KR102614672B1 - Light emitting diode package - Google Patents

Abstract

A light emitting diode package is provided. A light emitting diode package according to one embodiment includes a base substrate having a first electrode and a second electrode; A housing disposed on a base substrate and having a side wall defining a first cavity for mounting a light emitting diode; a light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; and a wavelength conversion plate disposed on a side wall and spaced apart from the light emitting diode.

Description

Light emitting diode package {LIGHT EMITTING DIODE PACKAGE}

The present invention relates to a light emitting diode package, and specifically to a light emitting diode package suitable for automobile headlamps.

Since the development of gallium nitride-based light emitting diodes, their application fields have expanded to include backlight units, lighting, and automobile headlamps. In particular, automobile headlamps emit high-output light in a closed space, so the temperature around the light-emitting diode is significantly higher than in other fields. Therefore, light emitting diode packages used in these fields require not only heat dissipation characteristics but also high-temperature durability. In particular, conventional wavelength converters containing phosphors in silicon or epoxy resin are prone to discoloration when used at high temperatures, making them difficult to use in automobile headlamps.

Meanwhile, a protection element is mounted on the light emitting diode package to protect the light emitting diode from high voltage such as surge. However, when a light emitting diode and a protection element are mounted together in one package, various problems occur. For example, in order to control the profile of light emitted from the light emitting diode, the cavity area in which the light emitting diode is mounted needs to be symmetrical. However, in order to mount a protection element, it is difficult to form a cavity area where a light emitting diode is mounted into a symmetrical structure.

Furthermore, in order to mount the light emitting diode and the protection element, the package must provide sufficient work space to mount them. Moreover, the light emitting diode and the protection element must be spaced apart from each other considering process margin. It is difficult to miniaturize the package because the light emitting diode and protection elements are mounted within the limited sidewall of the package.

The problem to be solved by the present invention is to provide a light emitting diode package suitable for use in a high temperature environment.

Another problem to be solved by the present invention is to provide a light emitting diode package that can be miniaturized while mounting a protection element together.

According to one embodiment of the present invention, a base substrate having a first electrode and a second electrode; a housing disposed on the base substrate and having a side wall defining a first cavity for mounting a light emitting diode; a light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; and a wavelength converting plate disposed on the sidewall and spaced apart from the light emitting diode.

According to another embodiment of the present invention, a light emitting diode package comprising: a base substrate having a first electrode and a second electrode; It is disposed on the base substrate and has a sidewall that defines a first cavity for mounting a light emitting diode, and a sidewall that defines a second cavity for mounting a protection element, wherein a portion of the sidewall of the second cavity is the light emitting diode. a housing open to communicate with the exterior of the package; a light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And a light emitting diode package including a protection element mounted in the second cavity is provided.

According to embodiments of the present invention, a light emitting diode package suitable for use in a high temperature environment can be provided by adopting a wavelength conversion plate. In addition, by distinguishing the cavities in which the light emitting diode and the protective element are mounted, and mounting the protective element in the cavity of an open structure, the direction pattern of the emitted light can be easily controlled and the work space can be secured, providing a light emitting diode package that can be miniaturized. It can be.

The features and advantages of the present invention will become more clear through the following drawings and detailed description.

1 is a schematic perspective view showing a vehicle equipped with a headlamp to which a light-emitting diode package is applied according to embodiments of the present invention.
Figure 2 is a schematic perspective view for explaining a light emitting diode package according to an embodiment of the present invention.
Figure 3 is a schematic cutaway perspective view for explaining a light emitting diode package according to an embodiment of the present invention.
Figure 4 is a bottom perspective view for explaining a light emitting diode package according to an embodiment of the present invention.
Figure 5 is a cross-sectional view for explaining a light emitting diode package according to an embodiment of the present invention.
Figure 6 is a schematic perspective view for explaining a light emitting diode package according to another embodiment of the present invention.
7 to 11 are schematic perspective views for explaining a light emitting diode package manufacturing process according to an embodiment of the present invention.
Figure 12 is a schematic cross-sectional view for explaining a light emitting diode package according to still other embodiments of the present invention.
Figure 13 is a schematic perspective view for explaining a light emitting diode package according to still other embodiments of the present invention.
Figure 14 is a schematic cross-sectional view illustrating a light emitting diode package according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. The embodiments introduced below are provided as examples so that the idea of the present invention can be sufficiently conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. Also, in the drawings, the width, length, thickness, etc. of components may be exaggerated for convenience. Additionally, when one component is described as being "on top of" or "on" another component, it means that each component is "directly on" or "directly on" the other component, as well as when each component is described as being "directly on" or "directly on" the other component. This also includes cases where another component is interposed. Like reference numerals refer to like elements throughout the specification.

