KR102587582B1 - Cooling device - Google Patents

Abstract

The present invention includes a condensing part that cools the working fluid, an evaporation part through which the working fluid moves and exchanges heat, a first pipe through which the working fluid moves from the condensation part to the evaporation part, and the working fluid is vaporized from the evaporation part. It includes a second pipe moving to the condensing part, and the evaporation part is divided into a first moving space and a second moving space through a heating part, and the first moving space and the second moving space are connected to one area of the heating part. A first moving passage is formed, and the working fluid flowing in through the first moving space moves to the second moving space through the first moving passage.

Description

Cooling device

The embodiment relates to a cooling device. More specifically, it relates to a cooling device for cooling local heat generated by sensors and controllers used in mechanical devices.

Recently, as part of measures to address environmental issues, the development of hybrid vehicles, fuel cell vehicles, and electric vehicles that utilize the driving force of motors is receiving more and more attention.

Vehicles as described above are generally equipped with electronic elements for HSG control and electronic elements for motor control, and since these electronic elements are heated when power (electricity) is supplied for driving, they must be separately cooled. We need means.

As a related technology, Japanese Patent Laid-Open No. 2001-245478 (publication date 2001.09.07, name: inverter cooling device) discloses an inverter using a semiconductor module containing semiconductor elements such as IGBT and diodes. Patent Publication No. 2008-294283 (publication date 2008.12.04, name: semiconductor device) discloses a heat sink that is installed in contact with the lower side of a semiconductor device and is formed to exchange heat while a fluid flows therein.

Referring to FIG. 1, conventionally, in order to cool each electronic device (e) provided in the engine room of a vehicle, refrigerant is transferred through a piping line (l) and then heat is exchanged between the refrigerant and the electronic device (e).

However, this conventional electronic device cooling method includes a piping line (l) for transferring the refrigerant to each electronic device (e), and a pump (p) that produces power for the refrigerant to move along the piping line (l). Because it is necessary, not only does it complicate the structure of the engine room, but there is a problem that additional power is needed to drive the pump.

In addition, as autonomous driving has recently been in the spotlight, additional heat is generated from the electronic elements of the sensors and image processing devices required for it. If the existing method above is adopted as a cooling method for this heat, not only will the piping line become longer, but the internal spatial situation may become worse. Heat pipes, which are mass-produced as a cooling method for PC electronic devices, When applied, corrosion problems of the material may arise, so it is not suitable for vehicles that must have durability.

Accordingly, there is a need for a new cooling device that can overcome the shortcomings of the conventional cooling device.

(Patent Document 1) Patent Document 1) Domestic Patent Publication No. 2017-0079177 (Name: Heat exchanger for cooling electronic devices, Publication date: 2017.07.10)

The purpose of the embodiment is to provide a cooling device that uses a refrigerant cooling method that is directly attached to a heat-generating member and circulates without a pump.

In addition, the purpose is to increase the heat absorption effect by separating the evaporation unit into a multi-layer structure.

In addition, the object is to provide a cooling device that can adjust the temperature of the working fluid according to the state of the working fluid or the surrounding environment using a heating unit.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned here will be clearly understood by those skilled in the art from the description below.

An embodiment of the present invention includes a condensation unit that cools the working fluid; an evaporation unit through which the working fluid moves and exchanges heat; a first pipe through which the working fluid moves from the condensation unit to the evaporation unit; and a second pipe through which the working fluid is vaporized from the evaporation unit and moves to the condensation unit, wherein the evaporation unit is divided into a first movement space and a second movement space through a heating unit, and one area of the heating unit has the A cooling device in which a first moving passage connecting the first moving space and the second moving space is formed, and the working fluid flowing in through the first moving space moves to the second moving space through the first moving passage. provides.

Preferably, the heating unit uses a thermoelectric element, and the thermoelectric element may have a heating part disposed in the first moving space and a heat absorbing portion disposed in the second moving space.

Preferably, it further includes a control unit that controls the operation of the heating unit, and the control unit may be characterized in that it controls the operation of the heating unit according to the state of the working fluid.

Preferably, the control unit may control the operation of the heating unit in at least one of the following cases: during initial operation of the electronic device, when the power of the electronic device is weak, or when the surrounding temperature is low.

Preferably, a plurality of protrusions may be disposed inside the second movement space.

Another embodiment of the present invention includes a condensation unit that cools the working fluid; an evaporation unit through which the working fluid moves and exchanges heat; a first pipe through which the working fluid moves from the condensation unit to the evaporation unit; and a second pipe through which the working fluid is vaporized from the evaporation unit and moves to the condensation unit, wherein the evaporation unit includes a first body including a first moving space through which the working fluid moves, and a first body through which the working fluid moves. It has a second main body having two moving spaces, and a heating part disposed between the first main body and the second main body, and the first moving space and the second moving space are connected through a third pipe. A cooling device is provided.

Preferably, the heating unit may use a thermoelectric element.

Preferably, the third pipe may connect the lower portions of the first body and the second body.

