WO2018016842A1

WO2018016842A1 - Light-emitting diode package and method for producing same

Info

Publication number: WO2018016842A1
Application number: PCT/KR2017/007706
Authority: WO
Inventors: 박병규; 네이마사미; 유종균
Original assignee: 서울반도체주식회사
Priority date: 2016-07-19
Filing date: 2017-07-18
Publication date: 2018-01-25

Abstract

A light-emitting diode package according to an embodiment comprises: a base substrate having a first electrode and a second electrode; a housing disposed on the base substrate and having a partition defining a first cavity for mounting a light-emitting diode; the light-emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; and a wavelength conversion plate disposed away from the light-emitting diode and over the partition.

Description

Light emitting diode package and how to manufacture it

The present invention relates to a light emitting diode package and a method of manufacturing the same, and more particularly, to a light emitting diode package suitable for an automobile head lamp and a method of manufacturing the same.

Since the development of gallium nitride based light emitting diodes, their applications have been extended to backlight units, lighting and automotive headlamps. In particular, automotive headlamps emit a high power of light in an enclosed space, which is characterized by a considerably higher ambient temperature of light emitting diodes than in other applications. Therefore, the LED package used in this field is more demanding not only heat dissipation characteristics but also high temperature durability. In particular, a wavelength converter containing a phosphor in a conventional silicone or epoxy resin tends to discolor when used at a high temperature, and thus is difficult to be used in an automobile head lamp.

On the other hand, a protection element is mounted together in the LED package to protect the LED from high voltage such as surge. However, when the light emitting diode and the protection device are mounted together in one package, various problems occur. For example, in order to adjust the profile of light emitted from the light emitting diode, the cavity area in which the light emitting diode is mounted needs to be symmetrical. However, it is difficult to form a cavity region in which a light emitting diode is mounted in a symmetrical structure for mounting a protection element.

Furthermore, in order to mount light emitting diodes and protective elements, a sufficient space for mounting them must be provided in the package. Moreover, the light emitting diode and the protection element should be spaced apart from each other in consideration of the process margin. It is difficult to miniaturize the package because the light emitting diode and the protection element are mounted within the limited sidewall of the package.

The problem to be solved by the present invention is to provide a light emitting diode package suitable for use in a high temperature environment.

Another object of the present invention is to provide a light emitting diode package that can be miniaturized while mounting a protection device together.

A light emitting diode package according to an embodiment of the present invention, the base substrate having a first electrode and a second electrode; A housing disposed on the base substrate, the housing having sidewalls defining a first cavity for mounting a light emitting diode; A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And a wavelength conversion plate spaced apart from the light emitting diode and disposed on the sidewall. By adopting a wavelength conversion plate, it is possible to prevent discoloration in a high temperature environment.

The wavelength converting plate may include a ceramic plate phosphor. In particular, the wavelength converting plate may include a phosphor glass (PIG) or a SiC phosphor.

Meanwhile, a sidewall of the first cavity may surround the first cavity. Alternatively, at least some of the side walls of the first cavity may be opened.

The light emitting diode is not particularly limited, and may be, for example, a flip chip, vertical or horizontal light emitting diode.

The center of the light emitting diode may be aligned with the center of the wavelength conversion plate. In contrast, the center of the light emitting diode may deviate from the center of the wavelength conversion plate.

Further, the side wall of the first cavity may have a groove formed along the first cavity on an upper surface thereof. When the groove is attached to the wavelength conversion plate, the adhesive is prevented from spreading widely to improve process reliability.

The inside of the first cavity may be an empty space. Alternatively, the light emitting diode package may further include a transparent resin covering the light emitting diode in the first cavity. The transparent resin can partially or completely fill the first cavity.

In some embodiments, the wavelength conversion plate may be used in an exposed state without a sealing resin. In other embodiments, the light emitting diode package may further include a sealing resin at least partially filling the space around the wavelength conversion plate. The sealing resin may be a transparent resin or a white reflective resin.

Meanwhile, the base substrate includes an insulating substrate, and the first and second electrodes each include an upper lead disposed on the insulating substrate; A lower lead disposed under the insulating substrate; And a via penetrating the insulating substrate to connect the upper lead and the lower lead.

Further, the base substrate may include an aluminum nitride substrate. Aluminum nitride substrates have good heat dissipation and high temperature durability, making them suitable for use in high temperature environments.

The light emitting diode package may further include a protection device. The housing further includes sidewalls defining a second cavity for mounting the protection element, wherein the protection element may be mounted in the second cavity. By mounting a protection element, a light emitting diode can be protected from a surge.

The sidewall of the second cavity may be opened to communicate with the outside of the LED package. By adopting the second cavity with some sidewalls open, the work space for mounting the protection element can be used widely without being limited in the second cavity, thereby making the LED package more compact.

The first cavity and the second cavity may share sidewalls. That is, the first cavity and the second cavity may be separated from each other by the side wall. As a result, it is not necessary to mount a protective element in the first cavity, so that the shape of the first cavity can be easily controlled, and in particular, the first cavity can be formed in a symmetrical structure. Thus, the directing pattern of the light emitted from the light emitting diode can be easily controlled.

Alternatively, the first cavity and the second cavity may communicate with each other. That is, a part of the sidewall positioned between the first cavity and the second cavity may be opened or the first cavity and the second cavity may be connected without the sidewall.

A light emitting diode package according to another embodiment of the present invention, the base substrate having a first electrode and a second electrode; A sidewall disposed on the base substrate, the sidewall defining a first cavity for mounting a light emitting diode, and the sidewall defining a second cavity for mounting a protection element, wherein a portion of the sidewall of the second cavity is the light emitting diode; A housing open to communicate with the outside of the package; A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And a protection element mounted in the second cavity.

The first cavity and the second cavity may be spaced apart or communicated with each other by sidewalls shared with each other.

On the other hand, the first cavity may have a size more than twice the second cavity. In addition, the first cavity may be disposed on a central area of the base substrate. Thus, the LED package can emit light to the outside from the central area.

The first cavity may have a rotationally symmetrical shape. For example, the first cavity may have a 180 degree rotational symmetry, a 90 degree rotational symmetry shape, or may have a circular shape. In particular, the first cavity may have a square shape.

The second cavity may have an elongated shape along one side edge of the base substrate, and may have a rectangular shape.

A light emitting diode package according to another embodiment of the present invention, the base substrate having a first electrode and a second electrode; A housing disposed on the base substrate, the housing having sidewalls defining a first cavity for mounting a light emitting diode; A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And a wavelength conversion plate disposed on an upper surface of the light emitting diode. By adopting a wavelength conversion plate, it is possible to prevent discoloration in a high temperature environment.

The wavelength conversion plate may cover the entire upper surface of the light emitting diode. The light emitting diode package may include a plurality of light emitting diodes. For the plurality of light emitting diodes, one wavelength conversion plate may cover the top surface of the entire light emitting diode, or the plurality of wavelength conversion plates may cover the plurality of light emitting diodes, respectively.

The wavelength conversion plate may cover a portion of the light emitting diode except for a wire bonding portion of the top surface of the light emitting diode.

Further, the side wall of the first cavity may have a groove formed along the first cavity on an upper surface thereof. The light emitting diode package may further include a sealing resin that at least partially fills a space around the first cavity and the wavelength conversion plate. The sealing resin may be a transparent resin or a white reflective resin. .

