, the chip capacity such as large RAM (Random Access Memory) and flash memory is increasing, but there is a noticeable tendency for packages to become smaller. It's a situation.

Accordingly, the size of the package used as a core component is being researched and developed in a trend toward miniaturization, and various technologies are being proposed and researched for mounting a greater number of packages on a limited-sized board.

Conventional semiconductor packaging technology is evolving from flat two-dimensional packaging to 3D stacked packaging that maximizes the area efficiency of mounted components by shortening the wiring length between components. In line with these changes, there is a rapid trend toward lightness, thinness, and shortness. It is progressing well.

In particular, high-end smartphones adopt a PoP (package on package) type stacked package structure, and in order to reduce the thickness of the stacked package, the thickness of the printed circuit board must be further reduced. I ran into a problem.

However, in the past, during the PCB manufacturing process, products made of thin or fragile designs and materials caused defects such as bending, deformation, and damage of the substrate. To solve this problem, high costs are invested to remodel facilities, but this method has the problem of increasing costs such as facility investment.

Related prior literature includes Korean Patent Publication No. 10-2016-0033844 (published on March 29, 2016), which describes an embedded substrate having a heat sink for heat dissipation and a manufacturing method thereof.

The purpose of the present invention is to provide a high-strength printed circuit that can dramatically reduce or eliminate bending of the substrate by increasing dimensional stability, and has damage, bending prevention and restoration functions that can suppress damage such as tearing and creasing of products during work processes. To provide a substrate, a manufacturing method thereof, and a semiconductor package.

In order to achieve the above object, a high-strength printed circuit board having damage, bending prevention and restoration functions according to an embodiment of the present invention includes a core layer having an upper and lower surface; A first strength reinforcement pattern disposed on an edge of the lower surface of the core layer; Internal circuit patterns disposed on the top, bottom, and inside of the core layer; an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer; an external circuit pattern disposed on and inside the insulating layer and connected to the internal circuit pattern; a second strength reinforcement pattern disposed at an edge of the upper surface of the insulating layer; and a third strength reinforcement pattern disposed on an edge of the lower surface of the core layer and laminated on the first strength reinforcement pattern.

Each of the first, second and third strength reinforcement patterns includes a metal material made of one metal or an alloy of two or more selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, polyimide (PI), and polyethylene (PET). terephthalate), PES (polyether sulfone), PTFE (polytetrafluoroethylene), and PC (polycarbonate), and a single or clad form selected from a metal-polymer composite material that is a mixture of the metal material and the polymer material. It is formed of a composite material containing

The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the inside of the core layer.

Preferably, each of the first, second and third strength reinforcement patterns has a line shape when viewed in plan and is arranged to overlap each other at the same position.

Here, the second strength reinforcement pattern includes a second seed pattern and a second strength reinforcement metal pattern stacked on the second seed pattern, and the third strength reinforcement pattern includes a third seed pattern and the third strength reinforcement pattern. It includes a third strength reinforcing metal pattern laminated on the seed pattern.

Additionally, the printed circuit board includes a first solder mask pattern that covers the upper surface of the second strength reinforcement pattern, the external circuit pattern, and the insulating layer, and has a first opening exposing a portion of the external circuit pattern; and a second solder mask pattern covering lower surfaces of the first and third strength reinforcement patterns, the internal circuit pattern, and the core layer, and having a second opening exposing a portion of the internal circuit pattern.

In order to achieve the above object, a high-strength printed circuit board having damage, bending prevention and restoration functions according to a modified example of the present invention includes a core layer having an upper and lower surface; A first strength reinforcement pattern disposed on the edge portion and the center portion of the lower surface of the core layer, respectively; Internal circuit patterns disposed on the top, bottom, and inside of the core layer; an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer; an external circuit pattern disposed on and inside the insulating layer and connected to the internal circuit pattern; second strength reinforcing patterns disposed on edge portions and central portions of the upper surface of the insulating layer, respectively; and a third strength reinforcement pattern disposed on the edge portion and the center portion of the lower surface of the core layer, respectively, and laminated on the first strength reinforcement pattern.

The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the inside of the core layer.

Here, each of the first, second, and third strength reinforcement patterns is disposed in a dummy area and a strip area of the printed circuit board, respectively, and is arranged in a grid structure surrounding the boundary of the strip area, so that the printed circuit board They are placed at the edges and in the center, respectively.

In addition, each of the first, second, and third strength reinforcement patterns includes a dummy portion disposed in a dummy region of the printed circuit board and a strip portion disposed in a strip region of the printed circuit board, and the strip portion includes at least one are arranged in a circular structure and are placed at the edge and center of the printed circuit board, respectively.

More preferably, the dummy portion is disposed at four corners of the dummy area of the printed circuit board.

In order to achieve the above object, a semiconductor package having a high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention includes a core layer having an upper and lower surface, and an edge portion of the lower surface of the core layer. A first strength reinforcement pattern, an internal circuit pattern disposed on the upper surface, lower surface, and inside of the core layer, an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer, an upper surface of the insulating layer, and An external circuit pattern disposed on the inside and connected to the internal circuit pattern, a second strength reinforcement pattern disposed on an edge of the upper surface of the insulating layer, and a first strength reinforcement pattern disposed on the edge of the lower surface of the core layer. A printed circuit board including a third strength reinforcement pattern laminated thereon; At least one semiconductor chip mounted on the printed circuit board and electrically connected to the external circuit pattern; a molding member sealing the upper surfaces of the at least one semiconductor chip and the printed circuit board; and an external connection member attached to the internal circuit pattern.

Each of the first, second and third strength reinforcement patterns has a line shape when viewed in plan and is arranged to overlap each other at the same position.

Here, the semiconductor chip is flip chip bonded to the external circuit pattern of the printed circuit board through bumps.