Preferably, a plurality of protrusions may be formed inside the second body to increase the heat exchange area.

Preferably, it further includes a control unit that controls the operation of the heating unit, and the control unit may be characterized in that it controls the operation of the heating unit according to the state of the working fluid.

Preferably, the control unit may control the operation of the heating unit in at least one of the following cases: during initial operation of the electronic device, when the power of the electronic device is weak, or when the surrounding temperature is low.

Preferably, the second body may be provided with an outlet portion through which the working fluid moves in a passage structure.

According to an embodiment, the cooling efficiency of the electronic device can be increased by being attached to one side of the electronic device.

Additionally, it has the effect of preventing dry-out due to lack of working fluid.

In addition, there is an effect of increasing cooling efficiency by transferring excess heat that cannot be cooled due to the boiling effect of the heat transfer surface to other layers through conduction.

In addition, because it passes through the front before flowing into the heat transfer surface (rear), the working fluid can not only flow uniformly, but also reduce the degree of supercooling of the working fluid through heat transfer through conduction, thereby increasing the cooling effect.

In addition, by providing a space through which gas can escape, there is an effect of preventing performance degradation due to accumulation of air bubbles in the heat transfer area.

In addition, there is an effect of increasing cooling efficiency by using the heating unit.

In addition, the use of thermoelectric elements has the effect of increasing the efficiency of the cooling device depending on the situation in which the electronic elements are placed.

The various and beneficial advantages and effects of the present invention are not limited to the above-described content, and may be more easily understood through description of specific embodiments of the present invention.

1 is a diagram showing a structure for cooling each electronic device conventionally provided in the engine room of a vehicle;
Figure 2 is a front perspective view of a cooling device according to an embodiment of the present invention;
Figure 3 is a rear perspective view of a cooling device according to an embodiment of the present invention;
Figure 4 is an exploded perspective view of the evaporation unit, which is a component of the present invention, viewed from the rear;
Figure 5 is a view looking at the rear of the main body of Figure 4,
Figure 6 is an exploded perspective view of the evaporation unit, which is a component of the present invention, viewed from the front;
Figure 7 is a view looking at the front of the main body, which is a component of Figure 6;
Figure 8 is an exploded perspective view of one embodiment of the evaporation unit, which is a component of the present invention;
Figure 9 is a view looking at the front of the main body, which is a component of Figure 8;
Figure 10 is a diagram showing the cooling flow of the working fluid in the present invention,
Figure 11 is a diagram showing the basic structure of the first embodiment of the heating unit, which is a component of the present invention;
Figure 12 is a diagram showing the detailed structure of the first embodiment of the heating unit of Figure 11;
Figure 13 is a diagram showing the basic structure of the second embodiment of the heating unit, which is a component of the present invention;
Figure 14 is an exploded perspective view of the structure of the heating unit, which is a component of Figure 13, viewed from the front;
Figure 15 is a diagram showing the structure of the second main body, which is a component of Figure 13;
Figure 16 is an exploded perspective view of the structure of the heating unit, which is a component of Figure 13, viewed from the rear;
Figure 17 is a diagram showing the structure of the second main body, which is a component of Figure 13;
Figure 18 is a diagram showing the basic structure of the cooling unit, which is a component of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated and described in the drawings. However, this is not intended to limit the embodiments of the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the embodiments.

Terms containing ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a second component may be named a first component without departing from the scope of the embodiment, and similarly, the first component may also be named a second component. The term and/or includes any of a plurality of related stated items or a combination of a plurality of related stated items.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the embodiments of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that it does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

In the description of the embodiment, when an element is described as being formed “on or under” another element, or under) includes both elements that are in direct contact with each other or one or more other elements that are formed (indirectly) between the two elements. Additionally, when expressed as "on or under," it can include not only the upward direction but also the downward direction based on one element.

Hereinafter, embodiments will be described in detail with reference to the attached drawings, but identical or corresponding components will be assigned the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted.

1 to 10 clearly illustrate only the main features in order to clearly understand the present invention conceptually, and as a result, various modifications of the illustration are expected, and the scope of the present invention is limited by the specific shape shown in the drawings. It doesn't have to be.

1 to 10 clearly illustrate only the main features in order to clearly understand the present invention conceptually, and as a result, various modifications of the illustration are expected, and the scope of the present invention is limited by the specific shape shown in the drawings. It doesn't have to be.

Figure 2 is a front perspective view of a cooling device according to an embodiment of the present invention, and Figure 3 is a rear perspective view of a cooling device according to an embodiment of the present invention.

Referring to FIGS. 2 and 3, the cooling device 1 according to an embodiment of the present invention may include a condensing unit 100, an evaporation unit 200, a first pipe 110, and a second pipe 120. You can.

The condensation unit 100 may cool the working fluid and supply it to the evaporation unit 200. The condensation unit 100 may cool the vaporized working fluid through heat exchange in the evaporation unit 200 and supply it to the evaporation unit 200. The cooling method of the condensing unit 100 is not limited, and various methods such as natural cooling or forced cooling can be used.