According to one embodiment of the present invention, a light emitting diode package is provided. This light emitting diode package includes a base substrate having a first electrode and a second electrode; a housing disposed on the base substrate and having a side wall defining a first cavity for mounting a light emitting diode; a light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; and a wavelength conversion plate disposed on the side wall and spaced apart from the light emitting diode. By adopting a wavelength conversion plate, discoloration can be prevented in a high temperature environment.

The wavelength converting plate may include a ceramic plate phosphor, and in particular, may include a phosphor in glass (PIG) or SiC phosphor.

Meanwhile, a side wall of the first cavity may surround the first cavity. Alternatively, at least a portion of the side walls of the first cavity may be open.

The light emitting diode is not particularly limited and may be, for example, a flip chip, vertical or horizontal light emitting diode.

The center of the light emitting diode may be aligned with the center of the wavelength conversion plate. In contrast, the center of the light emitting diode may deviate from the center of the wavelength conversion plate.

Furthermore, the side wall of the first cavity may have a groove formed along the first cavity on its upper surface. The groove improves process reliability by preventing the adhesive from spreading widely when attaching the wavelength conversion plate.

Meanwhile, the inside of the first cavity may be an empty space. Alternatively, the light emitting diode package may further include a transparent resin covering the light emitting diode within the first cavity. The transparent resin may partially or completely fill the first cavity.

In some embodiments, the wavelength conversion plate may be used in an exposed state without a sealing resin. In other embodiments, the light emitting diode package may further include a sealing resin that at least partially fills the space around the wavelength conversion plate. The sealing resin may be a transparent resin or a white reflective resin.

Meanwhile, the base substrate includes an insulating substrate, and the first and second electrodes each include an upper lead disposed on the insulating substrate; a lower lead disposed below the insulating substrate; and a via that penetrates the insulating substrate and connects the upper lead and the lower lead.

Furthermore, the base substrate may include an aluminum nitride substrate. Aluminum nitride substrates have good heat dissipation characteristics and high temperature durability, making them suitable for use in high temperature environments.

The light emitting diode package may further include a protection element. The housing further includes a side wall defining a second cavity for mounting the protection element, and the protection element may be mounted in the second cavity. By mounting a protection element, the light emitting diode can be protected from surges, etc.

Meanwhile, a side wall of the second cavity may be open to communicate with the outside of the light emitting diode package. By adopting a second cavity with some sidewalls open, the work space for mounting the protection element is not limited to the second cavity and can be widely used, and thus the light emitting diode package can be further miniaturized.

The first cavity and the second cavity may share a sidewall. That is, the first cavity and the second cavity may be separated from each other by the side wall. As a result, there is no need to mount a protection element in the first cavity, so the shape of the first cavity can be easily controlled, and in particular, the first cavity can be formed into a symmetrical structure. Therefore, the direction pattern of light emitted from the light emitting diode can be easily controlled.

Alternatively, the first cavity and the second cavity may communicate with each other. That is, a portion of the side wall located between the first cavity and the second cavity may be open, or the first cavity and the second cavity may be connected without a side wall.

A light emitting diode package according to another embodiment of the present invention includes a base substrate having a first electrode and a second electrode; It is disposed on the base substrate and has a sidewall that defines a first cavity for mounting a light emitting diode, and a sidewall that defines a second cavity for mounting a protection element, wherein a portion of the sidewall of the second cavity is the light emitting diode. a housing open to communicate with the exterior of the package; a light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; and a protection element mounted within the second cavity.

The first cavity and the second cavity may be spaced apart from each other by a shared side wall, or may communicate with each other.