A light emitting diode package according to another embodiment of the present invention, the base substrate having a first electrode and a second electrode; A sidewall disposed on the base substrate, the sidewall defining a first cavity for mounting a light emitting diode, and a sidewall defining a second cavity for mounting a protective element, wherein a portion of the sidewall of the second cavity is the light emitting diode; A housing open to communicate with the outside of the package; A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; A wavelength conversion plate disposed in at least a portion of an upper surface of the light emitting diode in the first cavity; And a protection element mounted in the second cavity.

According to another aspect of the present invention, there is provided a light emitting diode package manufacturing method including: providing a base substrate having a plurality of pairs of first electrodes and second electrodes, forming a housing having cavities on the base substrate, Mounting light emitting diodes and protective elements therein and dividing the base substrate and housing, wherein the housing includes a pair of first cavities facing each other and a second cavity disposed between the first cavities. The light emitting diodes are mounted in the first cavities, the protection elements are mounted in the second cavity, and when the housing is divided, the second cavity is divided.

Since the protection elements are disposed in the second cavity and the second cavity is divided, it is easy to secure a work space for mounting the protection elements, thereby miniaturizing the LED package.

In particular, two protection elements may be mounted in the second cavity, and the two protection elements may be separated from each other by dividing the base substrate and the housing. The two protection elements are each included in a separate LED package.

The light emitting diode package may further include attaching a wavelength conversion plate covering the first cavities before dividing the base substrate and the housing. In another exemplary embodiment, the method may further include attaching a wavelength conversion plate covering at least a portion of an upper surface of the light emitting diode before dividing the base substrate and the housing.

Furthermore, the light emitting diode package manufacturing method may further include forming a sealing resin filling the second cavity and at least partially filling a space around the phosphor glass.

The first cavity may be sealed by the wavelength conversion plate, and thus the interior may remain as an empty space. Alternatively, the light emitting diode in the first cavity may cover the transparent resin. In addition, the transparent resin may fill the first cavity, and may help the wavelength conversion plate to be attached on the sidewall of the first cavity.

Meanwhile, different pairs of first and second electrodes are exposed to the first cavities, and the second cavity exposes two pairs of first and second electrodes, and two protection elements are disposed on the first cavities. It may be mounted on two pairs of the first electrode and the second electrode exposed in the two cavity, respectively.

In addition, the pair of different first and second electrodes may be arranged to have a 180-degree rotational symmetry structure. By dividing the base substrate, light emitting diode packages having the same structure may be provided.

In some embodiments, the first cavities and the second cavity may have a square shape.

According to embodiments of the present invention, a light emitting diode package suitable for use in a high temperature environment may be provided by adopting a wavelength conversion plate. In addition, by distinguishing the cavity in which the light emitting diode and the protection element are mounted, and by installing the protection element in an open structure cavity, it is possible to easily control the directing pattern of the emitted light and to secure a working space, thereby providing a light emitting diode package that can be miniaturized. Can be.

The features and advantages of the present invention will become more apparent from the following drawings and detailed description.

1 is a schematic perspective view illustrating a vehicle equipped with a head lamp to which a light emitting diode package according to embodiments of the present invention is applied.

2 is a schematic perspective view illustrating a light emitting diode package according to an embodiment of the present invention, FIG. 3 is a schematic cutaway perspective view illustrating a light emitting diode package according to an embodiment of the present invention, and FIG. Bottom view for explaining a light emitting diode package according to an embodiment of the present invention, Figure 5 is a cross-sectional view for explaining a light emitting diode package according to an embodiment of the present invention.

6 is a schematic perspective view illustrating a light emitting diode package according to another embodiment of the present invention.

7 to 11 are schematic perspective views for explaining a light emitting diode package manufacturing process according to an embodiment of the present invention.

12 is a schematic cross-sectional view illustrating a light emitting diode package according to still another embodiment of the present invention.

13 is a schematic perspective view illustrating a light emitting diode package according to still another embodiment of the present invention.

14 is a schematic cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention.

15 is a schematic perspective view illustrating a light emitting diode package according to another embodiment of the present invention, FIG. 16 is a schematic cutaway perspective view illustrating a light emitting diode package according to another embodiment of the present invention, and FIG. 17 is a bottom perspective view illustrating a light emitting diode package according to another embodiment of the present invention, and FIG. 18 is a cross-sectional view illustrating a light emitting diode package according to another embodiment of the present invention.

19 is a schematic perspective view for describing a light emitting diode package according to another embodiment of the present invention.

20 to 24 are schematic perspective views illustrating a light emitting diode package manufacturing process according to another embodiment of the present invention.

25 are schematic perspective views illustrating a light emitting diode package according to still another embodiment of the present invention.

26 is a schematic perspective view and a cross-sectional view for describing a light emitting diode package according to still another embodiment of the present invention.

27 is a schematic perspective view and a cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention.

28 is a schematic perspective view illustrating a light emitting diode package according to another embodiment of the present invention.

29 is a cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art to which the present invention pertains. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, widths, lengths, thicknesses, and the like of components may be exaggerated for convenience. In addition, when one component is described as "on" or "on" another component, each component is different from each other as well as when the component is "just above" or "on" the other component. It also includes a case where another component is interposed therebetween. Like numbers refer to like elements throughout.

1 is a schematic perspective view illustrating a vehicle equipped with a head lamp 110 to which a light emitting diode package according to embodiments of the present invention is applied.

Referring to FIG. 1, in one embodiment of the present invention, the LED package is mounted at the front of the vehicle 100 and disposed in the head lamp 110. In an embodiment, the vehicle head lamp 110 includes a head lamp, a fog lamp, and the like, which secures the driver's front night vision.

The vehicle head lamp 110 may be mounted on the front left and right of the vehicle 100, and may have various shapes in consideration of the driver's taste.

2 to 5, the light emitting diode package according to the present embodiment includes a base substrate 10, a housing 20, a light emitting diode 30, and a protection device 40, and further, a glass phosphor 50. ) And the sealing resin 60 may be further included.

The base substrate 10 may include an insulating substrate 11,

first electrodes

13a, 13b, and 13c, and second electrodes 15; 15a, 15b, and 15c, and may further include a heat radiation pad 17. Can be. The insulating substrate 11 may be a ceramic substrate and may include, for example, an AlN substrate. AlN substrate has high temperature durability and good heat dissipation.

The first electrode 13 and the second electrode 15 have

upper leads

13a and 15a, lower leads 13c and 15c and vias 13b and 15b, respectively. The upper leads 13a and 15a are disposed on the upper surface of the insulating substrate 11. The lower leads 13c and 15c are disposed on the bottom surface of the insulating substrate 11, and the vias 13b and 15b penetrate the insulating substrate 11, respectively, to pass the upper leads 13a and 15a to the lower leads ( 13c, 15c).

In an embodiment, the first and second electrodes 13 and 15 may have a multilayer structure, for example, a multilayer structure in which a Ni layer / Cu layer / Au layer is stacked. The Ni layer is used to improve the adhesion of the electrode patterns to the AlN substrate, the Au layer is used to prevent oxidation of the Cu layer, and is also used to improve the adhesion to the light emitting diode 30 described later. In addition, the Cu layer is used for current and heat transfer, and may be relatively thick compared to the Ni layer and Au layer. However, the first and second electrodes 13 and 15 of the present invention are not limited to the metal layers.

