KR102609148B1 - Electronic component and board having the same mounted thereon - Google Patents

Abstract

The present invention, a capacitor body; first and second external electrodes spaced apart from each other on the mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively; a first plating layer covering the first external electrode and the first connection terminal; and a second plating layer covering the second external electrode and the second connection terminal; Provides an electronic component including and a mounting board thereof.

Description

Electronic components and their mounting boards {ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON}

The present invention relates to electronic components and their mounting boards.

Recently, in electronic devices, mechanical components have become quieter, and acoustic noise emitted by multilayer capacitors (MLCCs) is becoming more prominent.

Because the dielectric material of a multilayer capacitor has piezoelectric properties, it deforms in synchronization with the applied voltage.

When the cycle of the applied voltage is in the audible frequency band, the displacement becomes vibration and is transmitted to the board through the solder, and this board vibration is heard as sound. This is acoustic noise, which is a problem in electronic devices.

The problem of acoustic noise is that, when the operating environment of the device is quiet, the user perceives the acoustic noise as an abnormal sound and makes the user feel that the device is malfunctioning, or in devices with audio circuits, when acoustic noise is superimposed on the audio output, it deteriorates the quality of the device. do.

Additionally, apart from the acoustic noise perceived by the human ear, piezoelectric vibration of a multilayer capacitor may cause malfunctions in various sensors used in IT and industrial/electrical fields when it occurs in a high frequency range of 20 kHz or higher.

Japanese Patent No. 3847265 Domestic Published Patent No. 10-2010-0087622 Domestic Published Patent No. 10-2015-0127965

The purpose of the present invention is to provide an electronic component and a board for mounting the same that can reduce acoustic noise in the audible frequency range below 20 kHz and high-frequency vibration above 20 kHz.

One aspect of the present invention is a capacitor body; first and second external electrodes spaced apart from each other on the mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively; a first plating layer covering the first external electrode and the first connection terminal; and a second plating layer covering the second external electrode and the second connection terminal; Provides electronic components including.

In one embodiment of the present invention, the electronic component may further include a bridge portion disposed between the first and second connection terminals.

In one embodiment of the present invention, the first and second connection terminals may have the first and second cutouts formed on both surfaces of the first and second connection terminals, respectively, facing each other.

In one embodiment of the present invention, it may further include first and second conductive adhesive layers respectively disposed between the first and second external electrodes and the first and second connection terminals.

In one embodiment of the present invention, the thickness of the first and second plating layers may be 10 μm or more.

In one embodiment of the present invention, a plating layer formed on the surfaces of the first and second external electrodes may be further included.

In one embodiment of the present invention, the first and second connection terminals are made of an insulator, and the first connection terminal includes: a first conductive pattern formed on a surface facing the first external electrode; a second conductive pattern formed on a surface opposite to the first conductive pattern; a first cutout formed on a portion of a surface connecting the first and second conductive patterns; and a third conductive pattern formed on the first cutout and electrically connecting the first and second conductive patterns. It includes: wherein the second connection terminal includes: a fourth conductive pattern formed on a surface facing the second external electrode; a fifth conductive pattern formed on a surface opposite to the fourth conductive pattern; a second cutout formed on a portion of a surface connecting the fourth and fifth conductive patterns; and a sixth conductive pattern formed on the second cutout and electrically connecting the fourth and fifth conductive patterns; may include.

In one embodiment of the present invention, the first connection terminal has a third conductive pattern formed on the entire surface connecting the first and second conductive patterns or on a portion of the other surface including the first cutout, The second connection terminal may be formed on the entire surface where the sixth conductive pattern connects the fourth and fifth conductive patterns, or on a portion of the other surface including the second cutout.

In one embodiment of the present invention, the first and second connection terminals may be made of conductors.

In one embodiment of the present invention, first and second solder accommodating parts may be provided on the first and second external electrodes on the mounting surface side of the capacitor body by the first and second cutouts, respectively.

In one embodiment of the present invention, the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, first and second surfaces facing each other, the It includes third and fourth surfaces connected to the first and second surfaces and facing each other, and one end of the first and second internal electrodes may be exposed through the third and fourth surfaces, respectively.