Meanwhile, the first cavity may have a size more than twice that of the second cavity. Additionally, the first cavity may be disposed on the central area of the base substrate. Accordingly, the light emitting diode package can emit light to the outside from its central area.

The first cavity may have a rotationally symmetrical shape. For example, the first cavity may have a 180 degree rotational symmetry, a 90 degree rotational symmetry, or a circular shape. In particular, the first cavity may have a square shape.

Meanwhile, the second cavity may have an elongated shape along one edge of the base substrate and may have a rectangular shape.

According to another embodiment of the present invention, a method for manufacturing a light emitting diode package is provided. The method of manufacturing a light emitting diode package includes providing a base substrate having a plurality of pairs of first electrodes and second electrodes, forming a housing having cavities on the base substrate, and installing light emitting diodes and protection elements in the cavities. Mounting and dividing the base substrate and the housing, wherein the housing includes a pair of first cavities facing each other and a second cavity disposed between the first cavities, and the light emitting diodes are the first cavities. 1 cavities, the protection elements are mounted in the second cavity, and when dividing the housing, the second cavity is divided.

Since the protection elements are placed in the second cavity and the second cavity is divided, it is easy to secure a work space for mounting the protection elements, and the light emitting diode package can be miniaturized.

In particular, two protection elements are mounted in the second cavity, and the two protection elements can be separated from each other by dividing the base substrate and the housing. The two protection elements are each included in an individual light emitting diode package.

Meanwhile, the light emitting diode package manufacturing method may further include attaching a wavelength conversion plate covering the first cavities before dividing the base substrate and the housing. Furthermore, the method of manufacturing a light emitting diode package may further include forming a sealing resin that fills the second cavity and at least partially fills the space around the phosphor glass.

The first cavity may be sealed by a wavelength conversion plate, so the interior may remain as an empty space. Alternatively, the light emitting diode in the first cavity may be covered with transparent resin. Additionally, the transparent resin may fill the first cavity and help attach the wavelength conversion plate to the sidewall of the first cavity.

Meanwhile, different pairs of first electrodes and second electrodes are exposed to each of the first cavities, the second cavity exposes two pairs of first electrodes and second electrodes, and two protective elements are exposed to the first electrodes. 2 It can be mounted on two pairs of first and second electrodes exposed within the cavity, respectively.

Additionally, the different pairs of first and second electrodes may be arranged to have a 180 degree rotational symmetry structure. By dividing the base substrate, light emitting diode packages of the same structure can be provided.

In some embodiments, the first cavities and the second cavities may have a square shape.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a schematic perspective view showing a vehicle equipped with a headlamp 110 to which a light emitting diode package according to embodiments of the present invention is applied.

Referring to FIG. 1, in one embodiment of the present invention, the light emitting diode package is mounted on the front of the vehicle 100 and disposed within the headlamp 110. In the embodiment, the vehicle headlamp 110 includes a headlamp, a fog light, etc. that ensure the driver's forward night vision.

The vehicle headlamp 110 may be mounted on the front left and right sides of the vehicle 100, and may have various shapes in consideration of the driver's taste.

Figure 2 is a schematic perspective view for explaining a light-emitting diode package according to an embodiment of the present invention, Figure 3 is a schematic cut-away perspective view for explaining a light-emitting diode package according to an embodiment of the present invention, and Figure 4 is It is a bottom perspective view for explaining a light emitting diode package according to an embodiment of the present invention, and Figure 5 is a cross-sectional view for explaining a light emitting diode package according to an embodiment of the present invention.

1 to 5, the light emitting diode package according to this embodiment includes a base substrate 10, a housing 20, a light emitting diode 30, and a protection element 40, and further, a glass phosphor 50. ) and sealing resin 60 may be further included.

The base substrate 10 includes an insulating substrate 11, first electrodes 13 (13a, 13b, 13c) and second electrodes 15 (15a, 15b, 15c), and further includes a heat dissipation pad 17. You can. The insulating substrate 11 may be a ceramic substrate and may include, for example, an AlN substrate. The AlN substrate has good high-temperature durability and excellent heat dissipation characteristics.