A semiconductor package having a high-strength printed circuit board with damage, bending prevention and recovery functions according to a modification of the present invention to achieve the above object includes a core layer having an upper and lower surface, an edge portion and a central portion of the lower surface of the core layer. a first strength reinforcement pattern respectively disposed on the core layer, an internal circuit pattern disposed on the upper surface, lower surface, and inside of the core layer, an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer, and the insulation An external circuit pattern disposed on the upper surface and inside the layer and connected to the internal circuit pattern, a second strength reinforcement pattern disposed on the edge and center of the upper surface of the insulating layer, and the edge and center of the lower surface of the core layer Printed circuit boards disposed in each portion and including a third strength reinforcement pattern stacked on the first strength reinforcement pattern; At least one semiconductor chip mounted on the printed circuit board and electrically connected to the external circuit pattern; a molding member sealing the upper surfaces of the at least one semiconductor chip and the printed circuit board; and an external connection member attached to the internal circuit pattern.

Each of the first, second, and third strength reinforcement patterns is disposed in a dummy area and a strip area of the printed circuit board, respectively, and is arranged in a grid structure surrounding the boundary of the strip area, so as to form an edge portion of the printed circuit board. They are placed in the and central parts, respectively.

In addition, each of the first, second, and third strength reinforcement patterns includes a dummy portion disposed in a dummy region of the printed circuit board and a strip portion disposed in a strip region of the printed circuit board, and the strip portion includes at least one are arranged in a circular structure and are placed at the edge and center of the printed circuit board, respectively.

A method of manufacturing a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention to achieve the above object is (a) a carrier substrate in which a carrier metal layer and a carrier seed layer are sequentially laminated on both sides of the carrier substrate. Forming a first strength reinforcement pattern on edge portions of both sides; (b) sequentially laminating and pressing a core layer, a first seed layer, and a first metal layer on both sides of the carrier substrate on which the first strength reinforcement pattern is formed; (c) forming a first internal metal circuit layer by selectively patterning a first seed layer and a first metal layer located on both sides of the carrier substrate; (d) laminating and pressing an insulating layer in which a second seed layer and a second metal layer are sequentially laminated on both sides of the core layer on which the first internal metal circuit layer is formed; (e) separating the core layer on which the first internal metal circuit layer is formed, the second seed layer, and the insulating layer from the carrier substrate; (f) removing a portion of the second seed layer, the insulating layer, and the core layer, respectively, to form a first via hole and a second via hole exposing a portion of the first internal metal circuit layer to the outside; and (g) forming a circuit metal layer on the upper surface of the second seed layer and the insulating layer and inside the first via hole, and on the lower surface of the carrier seed layer and the core layer and inside the second via hole, and then selectively patterning to form an internal circuit. and forming a pattern, an external circuit pattern, a second strength reinforcement pattern, and a third strength reinforcement pattern.

Each of the first, second and third strength reinforcement patterns includes a metal material made of one metal or an alloy of two or more selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, polyimide (PI), and polyethylene (PET). terephthalate), PES (polyether sulfone), PTFE (polytetrafluoroethylene), and PC (polycarbonate), and a single or clad form selected from a metal-polymer composite material that is a mixture of the metal material and the polymer material. It is formed of a composite material containing

The first strength reinforcement pattern is formed by any one of adhesion, deposition, and plating.

In step (g), the second and third strength reinforcement patterns are formed simultaneously with the internal and external circuit patterns.

After step (g), (h) a first solder mask pattern covering the upper surface of the second strength reinforcement pattern, the external circuit pattern, and the insulating layer, and having a first opening exposing a portion of the external circuit pattern; It further includes forming a second solder mask pattern that covers lower surfaces of the first and third strength reinforcement patterns, the internal circuit pattern, and the core layer, and has a second opening exposing a portion of the internal circuit pattern. .

A high-strength printed circuit board with damage, bending prevention and recovery functions according to the present invention, and a method for manufacturing the same, and a semiconductor package thereof, are provided by adding metal to the edge of the substrate before or at the beginning of the process when damage is expected during the manufacturing process of the substrate. , by strengthening the strength by forming the first, second and third strength reinforcement patterns made of composite materials containing polymer resins or their clad form, securing dimensional stability, improving bending, preventing breakage, etc. Not only can the effect be achieved, but it can also be restored by reinforcing the area where bending or damage occurred.

As a result, the high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention has dimensional stability, etc. by introducing first, second and third strength reinforcement patterns selectively disposed at the edge of the board. By increasing the , not only can the warpage of the product be dramatically reduced or eliminated, but it can also become possible to restore it. In addition, it has a structural advantage that can prevent damage such as tearing or wrinkling of the product during the work process.

In addition, the high-strength printed circuit board having damage, bending prevention and restoration functions according to the present invention and its manufacturing method, and the semiconductor package thereof, are arranged in such a way that the first strength reinforcement pattern is embedded inside the core layer, thereby forming the core. Since the strength of the edge of the core layer can be strengthened without increasing the thickness of the layer, it may be possible to implement an ultra-thin structure.

In addition, the high-strength printed circuit board and its manufacturing method having damage, bending prevention and restoration functions according to the present invention, and the semiconductor package thereof have the first, second and third strength reinforcement patterns have the same line shape and are the same as each other. By arranging them so that they overlap, it is possible to dramatically reduce or eliminate warping of the product by increasing dimensional stability by reinforcing the strength of the edge of the substrate.

Figure 1 is a cross-sectional view showing a high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention.
Figure 2 is a plan view showing a high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention.
Figure 3 is a cross-sectional view showing a high-strength printed circuit board with damage, bending prevention and restoration functions according to a modification of the present invention.
Figures 4 and 5 are plan views showing a high-strength printed circuit board with damage, bending prevention and restoration functions according to modified examples of the present invention.
Figure 6 is a cross-sectional view showing a semiconductor package having a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention.
Figure 7 is a plan view showing a semiconductor package having a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention.
Figures 8 to 18 are cross-sectional process views showing a method of manufacturing a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms, but the present embodiments only serve to ensure that the disclosure of the present invention is complete and are within the scope of common knowledge in the technical field to which the present invention pertains. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, with reference to the attached drawings, a high-strength printed circuit board with damage, bending prevention and recovery functions, a manufacturing method thereof, and a semiconductor package thereof according to preferred embodiments of the present invention will be described in detail as follows.