The evaporation unit 200 receives working fluid from the condensation unit 100, and the working fluid may circulate inside the evaporation unit 200. The evaporation unit 200 may be in contact with electronic devices that generate heat, such as semiconductor devices, diodes, transistors, resistors, and condensers used in electric devices. These electronic devices generally have a problem in that their performance deteriorates or they do not work when the temperature rises above a certain level.

The evaporation unit 200 of the present invention is connected to the electronic device and performs heat exchange to prevent deterioration of the performance of the electronic device. Due to the heat generated by the electronic device, the working fluid boils and is converted to a gaseous state.

The evaporation unit 200 may be made of a metal material to facilitate heat exchange. In one embodiment, the evaporation unit 200 may be made of aluminum, but is not limited to this and various materials with high thermal conductivity may be used.

In addition, the evaporation unit 200 has a plurality of layers including a first outer wall 230, a second outer wall 240, and a main body portion 210 disposed between the first outer wall 230 and the second outer wall 240. It can be provided as a structure. The multiple layered structure is for manufacturing convenience, and the number or connection structure of the layers is not limited. The structure of the evaporation unit 200 will be described again below.

The first pipe 110 can move the working fluid from the condensation unit 100 to the evaporation unit 200. The shape of the first pipe 110 is not limited and can be modified into various shapes. In one embodiment, the first pipe 110 may be connected to the lower part of the condensation unit 100 and supplied to the evaporation unit 200 by gravity.

The second pipe 120 can move the working fluid vaporized in the evaporation unit 200 to the condensation unit 100. The second pipe 120 may be connected to the upper part of the condensation unit 100. The vaporized working fluid flows into the upper part of the condensation unit 100 and is cooled, and the liquefied working fluid can automatically move toward the first pipe 110 located below by gravity.

The first pipe 110 and the second pipe 120 may be connected together to either the first outer wall 230 or the second outer wall 240. This is to facilitate the connection of the cooling device 1 with the electronic device.

Figure 4 is an exploded perspective view of the evaporation unit 200, which is a component of the present invention, viewed from the rear, Figure 5 is a view viewed from the rear of the main body 210, which is a component of Fig. 4, and Figure 6 is a component of the present invention. It is an exploded perspective view of the phosphorus evaporation unit 200 viewed from the front, and FIG. 7 is a view viewed from the front of the main body 210, which is a component of FIG. 6.

Referring to FIGS. 4 to 7, the evaporation unit 200 has a main body portion 210 divided into a first moving space 212 and a second moving space 213 through which the working fluid moves through the partition wall 211. , the first outer wall 230 is connected to the front of the first movement space 212 and seals the first movement space 212, and is connected to the front of the second movement space 213 to seal the second movement space 213. It may include a second outer wall 240 that seals it.

The main body 210 may be divided into a first movement space 212 and a second movement space 213 through which the working fluid can move through the partition wall 211, and a first movement space 213 is located at the lower part of the partition wall 211. A first movement passage 214 may be formed connecting the movement space 212 and the second movement space 213.

The working fluid flowing into the first moving space 212 descends due to gravity, and the lowered working fluid can move to the second moving space 213 through the first moving passage 214. The working fluid moving into the second movement space 213 may exchange heat with the electronic device connected to the second outer wall 240 and be vaporized and move to the condensation unit.

In one embodiment, the first movement space 212 may be formed through the partition wall 211 and the first inner wall 210b and the second inner wall 210c disposed on both sides of the partition wall 211. 1 The movement passage 214 may be formed in an elongated shape in the horizontal direction at the lower part of the partition wall 211. An inlet portion 210a recessed inward is disposed on the upper side of the first inner wall 210b, and the working fluid supplied from the condensation portion 100 can flow into the inlet portion 210a.

The first moving passage 214, which is provided in an elongated shape, allows the working fluid supplied through the inlet 210a to be supplied to the entire second moving space 213. When the working fluid is heated in the second moving space 213, the first moving passage 214 supplies the working fluid as a whole rather than supplying it biased to one side, thereby increasing cooling efficiency.

The second movement space 213 is partitioned through a partition wall 211, and a second movement passage 216 is formed in the upper part of the partition wall 211, and a first movement space is formed in the lower part of the partition wall 211 ( A first movement passage 214 connected to 212 may be formed.

In the second moving passage 216, the working fluid flowing into the second moving space 213 is heated and boiled, and the vaporized working fluid can move.

On one side of the second moving passage 216, an outlet portion 216a is formed that merges inward than the second inner wall 210c, and the working fluid moved to the second moving passage 216 passes through the outlet portion 216a. It can escape and move to the condensation unit 100.

The second movement passage 216 penetrates the partition wall 211, but may be blocked from the first movement space 212 by the partition 219 provided in the first movement space 212. This is to prevent gas from entering the inlet 210a.