The first electrode 13 and the second electrode 15 have upper leads 13a and 15a, lower leads 13c and 15c, and vias 13b and 15b, respectively. The upper leads 13a and 15a are disposed on the upper surface of the insulating substrate 11. The lower leads 13c and 15c are disposed on the lower surface of the insulating substrate 11, and the vias 13b and 15b respectively penetrate the insulating substrate 11 to connect the upper leads 13a and 15a to the lower leads ( Connect to 13c, 15c).

In one embodiment, the first and second electrodes 13 and 15 may have a multi-layer structure, for example, a stacked Ni layer/Cu layer/Au layer. The Ni layer is used to improve the adhesion of the electrode patterns to the AlN substrate, and the Au layer is used to prevent oxidation of the Cu layer, and is also used to improve the adhesion to the light emitting diode 30, which will be described later. Additionally, the Cu layer is used for current and heat transfer and can be relatively thick compared to the Ni layer and Au layer. However, the first and second electrodes 13 and 15 of the present invention are not limited to the metal layers.

Meanwhile, the heat dissipation pad 17 is disposed between the first and second lower leads 13c and 15c, and is electrically insulated from the first and second lower leads 13c and 15c. The heat dissipation pad 17 contacts the printed circuit board, and in particular, can help dissipate heat by contacting metal such as a metal PCB. The heat dissipation pad 17 may be formed of the same material as the first and second electrodes 13 and 15.

In this embodiment, the first and second upper leads 13a and 15a are arranged parallel to each other, and the first and second lower leads 13c and 15c are arranged parallel to each other. Additionally, the heat dissipation pad 17 has a wider width than the first and first lower leads 13c and 15b and is arranged parallel to them. Meanwhile, the first and second upper leads 13a and 15a and the first and second lower leads 13c and 15c are arranged to be perpendicular to each other. The first and second vias 13b and 15b may be formed in areas where the first and second upper leads 13a and 15a and the first and second lower leads 13c and 15c intersect, respectively. . Since the first and second upper leads 13a and 15a are arranged to be perpendicular to the heat dissipation pad 17, the area of the area where they intersect can be increased to further improve heat dissipation characteristics.

However, the present invention is not limited to the first and second upper leads (13a, 15a) and the first and second lower leads (13c, 15c) being arranged to cross each other, and the first and second upper leads (13a, 15a) are arranged to intersect each other. The leads 13a and 15a may be arranged parallel to the first and second lower leads 13c and 15c. Additionally, the first and second upper leads 13a and 15a are not limited to being arranged in parallel, and may be modified in various ways depending on the type of light emitting diode.

The housing 20 has a first cavity (C1) and a second cavity (C2). The first cavity (C1) defines an area where the light emitting diode 30 is mounted, and the second cavity (C2) defines an area where the protection element 40 is mounted.

The first cavity C1 may be disposed in the central area of the package. The first cavity (C1) is surrounded by a side wall (21). The side wall 21 may have an inclined surface to reflect light emitted from the light emitting diode 30. Additionally, the first cavity C1 may have a rotationally symmetrical shape when viewed in plan view, and may have a rectangular shape, particularly a square shape. Here, rotational symmetry does not only mean a rotating body, but also includes maintaining the same shape when rotating at a specific angle, such as 60 degrees, 90 degrees, 120 degrees, or 180 degrees. In this embodiment, the first cavity C1 is completely surrounded by the side wall 21, but in other embodiments, a portion of the side wall 21 of the first cavity C1 may be open. Additionally, the shape of the first cavity C1 is not limited to a square, and may have various shapes as needed.

Meanwhile, a groove 23g may be formed along the upper surface 23 of the side wall 21. The groove 23g prevents adhesive, etc. from flowing to other areas when attaching the wavelength conversion plate 50.

The second cavity C2 has a shape in which some side walls are open. In particular, the second cavity C2 may communicate with the outside of the package. Since the sidewall of the second cavity C2 is open, when mounting the protection element 40, the outside area of the package can be used as a work space, allowing the light emitting diode package to be miniaturized.

Meanwhile, the first cavity (C1) and the second cavity (C2) may be disposed on both sides with a portion of the side wall 21 interposed therebetween. That is, the first cavity (C1) and the second cavity (C2) share a portion of the side wall (21). Accordingly, as shown in FIG. 5, the side wall 21 may have an inner wall surface 21a located on the first cavity C1 side and an inner wall surface 21a located on the second cavity C2 side. there is. Meanwhile, the inner wall surface 21a located on the first cavity C1 side is more gently inclined than the inner wall surface 21b located on the second cavity C2 side to reflect the light emitted from the light emitting diode 30. You can lose.