Figure 1 is a cross-sectional view showing a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention, and Figure 2 is a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention. This is a top view showing the substrate.

Referring to Figures 1 and 2, the high-strength printed circuit board 100 having damage, bending prevention, and restoration functions according to an embodiment of the present invention includes a core layer 110, a first strength reinforcement pattern 120, and an internal circuit. It includes a pattern 130, an insulating layer 140, an external circuit pattern 150, a second strength reinforcement pattern 160, and a third strength reinforcement pattern 170.

The core layer 110 may have a plate shape having an upper surface 110a and a lower surface 110b. This core layer 110 is made of one or more materials selected from prepreg, ABF (Ajinomoto Build-up Film), polyimide resin, epoxy resin, RCC (resin coated copper), PID (Photo-Imageable Dielectric), etc. may be used, but is not limited thereto.

In the present invention, the core layer 110 preferably has a thickness of 10 to 50㎛, because handling of the core layer 110 is possible only when it has the above thickness range, and it is suitable for implementing an ultra-thin design. .

The first strength reinforcement pattern 120 is disposed on the edge of the lower surface 110b of the core layer 110. Here, the first strength reinforcement pattern 120 is preferably disposed inside the lower surface 110b of the core layer 110 and embedded within the core layer 110. This first strength reinforcement pattern 120 is fixedly installed in the form of being buried inside the core layer 110, so that it is attached to the edge of the core layer 110 without increasing the thickness of the core layer 110. It becomes possible to reinforce strength.

This first strength reinforcement pattern 120 is a metal material made of one metal or an alloy of two or more selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, polyimide (PI), polyethylene terephthalate (PET), and PES. It is a composite material containing one or more polymer materials selected from (polyether sulfone), PTFE (polytetrafluoroethylene), and PC (polycarbonate), and a single or clad form selected from metal-polymer composite materials that are a mixture of metal materials and polymer materials. is formed

The internal circuit pattern 130 is disposed on the upper surface 110a, lower surface 110b, and inside the core layer 110. Here, the internal circuit pattern 130 is formed of one or more materials among copper (Cu), nickel (Ni), titanium (Ti), aluminum (Al), gold (Au), silver (Ag), and chromium (Cr). It can be used, and it is preferable to use copper (Cu).

The internal circuit pattern 130 includes a first internal metal circuit layer 132 disposed on the upper surface 110a of the core layer 110, and a second internal metal circuit layer disposed on the lower surface 110b of the core layer 110. It has 134 and an internal via electrode 136 disposed inside the core layer 110 to electrically connect the first and second internal metal circuit layers 132 and 134.

Here, the first internal metal circuit layer 132 has a two-layer structure including an internal metal seed layer 132a and an internal metal pattern 132b stacked on the internal metal seed layer 132a.

The insulating layer 140 covers the internal circuit pattern 130 and is laminated on the upper surface 110a of the core layer 110. Accordingly, the upper surface 140a of the insulating layer 140 is disposed on the outside, and the lower surface 140b of the insulating layer 140 is disposed to be bonded to the upper surface 110a of the core layer 110.

Here, the insulating layer 140 is made of one or more selected from prepreg, ABF (Ajinomoto Build-up Film), polyimide resin, epoxy resin, RCC (resin coated copper), PID (Photo-Imageable Dielectric), etc. Any material may be used, but is not limited thereto.

The external circuit pattern 150 is disposed on and inside the top surface 140a of the insulating layer 140 and is electrically connected to the internal circuit pattern 130.

Here, the external circuit pattern 150, like the internal circuit pattern 130, includes copper (Cu), nickel (Ni), titanium (Ti), aluminum (Al), gold (Au), silver (Ag), and chromium. It may be formed of one or more materials selected from (Cr), and it is preferable to use copper (Cu).

This external circuit pattern 150 is disposed inside the insulating layer 140 and the external metal circuit layer 152 disposed on the upper surface 140a of the insulating layer 140, and is connected to the external metal circuit layer 152 and the external metal circuit layer 152. 1 It has an external via electrode 154 that electrically connects the internal circuit metal layer 132.

Here, the external metal circuit layer 152 has a two-layer structure including an external metal seed layer 152a and an external metal pattern 152b stacked on the external metal seed layer 152a.

The second strength reinforcement pattern 160 is disposed at the edge of the upper surface 140a of the insulating layer 140. Here, the second strength reinforcement pattern 160 may be formed on the same layer and of the same material as the external circuit pattern 150. In this case, the second strength reinforcement pattern 160 may have a two-layer structure including a second seed pattern 162 and a second strength reinforcement metal pattern 164 stacked on the second seed pattern 162. there is.

In addition, the second strength reinforcement pattern 160 may be disposed on the same layer as the external circuit pattern 150, but may be formed of a different material from the external circuit pattern 150. However, considering the process cost, it is more preferable that the second strength reinforcement pattern 160 is formed on the same layer and of the same material as the external circuit pattern 150.

This second strength reinforcement pattern 160, like the first strength reinforcement pattern 120, is a metal material made of one metal selected from Cu, Ag, Al, Ni, Cr, Ti, and Si or an alloy of two or more, One or more polymer materials selected from PI (polyimide), PET (polyethylene terephthalate), PES (polyether sulfone), PTFE (polytetrafluoroethylene), and PC (polycarbonate), and a single metal-polymer composite material selected from a mixture of metal materials and polymer materials. Or, it is formed of a composite material including a clad form.