A third movement passage 217 connecting the first movement space 212 and the second movement passage 216 may be formed in one area of the partition 219. In one embodiment, the third movement passage 217 may be disposed on the upper side of the second inner wall 210c of the first movement space 212. When bubbles generated in the first movement space 212 or bubbles generated in the second movement space 213 enter the first movement passage 214, the third movement passage 217 moves them back to the second movement passage. It can be moved to (216).

The partition 219 may be arranged to have an inclination to prevent bubbles generated by heating of the working fluid from entering the inlet 210a, and a protruding protrusion 219a is provided in one area of the partition 219. The bubbles formed can be blocked from entering the inlet 210a.

Additionally, the second movement passage 216 may be disposed above the inlet 210a. This is to prevent the gas vaporized and rising in the second moving space 213 from flowing into the inlet 210a.

A plurality of protrusions 215 may be formed on either the partition wall 211 or the second outer wall 240 forming the second movement space 213 to face the second movement space 213 . The purpose of the plurality of protrusions 215 is to increase heat transfer efficiency when transferring heat generated from electronic devices in contact with the second outer wall 240 to the working fluid. In the drawing, the protrusion 215 is shown to protrude from the partition wall 211. However, the protrusion 215 is not limited to this, and may be arranged to protrude from the second outer wall 240 toward the second movement space 213.

The partition wall 211 divides the first movement space 212 and the second movement space 213, and the working fluid heated in the second movement space 213 passes through the partition wall 211 into the first movement space ( Heat is transferred to the working fluid located at 212).

This is because the working fluid in the second moving space 213, whose heat content has increased through boiling, transfers heat to the working fluid present in the first moving space 212 through the partition wall 211, so that the second moving space 213 Heat diffusion occurs, and the degree of subcooling of the working fluid in the first moving space 212 can be reduced, thereby improving the performance of the evaporation unit 200.

The protrusion 215 may make surface contact with the second outer wall 240. This can increase the efficiency of transferring heat from the electronic device in contact with the second outer wall 240 to the working fluid.

The protrusion 215 may protrude vertically from the partition wall 211. In one embodiment, the protrusion 215 may be provided in the shape of a square pillar. The upper surface of the square pillar-shaped protrusion 215 is in contact with the second outer wall 240 to transfer heat generated from the electronic device to the protrusion 215, and the side wall of the square pillar can transfer heat to the working fluid.

Due to the protrusion 215 having a structure that protrudes perpendicularly from the partition wall 211, surface tension of the working fluid is generated at that portion and it can easily stay there.

In addition, bubbles are generated through boiling in the vertically formed side wall in the area in contact with the partition wall 211, and bubbles generated on the vertically connected side wall are easily separated from the side wall.

Additionally, the plurality of protrusions 215 can increase the degree of freedom of bubbles and slow down dry-out due to gas flow.

Additionally, the plurality of protrusions 215 may have different heights. In one embodiment, the height of the plurality of protrusions 215 may be proportionally lowered in the direction from the first moving passage 214 to the second moving passage 216, which may be applied to the liquid film of the working fluid. Performance can be improved by cooling or facilitating the flow of enlarged bubbles.

The plurality of protrusions 215 are arranged at regular intervals to heat the working gas evenly throughout. Through this, it is possible to prevent uneven heating caused by heat transferred from the electronic device.

The first outer wall 230 may be coupled to the front of the first movement space 212 to seal the first movement space 212. A first connection hole 231 and a second connection hole 232 may be formed in the first outer wall 230.

The first connection hole 231 is disposed on the front side of the inlet 210a disposed in the first movement space 212 to connect one end of the first pipe 110. The liquid working fluid flowing in through the first connection hole 231 may move to the first movement space 212.

The second connection hole 232 may be disposed on the front of the outlet portion 216a disposed in the second movement passage 216 of the second movement space 213. When the working fluid moves from the first moving space 212 to the second moving space 213, the second connection hole 232 is a passage through which boiling occurs by receiving heat from the electronic device and the vaporized working fluid moves. can play a role. The gaseous working fluid flowing through the second connection hole 232 may move to the condensation unit 100 through the second pipe 120.

The second outer wall 240 can be coupled to the front of the second movement space 213 to seal the second movement space 213. The second outer wall 240 is in contact with the electronic device and transfers heat to the working fluid, and the shape of the second outer wall 240 can be modified in various ways to closely adhere to the shape of the electronic device with which it is in contact.

FIG. 8 is an exploded perspective view of an embodiment of the evaporation unit 200, which is a component of the present invention, and FIG. 9 is a front view of the main body 210, which is a component of FIG. 8.

Referring to FIGS. 8 and 9 , one embodiment of the evaporation unit 200, which is a component of the present invention, may include a guide unit 218.

The guide unit 218 is disposed at an angle in the first movement space 212 and can guide air bubbles flowing in through the first movement passage 214 to the third movement passage 217. The guide portion 218 may be arranged to be spaced apart from the first inner wall 210b and the second inner wall 210c. This is to supply the working fluid into the first moving space 212 through a separation passage at one end of the first inner wall 210b and the guide portion 218. Additionally, the spaced passage between the second inner wall 210c and the other end of the guide portion 218 can move bubbles of the working fluid flowing into the first moving passage 214 to the outlet portion 216a.