Additionally, the second cavity (C2) has a smaller size than the first cavity (C1). For example, the first cavity (C1) may be more than twice as large as the second cavity (C2). The second cavity C2 may have an elongated shape, for example, an elongated rectangular shape, along one edge of the base substrate 10 .

The first cavity (C1) and the second cavity (C2) are formed by the housing 20, and include the first electrode 13 and the second electrode 15, especially the first and second upper leads 13a, 15a) is exposed.

Meanwhile, the housing 20 may be formed of a material different from the insulating substrate 11, for example, thermosetting or thermoplastic resin. The housing 20 may be formed of a highly reflective resin, for example, poly phthal amide (PPA), poly cyclohexylenedimethylene terephthalate (PCT), epoxy molding compound (EMC), or silicon molding compound (SMC). there is. In particular, the silicon molding compound (SMC) is resistant to high temperatures and has a high reflectivity, making it suitable for use in light emitting diode packages that require high output, such as automobile headlamps.

The housing 20 may have a stepped top surface. For example, the housing 20 may include an uppermost end surface 27, a middle upper surface 25, and a side wall 21 upper surface 23, and steps 25w and 27w may be located between them. You can. The upper surface 23 of the side wall 21 prevents the adhesive used to adhere the wavelength conversion plate 50 from spreading to the wide surface of the housing 20. Therefore, even when more adhesive than necessary is used, the adhesive gathers around the side of the wavelength conversion plate 50 and can improve the adhesion of the wavelength conversion plate 50.

Meanwhile, the stepped portions 25w and 27w and the middle upper surface 25 increase the adhesive area of the transparent resin 60 formed around the wavelength conversion plate 50, thereby preventing the transparent resin 60 from peeling from the housing 20. prevent it from happening. Although the double-stepped top surface structure is shown and described in this embodiment, it is not limited thereto, and more top surfaces may be formed.

The top end surface 27 forms the edge of the housing 20. However, because the sidewall of the second cavity C2 is open, a portion of the edge has a broken shape. Additionally, a cathode mark 27a is formed on a portion of the uppermost end surface 27 to specify the position of the cathode electrode.

The light emitting diode 30 is disposed on the first and second upper leads 13a and 15a within the first cavity C1. The light emitting diode 30 is a gallium nitride-based inorganic semiconductor light emitting diode that emits blue or ultraviolet rays. In this embodiment, the light emitting diode 30 is a light emitting diode that can be mounted without a bonding wire, and may be, for example, a flip chip type light emitting diode. However, the present invention is not limited to this, and in another embodiment, it may be a vertical or horizontal light emitting diode using a bonding wire.

The protection element 40 protects the light emitting diode 30 from high voltage such as surge. The protection element 40 may be, for example, a transient voltage suppressor (TVS) diode or a Zener diode.

The wavelength conversion plate 50 covers the first cavity (C1). A ceramic plate containing a wavelength conversion material includes, for example, phosphor in glass (PIG) containing a phosphor or SiC phosphor containing a phosphor in a SiC substrate, and quartz may also contain a phosphor. In addition, various ceramic plate phosphors are available. Additionally, in addition to phosphors, other wavelength conversion materials such as quantum dots may be used. The upper surface of the wavelength conversion plate 50 may be located above the upper surface 23 of the side wall 21, below the uppermost end surface 27 of the housing 20, and above the middle surface 25. . However, the present invention is not limited to this, and the upper surface of the wavelength conversion plate 50 may be located above the uppermost end surface 27.

By using a ceramic plate, the wavelength conversion plate 50 is sturdier and more durable at high temperatures than a resin containing a conventional phosphor. The wavelength conversion plate 50 may have a rectangular shape, particularly a square shape. The wavelength conversion plate 50 may be attached to the side wall 21 using silicon, epoxy, etc. At this time, the silicone or epoxy used as an adhesive is guided by the groove 23g, and thus is prevented from spreading to the first cavity C1, the second cavity C2, or other parts of the housing 20.