The third strength reinforcement pattern 170 is disposed on the edge of the lower surface 110b of the core layer 110 and is laminated on the first strength reinforcement pattern 120. Here, the third strength reinforcement pattern 170 may be formed of the same material in the same layer as the internal circuit pattern 130, more specifically, the second internal metal circuit layer 134 and the internal via electrode 136. In this case, the third strength reinforcement pattern 170 may have a two-layer structure including a third seed pattern 172 and a third strength reinforcement metal pattern 174 stacked on the third seed pattern 172. there is.

In addition, the third strength reinforcement pattern 170 may be disposed on the same layer as the external circuit pattern 150, but may be formed of a different material from the external circuit pattern 150. However, considering the process cost, it is more preferable that the third strength reinforcement pattern 170 is formed on the same layer and of the same material as the internal circuit pattern 130.

This third strength reinforcement pattern 170, like the first strength reinforcement pattern 120, is a metal material made of one metal selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, or an alloy of two or more, One or more polymer materials selected from PI (polyimide), PET (polyethylene terephthalate), PES (polyether sulfone), PTFE (polytetrafluoroethylene), and PC (polycarbonate), and a single metal-polymer composite material selected from a mixture of metal materials and polymer materials. Or, it is formed of a composite material including a clad form.

As shown in FIG. 2, each of the first, second, and third strength reinforcement patterns 120, 160, and 170 has a line shape when viewed in plan, and is preferably arranged to overlap each other at the same position. do. In this way, the first, second, and third strength reinforcement patterns 120, 160, and 170 have the same line shape and are arranged to overlap each other at the same position, thereby increasing the strength of the edge portion of the substrate. By increasing stability, it is possible to dramatically reduce or eliminate product warping.

In addition, in the present invention, the first, second, and third strength reinforcement patterns 120, 160, and 170 are formed together during the manufacturing process of the printed circuit board 100, thereby preventing damage such as tearing or creasing of the product during the work process. can be suppressed.

In addition, the high-strength printed circuit board 100 having damage, bending prevention, and restoration functions according to an embodiment of the present invention further includes a first solder mask pattern 180 and a second solder mask pattern 190.

The first solder mask pattern 180 covers the second strength reinforcement pattern 160, the external circuit pattern 150, and the upper surface 140a of the insulating layer 140, and exposes a portion of the external circuit pattern 150. It has a first opening (G1).

The second solder mask pattern 190 covers the first and third strength reinforcement patterns 120 and 170, the internal circuit pattern 130, and the lower surface 110b of the core layer 110, and the internal circuit pattern 130 It has a second opening (G2) exposing a portion of.

Each of these first and second solder mask patterns 180 and 190 is a photo solder resist, a liquid photosensitive coverlay, a photo polyimide film, and an epoxy resin. It is formed of one or more materials selected from the like.

The high-strength printed circuit board with damage, bending prevention, and recovery functions according to the above-described embodiment of the present invention has metal, polymer resin, or By reinforcing strength by forming the first, second and third strength reinforcement patterns made of composite materials containing these clad types, effects such as securing dimensional stability, improving bending, and preventing damage can be obtained. In addition, it can be restored by reinforcing the area where bending or damage occurred.

As a result, the high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention has dimensional stability, etc. by introducing first, second and third strength reinforcement patterns selectively disposed at the edge of the board. By increasing the , not only can the warpage of the product be dramatically reduced or eliminated, but it can also become possible to restore it. In addition, it has a structural advantage that can prevent damage such as tearing or wrinkling of the product during the work process.

In addition, the high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention increases the thickness of the core layer by arranging the first strength reinforcement pattern in a form embedded in the interior of the core layer. Since the strength of the edge of the core layer can be strengthened without any additional material, it may be possible to implement an ultra-thin structure.

In addition, a high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention has the first, second and third strength reinforcement patterns having the same line shape and arranged to overlap each other at the same position. As a result, dimensional stability is increased by reinforcing the strength of the edge of the substrate, thereby dramatically reducing or eliminating product warping.

Meanwhile, Figure 3 is a cross-sectional view showing a high-strength printed circuit board with damage, bending prevention and restoration functions according to a modified example of the present invention, and Figures 4 and 5 are a cross-sectional view showing damage, bending prevention and restoration according to the modified examples of the present invention. This is a plan view showing a functional high-strength printed circuit board.

As shown in Figures 3 and 4, the high-strength printed circuit board 100 having damage, bending prevention and restoration functions according to a modified example of the present invention has first, second and third strength reinforcement patterns 120 and 160. , 170), it has substantially the same configuration as the embodiment described with reference to FIGS. 1 and 2, so redundant description will be omitted and the description will focus on the differences.

The high-strength printed circuit board 100 having damage, bending prevention and restoration functions according to a modified example of the present invention is provided by referring to FIGS. 1 and 2 and the first strength reinforcement pattern 120 and the second strength reinforcement pattern. There is a difference only in the arrangement structure of (160) and the third strength reinforcement pattern (170).

That is, the first strength reinforcement pattern 120 is disposed on the edge and center portion of the lower surface 110b of the core layer 110, and the second strength reinforcement pattern 160 is on the upper surface 140a of the insulating layer 140. It is disposed at the edge and the center, respectively, and the third strength reinforcement pattern 170 is disposed at the edge and the center of the lower surface 110b of the core layer 110, respectively, and is laminated on the first strength reinforcement pattern 120. do.

At this time, the first, second, and third strength reinforcement patterns 120, 160, and 170 are each disposed in the dummy area DA and the strip area SA of the printed circuit board 100, respectively, and form the strip area SA. It can be arranged in a lattice structure surrounding the boundary of . Accordingly, the first, second, and third strength reinforcement patterns 120, 160, and 170 are respectively disposed at the edge and center of the printed circuit board 100.