In one embodiment, the guide part 218 may have a protruding bar shape, and the guide part 218 may be connected to the partition wall 211 with a curved surface. This is to prevent the working fluid from vaporizing in the guide part 218. There is no limit to the shape of the curved surface, and it can be connected in various forms.

Figure 10 is a diagram showing the cooling flow of the working fluid in the present invention. Figure 10 (a) is a diagram showing the flow of the working fluid as seen from the first moving space 212 of the evaporation unit 200, and Figure 10 (b) is a diagram showing the flow of the working fluid as seen from the side of the evaporation part 200. It is a diagram showing the flow, and Figure 10(c) is a diagram showing the flow of the working fluid as seen from the second moving space 213 of the evaporation unit 200.

Referring to FIG. 10, the working fluid flowing in through the inlet 210a moves downward in the first movement space 212 and moves to the second movement passage 216 through the first movement passage 214. .

The working fluid flowing into the second moving space 213 begins to be heated from the bottom and moves to the top, and during the movement process, it vaporizes through boiling and rises. The raised gas moves from the second movement passage 216 to the outlet section 216a and travels through the second pipe 120 to the condensation section 100, where heat exchange occurs.

Additionally, air bubbles flowing from the second moving space 213 into the first moving space 212 through the first moving passage 214 move to the outlet portion 216a through the guide portion 218.

Hereinafter, an embodiment including a heating unit as a component of the cooling device of the present invention will be described.

11 to 12 show a first embodiment of a cooling device including a heating unit.

Figure 11 is a diagram showing the basic structure of the first embodiment of the heating unit, which is a component of the present invention.

Referring to FIG. 11, the heating unit 300, which is a component of the present invention, can increase the efficiency of the cooling device by heating the working fluid flowing into the first pipe 110.

In general, the electronic device 10 operates within a certain temperature. If the temperature is above or below the reference temperature, problems may occur in the operation of the electronic device 10. The basic function of the existing cooling device is to prevent the cooling device from exceeding the upper operating temperature limit of the electronic device 10, but when using the lower limit as a standard, it is better to warm the surrounding temperature through heat generation from the device.

If the ambient temperature is low and the element generates little heat, it may take longer than expected for the cooling device to reach a normal state. Additionally, if the amount of heat generated varies depending on the load of the device, it may be difficult to secure stable performance.

The heating unit 300, which is a component of the present invention, can increase the efficiency of the working fluid in lowering the temperature of the electronic device 10 by heating the working fluid to a certain temperature.

As mentioned above, the evaporation unit 200 may be divided into a first movement space 212 and a second movement space 213 partitioned through a partition wall 211. The heating unit 300 may heat the working fluid flowing into the first moving space 212. In one embodiment, the heating unit 300 may heat the working fluid on the outer peripheral surface of the first pipe 110 through which the working fluid is supplied from the condensing unit 100.

The working fluid heated in the first moving space 212 can move to the second moving space 213, and the working fluid moving in the second moving space 213 can exchange heat with the electronic device 10.

The heating unit 300 is connected to one side of the first outer wall 230 forming the first movement space 212 and can heat the working fluid moving in the first movement space 212.

In one embodiment, the heating unit 300 may use a thermoelectric element.

A thermoelectric element refers to an element that produces the Peltier effect, in which when an electric current flows, the heating part on one side dissipates heat and the cooling part on the other side absorbs heat and cools it.

The Peltier effect refers to the effect that when two types of metal ends are connected and current flows, one terminal absorbs heat and the other terminal generates heat depending on the direction of the current. By using semiconductors with different electrical conduction methods instead of two types of metals, a Peltier element with highly efficient endothermic heat generation can be obtained. This Peltier device can switch between endothermic heat generation depending on the direction of current, and can control the amount of endothermic heat generation depending on the amount of current.

The thermoelectric element may be connected to one side of the first outer wall 230, and the side heated by flowing current comes into contact with the first outer wall 230 to heat the working fluid. At this time, the cold air on the other side generated by the Peltier effect is transferred to the condensation unit 100, thereby increasing the cooling efficiency of the working fluid. Embodiments related to the transmission of cold air will be described again below.

FIG. 12 is a diagram showing the detailed structure of the first embodiment of the heating unit 300 of FIG. 11.

A control unit 500 may be connected to the heating unit 300. The thermoelectric element, which is an embodiment of the heating unit 300, can have its heat generation amount adjusted depending on the direction or amount of current. The control unit 500 may control the operation of the heating unit 300 according to the state of the working fluid.

In one embodiment, the control unit 500 controls the operation of the heating unit 300 in at least one of the following cases: during the initial operation of the electronic device 10, when the power of the electronic device 10 is weak, and when the surrounding temperature is low. You can control it.

Additionally, when the working fluid is determined to be below a preset temperature, the heating unit 300 can be operated.