Meanwhile, the sealing resin 60 fills some of the space around the wavelength conversion plate 50. The sealing resin 60 may cover the upper surface 23 and the middle surface 25 of the side wall 21, cover the stepped portion 25w, and cover at least a portion of the stepped portion 27w. The sealing resin 60 also covers the side of the wavelength conversion plate 50 and ensures that the wavelength conversion plate 50 is firmly adhered to the housing 20.

Sealing resin 60 may also fill the second cavity C2 of housing 20. The sealing resin 60 may be formed of transparent silicone or epoxy. When the first cavity (C1) is spaced apart from the second cavity (C2), the first cavity (C1) is covered with the wavelength conversion plate 50 to prevent the sealing resin 60 from penetrating into the first cavity (C1). It can be prevented. Accordingly, the first cavity C1 may remain as an empty space. However, the present invention is not limited to this, and the light emitting diode 30 in the first cavity C1 may be covered with transparent resin. The transparent resin may partially fill the first cavity (C1) or completely fill the first cavity (C1). This will be described again later with reference to FIG. 12.

Figure 6 is a schematic perspective view for explaining a light emitting diode package according to another embodiment of the present invention.

Referring to FIG. 6, the light emitting diode package according to this embodiment is generally similar to the light emitting diode package of the previously described embodiment, but the difference is that the sealing resin 60 is formed of a white reflector. The white reflector can be made of a material that mixes a white pigment with a resin such as silicone or epoxy. Additionally, reflectors such as polycarbonate or PCT may also be used as the sealing resin.

By forming the sealing resin 60 using a white reflector, the light emitted from the light emitting diode package can be generally emitted to the outside only through the wavelength conversion plate 50. Therefore, unwanted light can be blocked from being emitted through the sealing resin 60, and the directional distribution of light can be easily controlled.

7 to 11 are schematic perspective views for explaining a light emitting diode package manufacturing process according to an embodiment of the present invention. In the drawings, dotted lines indicate positions to be divided.

First, referring to FIG. 7, a base substrate 10 is prepared. The base substrate 10 includes a plurality of pairs of first electrodes 13 and second electrodes 15. The drawing shows only the first and second upper leads 13a and 15a, but as described with reference to FIGS. 1 to 5, the first and second vias 13b and 15b and the first and second lower leads Fields 13c and 15c are also included. Although FIG. 7 shows two different pairs of the first electrode 13 and the second electrode 15, more pairs may be provided on the base substrate 10.

Meanwhile, the two pairs of first electrodes 13 and second electrodes 15 may be arranged in a 180 degree rotationally symmetrical structure. They form a pair again. A plurality of such pairs may be disposed on the base substrate 10. Here, the first electrode 13 and the second electrode 15 are described as being arranged symmetrically, but the shape and structure of the first electrode 13 and the second electrode 15 may be modified in various ways.

Referring to FIG. 8, a housing 20 is formed on the base substrate 10. The housing 20 may be formed of a highly reflective resin. The housing 20 may be formed on the base substrate 10 using a molding technique. The housing 20 includes a pair of first cavities C1 and a second cavity C2 disposed between these first cavities. The second cavity C2 may be formed to have the same size as the first cavity C1, but may be smaller than the first cavity C1 because a relatively small protection element is mounted.

The pair of first cavities C1 each expose different first upper leads 13a and second upper leads 15a. Meanwhile, the second cavity C2 exposes two different pairs of first upper leads 13a and second upper leads 15a. That is, in FIG. 8, the first cavity C1 disposed at the top exposes the first pair of first and second upper leads 13a and 15a, and the first cavity C1 disposed below exposes the second upper leads 13a and 15a. The pair of first and second upper leads 13a and 15a are exposed. Additionally, the second cavity C2 exposes the first and second pairs of first and second upper leads 13a and 15a.

Meanwhile, the first cavities C1 may have the same size. The second cavity C2 may have the same size as the first cavities C1, but may also have a smaller size than the first cavities C1.

The first and second cavities C1 and C2 may both have a rotationally symmetrical shape, for example, a square shape. However, it is not limited to this and may have other shapes.