In this way, the first, second, and third strength reinforcement patterns 120, 160, and 170 are respectively disposed at the center portion as well as the edge portion of the core layer 110, thereby providing greater strength compared to the embodiment. It has the structural advantage of being able to reinforce. As a result, the modified example of the present invention provides strength reinforcement compared to the embodiment by introducing the first, second, and third strength reinforcement patterns 120, 160, and 170 that are selectively disposed at the edge and center of the substrate. As the effect is superior, dimensional stability can be further improved, dramatically reducing or eliminating product warping, and damage such as tearing or creasing of the product during the work process can be suppressed in advance.

In addition, as shown in FIG. 5, each of the first, second, and third strength reinforcement patterns 120, 160, and 170 is a dummy portion 122 disposed in the dummy area DA of the printed circuit board 100. and a strip portion 124 disposed in the strip area SA of the printed circuit board 100.

Here, the dummy portion DA of the printed circuit board 100 is preferably disposed at each of the four corners where stress is concentrated. In particular, it is preferable that the strip portion SA of the printed circuit board 100 is arranged in at least one circular structure and disposed at the edge and the center of the printed circuit board 100, respectively.

Meanwhile, Figure 6 is a cross-sectional view showing a semiconductor package having a high-strength printed circuit board with damage, bending prevention and restoration functions according to an embodiment of the present invention, and Figure 7 is a cross-sectional view showing damage, bending prevention and restoration according to an embodiment of the present invention. This is a plan view showing a semiconductor package with a functional high-strength printed circuit board.

Referring to Figures 6 and 7, a semiconductor package 200 having a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention includes a printed circuit board 100, a semiconductor chip 210, It includes a molding member 220 and an external connection member 230.

Here, the printed circuit board 100 may be substantially the same as the printed circuit board described with reference to FIGS. 1 and 2 . That is, the printed circuit board 100 includes a core layer 110 having an upper surface 110a and a lower surface 110b, and a first strength reinforcement pattern 120 disposed on the edge of the lower surface 110b of the core layer 110. and the upper surface 110a, the lower surface 110b of the core layer 110, and the internal circuit pattern 130 disposed therein, covering the internal circuit pattern 130, and the upper surface 110a of the core layer 110. The insulating layer 140 laminated on the top surface 140a of the insulating layer 140 and the external circuit pattern 150 disposed inside and connected to the internal circuit pattern 130, and the top surface 140a of the insulating layer 140. ) and a third strength reinforcement pattern disposed on the edge of the lower surface 110b of the core layer 110 and stacked on the first strength reinforcement pattern 120. Includes (170).

At least one semiconductor chip 210 is mounted on the printed circuit board 100 and is electrically connected to the external circuit pattern 150. At this time, the semiconductor chip 210 is physically attached to the printed circuit board 100 via an adhesive (not shown). In addition, the bonding pad 215 of the semiconductor chip 210 is electrically connected to the external circuit pattern 150 of the printed circuit board 100 by flip chip bonding through the bump 240.

This semiconductor chip 210 may be a memory chip or a driving chip, but is not limited thereto. Although not shown in detail in the drawings, the semiconductor chip 210 may be electrically connected to the external circuit pattern 150 of the printed circuit board 100 via a metal wire or a through electrode instead of the bump 215.

The molding member 220 seals the upper surface of at least one semiconductor chip 210 and the printed circuit board 100. This molding member 220 serves to protect the external circuit pattern 150 and the semiconductor chip 210 from external shock. For the molding member 220, for example, an epoxy molding compound may be used.

The external connection member 230 is attached to the internal circuit pattern 130. Solder balls may be used as these external connection members 230.

Hereinafter, a method for manufacturing a high-strength printed circuit board with damage, warpage prevention, and restoration functions according to an embodiment of the present invention will be described with reference to the attached drawings.

Figures 8 to 18 are cross-sectional process views showing a method of manufacturing a high-strength printed circuit board with damage, bending prevention, and restoration functions according to an embodiment of the present invention.

As shown in FIG. 8, a first strength reinforcement pattern 120 is formed on the edges of both sides of the carrier substrate 10, in which the carrier metal layer 14 and the carrier seed layer 16 are sequentially laminated on both sides of the carrier substrate 12. forms.

Here, the first strength reinforcement pattern 120 is a metal material made of one metal selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, or an alloy of two or more, polyimide (PI), polyethylene terephthalate (PET), A composite material containing one or more polymer materials selected from PES (polyether sulfone), PTFE (polytetrafluoroethylene), and PC (polycarbonate), and a single or clad form selected from metal-polymer composite materials that are a mixture of metal materials and polymer materials. is formed by

At this time, the first strength reinforcement pattern 120 is preferably formed by any one of adhesion, deposition, and plating. That is, the first strength reinforcement pattern 120 may be directly attached to both sides of the carrier substrate 10 via an adhesive. Additionally, the first strength reinforcement pattern 120 may be formed directly on both sides of the carrier substrate 120 using a deposition method such as sputtering, electrolytic plating, or electroless plating.

Next, as shown in FIG. 9, a core layer 110, a first seed layer 112, and a first metal layer 114 are formed on both sides of the carrier substrate 10 on which the first strength reinforcement pattern 120 is formed. Each is laminated and pressed in turn.

Here, the core layer 110 is made of one or more materials selected from prepreg, ABF (Ajinomoto Build-up Film), polyimide resin, epoxy resin, RCC (resin coated copper), PID (Photo-Imageable Dielectric), etc. Any material may be used, but is not limited thereto.

In the present invention, the core layer 110 preferably has a thickness of 10 to 50㎛ after compression, which is necessary to have the above thickness range to enable handling of the core layer 110 and to realize an ultra-thin shape. Because it is suitable.

As shown in FIG. 10, the first seed layer (112 in FIG. 9) and the first metal layer (114 in FIG. 9) located on both sides of the carrier substrate 10 are selectively patterned to form a first internal metal circuit layer. It forms (132).

Accordingly, the first internal metal circuit layer 132 has a two-layer structure including an internal metal seed layer 132a and an internal metal pattern 132b stacked on the internal metal seed layer 132a.