Meanwhile, the heat radiating pad 17 is disposed between the first and second lower leads 13c and 15c and is electrically insulated from the first and second lower leads 13c and 15c. The heat dissipation pad 17 is in contact with the printed circuit board, and in particular, may be in contact with a metal such as a metal PCB to help heat dissipation. The heat dissipation pad 17 may be formed of the same material as the first and second electrodes 13 and 15.

In the present embodiment, the first and second upper leads 13a and 15a are disposed in parallel to each other, and the first and second lower leads 13c and 15c are disposed in parallel to each other. In addition, the heat dissipation pad 17 has a wider width than the first and first lower leads 13c and 15b and is disposed in parallel therewith. Meanwhile, the first and second upper leads 13a and 15a and the first and second lower leads 13c and 15c are disposed to be orthogonal to each other. The first and second vias 13b and 15b may be formed in an area where the first and second upper leads 13a and 15a and the first and second lower leads 13c and 15c intersect, respectively. . Since the first and second upper leads 13a and 15a are disposed to be orthogonal to the heat radiating pad 17, the heat dissipation characteristics may be further improved by increasing the area of the area where they cross.

However, the present invention is not limited to the first and second upper leads 13a and 15a and the first and second lower leads 13c and 15c disposed to cross each other, and the first and second upper leads. The

fields

13a and 15a may be disposed parallel to the first and second lower leads 13c and 15c. In addition, the first and second upper leads 13a and 15a are not limited to being arranged in parallel, and may be variously modified according to the type of light emitting diode.

The housing 20 has a first cavity C1 and a second cavity C2. The first cavity C1 defines a region in which the light emitting diode 30 is mounted, and the second cavity C2 defines a region in which the protection element 40 is mounted.

The first cavity C1 may be disposed in the central area of the package. The first cavity C1 is surrounded by the side wall 21. The side wall 21 may have an inclined surface to reflect light emitted from the light emitting diode 30. In addition, the first cavity C1 may have a rotationally symmetrical shape when viewed in plan, and may have a rectangular, in particular square, shape. The rotation symmetry here does not mean only the rotating body, and includes the same shape is maintained when rotating at a specific angle, such as 60 degrees, 90 degrees, 120 degrees or 180 degrees. In the present exemplary embodiment, the first cavity C1 is completely surrounded by the sidewall 21, but in another exemplary embodiment, a part of the sidewall 21 of the first cavity C1 may be opened. In addition, the shape of the first cavity C1 is not limited to the quadrangle and may have various shapes as necessary.

Meanwhile, a groove 23g may be formed along the upper surface 23 of the side wall 21. The groove 23g prevents the adhesive or the like from flowing to other areas when attaching the wavelength conversion plate 50.

The second cavity C2 has a shape in which some sidewalls are open. In particular, the second cavity C2 may communicate with the outside of the package. Since the sidewall of the second cavity C2 is opened, when the protection device 40 is mounted, an outer area of the package may be used as a work space, thereby miniaturizing the LED package.

Meanwhile, the first cavity C1 and the second cavity C2 may be disposed at both sides with a part of the sidewall 21 interposed therebetween. That is, the first cavity C1 and the second cavity C2 share a part of the sidewall 21. Accordingly, as shown in FIG. 5, the side wall 21 may have an inner wall surface 21a positioned on the side of the first cavity C1 and an inner wall surface 21a positioned on the side of the second cavity C2. have. On the other hand, the inner wall surface 21a located on the side of the first cavity C1 is inclined more gently than the inner wall surface 21b located on the side of the second cavity C2 to reflect the light emitted from the light emitting diode 30. Can lose.

In addition, the second cavity C2 has a smaller size than the first cavity C1. For example, the first cavity C1 may be two times larger than the second cavity C2. The second cavity C2 may have an elongated shape, for example, an elongated rectangular shape, along one edge of the base substrate 10.

The first cavity C1 and the second cavity C2 are formed by the housing 20, and the first electrode 13 and the second electrode 15, in particular, the first and second

upper leads

13a, 15a).

The housing 20 may be formed of a material different from the insulating substrate 11, for example, a thermosetting or thermoplastic resin. The housing 20 may be formed of a resin having high reflectance, and may be formed of, for example, poly phthal amide (PPA), poly cyclohexylenedimethylene terephthalate (PCT), epoxy molding compount (EMC), or silicone molding compound (SMC). have. In particular, the silicon molding compound (SMC) is resistant to high temperatures and has a high reflectance, so that the silicon molding compound (SMC) may be suitably used in a light emitting diode package requiring high power such as an automobile head lamp.

The upper surface of the housing 20 may have a stepped shape. For example, the housing 20 may include a top surface 27, a middle top surface 25, and a side surface 21, an upper surface 23, between which step

portions

25w and 27w may be located. Can be. The upper surface 23 of the sidewall 21 prevents the adhesive used to adhere the wavelength conversion plate 50 to spread to the wide side of the housing 20. Therefore, even when more than necessary adhesives are used, the adhesives can gather around the side surface of the wavelength conversion plate 50 to improve the adhesion of the wavelength conversion plate 50.

Meanwhile, the stepped

portions

25w and 27w and the intermediate upper surface 25 increase the adhesion area of the transparent resin 60 formed around the wavelength conversion plate 50 so that the transparent resin 60 is peeled off from the housing 20. Prevent it. In the present embodiment, the double stepped top surface structure is illustrated and described, but is not limited thereto, and more top surfaces may be formed.

The upper end surface 27 constitutes an edge of the housing 20. However, due to the open sidewall of the second cavity C2, a part of the edge has a broken shape. In addition, a cathode mark 27a is formed on a part of the uppermost end face 27 to designate the position of the cathode electrode.

The light emitting diode 30 is disposed on the first and second upper leads 13a and 15a in the first cavity C1. The light emitting diode 30 may be a light emitting diode emitting blue or ultraviolet rays as a gallium nitride-based inorganic semiconductor light emitting diode. In the present embodiment, the light emitting diode 30 is a light emitting diode that can be mounted without a bonding wire, for example, may be a flip chip type light emitting diode. However, the present invention is not limited thereto, and in another embodiment, may be a vertical or horizontal light emitting diode using a bonding wire.

The protection element 40 protects the light emitting diode 30 from a high voltage such as a surge. The protection element 40 may be, for example, a transient voltage suppressor (TVS) diode or a zener diode.

The wavelength conversion plate 50 covers the first cavity C1. The wavelength conversion material is contained in the ceramic plate, for example, there is a glass (phosphor in glass (PIG)) containing the phosphor, or SiC phosphor containing the phosphor in the SiC substrate, the quartz may also contain a phosphor. In addition, various ceramic plate phosphors are possible. In addition to phosphors, other wavelength converting materials such as quantum dots may be used. The upper surface of the wavelength conversion plate 50 may be positioned above the upper surface 23 of the side wall 21, may be positioned below the uppermost surface 27 of the housing 20, and may be positioned above the intermediate surface 25. . However, the present invention is not limited thereto, and the upper surface of the wavelength conversion plate 50 may be located above the upper end surface 27.