In one embodiment of the present invention, the first and second external electrodes include first and second connection portions respectively disposed on third and fourth surfaces of the capacitor body; and first and second band portions extending from the first and second connection portions to a portion of the first surface of the capacitor body and connected to the first and second connection terminals, respectively; may include each.

In one embodiment of the present invention, the first and second connection terminals may be further disposed on opposite sides of the capacitor body to be spaced apart from each other.

In one embodiment of the present invention, the first and second plating layers include an internal plating layer having a Young's Modulus of 100 GPa or more; and an outer plating layer that covers the inner plating layer and has a Young's modulus of less than 100 GPa. may include.

In one embodiment of the present invention, the electronic component further includes a plating layer formed on the surfaces of the first and second external electrodes, respectively, and the plating layer may include a nickel plating layer and a tin plating layer.

In one embodiment of the present invention, the inner plating layer may include one of Ni or Co (cobalt), and the outer plating layer may include Sn.

Another aspect of the present invention includes: a substrate having first and second electrode pads on one surface; and an electronic component mounted on the first and second electrode pads so that first and second connection terminals are respectively connected to each other. Provides a mounting board for electronic components including.

According to one embodiment of the present invention, there is an effect of reducing acoustic noise in the audible frequency range below 20 kHz and high-frequency vibration above 20 kHz of the multilayer electronic component.

1 is a perspective view schematically showing an electronic component according to an embodiment of the present invention.
Figures 2(a) and 2(b) are plan views respectively showing first and second internal electrodes of an electronic component according to an embodiment of the present invention.
Figure 3 is a cross-sectional view taken along line II' of Figure 1.
FIG. 4 is a perspective view of FIG. 1 excluding the first and second plating layers.
Figure 5 is a front view of Figure 4.
FIG. 6 is a perspective view showing an electronic component in which a bridge portion is additionally formed in FIG. 1.
FIG. 7 is an exploded perspective view of FIG. 6 excluding the first and second plating layers.
Figure 8 is a cross-sectional view of Figure 6.
Figure 9 is a front view showing a modified example of the first and second plating layers of an electronic component according to another embodiment of the present invention.
Figure 10 is a cross-sectional view showing an electronic component according to another embodiment of the present invention, where the connection terminal is additionally disposed on the surface opposite to the mounting of the capacitor body.
Figure 11 is a cross-sectional view showing an electronic component in which the first and second plating layers are double layers according to another embodiment of the present invention.
FIG. 12 is a cross-sectional view showing that a plating layer is additionally formed on the surface of the external electrode in FIG. 11.
FIG. 13 is a front view schematically showing the electronic component of FIG. 3 mounted on a board.

Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings.

However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

Additionally, the embodiments of the present invention are provided to more completely explain the present invention to those with average knowledge in the relevant technical field.

The shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

In addition, components having the same function within the scope of the same idea shown in the drawings of each embodiment will be described using the same reference numerals.

In addition, 'including' a certain element throughout the specification means that other elements may be further included rather than excluding other elements, unless specifically stated to the contrary.

1 is a perspective view schematically showing an electronic component according to an embodiment of the present invention, and FIGS. 2(a) and 2(b) show first and second internal parts of the electronic component according to an embodiment of the present invention. It is a plan view showing each electrode, Figure 3 is a cross-sectional view taken along line II' of Figure 1, Figure 4 is a perspective view shown excluding the first and second plating layers in Figure 1, and Figure 5 is a front view of Figure 4. .

1 to 5, the electronic component 100 according to an embodiment of the present invention includes a capacitor body 110, first and second external electrodes 131 and 132, and first and second connection terminals. (141, 142) and first and second plating layers (161, 162).

Hereinafter, if the direction of the capacitor body 110 is defined to clearly describe the embodiment of the present invention, . Additionally, in this embodiment, the thickness direction can be used as the same concept as the stacking direction in which the dielectric layers are stacked.

The capacitor body 110 is made by stacking a plurality of dielectric layers 111 in the Z direction and then firing them. The capacitor body 110 includes a plurality of dielectric layers 111 and a plurality of first and second dielectric layers alternately arranged in the Z direction with the dielectric layer 111 interposed therebetween. It includes 2 internal electrodes (121, 122).

Additionally, covers 112 and 113 of a predetermined thickness may be formed on both sides of the capacitor body 110 in the Z direction, if necessary.