Next, the insulating layer 140, in which the second seed layer 151 and the second metal layer 153 are sequentially laminated, is stacked on both sides of the core layer 110 on which the first internal metal circuit layer 132 is formed and pressed. . Here, the insulating layer 140, the second seed layer 151, and the second metal layer 153 are stacked and pressed on both sides of the core layer 110 on which the first internal metal circuit layer 132 is formed. It is desirable.

Here, the insulating layer 140 is made of one or more selected from prepreg, ABF (Ajinomoto Build-up Film), polyimide resin, epoxy resin, RCC (resin coated copper), PID (Photo-Imageable Dielectric), etc. Any material may be used, but is not limited thereto.

As shown in FIG. 11, the core layer 110 on which the first internal metal circuit layer 132 is formed, the second seed layer 151, and the insulating layer 140 are separated from the carrier substrate 10.

In this step, it is preferable to remove the second metal layer 153 on the insulating layer 140 and leave the carrier seed layer 16 located on the carrier substrate 10 to be transferred to the core layer 110.

As shown in FIG. 12, the second seed layer 151, the insulating layer 140, and a portion of the core layer 110 are each removed to expose a portion of the first internal metal circuit layer 132 to the outside. A first via hole (V1) and a second via hole (V2) are formed.

Here, each of the first and second via holes V1 and V2 may be formed by mechanical drilling, laser drilling, etc., but is not limited thereto. The upper surface of the first internal metal circuit layer 132 is exposed to the outside by the first via hole (V1), and the lower surface of the first internal metal circuit layer 132 is exposed to the outside by the second via hole (V2). exposed.

As shown in FIG. 13, the upper surface 140a of the second seed layer 151 and the insulating layer 140 and the inside of the first via hole (V1 in FIG. 12), the carrier seed layer 16 and the core layer 110 ) and the circuit metal layer 145 is formed inside the lower surface 110b and the second via hole (V2 in FIG. 12).

Here, the circuit metal layer 145 may be formed of one or more materials selected from copper (Cu), nickel (Ni), titanium (Ti), aluminum (Al), gold (Au), silver (Ag), and chromium (Cr). Among these, it is preferable to use copper (Cu). This circuit metal layer 145 may be formed by electrolytic plating using the second seed layer 151 and the carrier seed 16, but is not limited thereto.

Next, as shown in FIG. 14, the second seed layer (151 in FIG. 13), the top surface 140a of the insulating layer 140, the inside of the first via hole, the carrier seed layer (16 in FIG. 13), and the core By selectively patterning the circuit metal layer (145 in FIG. 13) formed inside the lower surface 110b of the layer 110 and the second via hole, the internal circuit pattern 130, the external circuit pattern 150, and the second strength reinforcement pattern are formed. (160) and a third strength reinforcement pattern (170) are formed.

Here, the second and third strength reinforcement patterns 160 and 170 may be formed in a separate process after forming the internal circuit pattern 130 and the external circuit pattern 150, but considering process time and cost, etc. In this case, it is more preferable to form the second and third strength reinforcement patterns 160 and 170 simultaneously with the internal and external circuit patterns 130 and 150.

The internal circuit pattern 130 includes a first internal metal circuit layer 132 disposed on the upper surface 110a of the core layer 110, and a second internal metal circuit layer disposed on the lower surface 110b of the core layer 110. It has 134 and an internal via electrode 136 disposed inside the core layer 110 to electrically connect the first and second internal metal circuit layers 132 and 134. Here, the first internal metal circuit layer 132 has a two-layer structure including an internal metal seed layer 132a and an internal metal pattern 132b stacked on the internal metal seed layer 132a.

The external circuit pattern 150 is disposed inside the insulating layer 140 and the external metal circuit layer 152 disposed on the upper surface 140a of the insulating layer 140, and includes the external metal circuit layer 152 and the first It has an external via electrode 154 that electrically connects the internal circuit metal layer 132. Here, the external metal circuit layer 152 has a two-layer structure including an external metal seed layer 152a and an external metal pattern 152b stacked on the external metal seed layer 152a.

In addition, the second strength reinforcement pattern 160 is disposed at the edge of the upper surface 140a of the insulating layer 140. The second strength reinforcement pattern 160 may have a two-layer structure including a second seed pattern 162 and a second strength reinforcement metal pattern 164 stacked on the second seed pattern 162.

Additionally, the third strength reinforcement pattern 170 is disposed on the edge of the lower surface 110b of the core layer 110 and is laminated on the first strength reinforcement pattern 120. The third strength reinforcement pattern 170 may have a two-layer structure including a third seed pattern 172 and a third strength reinforcement metal pattern 174 stacked on the third seed pattern 172.

Next, as shown in FIG. 15, the second strength reinforcement pattern 160, the external circuit pattern 150, and the first solder mask pattern 180 covering the upper surface 140a of the insulating layer 140, and the A second solder mask pattern 190 is formed to cover the first and third strength reinforcement patterns 120 and 170, the internal circuit pattern 130, and the lower surface 110b of the core layer 110.

Here, the first and second solder mask patterns 180 and 190 each include photo solder resist, liquid photosensitive coverlay, photo polyimide film, and epoxy. It is formed of one or more materials selected from resin, etc.

As shown in FIG. 16, a first opening G1 is exposed to a portion of the external circuit pattern 150 by removing the first solder mask pattern 180 at a position corresponding to the external circuit pattern 150; The second solder mask pattern 190 at a position corresponding to the internal circuit pattern 130 is removed to form a second opening G2 exposing a portion of the internal circuit pattern 130.

With this, the method for manufacturing a high-strength printed circuit board with damage, warpage prevention, and restoration functions according to an embodiment of the present invention can be completed.

Meanwhile, as shown in FIG. 17, in order to manufacture a semiconductor package, it is electrically connected to the external circuit pattern 150 exposed through the first opening (G1 in FIG. 16) on the first solder mask pattern 180. After mounting the at least one semiconductor chip 210 , the at least one semiconductor chip 210 and the first solder mask pattern 180 may be sealed with the molding member 220 .