By using the ceramic plate, the wavelength conversion plate 50 is stronger than the resin containing the conventional phosphor and has high temperature durability. The wavelength conversion plate 50 may have a rectangular shape, in particular a square shape. The wavelength conversion plate 50 may be attached to the sidewall 21 using silicon or epoxy. At this time, the silicone or epoxy used as the adhesive is guided by the groove 23g, so that it is prevented from spreading to the first cavity C1, the second cavity C2, or another part of the housing 20.

On the other hand, the sealing resin 60 fills some space around the wavelength conversion plate 50. The sealing resin 60 may cover the upper surface 23 and the intermediate surface 25 of the side wall 21, and may cover the stepped portion 25w and at least a portion of the stepped portion 27w. The sealing resin 60 also covers the side of the wavelength conversion plate 50 so that the wavelength conversion plate 50 is firmly adhered to the housing 20.

The sealing resin 60 may also fill the second cavity C2 of the housing 20. The sealing resin 60 may be formed of transparent silicone or epoxy. When the first cavity C1 is spaced apart from the second cavity C2, the first cavity C1 is covered with the wavelength conversion plate 50 so that the sealing resin 60 penetrates into the first cavity C1. Can be prevented. Therefore, the first cavity C1 may remain in the empty space. However, the present invention is not limited thereto, and the light emitting diode 30 in the first cavity C1 may be covered with a transparent resin. The transparent resin may fill part of the first cavity C1 or completely fill the first cavity C1. This will be described later with reference to FIG. 12.

Referring to FIG. 6, the LED package according to the present embodiment is generally similar to the LED package of the above-described embodiment, but there is a difference in that the sealing resin 60 is formed of a white reflector. The white reflector may be formed of a material in which a white pigment is mixed with a resin such as silicone or epoxy. In addition, a reflector such as polycarbonate or PCT may be used as the sealing resin.

By forming the encapsulation resin 60 using the white reflector, light emitted from the light emitting diode package can be generally emitted to the outside only through the wavelength conversion plate 50. Thus, unwanted light can be prevented from being emitted through the sealing resin 60 so that the directivity distribution of the light can be easily controlled.

7 to 11 are schematic perspective views for explaining a light emitting diode package manufacturing process according to an embodiment of the present invention. The dashed lines in the figures indicate the positions to be divided.

First, referring to FIG. 7, a base substrate 10 is provided. The base substrate 10 includes a plurality of pairs of the first electrode 13 and the second electrode 15. Although only the first and second upper leads 13a and 15a are shown in the drawing, the first and second vias 13b and 15b and the first and second lower leads as described with reference to FIGS. 13c and 15c are also included. Although two different pairs of the first electrode 13 and the second electrode 15 are shown in FIG. 7, more pairs may be provided on the base substrate 10.

Meanwhile, the two pairs of the first electrode 13 and the second electrode 15 may be disposed in a 180 degree rotationally symmetrical structure. They again form a pair. A plurality of such pairs may be disposed on the base substrate 10. Here, although the first electrode 13 and the second electrode 15 are described as being arranged in a symmetrical structure, the shape and structure of the first electrode 13 and the second electrode 15 may be variously modified.

Referring to FIG. 8, a housing 20 is formed on the base substrate 10. The housing 20 may be formed of a resin having high reflectance. The housing 20 may be formed on the base substrate 10 using molding techniques. The housing 20 includes a pair of first cavities C1 and a second cavity C2 disposed between these first cavities. The second cavity C2 may be formed to have the same size as the first cavity C1, but may be smaller than the first cavity C1 because a relatively small protective element is mounted.

The pair of first cavities C1 expose different first upper leads 13a and second upper leads 15a, respectively. Meanwhile, the second cavity C2 exposes two different pairs of the first upper lead 13a and the second upper lead 15a. That is, in FIG. 8, the first cavity C1 disposed above exposes the first and second upper leads 13a and 15a of the first pair, and the first cavity C1 disposed below exposes the second. Expose the pair of first and second

upper leads

13a, 15a. In addition, the second cavity C2 exposes the first and second pair of first and second upper leads 13a and 15a.

Meanwhile, the first cavities C1 may have the same size. The second cavity C2 may have the same size as the first cavities C1 but may have a smaller size than the first cavities C1.

Both the first and second cavities C1 and C2 may have a rotationally symmetrical shape, for example, may have a square shape. However, the present invention is not limited thereto and may have other shapes.

The housing 20 also defines the top surface 23, the middle surface 25 and the top surface 27 of the side wall 21 surrounding the first cavity C1 as described above with reference to FIGS. 2 to 5. It may have a stepped portion (25w, 27w) between them, the cathode mark 27a may be formed on the top end surface 27.

9, a light emitting diode 30 is mounted in each of the first cavities C1, and a protection element 40 is mounted in the second cavity C2. The light emitting diode 30 may be flip bonded to the first and second upper leads 13a and 15a exposed to the first cavity C1, and the protection device 40 may be exposed to the second cavity C2. The first and second upper leads 13a and 15a may be flip bonded.

Referring to FIG. 10, wavelength conversion plates 50 are attached to the first cavities C1. The wavelength conversion plate 50 may be attached on the sidewall 21 surrounding the first cavity C1 using silicon or epoxy. As the wavelength conversion plate 50 is attached, the first cavity C1 may be blocked from the outside.

Referring to FIG. 11, a sealing resin 60 is then formed to fill the second cavity C2. The sealing resin 60 may fill some space around the wavelength conversion plate 50. The sealing resin 60 may cover the upper surface 23 and the middle surface 25 of the sidewall 21 and may cover a part of the stepped portion 25w and the stepped portion 27w. Furthermore, the sealing resin 60 may cover the side surface of the wavelength conversion plate 5. The sealing resin 60 may be formed of a transparent resin such as epoxy or silicone. Alternatively, it may be formed with a white reflector such as epoxy or silicone containing a white pigment.

Subsequently, the base substrate 10 and the housing 20 are divided into individual light emitting diode packages by dividing along the dotted lines to complete the light emitting diode package. When dividing the base substrate 10 and the housing 20, in particular, the second cavity C2 is divided. The second cavity C2 can be divided into the same size, and therefore, the same light emitting diode packages can be manufactured.

According to the LED package manufacturing method according to the present embodiment, two LED package regions share a second cavity C2 in which the protection devices 40 are mounted. As a result, a work space for mounting the protection element 40 can be secured, and the LED package can be miniaturized. In the prior art, the second cavity is surrounded by the side wall. However, when both the first cavity and the second cavity are separated from each other and surrounded by sidewalls, it is difficult to miniaturize the package because the work space for mounting the light emitting diode and the protection element is limited by the sidewalls.

12 is a schematic cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention.

First, referring to FIG. 12 (a), the light emitting diode package according to the present exemplary embodiment is generally similar to the light emitting diode package described with reference to FIGS. 1 to 5, but the transparent resin 70a uses the light emitting diode 30. There is a difference in covering.

The transparent resin 70a may be a transparent silicone resin or an epoxy resin, and seals and protects the light emitting diode 30. The transparent resin 70a fills a portion of the first cavity C1, and as illustrated, the wavelength conversion plate 50 may be spaced apart from the transparent resin 70a.