At this time, the adjacent dielectric layers 111 of the capacitor body 110 may be integrated to the extent that their boundaries cannot be confirmed.

The capacitor body 110 may have a generally hexahedral shape, but the present invention is not limited thereto.

In this embodiment, for convenience of explanation, the two surfaces of the capacitor body 110 facing each other in the Z direction are connected to the first and second surfaces (1, 2) and the first and second surfaces (1, 2). The two sides facing each other in the The two sides facing each other in the Y direction will be defined as the fifth and sixth sides (5, 6). In this embodiment, the first surface 1 may be a mounting surface.

The dielectric layer 111 may include a high dielectric constant ceramic material, for example, BaTiO ₃ -based ceramic powder, but the present invention is not limited thereto.

In addition, ceramic additives, organic solvents, plasticizers, binders, and dispersants may be further added to the dielectric layer 111 along with the ceramic powder. The ceramic additive may be, for example, a transition metal oxide or transition metal carbide, a rare earth element, magnesium (Mg), or aluminum (Al).

The first and second internal electrodes 121 and 122 are electrodes having different polarities, and are alternately arranged opposite each other along the Z direction with the dielectric layer 111 in between, and one end of the third internal electrode of the capacitor body 110 and may be exposed through the fourth surfaces 3 and 4, respectively.

At this time, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed in the middle.

The ends of the first and second internal electrodes 121 and 122 alternately exposed through the third and fourth surfaces 3 and 4 of the capacitor body 110 are connected to the third and fourth internal electrodes 121 and 122 of the capacitor body 110, which will be described later. It may be electrically connected to the first and second external electrodes 131 and 132 disposed on the four sides 3 and 4, respectively.

At this time, the first and second internal electrodes 121 and 122 are formed of a conductive metal. For example, materials such as nickel (Ni) or nickel (Ni) alloy may be used, but the present invention is not limited thereto. .

According to the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122 facing each other.

At this time, the capacitance of the electronic component 100 is proportional to the overlapped area of the first and second internal electrodes 121 and 122 that overlap each other along the Z direction.

The first and second external electrodes 131 and 132 are arranged to be spaced apart from each other on the first surface 1, which is the mounting surface of the capacitor body 110, and are provided with voltages of different polarities, and the first and second internal electrodes They may be respectively connected to the exposed portions of (121, 122) and electrically connected.

A plating layer may be formed on the surfaces of the first and second external electrodes 131 and 132, if necessary.

For example, the first and second external electrodes 131 and 132 include first and second conductive layers, first and second nickel (Ni) plating layers formed on the first and second conductive layers, and the first and second conductive layers. It may include first and second tin (Sn) plating layers formed on the first and second plating layers, respectively.

The first and second conductive layers may include copper, for example.

The first external electrode 131 may include a first connection portion 131a and a first band portion 131b.

The first connection part 131a is formed on the third surface 3 of the capacitor body 110 and is connected to the first internal electrode 121, and the first band part 131b is a capacitor in the first connection part 131a. This part extends to a portion of the first surface 1, which is the mounting surface of the body 110, and is connected to the first connection terminal 140.

At this time, the first band portion 131b may be further extended to a portion of the second surface 2 and portions of the fifth and sixth surfaces 5 and 6 of the capacitor body 110, if necessary, for purposes such as improving adhesion strength. You can.

The second external electrode 132 may include a second connection portion 132a and a second band portion 132b.

The second connection portion 132a is formed on the fourth surface 4 of the capacitor body 110 and is connected to the second internal electrode 122, and the second band portion 132b is a capacitor in the second connection portion 132a. This part extends to a portion of the first surface 1, which is the mounting surface of the body 110, and is connected to the second connection terminal 150.

At this time, the second band portion 132b may be further extended to a portion of the second surface 2 and portions of the fifth and sixth surfaces 5 and 6 of the capacitor body 110, if necessary, for purposes such as improving adhesion strength. You can.

The first and second connection terminals 141 and 142 are arranged to be connected to the first and second external electrodes 131 and 132, respectively, and have first and second cutouts 141a and 142a, respectively.