The housing 20 also has an upper surface 23, a middle surface 25, and a top end surface 27 of the side wall 21 surrounding the first cavity C1, as previously described with reference to FIGS. 1 to 5. It may have stepped portions 25w and 27w between them, and a cathode mark 27a may be formed on the uppermost end surface 27.

Referring to FIG. 9, a light emitting diode 30 is mounted in each of the first cavities C1, and a protection element 40 is mounted in the second cavity C2. The light emitting diode 30 may be flip-bonded to the first and second upper leads 13a and 15a exposed to the first cavity C1, and the protection element 40 is exposed to the second cavity C2. It may be flip-bonded to the first and second upper leads 13a and 15a.

Referring to FIG. 10, wavelength conversion plates 50 are attached to the first cavities C1. The wavelength conversion plate 50 may be attached to the side wall 21 surrounding the first cavity C1 using silicon or epoxy. By attaching the wavelength conversion plate 50, the first cavity C1 can be blocked from the outside.

Referring to FIG. 11, the sealing resin 60 filling the second cavity C2 is formed. The sealing resin 60 may fill some space around the wavelength conversion plate 50. The sealing resin 60 may cover the upper surface 23 and the middle surface 25 of the side wall 21 and a portion of the stepped portion 25w and the stepped portion 27w. Furthermore, the sealing resin 60 may cover the side of the wavelength conversion plate 5. The sealing resin 60 may be formed of a transparent resin such as epoxy or silicone. Alternatively, it may be formed from a white reflector, such as epoxy or silicone containing white pigment.

Next, the base substrate 10 and the housing 20 are divided into individual light emitting diode packages by dividing them along the dotted line, thereby completing the light emitting diode package. When dividing the base substrate 10 and the housing 20, in particular, the second cavity C2 is divided. The second cavity C2 can be divided into equal sizes, and thus, identical light emitting diode packages can be manufactured.

According to the light emitting diode package manufacturing method according to this embodiment, the second cavity C2 in which the protection elements 40 are mounted is shared by two light emitting diode package areas. Accordingly, a work space for mounting the protection element 40 can be secured, and the light emitting diode package can be miniaturized. In the prior art, the second cavity is surrounded by a side wall. However, when the first cavity and the second cavity are separated from each other and surrounded by sidewalls, it is difficult to miniaturize the package because the work space for mounting the light emitting diode and the protection element is limited by the sidewall.

Figure 12 is a schematic cross-sectional view for explaining a light emitting diode package according to another embodiment of the present invention.

First, referring to FIG. 12(a), the light emitting diode package according to this embodiment is generally similar to the light emitting diode package previously described with reference to FIGS. 1 to 5, but the transparent resin 70a forms the light emitting diode 30. There is a difference in covering.

The transparent resin 70a may be a transparent silicone resin or an epoxy resin, and seals and protects the light emitting diode 30. The transparent resin 70a fills a portion of the first cavity C1, and as shown, the wavelength conversion plate 50 may be spaced apart from the transparent resin 70a.

Referring to FIG. 12(b), the light emitting diode package according to this embodiment is generally similar to the embodiment of FIG. 12(a), but the difference is that the transparent resin 70b completely fills the first cavity C1. .

The transparent resin 70b completely fills the first cavity C1 and seals the light emitting diode 30. Additionally, the transparent resin 70b can be used as an adhesive to adhere the wavelength conversion plate 50. Therefore, the wavelength conversion plate 50 can be firmly adhered to the housing 20.

Figure 13 is a perspective view for explaining a light emitting diode package according to another embodiment of the present invention.

In the previously described embodiments, it was explained that the first cavity (C1) and the second cavity (C2) are spaced apart from each other by the side wall 21, but here, the first cavity (C1) and the second cavity (C2) are separated from each other. Explain about communication.

Referring to FIG. 13(a), a portion of the side wall 21 disposed between the first cavity (C1) and the second cavity (C2) is opened so that the first cavity (C1) and the second cavity (C2) are connected to each other. It communicates. The open portion may be the central portion of the side wall 21 shared by the first cavity (C1) and the second cavity (C2).

Referring to FIG. 13(b), most of the side wall 21 shared by the first cavity (C1) and the second cavity (C2) may be open. Accordingly, the second cavity C2 communicates with the outside of the package and the first cavity C1.