Referring to FIG. 12B, the LED package according to the present embodiment is generally similar to the embodiment of FIG. 12A, except that the transparent resin 70b completely fills the first cavity C1. .

The transparent resin 70b completely fills the first cavity C1 to seal the light emitting diode 30. In addition, the transparent resin 70b may be used as an adhesive for bonding the wavelength conversion plate 50. Therefore, the wavelength conversion plate 50 can be firmly adhered to the housing 20.

13 is a perspective view illustrating a light emitting diode package according to another embodiment of the present invention.

In the above-described embodiments, the first cavity C1 and the second cavity C2 have been described as being spaced apart from each other by the side wall 21, but here, the first cavity C1 and the second cavity C2 are separated from each other. Explain about communicating.

Referring to FIG. 13A, a part of the sidewall 21 disposed between the first cavity C1 and the second cavity C2 is opened to allow the first cavity C1 and the second cavity C2 to each other. Communicate. The open portion may be a central portion of the sidewall 21 shared by the first cavity C1 and the second cavity C2.

Referring to FIG. 13B, most of the sidewalls 21 shared by the first cavity C1 and the second cavity C2 may be opened. Thus, the second cavity C2 communicates with the outside of the package and the first cavity C1.

Referring to FIG. 13C, in the present embodiment, the height of the sidewall 21 shared by the first cavity C1 and the second cavity C2 is relatively lower than that of the side wall 21 of the other part. Thus, the first cavity C1 and the second cavity C2 communicate with each other.

14 is a perspective view illustrating a light emitting diode package according to another embodiment of the present invention.

Referring to FIG. 14, the light emitting diode package according to the present embodiment is generally similar to the light emitting diode package of the above-described embodiments, except that the light emitting diode 30a has a vertical structure.

Since the flip-chip light emitting diode 30 flip-bonds the light emitting diode, it does not require a bonding wire. However, a light emitting diode such as a vertical type or a horizontal type requires a bonding wire to electrically connect to the first and second upper leads 13a and 15a. The vertical light emitting diode 30a generally has a first electrode on the lower surface and a second electrode on the upper surface. Accordingly, as illustrated, the light emitting diode 30a may be mounted on the first upper lead 13a and electrically connected to the second upper lead 15a through the bonding wire 80.

In the case of a horizontal light emitting diode, since both the first electrode and the second electrode are disposed on the upper surface side of the light emitting diode, both of these electrodes are electrically connected to the first and second upper leads 13a and 15a through bonding wires. will be.

Meanwhile, in the above embodiments, the centers of the light emitting diode 30 and the wavelength conversion plate 50 may be aligned with each other. However, in the present embodiment, as the bonding wire 80 is used, the light emitting diode 30a may deviate from the center of the first cavity C1. Thus, the center of the light emitting diode 30a and the wavelength conversion plate 50a It can be shifted.

Although not shown, the protection element 40 may also be electrically connected to the upper leads 13a and 15a through a bonding wire.

FIG. 15 is a schematic perspective view illustrating a light emitting diode package according to another embodiment of the present invention, and FIG. 16 is a schematic cutaway perspective view illustrating a light emitting diode package according to another embodiment of the present invention. 17 is a bottom perspective view illustrating a light emitting diode package according to another embodiment of the present invention, and FIG. 18 is a cross-sectional view illustrating a light emitting diode package according to another embodiment of the present invention.

15 to 18, the light emitting diode package according to the present embodiment includes a base substrate 10, a housing 20, a light emitting diode 30, and a protection device 40, and further, a glass phosphor 50. ) And the sealing resin 60 may be further included.

The base substrate 10 may include an insulating substrate 11,

first electrodes

The first electrode 13 and the second electrode 15 have

upper leads

fields

Meanwhile, a groove 23g may be formed along the upper surface 23 of the side wall 21. The groove 23g may improve the adhesion between the sealing resin 60 and the housing 20. That is, when the sealing resin 60 is formed in the cavities C1 and C2 of the housing 20, the sealing resin 60 is also formed inside the groove 23g so that the sealing resin 60 is formed in the housing 20. Can be fixed In addition, the groove 23g may increase the adhesion area of the sealing resin 60 to minimize the peeling of the sealing resin 60 from the housing 20.

However, according to another exemplary embodiment, the upper surface 23 of the sidewall 21 may not include the groove 23g and may be flat. Referring to FIG. 18B, the upper surface 23 of the sidewall 21 has a flat shape in which no groove 23g is formed. In the light emitting diode package disclosed in FIG. 18B, the process for forming the grooves 23g is omitted in comparison with the light emitting diode package disclosed in FIG. 18A, and thus, the process may be simplified. Here, FIG. 18B is representatively showing that the groove 23g is not formed in the upper surface 23 of the side wall 21. Therefore, the upper surface of the side wall 21 as shown in FIG. The structure in which the 23 does not include the groove 23g can be equally applied to all other drawings.

Meanwhile, the first cavity C1 and the second cavity C2 may be disposed at both sides with a part of the sidewall 21 interposed therebetween. That is, the first cavity C1 and the second cavity C2 share a part of the sidewall 21. Accordingly, as shown in FIG. 18, the side wall 21 may have an inner wall surface 21 a positioned on the side of the first cavity C1 and an inner wall surface 21 a positioned on the side of the second cavity C2. have. On the other hand, the inner wall surface 21a located on the side of the first cavity C1 is inclined more gently than the inner wall surface 21b located on the side of the second cavity C2 to reflect the light emitted from the light emitting diode 30. Can lose. That is, referring to FIG. 18A, the angle 21a-1 of the inner wall surface 21a positioned on the first cavity C1 side is the inner wall surface 21b positioned on the second cavity C2 side. Is larger than the angle 21b-1. This means that the inclination of the inner wall surface 21a located on the side of the first cavity C1 is smaller than the inclination of the inner wall surface 21b located on the side of the second cavity C2 in relation to the substrate 11. do. The light efficiency of the LED package may be increased by the slopes of the sides of the cavity C1 and C2.

upper leads

13a, 15a).

The housing 20 may be formed of a material different from the insulating substrate 11, for example, a thermosetting or thermoplastic resin. The housing 20 may be formed of a resin having high reflectance, and may be formed of, for example, poly phthal amide (PPA), poly cyclohexylenedimethylene terephthalate (PCT), epoxy molding compount (EMC), or silicone molding compound (SMC). have. In particular, the silicon molding compound (SMC) is resistant to high temperatures and has a high reflectance, so that the silicon molding compound (SMC) may be suitably used in a light emitting diode package requiring high power such as an automobile head lamp. Alternatively, the housing 20 may be formed of a transparent resin. The light emitting diode package including the housing 20 formed of a transparent resin may have a relatively low directivity of light. Such a light emitting diode package may be suitable for use in, for example, an indoor light, particularly an automotive light, where dispersion of light is required. Alternatively, the housing 20 may be formed of an antireflective resin having a high light absorption rate. For example, the housing 20 may be formed of a black resin that absorbs light of all wavelengths. As a result, the housing 20 may be formed of a resin having a high reflectance, a transparent resin, or an antireflective resin having a high absorption rate.

portions

25w and 27w may be located. Can be. The stepped

portions

25w and 27w, the middle top surface 25 and the side surface 21 upper surface 23 increase the adhesive area of the sealing resin 60 to prevent the sealing resin 60 from being peeled from the housing 20. prevent. In the present embodiment, a double stepped top surface structure is illustrated and described, but is not limited thereto. More or fewer top surfaces may be formed.