This means that if the working fluid moving inside the evaporation unit 200 is in a supercooled state, an additional amount of heat is required for saturation boiling even if a heat source is received from the electronic device 10. The heating unit 300 of the present invention can facilitate boiling of the working fluid by preheating the working fluid to a certain temperature.

The control unit 500 may receive information such as the status of the electronic device 10 or the surrounding environment, calculate the information, and provide an optimal temperature state for boiling of the working fluid to occur.

Additionally, the cooling air generated from the thermoelectric element can be transferred to the condensing unit 100 to increase the efficiency of the condensing unit 100.

The working fluid rising through boiling in the second moving space 213 flows into the condensation unit 100 and is cooled. At this time, cooling air generated from the thermoelectric element may be delivered to the condensation unit 100.

In one embodiment, the thermoelectric element and the condensing unit 100 are connected through a moving pipe 400 so that cooling air generated from the thermoelectric element can move to the condensing unit 100.

One side of the moving pipe 400 may be placed in front of the thermoelectric element, and the cooling air generated from the thermoelectric element may move to the condensation unit 100 along the moving pipe 400.

The other side of the moving tube 400 may be connected to the condensing unit 100. In one embodiment, the condensation unit 100 may be provided as an air-cooled structure. The condensing unit 100, which has an air-cooled structure, operates a fan to suck in air. At this time, when the fan rotates and sucks air, the cooling air generated from the thermoelectric element is delivered to the condensation unit 100 along the moving pipe 400, thereby increasing the cooling efficiency of the working fluid.

Additionally, the other side of the moving tube 400 may be connected to the lower part of the condensing unit 100. The air that rises through boiling moves downward in the condensation unit 100 by its own weight. At this time, the cooling efficiency of the working fluid can be further increased by placing the moving pipe 400 at the lower part of the condensing unit 100.

An inlet 410 may be formed in one area of the moving pipe 400. The inlet 410 may serve as a passage through which air is introduced when air is sucked from the condensation unit 100 of the air-cooled structure. In one embodiment, the inlet 410 is formed close to the thermoelectric element to prevent loss of cooling air.

The moving pipe 400 can cool the working fluid moving through the second pipe 120.

The moving pipe 400 cools the working fluid moving through the second pipe 120 and simultaneously delivers cooling air to the condensation unit 100, thereby further increasing the cooling efficiency of the working fluid. In this case, the moving pipe 400 may be provided in a form that surrounds the second pipe 120, so that the outer surface of the second pipe 120 and the moving pipe 400 are in contact. At this time, the moving tube 400 may have a spiral structure and is made of a metal material to enable heat exchange in the form of heat conduction. Additionally, a structure may be provided in which cooling air moving through the moving pipe 400 directly contacts the second pipe 120 to exchange heat.

In one embodiment, the second pipe 120 may be provided in a structure that penetrates the moving pipe 400.

At this time, the second pipe 120 may pass through one area of the moving pipe 400 and be connected to the upper part of the condensation unit 100.

13 to 17 show a second embodiment of a cooling device including a heating unit 300.

Figure 13 is a diagram showing the basic structure of the second embodiment of the heating unit 300, which is a component of the present invention.

Referring to FIG. 13, the second embodiment of the cooling device includes a condensation unit 100 that cools the working fluid, an evaporation unit 200 in which the working fluid moves and exchanges heat, and an evaporation unit 200 from the condensation unit 100. It may include a first pipe 110 through which the working fluid moves and a second pipe 120 through which the working fluid is vaporized from the evaporation unit 200 and moves to the condensation unit 100.

In this case, the evaporation unit 200 is divided into a first movement space 212 and a second movement space 213 through the heating unit 300, and one area of the heating unit 300 has a first movement space 212. ) and a first moving passage 214 connecting the second moving space 213 is formed, and the working fluid flowing in through the first moving space 212 is transferred to the second moving space through the first moving passage 214. You can go to (213).

The heating unit 300 heats the working fluid in the second moving space 213, where the electric element is connected and exchanges heat with the working fluid, and heats the working fluid together with the battery element to facilitate boiling.

In one embodiment, the heating unit 300 may use a thermoelectric element. The thermoelectric element can perform the same operations and functions as described in the first embodiment.

When a thermoelectric element is used as the heating unit 300, the heating unit (heating) may be arranged toward the first moving space 212, and the heat absorbing unit (cooling) may be placed facing the second moving space 213. It can be.

This arrangement can increase the cooling efficiency of the working fluid moving in the first moving space 212, and can further increase the heating efficiency of the working fluid boiling through heating in the second moving space 213.

Additionally, the cooling element may further include a control unit 500.

Like the first embodiment, the control unit 500 can control the operation of the heating unit 300 according to the state of the working fluid. In one embodiment, during the initial operation of the electronic device 10, the control unit 500 operates the heating unit 300 in at least one of the following cases: when the power of the electronic device 10 is weak or when the surrounding temperature is low. Movement can be controlled.