In this embodiment, the first and second connection terminals 141 and 142 are formed on the first surface 1 of the capacitor body 110 at the first and second external electrodes 131 and 132. It may be arranged to correspond to the two band portions 131b and 132b.

Accordingly, the first and second band portions of the first and second external electrodes 131 and 132 are connected to the first surface 1, which is the mounting surface of the capacitor body 110, by the first and second cutouts 141a and 142a. First and second solder receiving portions may be provided on (131b, 132b), respectively.

That is, the first and second cutouts 141a and 142a serve as solder pockets that confine the molten solder 220, etc., used when mounting the electronic components of this embodiment on the board 200. By preventing the solder 220 from being formed in the direction of the head of the capacitor body 110, transmission of vibration of the capacitor body 110 to the substrate 200 can be suppressed, thereby reducing acoustic noise.

At this time, the first and second cutouts 141a and 142a may be formed on both sides of the first and second connection terminals 141 and 142 that face each other in the X direction.

Additionally, the first and second cutouts 141a and 142a may be formed to have a curved surface. If the first and second cutouts 141a and 142a are formed in a curved shape, convenience in manufacturing can be further improved. However, the present invention does not limit the shape of the incision to a curved shape, and the shape of the incision may be changed in various ways as needed.

These first and second connection terminals 141 and 142 may be made of an insulator such as FR4, F-PCB, or ceramic material and a conductor such as metal.

When the first and second connection terminals 141 and 142 are made of an insulating material, they may have conductive land patterns on their upper and lower surfaces that function as signal terminals and ground (GND) terminals. At this time, a conductive layer may be applied to the first and second cutouts 141a and 142a.

That is, the first connection terminal 141 may be formed on the entire surface where the third conductive pattern connects the first and second conductive patterns, or on a portion of the other surface while including the first cutout 141a. there is.

In addition, the second connection terminal 142 may be formed on the entire surface where the sixth conductive pattern connects the fourth and fifth conductive patterns, or on a portion of the other surface including the second cutout 142a. there is.

More specifically, the first connection terminal 141 of this embodiment includes a first conductive pattern formed on a surface facing the first external electrode 131, and a first conductive pattern formed on a surface opposing the first conductive pattern. 2 conductive patterns, a first cutout 141a formed on a portion of the surface connecting the first and second conductive patterns, and a first cutout 141a formed on the first cutout 141a and the first and second conductive patterns It may include a third conductive pattern that electrically connects.

In addition, the second connection terminal 142 includes a fourth conductive pattern formed on a surface facing the second external electrode 132, a fifth conductive pattern formed on a surface opposing the fourth conductive pattern, and a second cutout 142a formed on a portion of the surface connecting the fourth and fifth conductive patterns, and a second cutout 142a formed on the second cutout 142a and electrically connecting the fourth and fifth conductive patterns. 6 Challenge patterns may be included.

Accordingly, the conductive patterns, which are land patterns on the upper and lower surfaces of the first and second connection terminals 141 and 142 described above, can be electrically connected through the conductive patterns of the first and second cutouts 141a and 142a, respectively. .

Meanwhile, when the first and second connection terminals 141 and 142 are made of a conductive material, electrical connection is possible through all surfaces.

That is, the electronic component 100 of the present embodiment includes first and second connection terminals 141 in the form of small boards that are spaced apart from each other on the X-Y planes of the first and second external electrodes 131 and 132. , 142).

At this time, the first and second external electrodes 131 and 132 are connected to the first and second connection terminals 141 and 142 by the first and second conductive adhesive layers 151 and 152 made of solder or conductive paste, etc. ) can be mounted on top.

That is, first and second conductive adhesive layers between the first and second band portions 131b and 132b of the first and second external electrodes 131 and 132 and the upper surfaces of the first and second connection terminals 141 and 142. (151, 152) can be arranged respectively.

The first and second conductive adhesive layers 151 and 152 may be made of solder or conductive paste, but the present invention is not limited thereto.

The first plating layer 161 is formed to simultaneously cover the first external electrode 131 and the first connection terminal 141.

The second plating layer 162 is formed to simultaneously cover the second external electrode 132 and the second connection terminal 142.

The first and second plating layers 161 and 162 may be composed of a nickel plating layer and a tin plating layer formed on the nickel plating layer.