The wavelength conversion plate 50 is disposed on the top surface of the light emitting diode 30 in the first cavity C1. That is, the wavelength conversion plate 50 forms a structure directly connected to the light emitting diode 30. The wavelength conversion plate 50 forms a structure covering all or part of the upper surface of the light emitting diode 30 according to the type of the light emitting diode 50. That is, when the light emitting diode 30 requires wire bonding in order to receive power, the wavelength conversion plate 50 may have a remaining area on the top surface of the light emitting diode 50 except for an area requiring wire bonding. Can cover. However, when the light emitting diode 50 does not require a separate wire bonding, the wavelength conversion plate 50 may cover the entire upper surface of the light emitting diode 30.

The wavelength conversion plate 50 contains a wavelength conversion material in a ceramic plate. For example, there is a glass containing phosphor (PIG) or a SiC phosphor containing a phosphor in a SiC substrate, and a phosphor in quartz It may also contain. In addition, various ceramic plate phosphors are possible. In addition to phosphors, other wavelength converting materials such as quantum dots may be used. The upper surface of the wavelength conversion plate 50 may be positioned above the upper surface 23 of the side wall 21, may be positioned below the uppermost surface 27 of the housing 20, and may be positioned above the intermediate surface 25. . However, the present invention is not limited thereto, and the upper surface of the wavelength conversion plate 50 may be located above the upper end surface 27.

By using the ceramic plate, the wavelength conversion plate 50 is stronger than the resin containing the conventional phosphor and has high temperature durability. The wavelength conversion plate 50 may have a rectangular shape, in particular a square shape. In particular, the wavelength conversion plate 50 may have the same or similar shape as the light emitting diode 30. The wavelength conversion plate 50 may be attached to the top surface of the light emitting diode 30 using silicon or epoxy.

Meanwhile, the sealing resin 60 fills the remaining space around the light emitting diode 30 and the wavelength conversion plate 50 in the first cavity C1. In addition, the sealing resin 60 may cover the upper surface 23 and the intermediate surface 25 of the sidewall 21, and may cover the stepped portion 25w and at least a portion of the stepped portion 27w. The sealing resin 60 also covers the side surface of the wavelength conversion plate 50 so that the wavelength conversion plate 50 is firmly adhered to the light emitting diode 30 in the housing 20. The sealing resin 60 may also fill the second cavity C2 of the housing 20. The sealing resin 60 may be formed of transparent silicone or epoxy.

Referring to FIG. 19, the LED package according to the present embodiment is generally similar to the LED package of the above-described embodiment, but there is a difference in that the sealing resin 60 is formed of a white reflector. The white reflector may be formed of a material in which a white pigment is mixed with a resin such as silicone or epoxy. In addition, a reflector such as polycarbonate or PCT may be used as the sealing resin.

20 to 24 are schematic perspective views illustrating a light emitting diode package manufacturing process according to an embodiment of the present invention. The dashed lines in the figures indicate the positions to be divided.

First, referring to FIG. 20, a base substrate 10 is provided. The base substrate 10 includes a plurality of pairs of the first electrode 13 and the second electrode 15. Although only the first and second upper leads 13a and 15a are shown in the drawing, the first and second vias 13b and 15b and the first and second lower leads as described with reference to FIGS. 15 to 18 are illustrated. 13c and 15c are also included. Although two different pairs of the first electrode 13 and the second electrode 15 are shown in FIG. 20, more pairs may be provided on the base substrate 10.

Referring to FIG. 21, a housing 20 is formed on the base substrate 10. The housing 20 may be formed of a resin having high reflectance. The housing 20 may be formed on the base substrate 10 using molding techniques. The housing 20 includes a pair of first cavities C1 and a second cavity C2 disposed between these first cavities. The second cavity C2 may be formed to have the same size as the first cavity C1, but may be smaller than the first cavity C1 because a relatively small protective element is mounted.

The pair of first cavities C1 expose different first upper leads 13a and second upper leads 15a, respectively. Meanwhile, the second cavity C2 exposes two different pairs of the first upper lead 13a and the second upper lead 15a. That is, in FIG. 21, the first cavity C1 disposed above exposes the first and second upper leads 13a and 15a of the first pair, and the first cavity C1 disposed below exposes the second. Expose the pair of first and second

upper leads

The housing 20 also has an upper surface 23, a middle surface 25, and a top surface 27 of the side wall 21 surrounding the first cavity C1 as described above with reference to FIGS. 15 to 18. It may have a stepped portion (25w, 27w) between them, the cathode mark 27a may be formed on the top end surface 27.

Referring to FIG. 22, a light emitting diode 30 is mounted in each of the first cavities C1, and a protection element 40 is mounted in the second cavity C2. The light emitting diode 30 may be flip bonded to the first and second upper leads 13a and 15a exposed to the first cavity C1, and the protection device 40 may be exposed to the second cavity C2. The first and second upper leads 13a and 15a may be flip bonded.

Referring to FIG. 23, wavelength conversion plates 50 are attached to upper surfaces of the light emitting diodes 30 in the first cavities C1. The wavelength conversion plate 50 may be attached to the top surface of the light emitting diode 30 using silicon or epoxy. Here, the structure in which the wavelength conversion plate 50 covers the entire upper surface of the light emitting diode 30 is shown. However, when the light emitting diode 30 has a structure requiring wire bonding, the wavelength conversion plate 50 may cover a portion of the light emitting diode 30 to expose the wire bonding portion of the light emitting diode 30.

Referring to FIG. 24, a sealing resin 60 is then formed to fill the first cavity C1 and the second cavity C2. The sealing resin 60 may fill some space around the wavelength conversion plate 50. The sealing resin 60 may cover the upper surface 23 and the middle surface 25 of the sidewall 21 and may cover a part of the stepped portion 25w and the stepped portion 27w. Furthermore, the sealing resin 60 may cover the side surface of the wavelength conversion plate 5. The sealing resin 60 may be formed of a transparent resin such as epoxy or silicone. Alternatively, it may be formed with a white reflector such as epoxy or silicone containing a white pigment.

25 is a perspective view illustrating a light emitting diode package according to another embodiment of the present invention.

Referring to FIG. 25A, a part of the sidewall 21 disposed between the first cavity C1 and the second cavity C2 is opened to allow the first cavity C1 and the second cavity C2 to each other. Communicate. The open portion may be a central portion of the sidewall 21 shared by the first cavity C1 and the second cavity C2.

Referring to FIG. 25B, most of the sidewalls 21 shared by the first cavity C1 and the second cavity C2 may be opened. Thus, the second cavity C2 communicates with the outside of the package and the first cavity C1.

Referring to FIG. 25C, the height of the side wall 21 shared by the first cavity C1 and the second cavity C2 is relatively lower than that of the side wall 21 of the other part. Thus, the first cavity C1 and the second cavity C2 communicate with each other.