At this time, the semiconductor chip 210 may be physically attached to the printed circuit board 100 via an adhesive (not shown). In addition, the semiconductor chip 210 is flip-chip bonded to the external circuit pattern 150 of the printed circuit board 210 and electrically connected to the bump 2240.

This semiconductor chip 210 may be a memory chip or a driving chip, but is not limited thereto. Although not shown in detail in the drawings, the semiconductor chip 210 may be electrically connected to the external circuit pattern 150 of the printed circuit board 100 via a metal wire or through electrode instead of the bump 240.

For the molding member 220, for example, an epoxy molding compound may be used.

Next, as shown in FIG. 18, the external connection member 230 is attached to the internal circuit pattern 130 exposed by the second opening (G2 in FIG. 16). Here, a solder ball may be used as the external connection member 230.

Although the above description focuses on the embodiments of the present invention, various changes or modifications can be made at the level of a person skilled in the art in the technical field to which the present invention pertains. These changes and modifications can be said to belong to the present invention as long as they do not depart from the scope of the technical idea provided by the present invention. Therefore, the scope of rights of the present invention should be determined by the claims described below.

100: printed circuit board 110: core layer
120: First strength reinforcement pattern 130: Internal circuit pattern
140: Insulating layer 150: External circuit pattern
160: Second strength reinforcement pattern 170: Third strength reinforcement pattern
180: first solder mask pattern 190: second solder mask pattern
G1, G2: first and second openings

Claims (22)