FIG. 14 is an exploded perspective view of the structure of the heating unit 300, which is a component of FIG. 13, viewed from the front, FIG. 15 is a view showing the structure of the second body 1300, which is a component of FIG. 13, and FIG. 16 is a This is an exploded perspective view of the structure of the heating unit 300, which is a component of Figure 13, when viewed from the rear, and Figure 17 is a diagram showing the structure of the second main body 1300, which is a component of Figure 13.

14 to 17, the evaporation unit 200 includes a first body 1200 having a first movement space 212 through which the working fluid moves, and a second movement space 213 through which the working fluid moves. It may include a second main body 1300, and a heating unit 300 disposed between the first main body 1200 and the second main body 1300, and the first moving space 212 and the second moving space. (213) may be connected through the third pipe 130.

Unlike the structure that penetrates the heating unit 300, this can be combined into a separate structure so that it can be disassembled and replaced if a problem occurs in the heating unit 300. In the above embodiment, the working fluid moves through a passage penetrating the heating unit 300, but the heating unit 300, which is provided in a separable structure, may be provided with a separate third pipe 130.

A second moving space 213 through which the working fluid moves may be disposed in the second body 1300, and a plurality of protrusions 215 may be formed in the second moving space 213. The second body 1300 can be combined with the second outer wall 240 to seal the second moving space 213.

The second outer wall 240 is connected to contact the electronic device 10, and the working fluid absorbs heat transferred to the second moving space 213 and boils.

A first connection passage 1210 is disposed at the lower part of the second body 1300 so that working fluid can be supplied from the first moving space 212. The shape of the second connection passage 1310 is not limited, but it is preferably formed at the bottom of the first moving space 212 to increase the efficiency of heat exchange of the working fluid.

Additionally, an outlet portion 216a may be disposed on the upper part of the second body 1300 through which the boiled working fluid moves to the condensation portion 100.

The outlet portion 216a may be provided as a passage structure, there are no restrictions on its shape or direction, and the outlet portion 216a may be connected to the condensation portion 100 through the second pipe 120. Since the boiling working fluid moves upward, the outlet portion 216a is preferably disposed at the upper part of the first movement space 212.

In one embodiment, the upper surface forming the first movement space 212 is provided to have an inclination to guide the movement of the boiling working fluid.

The heating unit 300 may be disposed between the first body 1200 and the second body 1300. In one embodiment, when a thermoelectric element is used as the heating unit 300, the heating (heating) side is disposed so as to face the second body 1300, and the endothermic (cooling) side is disposed to face the first body 1200, so that the working fluid Heat can be exchanged with

13 to 17, the operation of the second embodiment of the cooling device including the heating unit 300 will be described.

First, the working fluid moving through the first pipe 110 may flow into the first movement space 212 through the inlet 210a. The introduced working fluid can be cooled by the thermoelectric element in the first moving space 212, and is connected to the second connection passage 1310 and the first connection passage 1210 through the third pipe 130. It may flow into the moving space 213.

The working fluid flowing into the second moving space 213 exchanges heat with the electric element. At this time, the protrusion 215 disposed in the second moving space 213 can facilitate heat exchange with the working fluid. The thermoelectric element applies heat to the working fluid located in the second moving space 213, and the working fluid absorbs the heat generated from the electric element and the heat generated from the thermoelectric element to generate boiling.

The boiling working fluid rises to the top, and the raised working fluid moves to the condensing part 100 along the second pipe 120 through the outlet part 216a and is cooled.

Figure 18 is a diagram showing the basic structure of the cooling unit, which is a component of the present invention.

Referring to FIG. 18, the cooling device including the cooling unit 600 includes a condensing unit 100 that cools the working fluid, an evaporating unit 200 in which the working fluid moves and exchanges heat, and an evaporating unit from the condensing unit 100. It may include a first pipe 110 through which the working fluid moves to (200) and a second pipe 120 through which the working fluid is vaporized from the evaporation unit 200 and moves to the condensation unit 100.

At this time, the evaporation unit 200 is divided into a first movement space 212 and a second movement space 213 through a partition wall 211, and a first movement space 212 is located in one area of the partition wall 211. A first moving passage 214 connecting the first moving space 213 and the second moving space 213 is formed, and the working fluid flowing in through the first moving space 212 moves to the second moving passage through the first moving passage 214. It moves into the space 213, and a cooling unit 600 may be disposed outside the second movement space 213.

The cooling unit 600 may contact the electronic device 10 and serve to absorb heat generated from the electronic device 10. In one embodiment, the cooling unit 600 may use a thermoelectric element.

As mentioned above, the evaporation unit 200 has a main body 210 and a first movement space 212 that are divided into a first movement space 212 and a second movement space 213 through a partition wall 211. It may include a first outer wall 230 that seals and a second outer wall 240 that seals the second movement space 213.

The thermoelectric element may be disposed between the second outer wall 240 and the electronic element 10.

At this time, the exothermic (heating) side of the thermoelectric element may be arranged to face the second outer wall 240, and the endothermic (cooling) side may be arranged to face the electronic device 10.

The material of the second outer wall 240 and the electronic device 10 is metal, so that heat transfer by conduction with the thermoelectric device can be performed.