26 is a perspective view and a cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention. Specifically, FIG. 26A illustrates a schematic perspective view for describing the LED package according to the present embodiment, FIG. 26B illustrates a cutaway perspective view, and FIG. 26C illustrates a cross-sectional view.

26 (a) to 26 (c), the LED package according to the present embodiment is generally similar to the LED package of the embodiments described with reference to FIGS. 1 to 12, but the size of the LED 30 is shown. The difference is that the size of the wavelength conversion plate 50 is larger.

26A to 26C, the size of the wavelength conversion plate 50 positioned on the light emitting diode 30 is larger than that of the light emitting diode 30. Here, the size means the width of the upper surface of the light emitting diode 30 and the wavelength conversion plate 50. Therefore, the thickness of the light emitting diode 30 and the wavelength conversion plate 50 is not limited. In general, the light emitted from the active layer (not shown) of the light emitting diode 30 may be emitted not only to the upper surface of the light emitting diode 30 but also to the side surface. When the size of the wavelength conversion plate 50 is larger than the size of the light emitting diode 30, all or part of the light emitted to the side of the light emitting diode 30 is converted into the wavelength band intended by the wavelength conversion plate 50. Can be. Therefore, when the size of the wavelength conversion plate 50 is larger than the light emitting diode 30, the reliability of the light emitting diode package may be increased.

27 is a perspective view and a cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention. Specifically, FIG. 27A shows a schematic perspective view for explaining the LED package according to the present embodiment, FIG. 27B shows a cutaway perspective view, and FIG. 27C shows a cross-sectional view.

27 (a) to 27 (c), the light emitting diode package according to the present embodiment is generally similar to the light emitting diode package of the above-described embodiments, except that the light emitting diode 30 has a vertical structure. have.

Since the flip-chip light emitting diode 30 flip-bonds the light emitting diode, it does not require a bonding wire. However, a light emitting diode such as a vertical type or a horizontal type requires a bonding wire to electrically connect to the first and second upper leads 13a and 15a. The vertical light emitting diode 30a generally has a first electrode on the lower surface and a second electrode on the upper surface. Accordingly, the light emitting diode 30a is mounted on the first upper lead 15a and the second upper lead 13a through the bonding wire 80 as shown in FIGS. 27A to 27C. ) Can be electrically connected.

Meanwhile, in the above embodiments, the light emitting diode 30 is positioned at the center of the first cavity C1. However, in the present embodiment, the light emitting diode 30a may deviate from the center of the first cavity C1 by using the bonding wire 80. In addition, in the above embodiments, the wavelength conversion plate 50 covers the entire upper surface of the light emitting diode 30. However, in this embodiment, wire bonding is performed on a part of the upper surface of the light emitting diode 30. Accordingly, the wavelength conversion plate 50 exposes a portion of the upper surface of the light emitting diode 30 to which wire bonding is made, and covers the upper surface of the light emitting diode 30 in the remaining portion.

28 is a perspective view illustrating a light emitting diode package according to another embodiment of the present invention.

Referring to FIG. 28, the LED package according to the present embodiment is generally similar to the LED package of the embodiment described with reference to FIG. 27, but there are differences in the structures of the cavity C1 ′ and C3.

In FIG. 28, the first cavity C1 of FIG. 27 is divided into two distinct first and second regions C1 ′ and C3. The light emitting diode 30 disclosed in FIGS. 27 and 28 is a vertical light emitting diode, for example, and requires a bonding wire. Here, the first region C1 ′ of FIG. 28 is a portion in which the light emitting diode 30 is mounted, and the second region C3 is a region in which the bonding wire 80 is bonded to the upper lead 13a. The sidewall C1 ′ -1 of the first region C1 ′ in which the light emitting diodes 30 are mounted serves to reflect the light emitted from the light emitting diodes 30 onto the light emitting diode package. Thus, the sidewall C1'-1 has a gentle slope to reflect light. However, the second region C3 is a portion for bonding the bonding wire 80 to the upper lead 13a, and the sidewall C3-1 of the second region C3 is an inclined surface of the sidewall C1'-1. Have a more steep slope. The package may be prevented from growing by sharpening the inclined surface of the sidewall C3-1 of the second region C3. Furthermore, the size of the second region C3 may be smaller than that of the first region C1 ′ and may be formed to a minimum size for the bonding wire.

29 is a cross-sectional view for describing a light emitting diode package according to another embodiment of the present invention. The LED package according to the present exemplary embodiment is generally similar to the LED package of the exemplary embodiment described with reference to FIGS. 15 to 26, but there are some differences in the shape and number of the LED and the wavelength conversion plate.

Referring to FIGS. 29A and 29B, two light emitting diodes 30 ′ -1 and 30 ′ -2 may be mounted in the first cavity C1. The two light emitting diodes 30'-1 and 30'-2 may be mounted to be spaced apart from each other in the first cavity C1. The separation distance of the light emitting diodes 30'-1 and 30'-2 may be determined in consideration of the relationship with the sidewall 21. For example, the separation distance of the light emitting diodes 30'-1 and 30'-2 may be determined to be equal to the distance between the light emitting diodes 30'-1 and 30'-2 and the sidewall 21.

The light emitting diode package in FIG. 29A includes one wavelength conversion plate 50 ′. One wavelength conversion plate 50 'may cover the top surfaces of the two light emitting diodes 30'-1 and 30'-2. The wavelength conversion plate 50 ′ may have a size determined to cover the top surfaces of the two light emitting diodes 30 ′ -1 and 30 ′ -2 spaced apart from each other, as illustrated in FIG. 16A. However, it is not limited thereto. That is, the wavelength conversion plate 50 ′ may have a size determined to cover an area wider than the top surfaces of the two light emitting diodes 30 ′ -1 and 30 ′ -2, as in the embodiment shown in FIG. 26. have. Through this, the wavelength of the light emitted from the sides of the light emitting diodes 30'-1 and 30'-2 can be efficiently changed.

In another embodiment, the LED package of FIG. 29B includes two wavelength conversion plates 50'-1 and 50'-2. Two wavelength conversion plates 50'-1 and 50'-2 cover two light emitting diodes 30'-1 and 30'-2, respectively. Here, the size of the wavelength conversion plate 50'-1, 50'-2 may be the same as the size of the light emitting diodes 30'-1, 30'-2 as shown in FIG. However, the present invention is not limited thereto, and as in the exemplary embodiment illustrated in FIG. 26, the size of each wavelength converting plate 50 ′ -1 and 50 ′ -2 may correspond to each light emitting diode 30 ′ -1 and 30 ′ -2 May be larger than). Through this, the wavelength of the light emitted from the sides of the light emitting diodes 30'-1 and 30'-2 can be efficiently changed. Here, the size may mean the width of the upper surface of the light emitting diode 30 and the wavelength conversion plate 50.

Although two light emitting diodes 30'-1 and 30'-2 are mounted inside the first cavity C1 in FIGS. 29A and 29B, the present invention is not limited thereto. The plurality of light emitting diodes may be mounted in the first cavity C1. In FIG. 15B, the number of wavelength conversion plates may be two or more, and may be equal to or smaller than the number of light emitting diodes mounted in the first cavity C1. When the number of wavelength conversion plates is smaller than the number of light emitting diodes, the number of light emitting diodes covered by the individual wavelength conversion plates may be different for each wavelength conversion plate. For example, when the light emitting diode package includes five light emitting diodes and two wavelength conversion plates, one wavelength conversion plate may cover three light emitting diodes and the other wavelength conversion plate may cover two light emitting diodes.