Referring to FIG. 13(c), in the case of this embodiment, the height of the side wall 21 shared by the first cavity (C1) and the second cavity (C2) is formed to be relatively low compared to the side walls 21 of other portions. Thus, the first cavity (C1) and the second cavity (C2) communicate with each other.

Figure 14 is a perspective view for explaining a light emitting diode package according to another embodiment of the present invention.

Referring to FIG. 14, the light emitting diode package according to this embodiment is generally similar to the light emitting diode packages of the previously described embodiments, but the difference is that the light emitting diode 30a has a vertical structure.

The flip chip structure light emitting diode 30 does not require a bonding wire because the light emitting diode is flip bonded. However, vertical or horizontal light emitting diodes require a bonding wire to electrically connect to the first and second upper leads 13a and 15a. The vertical light emitting diode 30a generally has a first electrode on the lower surface and a second electrode on the upper surface. Therefore, as shown, the light emitting diode 30a may be mounted on the first upper lead 13a and electrically connected to the second upper lead 15a through the bonding wire 80.

In the case of a horizontal light emitting diode, both the first electrode and the second electrode are disposed on the top side of the light emitting diode, so all of these electrodes are electrically connected to the first and second upper leads 13a and 15a through bonding wires. will be.

Meanwhile, in the previous embodiments, the centers of the light emitting diode 30 and the wavelength conversion plate 50 may be aligned with each other. However, in this embodiment, as the bonding wire 80 is used, the light emitting diode 30a may deviate from the center of the first cavity C1, and therefore, the center of the light emitting diode 30a and the wavelength conversion plate 50a is There may be discrepancies.

Meanwhile, although not shown, the protection element 40 may also be electrically connected to the upper leads 13a and 15a through a bonding wire.

Although various embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications may be made without departing from the scope of the present invention.

Claims (24)

A base substrate having a first electrode and a second electrode;
a housing disposed on the base substrate and having sidewalls defining a first cavity and a second cavity;
at least one light emitting diode disposed in the first cavity and electrically connected to the first and second electrodes; and
It includes a protective element disposed in the second cavity,
A light emitting diode package wherein a portion of a side wall of the second cavity is open to communicate with the outside of the light emitting diode package. In claim 1,
Further comprising a wavelength conversion plate disposed in the first cavity,
The wavelength conversion plate is a light emitting diode package including a ceramic plate phosphor. In claim 1,
A light emitting diode package wherein a sidewall of the first cavity surrounds the first cavity. In claim 1,
A light emitting diode package wherein at least a portion of the sidewall of the first cavity is open. In claim 1,
A light emitting diode package wherein the light emitting diode is a flip chip, vertical or horizontal light emitting diode. In claim 5,
Further comprising a wavelength conversion plate disposed in the first cavity,
A light emitting diode package where the center of the light emitting diode is aligned with the center of the wavelength conversion plate. In claim 5,
Further comprising a wavelength conversion plate disposed in the first cavity,
A light emitting diode package in which the center of the light emitting diode deviates from the center of the wavelength conversion plate. In claim 1,
A light emitting diode package wherein a sidewall of the first cavity has a groove formed along the first cavity on its upper surface. In claim 1,
A light emitting diode package further comprising a transparent resin covering the light emitting diode within the first cavity. In claim 9,
A light emitting diode package wherein the transparent resin partially or completely fills the first cavity. In claim 1,
Further comprising a wavelength conversion plate disposed in the first cavity,
A light emitting diode package further comprising a sealing resin that at least partially fills the space around the wavelength conversion plate. In claim 11,
A light emitting diode package wherein the sealing resin is a transparent resin or a white reflective resin. In claim 1,
The base substrate includes an insulating substrate,
The first and second electrodes are each,
an upper lead disposed on the insulating substrate;
a lower lead disposed below the insulating substrate; and
A light emitting diode package including a via that penetrates the insulating substrate and connects the upper lead and the lower lead. In claim 13,
A light emitting diode package wherein the insulating substrate includes an aluminum nitride substrate. delete delete In claim 1,
The first cavity and the second cavity share a sidewall. In claim 1,
A light emitting diode package wherein the first cavity and the second cavity communicate with each other. delete delete delete delete delete delete

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