A core layer having an upper and lower surface;
A first strength reinforcement pattern disposed on an edge of the lower surface of the core layer;
Internal circuit patterns disposed on the top, bottom, and inside of the core layer;
an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer;
an external circuit pattern disposed on and inside the insulating layer and connected to the internal circuit pattern;
a second strength reinforcement pattern disposed at an edge of the upper surface of the insulating layer; and
It includes a third strength reinforcement pattern disposed on an edge of the lower surface of the core layer and laminated on the first strength reinforcement pattern,
The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the interior of the core layer,
Each of the first, second and third strength reinforcement patterns has the same line shape when viewed in plan, and the first, second and third strength reinforcement patterns are arranged to overlap each other at the same position. A high-strength printed circuit board with features that prevent damage, bending, and restore functions.
According to paragraph 1,
Each of the first, second and third strength reinforcement patterns is
A metal material made of one metal selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, or an alloy of two or more,
At least one polymer material selected from polyimide (PI), polyethylene terephthalate (PET), polyether sulfone (PES), polytetrafluoroethylene (PTFE), and polycarbonate (PC);
A high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that it is formed of a composite material containing a single or clad form selected from the metal-polymer composite material mixed with the metal material and the polymer material.
delete delete According to paragraph 1,
The second strength reinforcement pattern includes a second seed pattern and a second strength reinforcement metal pattern stacked on the second seed pattern,
The third strength reinforcement pattern is a high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that it includes a third seed pattern and a third strength reinforcement metal pattern laminated on the third seed pattern.
According to paragraph 1,
The printed circuit board is
a first solder mask pattern covering the second strength reinforcement pattern, an external circuit pattern, and an upper surface of the insulating layer, and having a first opening exposing a portion of the external circuit pattern; and
a second solder mask pattern covering lower surfaces of the first and third strength reinforcement patterns, the internal circuit pattern, and the core layer, and having a second opening exposing a portion of the internal circuit pattern;
A high-strength printed circuit board with damage, bending prevention, and restoration functions, further comprising:
A core layer having an upper and lower surface;
A first strength reinforcement pattern disposed on the edge portion and the center portion of the lower surface of the core layer, respectively;
Internal circuit patterns disposed on the top, bottom, and inside of the core layer;
an insulating layer covering the internal circuit pattern and laminated on the upper surface of the core layer;
an external circuit pattern disposed on and inside the insulating layer and connected to the internal circuit pattern;
second strength reinforcing patterns disposed on edge portions and central portions of the upper surface of the insulating layer, respectively; and
A third strength reinforcement pattern is disposed on the edge and the center of the lower surface of the core layer, respectively, and is laminated on the first strength reinforcement pattern.
The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the interior of the core layer,
Each of the first, second and third strength reinforcement patterns is disposed in a dummy area located at an edge and a strip area located in a central part, and is arranged in a grid structure surrounding the boundary of the strip area, A high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that the first, second and third strength reinforcement patterns are arranged to overlap each other at the same position.
delete In clause 7,
Each of the first, second and third strength reinforcement patterns is
Damage, characterized in that it is disposed in the dummy area and the strip area of the printed circuit board, respectively, and is arranged in a lattice structure surrounding the border of the strip area, respectively, and arranged in the edge portion and the center portion of the printed circuit board, respectively. High-strength printed circuit board with bending prevention and restoration functions.
In clause 7,
Each of the first, second and third strength reinforcement patterns is
It includes a dummy portion disposed in a dummy area of the printed circuit board, and a strip portion disposed in a strip area of the printed circuit board,
A high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that the strip portion is arranged in at least one circular structure and disposed at an edge portion and a center portion of the printed circuit board, respectively.
According to clause 10,
The dummy part
A high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that it is disposed at the four corners of the dummy area of the printed circuit board.
A core layer having an upper surface and a lower surface, a first strength reinforcement pattern disposed on an edge of the lower surface of the core layer, an internal circuit pattern disposed on the upper surface, a lower surface, and inside the core layer, and covering the internal circuit pattern. , an insulating layer laminated on the upper surface of the core layer, an external circuit pattern disposed on the upper surface and inside the insulating layer and connected to the internal circuit pattern, and a second strength reinforcement pattern disposed at an edge of the upper surface of the insulating layer. and a printed circuit board disposed on an edge of the lower surface of the core layer and including a third strength reinforcement pattern stacked on the first strength reinforcement pattern;
At least one semiconductor chip mounted on the printed circuit board and electrically connected to the external circuit pattern;
a molding member sealing the upper surfaces of the at least one semiconductor chip and the printed circuit board; and
It includes an external connection member attached to the internal circuit pattern,
The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the interior of the core layer,
Each of the first, second and third strength reinforcement patterns has the same line shape when viewed in plan, and the first, second and third strength reinforcement patterns are arranged to overlap each other at the same position. A semiconductor package with a high-strength printed circuit board that is characterized by damage, bending prevention, and restoration functions.
delete According to clause 12,
The semiconductor chip is
A semiconductor package having a high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that flip chip bonding to the external circuit pattern of the printed circuit board through bumps.
A core layer having an upper surface and a lower surface, a first strength reinforcement pattern disposed on the edge portion and a central portion of the lower surface of the core layer, an internal circuit pattern disposed on the upper surface, a lower surface, and an inside of the core layer, and the internal circuit Covering the pattern, an insulating layer laminated on the upper surface of the core layer, an external circuit pattern disposed on the upper surface and inside the insulating layer and connected to the internal circuit pattern, and at the edge and center of the upper surface of the insulating layer A printed circuit board including a second strength reinforcement pattern respectively disposed at an edge portion and a center portion of the lower surface of the core layer and a third strength reinforcement pattern laminated on the first strength reinforcement pattern;
At least one semiconductor chip mounted on the printed circuit board and electrically connected to the external circuit pattern;
a molding member sealing the upper surfaces of the at least one semiconductor chip and the printed circuit board; and
It includes an external connection member attached to the internal circuit pattern,
The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the interior of the core layer,
Each of the first, second and third strength reinforcement patterns is disposed in a dummy area located at an edge and a strip area located in a central part, and is arranged in a lattice structure surrounding the boundary of the strip area, A semiconductor package having a high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that the first, second and third strength reinforcement patterns are arranged to overlap each other at the same position.
According to clause 15,
Each of the first, second and third strength reinforcement patterns is
Damage, characterized in that it is disposed in the dummy area and the strip area of the printed circuit board, respectively, and is arranged in a lattice structure surrounding the border of the strip area, respectively, and arranged in the edge portion and the center portion of the printed circuit board, respectively. A semiconductor package with a high-strength printed circuit board that has bending prevention and restoration functions.
According to clause 15,
Each of the first, second and third strength reinforcement patterns is
It includes a dummy portion disposed in a dummy area of the printed circuit board, and a strip portion disposed in a strip area of the printed circuit board,
A semiconductor package having a high-strength printed circuit board with damage, bending prevention, and restoration functions, wherein the strip portion is arranged in at least one circular structure and disposed at an edge portion and a center portion of the printed circuit board, respectively.
(a) forming a first strength reinforcement pattern on the edges of both sides of a carrier substrate in which a carrier metal layer and a carrier seed layer are sequentially stacked on both sides of the carrier substrate;
(b) sequentially laminating and pressing a core layer, a first seed layer, and a first metal layer on both sides of the carrier substrate on which the first strength reinforcement pattern is formed;
(c) forming a first internal metal circuit layer by selectively patterning a first seed layer and a first metal layer located on both sides of the carrier substrate;
(d) laminating and pressing an insulating layer in which a second seed layer and a second metal layer are sequentially laminated on both sides of the core layer on which the first internal metal circuit layer is formed;
(e) separating the core layer on which the first internal metal circuit layer is formed, the second seed layer, and the insulating layer from the carrier substrate;
(f) removing a portion of the second seed layer, the insulating layer, and the core layer, respectively, to form a first via hole and a second via hole exposing a portion of the first internal metal circuit layer to the outside; and
(g) forming a circuit metal layer on the upper surface of the second seed layer and the insulating layer and inside the first via hole, and on the lower surface of the carrier seed layer and the core layer and inside the second via hole, and then selectively patterning to form an internal circuit pattern And forming an external circuit pattern, a second strength reinforcement pattern, and a third strength reinforcement pattern,
The first strength reinforcement pattern is disposed on the inside of the lower surface of the core layer and embedded in the interior of the core layer,
Each of the first, second and third strength reinforcement patterns has the same line shape when viewed in plan, and the first, second and third strength reinforcement patterns are arranged to overlap each other at the same position. A method of manufacturing a high-strength printed circuit board featuring damage, bending prevention, and restoration functions.
According to clause 18,
Each of the first, second and third strength reinforcement patterns is
A metal material made of one metal selected from Cu, Ag, Al, Ni, Cr, Ti, and Si, or an alloy of two or more,
At least one polymer material selected from polyimide (PI), polyethylene terephthalate (PET), polyether sulfone (PES), polytetrafluoroethylene (PTFE), and polycarbonate (PC);
A method of manufacturing a high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that it is formed of a composite material containing a single or clad form selected from among the metal-polymer composite materials that are a mixture of the metal material and the polymer material.
According to clause 18,
The first strength reinforcement pattern is
A method of manufacturing a high-strength printed circuit board with damage, warpage prevention, and restoration functions, characterized in that it is formed by any one of adhesion, deposition, and plating.
According to clause 18,
In step (g) above,
The second and third strength reinforcement patterns are
A method of manufacturing a high-strength printed circuit board with damage, bending prevention and restoration functions, characterized in that the internal and external circuit patterns are formed simultaneously.
According to clause 18,
After step (g) above,
(h) a first solder mask pattern covering the upper surface of the second strength reinforcement pattern, the external circuit pattern, and the insulating layer, and having a first opening exposing a portion of the external circuit pattern, and the first and third strength reinforcement patterns; forming a second solder mask pattern covering the reinforcing pattern, the internal circuit pattern, and the lower surface of the core layer, and having a second opening exposing a portion of the internal circuit pattern;
A method of manufacturing a high-strength printed circuit board with damage, bending prevention, and restoration functions, further comprising:

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