As the number of light emitting diodes mounted in the first cavity C1 increases, the number of protection elements mounted in the second cavity C2 may also increase. That is, a plurality of protection elements may be mounted in the second cavity C2.

While various embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications may be made without departing from the scope of the present invention. In addition, the components described in only one embodiment may be applied to other embodiments without departing from the scope of the invention.

Claims

A base substrate having a first electrode and a second electrode;

A housing disposed on the base substrate, the housing having sidewalls defining a first cavity for mounting a light emitting diode;

A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And

And a wavelength conversion plate spaced apart from the light emitting diode and disposed on the sidewall.
The method according to claim 1,

The wavelength conversion plate is a light emitting diode package comprising a ceramic plate phosphor.
The method according to claim 1,

The sidewalls of the first cavity surrounds the first cavity.
The method according to claim 1,

At least a portion of the sidewall of the first cavity is open LED package.
The method according to claim 1,

The light emitting diode package is a flip chip, vertical or horizontal light emitting diode package.
The method according to claim 5,

The center of the light emitting diode is a light emitting diode package aligned with the center of the wavelength conversion plate.
The method according to claim 5,

The center of the light emitting diode is a light emitting diode package off the center of the wavelength conversion plate.
The method according to claim 1,

The sidewall of the first cavity has a groove formed in the upper surface along the first cavity.
The method according to claim 1,

The LED package of claim 1, further comprising a transparent resin covering the light emitting diode in the first cavity.
The method according to claim 9,

And the transparent resin partially or completely fills the first cavity.
The method according to claim 1,

And a sealing resin at least partially filling the space around the wavelength conversion plate.
The method according to claim 11,

The sealing resin is a light emitting diode package is a transparent resin or a white reflective resin.
The method according to claim 1,

The base substrate includes an insulating substrate,

The first and second electrodes, respectively,

An upper lead disposed on the insulating substrate;

A lower lead disposed under the insulating substrate; And

And a via penetrating the insulating substrate to connect the upper lead and the lower lead.
The method according to claim 13,

The insulating substrate is a light emitting diode package comprising an aluminum nitride substrate.
The method according to claim 1,

Further include a protective element,

The housing further includes sidewalls defining a second cavity for mounting the protective element,

The protection device is a light emitting diode package mounted in the second cavity.
The method according to claim 15,

The sidewall of the second cavity is open to communicate with the outside of the LED package.
The method according to claim 15,

The LED package of the first cavity and the second cavity share a side wall.
The method according to claim 15,

The first cavity and the second cavity communicate with each other.
In the light emitting diode package,

A base substrate having a first electrode and a second electrode;

A sidewall disposed on the base substrate, the sidewall defining a first cavity for mounting a light emitting diode, and the sidewall defining a second cavity for mounting a protection element, wherein a portion of the sidewall of the second cavity is the light emitting diode; A housing open to communicate with the outside of the package;

A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And

A light emitting diode package comprising a protection element mounted in the second cavity.
The method according to claim 19,

The first cavity and the second cavity are spaced apart by a side wall shared with each other.
The method according to claim 19,

The light emitting diode package of claim 1, wherein the first cavity and the second cavity communicate with each other.
The method according to claim 19,

The first cavity has a size greater than twice the size of the second cavity.
The method according to claim 19,

The first cavity is disposed on the central area of the base substrate.
The method according to claim 19,

The first cavity has a rotationally symmetrical shape,

The second cavity is a light emitting diode package having an elongated shape along one edge of the base substrate.
A base substrate having a first electrode and a second electrode;

A housing disposed on the base substrate, the housing having sidewalls defining a first cavity for mounting a light emitting diode;

A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; And

A light emitting diode package comprising a wavelength conversion plate disposed on an upper surface of the light emitting diode.
The method according to claim 25,

The wavelength conversion plate is a light emitting diode package comprising a ceramic plate phosphor.
The method according to claim 25,

The sidewalls of the first cavity surrounds the first cavity.
The method according to claim 25,

At least a portion of the sidewall of the first cavity is open LED package.
The method according to claim 25,

The light emitting diode package is a flip chip, vertical or horizontal light emitting diode package.
The method of claim 29,

The wavelength conversion plate is a light emitting diode package covering the entire upper surface of the light emitting diode.
The method of claim 30,

The wavelength conversion plate is greater than or equal to the size of the light emitting diode package.
The method according to claim 31,

The wavelength conversion plate covers a portion of the upper surface of the light emitting diode to expose a wire bonding portion.
The method according to claim 25,

The sidewall of the first cavity has a groove formed in the upper surface along the first cavity.
The method according to claim 25,

The LED package of claim 1, further comprising a sealing resin filling the space around the first cavity and the wavelength conversion plate.
The method of claim 34, wherein

The sealing resin is a light emitting diode package is a transparent resin or a white reflective resin.
The method according to claim 25,

The base substrate includes an insulating substrate,

The first and second electrodes, respectively,

An upper lead disposed on the insulating substrate;

A lower lead disposed under the insulating substrate; And

And a via penetrating the insulating substrate to connect the upper lead and the lower lead.
The method of claim 36,

The insulating substrate is a light emitting diode package comprising an aluminum nitride substrate.
The method according to claim 25,

Further include a protective element,

The housing further includes sidewalls defining a second cavity for mounting the protective element,

The protection device is a light emitting diode package mounted in the second cavity.
The method of claim 38,

The sidewall of the second cavity is open to communicate with the outside of the LED package.
The method of claim 38,

The LED package of the first cavity and the second cavity share a side wall.
The method of claim 38,

The first cavity and the second cavity communicate with each other.
The method according to claim 25,

The light emitting diode package is at least two light emitting diodes.
The method of claim 42,

The wavelength conversion plate is a light emitting diode package disposed on the upper surface of the at least two light emitting diodes.
The method of claim 42,

The wavelength conversion plate is at least two,

The at least two wavelength conversion plate is a light emitting diode package disposed on the upper surface of the at least two light emitting diodes.
In the light emitting diode package,

A base substrate having a first electrode and a second electrode;

A sidewall disposed on the base substrate, the sidewall defining a first cavity for mounting a light emitting diode, and the sidewall defining a second cavity for mounting a protection element, wherein a portion of the sidewall of the second cavity is the light emitting diode; A housing open to communicate with the outside of the package;

A light emitting diode mounted in the first cavity and electrically connected to the first and second electrodes;

A wavelength conversion plate disposed in at least a portion of an upper surface of the light emitting diode in the first cavity; And

A light emitting diode package comprising a protection element mounted in the second cavity.
The method of claim 45,

The first cavity and the second cavity are spaced apart by a side wall shared with each other.
The method of claim 45,

The light emitting diode package of claim 1, wherein the first cavity and the second cavity communicate with each other.
The method of claim 45,

The first cavity has a size greater than twice the size of the second cavity.
The method of claim 45,

The first cavity is disposed on the central area of the base substrate.
The method of claim 45,

The first cavity has a rotationally symmetrical shape,

The second cavity is a light emitting diode package having an elongated shape along one edge of the base substrate.