At this time, when the first and second connection terminals 141 and 142 are made of an insulator, a conductive film is formed on the surface of the first and second connection terminals 141 and 142 by, for example, deposition, and then deposited on the conductive film. First and second plating layers 161 and 162 may be formed.

When joining a connection terminal and an external electrode with a conductive adhesive layer, if heat such as reflow is applied, the tin (Sn) layer on the surface of the external electrode may be partially melted and removed, resulting in a dirty appearance.

In addition, since the tin layer is melted on the surface of the connection terminal, soldering performance becomes unstable when mounted on a board, which may increase noise deviation.

However, according to the present embodiment, an improvement in the appearance of the molten Sn layer portion can be expected due to the first and second plating layers 161 and 162 formed by secondary plating of Ni/Sn, etc., and at the same time, the substrate When mounted, the first and second plating layers 161 and 162 connect the first and second external electrodes 131 and 132 and the first and second connection terminals 141 and 142, respectively, and strongly fix them to form an electronic component. By improving soldering between 100 and the substrate 200, adhesion strength can be improved.

In addition, the conductor part melted and removed during reflow is formed into a conductor layer with a uniform surface through secondary plating, so that the molten solder can be evenly spread and formed on various surfaces of the connection terminal when mounted on a circuit board. As a result, the height of the solder fillet connected through the side of the electronic component 100 can be reduced, and thus the acoustic noise reduction effect can be further improved.

Meanwhile, referring to FIGS. 6 to 8 , the electronic component of this embodiment may further include a bridge portion 143 disposed between the first and second connection terminals 141 and 142.

Accordingly, the first and second connection terminals 141 and 142 disposed on the mounting surface of the capacitor body 110 may be configured in an interposer-like structure connected to each other in the X direction through the bridge portion 143.

In addition, the first plating layer 161 is formed to simultaneously cover the first external electrode 131 and the first connection terminal 141, and the second plating layer 162 covers the second external electrode 132 and the second connection terminal. It is formed to simultaneously cover 142, and at this time, the bridge portion 143 is formed to be exposed from the first and second plating layers 161 and 162.

Referring to FIG. 9, the maximum thickness of the first and second plating layers 161' and 162' in the Z direction may each be 10 μm or more.

When the thickness of the first and second plating layers 161' and 162' is 10㎛ or more, the vibration absorption ability can be improved by providing a buffer layer made of a thick plating layer at the portion corresponding to the board mounting surface at the connection terminal. The reliability of the product can be improved by improving acoustic noise and at the same time preventing damage to the capacitor body due to external force transmitted from the board.

As another embodiment, referring to FIG. 10, the first and second connection terminals 141' and 142' may be further arranged to be spaced apart from each other in the .

At this time, the additionally disposed first connection terminal 141' is connected to the first band portion 131b of the first external electrode 131 by the conductive adhesive layer 151' on the upper side of the capacitor body 110 to provide electrical power. and the additionally disposed second connection terminal 142' is electrically connected to the second band portion 132b of the second external electrode 132 by the conductive adhesive layer 152'.

In addition, the first plating layer 161' covers the first external electrode 131 and a pair of first connection terminals 141 and 141' disposed on both sides of the capacitor body 110 in the Z direction, and the second The plating layer 162' covers the second external electrode 132 and a pair of second connection terminals 142 and 142' disposed on both sides of the capacitor body 110 in the Z direction.

In this way, when the first and second connection terminals 141, 141', 142, and 142' are symmetrically disposed on both sides of the capacitor body 110 in the Z direction, the vertical direction of the electronic component is eliminated, so the electronic component can be placed on the board, etc. It is possible to prevent defects in which the mounting direction changes unexpectedly during mounting.

In addition, since a conductor layer rather than an air layer exists on the opposite side of the capacitor body 110 to a certain thickness, a smoother heat dissipation effect can be expected.

Figure 11 is a cross-sectional view showing an electronic component in which the first and second plating layers are double layers according to another embodiment of the present invention.

In an electronic component according to another embodiment of the present invention, the first and second connection terminals 141 and 142 may be formed of a conductor or may partially include a conductor.

In addition, referring to FIG. 11, the electronic component of this embodiment includes the first and second plating layers 161" and 162" including inner plating layers 161a and 162a and an outer plating layer covering the inner plating layers 161a and 162a. 161b and 162b) may be included, respectively.