In this way, the thermoelectric element is connected to the electronic device 10 and can serve to cool the heat generated by the electronic device 10, and the cooling fluid can serve to cool the heat generated from the thermoelectric device.

The locations and environments in which the electronic devices 10 are placed vary. However, when using the existing air cooling method to cool the electronic device 10, there is a problem that it is impossible to lower the temperature of the electronic device 10 below the ambient temperature.

The cooling unit 600 using a thermoelectric element can control the cooling temperature by controlling the current, thereby solving the problems of air-cooled cooling devices in hot environments.

Additionally, the operation of the thermoelectric element may be controlled by the control unit 500.

The control unit 500 can control the operation of the thermoelectric element according to the state of the working fluid. In one embodiment, the control unit 500 may control the operation of the thermoelectric element in at least one of the following cases: the heat generation amount of the electronic device 10 is greater than the preset heat generation amount or the surrounding temperature is higher than the preset temperature.

The thermoelectric element cools the electronic element 10, and the heat generated from the thermoelectric element is absorbed through the evaporation unit 200 and moves to the condensation unit 100.

Above, embodiments of the present invention have been examined in detail with reference to the attached drawings.

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications, changes, and substitutions can be made by those skilled in the art without departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the attached drawings are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments and the attached drawings. . The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

1: Cooling device 10: Electronic device
100: condensation unit 110: first pipe
120: second pipe 130: third pipe
200: Evaporation unit
210: main body 210a: inlet
210b: first inner wall 210c: second inner wall
211: partition wall 212: first movement space
213: second movement space 214: first movement passage
215: projection 216: second movement passage
216a: outlet 217: third movement passage
218: guide part 219: compartment part
219a: Protruding jaw 230: First outer wall
231: first connection hole 232: second connection hole
240: second outer wall
300: heating unit 400: moving tube
410: Inlet 500: Control unit
1200: first body 1210: first connection passage
1300 ; Second main body 1310: Second connection passage

Claims (12)

A condensation unit that cools the working fluid;
an evaporation unit that is connected to contact with an electronic device that generates heat and moves the working fluid to exchange heat with the electronic device;
a first pipe through which the working fluid moves from the condensation unit to the evaporation unit; and
a second pipe through which the working fluid, which has exchanged heat with the electronic device from the evaporation unit, is vaporized and moves to the condensation unit;
Includes,
The evaporation unit is divided into a first movement space and a second movement space through a heating unit, and a first movement passage connecting the first movement space and the second movement space is formed in one area of the heating unit,
The working fluid flowing in through the first movement space moves to the second movement space through the first movement passage,
In a state where the electronic device is arranged to exchange heat with the working fluid in the second moving space, the heating unit heats the working fluid flowing into the first moving space between the first moving space and the second moving space. A cooling device configured to cool and heat the working fluid flowing into the second moving space. According to claim 1,
The heating unit uses a thermoelectric element,
The thermoelectric element is a cooling device in which a heat absorbing portion is disposed in the first moving space and a heating portion is disposed in the second moving space. According to clause 2,
a control unit that controls the operation of the heating unit;
It further includes,
The cooling device, wherein the control unit controls the operation of the heating unit according to the state of the working fluid. According to clause 3,
The control unit
A cooling device that controls the operation of the heating unit when the electronic device is initially operated, when the power of the electronic device is weak or when the surrounding temperature is low. According to clause 2,
A cooling device, characterized in that a plurality of protrusions are disposed inside the second moving space. A condensation unit that cools the working fluid;
an evaporation unit that is connected to contact with an electronic device that generates heat and moves the working fluid to exchange heat with the electronic device;
a first pipe through which the working fluid moves from the condensation unit to the evaporation unit; and
It includes a second pipe through which the working fluid, which has exchanged heat with the electronic device from the evaporation unit, is vaporized and moves to the condensation unit,
The evaporation unit
A first body having a first moving space through which the working fluid moves,
A second body having a second moving space through which the working fluid moves, and
A heating unit disposed between the first body and the second body,
The first movement space and the second movement space are connected through a third pipe,
In a state where the electronic device is arranged to exchange heat with the working fluid in the second moving space, the heating unit cools the working fluid flowing into the first moving space and the operating fluid flowing into the second moving space. A cooling device configured to heat a fluid. According to clause 6,
The heating unit is a cooling device in which a thermoelectric element is used. According to clause 7,
The third pipe connects the lower portions of the first body and the second body. According to clause 8,
A cooling device characterized in that a plurality of protrusions are formed inside the second body to increase the heat exchange area. According to any one of claims 6 to 9,
a control unit that controls the operation of the heating unit;
It further includes,
The cooling device, wherein the control unit controls the operation of the heating unit according to the state of the working fluid. According to claim 10,
The control unit
A cooling device that controls the operation of the heating unit when the electronic device is initially operated, when the power of the electronic device is weak or when the surrounding temperature is low. According to clause 8,
A cooling device in which an outlet portion through which the working fluid moves is provided in a passage structure in the second main body.

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