Here, the inner plating layers 161a and 162a may be made of high rigidity with a Young's modulus of 100 GPa or more, and the outer plating layers 161b and 162b may be made of medium or low rigidity with a Young's modulus of less than 100 GPa.

In this way, the high-rigidity internal plating layers 161a and 162a serve to directly connect and strongly couple the first and second external electrodes 131 and 132 of the multilayer capacitor and the first and second connection terminals 141 and 142. By doing this, high resistance can be generated when an external force acts, thereby improving the adhesion strength between the first and second external electrodes 131 and 132 and the first and second connection terminals 141 and 142.

These internal plating layers 161a and 162a may be formed of either Ni or Co (cobalt), which have high rigidity characteristics, but the present invention is not limited thereto.

In addition, the external plating layers 161b and 162b do not directly connect the first and second external electrodes 131 and 132 and the first and second connection terminals 141 and 142, so they have high strength as in the internal plating layer described above. Resistance is not required, and during mounting, it acts as a mounting surface that directly contacts the molten solder on the circuit board.

Accordingly, the external plating layers 161b and 162b may be formed of Sn, which has excellent bonding properties with molten solder and has medium and low rigidity characteristics, but the present invention is not limited thereto.

In addition, the first and second plating layers 161" and 162" of this double-layer structure absorb the impact of external force transmitted to the first and second connection terminals 141 and 142 and the capacitor body 110 through the substrate. Since it acts as a buffer layer, reliability can be increased by improving bending strength, etc.

Meanwhile, the electronic component of this embodiment may further include plating layers 133 and 134 formed on the surfaces of the first and second external electrodes 131 and 132, respectively, as shown in FIG. 12, where the plating layer 133 , 134) may include a nickel plating layer and a tin plating layer formed on the nickel plating layer.

FIG. 13 is a front view schematically showing the electronic component of FIG. 3 mounted on a board.

Referring to FIG. 13, the electronic component mounting substrate according to the present embodiment includes a substrate 210 having first and second electrode pads 211 and 212 on one surface and first and second electrode pads on the upper surface of the substrate 210. It includes an electronic component 100 mounted so that connection terminals 141 and 142 are connected to the first and second electrode pads 211 and 212, respectively.

When voltages with different polarities are applied to the first and second external electrodes 131 and 132 formed on the stacked electronic component 100 while the electronic component 100 is mounted on the substrate 210, the reverse of the dielectric layer 111 The capacitor body 110 expands and contracts in the Z direction due to the piezoelectric effect, and both ends of the first and second external electrodes 131 and 132 are capacitors due to the Poisson effect. The body 110 contracts and expands opposite to the expansion and contraction in the Z direction.

This contraction and expansion generates vibration. Additionally, the vibration is transmitted from the first and second external electrodes 131 and 132 to the substrate 210, and sound is emitted from the substrate 210 to become acoustic noise.

At this time, the solder 220 formed between the first and second external electrodes 131 and 132 of the electronic component 100 and the first and second electrode pads 221 and 222 formed on one surface of the substrate 210 is a capacitor. By being formed at a certain height toward the second surface of the body 110, a large amount of vibration generated from the electronic component 100 can be transmitted to the substrate.

However, in this embodiment, the piezoelectric vibration transmitted to the substrate through the first and second external electrodes 131 and 132 of the electronic component 100 is transmitted through the elasticity of the first and second connection terminals 141 and 142. By being absorbed, acoustic noise can be reduced.

At this time, the first and second solder receiving portions provided by the first and second cutouts 141a and 142a of the first and second connection terminals 141 and 142, respectively, are formed on the first surface of the capacitor body 110 ( 1) It serves as a solder pocket that can confine the solder 220.

Accordingly, by blocking the piezoelectric vibration transmission path of the electronic component 100 and separating the maximum displacement points in the solder fillet and the capacitor body 110, the acoustic noise reduction effect can be greatly improved compared to conventional electronic components.

According to this embodiment, the acoustic noise reduction structure can effectively suppress the amount of piezoelectric vibration transmitted to the substrate of the multilayer electronic component at an audible frequency within 20 kHz of the multilayer electronic component.

Therefore, by reducing the high-frequency vibration of stacked electronic components, it prevents malfunction of sensors that can be problematic due to high-frequency vibration of 20 kHz or more of electronic components in the IT or industrial/electronic fields, and suppresses the accumulation of internal fatigue caused by long-term vibration of sensors. can do.

Although the embodiment of the present invention has been described in detail above, the scope of the present invention is not limited thereto, and various modifications and variations are possible without departing from the technical details of the present invention described in the claims. This will be self-evident to those with ordinary knowledge in the field.

100: Electronic components
110: capacitor body
111: dielectric layer
121, 122: first and second internal electrodes
131, 132: first and second external electrodes
141, 141', 142, 142': first and second connection terminals
141a, 142a: first and second incisions
143: Bridge part
151, 151', 152, 152': conductive adhesive layer
161, 162, 161', 162', 161", 162": first and second plating layers
200: substrate
211, 212: first and second electrode pads
220: solder

Claims (17)

capacitor body;
first and second external electrodes spaced apart from each other on the mounting surface of the capacitor body;
first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively;
a first plating layer covering the first external electrode and the first connection terminal; and
a second plating layer covering the second external electrode and the second connection terminal; Including,
The first and second connection terminals are made of an insulator,
The first connection terminal includes: a first conductive pattern formed on a surface facing the first external electrode; a second conductive pattern formed on a surface opposite to the first conductive pattern; a first cutout formed on a portion of a surface connecting the first and second conductive patterns; and a third conductive pattern formed on the entire surface connecting the first and second conductive patterns and electrically connecting the first and second conductive patterns. Including,
The second connection terminal includes a fourth conductive pattern formed on a surface facing the second external electrode; a fifth conductive pattern formed on a surface opposite to the fourth conductive pattern; a second cutout formed on a portion of a surface connecting the fourth and fifth conductive patterns; and a sixth conductive pattern formed on the entire surface connecting the fourth and fifth conductive patterns and electrically connecting the fourth and fifth conductive patterns. Electronic components containing.
According to paragraph 1,
An electronic component further comprising a bridge portion disposed between the first and second connection terminals.
According to paragraph 1,
The first and second connection terminals are electronic components in which the first and second cutouts are formed on opposite sides of the first and second connection terminals, respectively.
According to paragraph 1,
The electronic component further includes first and second conductive adhesive layers respectively disposed between the first and second external electrodes and the first and second connection terminals.
According to paragraph 1,
An electronic component wherein the first and second plating layers have a thickness of 10 μm or more.
According to paragraph 1,
An electronic component further comprising a plating layer formed on surfaces of the first and second external electrodes.
delete delete delete According to paragraph 1,
An electronic component in which first and second solder accommodating parts are respectively provided by the first and second cutouts on the first and second external electrodes on the mounting surface side of the capacitor body.
According to paragraph 1,
The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed, first and second surfaces facing each other, and connected to the first and second surfaces. and includes third and fourth sides facing each other,
An electronic component in which ends of the first and second internal electrodes are exposed through third and fourth surfaces, respectively.
According to clause 11,
The first and second external electrodes are,
first and second connection portions disposed on third and fourth sides of the capacitor body, respectively; and
first and second band portions extending from the first and second connection portions to a portion of the first surface of the capacitor body and connected to the first and second connection terminals, respectively; Electronic components each containing.
According to clause 12,
An electronic component in which first and second connection terminals are further disposed on opposite sides of the capacitor body to be spaced apart from each other.
According to paragraph 1,
The first and second plating layers are,
An internal plating layer with a Young's Modulus of 100 GPa or more; and
an outer plating layer that covers the inner plating layer and has a Young's modulus of less than 100 GPa; Electronic components containing.
According to clause 14,
An electronic component further comprising plating layers formed on surfaces of the first and second external electrodes, respectively, wherein the plating layers include a nickel plating layer and a tin plating layer.
According to clause 14,
The internal plating layer includes either Ni or Co (cobalt),
An electronic component wherein the external plating layer includes Sn.
A substrate having first and second electrode pads on one surface; and
The electronic component of any one of claims 1 to 6 and 10 to 16, which is mounted so that first and second connection terminals are connected to the first and second electrode pads, respectively; A mounting board for electronic components containing a.

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