KR102512814B1 - Cooling device - Google Patents

Abstract

The present invention provides a condensing unit for cooling the working fluid, an evaporation unit for moving the working fluid and exchanging heat, a first pipe for moving the working fluid from the condensing unit to the evaporation unit, and the working fluid vaporized from the evaporator. It includes a second pipe moving to the condensing unit, and the evaporation unit is divided into a first moving space and a second moving space through a partition wall, and the first moving space and the second moving space are located in a lower region of the partition wall. A first movement passage is formed, and the working fluid introduced through the first movement passage moves to the second movement space through the first movement passage to provide a cooling device that causes heat exchange.

Description

Cooling device {Cooling device}

The embodiment relates to a cooling device. More specifically, it relates to a cooling device for cooling local heat generated by sensors, controllers, etc. used in mechanical devices.

Recently, as part of measures against environmental problems, development of hybrid vehicles, fuel cell vehicles, electric vehicles, and the like using driving force of a motor is attracting more and more attention.

Vehicles as described above are generally provided with electronic devices for HSG control and electronic devices for motor control, and since these electronic devices are heated when power is supplied for driving, separate cooling is required. A means is needed.

As a technology related to this, Japanese Patent Laid-open Publication No. 2001-245478 (published on September 7, 2001, name: Inverter cooling device) discloses an inverter using a semiconductor module including a semiconductor element such as IGBT and a diode. Patent Publication No. 2008-294283 (published on December 4, 2008, name: semiconductor device) discloses a heat sink installed in contact with the lower surface of a semiconductor device and formed to exchange heat while a fluid flows therein.

Referring to FIG. 1 , conventionally, in order to cool each electronic device (e) provided in an engine room of a vehicle, a refrigerant is transported through a pipe line (l) and heat exchange is performed between the refrigerant and the electronic device (e).

However, this conventional electronic device cooling method includes a pipe line (l) for transferring the refrigerant to each electronic device (e), and a pump (p) for generating power for the refrigerant to move along the pipe line (l). Since it is necessary, there is a problem that not only complicates the structure of the engine room, but also requires additional power to drive the pump.

In addition, as autonomous driving has recently been in the limelight, heat from sensors and electronic elements on the image processing device side required for it has been additionally generated. In the case of adopting the above existing method as a cooling method for this heat, not only the piping line becomes longer, but the internal space situation may become worse, and the heat pipe that is being mass-produced as a cooling method for electronic devices of PCs When applying, there is a problem that is not suitable for a vehicle that needs to have durability because the corrosion problem of the material may be raised.

Therefore, there is a need for a new cooling device capable of solving the disadvantages of the conventional cooling device.

(Patent Document 1) Patent Document 1) Korean Patent Publication No. 2017-0079177 (Name: Heat Exchanger for Electronic Device Cooling, Publication Date: 2017.07.10)

An object of the embodiment is to provide a cooling device using a refrigerant cooling system that is directly attached to a heat generating member and circulates without a pump.

In addition, it is aimed at increasing the heat absorption effect by separating the configuration of the evaporation unit into a multi-layered structure.

The problem to be solved by the present invention is not limited to the above-mentioned problems, and other problems not mentioned herein will be clearly understood by those skilled in the art from the following description.

An embodiment of the present invention, the condensing unit for cooling the working fluid; an evaporation unit in which the working fluid moves and exchanges heat; a first pipe through which the working fluid moves from the condensing unit to the evaporating unit; and a second pipe through which the working fluid is vaporized from the evaporation unit and moved to the condensation unit, wherein the evaporation unit is divided into a first movement space and a second movement space through a partition wall, and in one region of the partition wall A first movement passage connecting the first movement space and the second movement space is formed, and the working fluid introduced through the first movement passage moves to the second movement space through the first movement passage to exchange heat. Provides a cooling device that causes

Preferably, the first movement passage may be formed below the partition wall.

Preferably, the evaporation unit includes a main body partitioned into a first movement space and a second movement space through the partition wall, a first outer wall sealing the first movement space, and a second movement space sealing the second movement space. May include an outer wall.

Preferably, a plurality of protrusions are formed on the partition wall of the second moving space to increase a heat exchange area.

Preferably, a plurality of protrusions may be formed on the second outer wall sealing the second moving space.

Preferably, the protrusion may make surface contact with the second outer wall.

Preferably, the protrusion may protrude perpendicularly to the partition wall.

Preferably, the protrusion may have a rectangular pillar shape.

Preferably, a second movement passage is provided above the second movement space, and the second movement passage may be blocked from the first movement space by the partition.

Preferably, an inlet that is recessed into the inside is disposed on an upper side of the first inner wall of the first movement space, and the inlet is connected to the first pipe so that the working fluid can flow therein.

Preferably, a third movement passage connecting the second movement passage and the first movement space may be disposed on an upper side of the second inner wall facing the first inner wall of the first movement space.

Preferably, a guide unit for guiding air bubbles introduced through the first movement passage to the third movement passage may be disposed in the first movement space.

Preferably, the guide part may be spaced apart from the first inner wall and the second inner wall, and may be disposed to have an inclination.

Preferably, the guide part may be connected to the partition wall in a curved surface.

Preferably, the first pipe and the second pipe may be connected together to the first outer wall.

Preferably, the first pipe may be connected to a lower portion of the condensing unit, and the second pipe may be connected to an upper portion of the condensing unit.

Preferably, a protruding jaw may be formed in one region of the compartment.

Preferably, the plurality of protrusions may have different heights.

Preferably, the cooling device has a height of the plurality of protrusions proportionally lowered in a direction from the first moving passage to the second moving passage.

According to the embodiment, the cooling efficiency of the electronic device may be increased by being attached to one side of the electronic device.

In addition, there is an effect of preventing dry-out due to lack of working fluid.

In addition, there is an effect of increasing the cooling efficiency by transferring the excess heat amount that is not cooled due to the boiling effect of the heat transfer surface to another layer through conduction.

In addition, since it passes through the front surface before entering the heat transfer surface (rear surface), the working fluid can flow uniformly, and the degree of undercooling of the working fluid can be reduced through heat transfer through conduction, thereby increasing the cooling effect.

In addition, there is an effect of preventing performance deterioration due to the accumulation of air bubbles in the heat transfer area by providing a space through which gas can escape.

Various advantageous advantages and effects of the present invention are not limited to the above description, and will be more easily understood in the process of describing specific embodiments of the present invention.

1 is a view showing a structure for cooling each electronic device provided in the engine room of a vehicle in the related art;
2 is a front perspective view of a cooling device according to an embodiment of the present invention;
3 is a rear perspective view of a cooling device according to an embodiment of the present invention;
4 is an exploded perspective view of the evaporator, which is a component of the present invention, viewed from the rear;
Figure 5 is a view looking at the rear of the main body of the configuration of Figure 4,
6 is an exploded perspective view of the evaporator, which is a component of the present invention, viewed from the front;
7 is a view of the front of the main body, which is a component of FIG. 6,
8 is an exploded perspective view of an embodiment of an evaporation unit, which is a component of the present invention;
9 is a view of the front of the main body, which is a component of FIG. 8,
10 is a view showing the cooling flow of the working fluid in the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated and described in the drawings. However, this is not intended to limit the embodiments of the present invention to specific embodiments, and should be understood to include all changes, equivalents, or substitutes included in the spirit and technical scope of the embodiments.

Terms including ordinal numbers, such as first and second, may be used to describe various components, but the components are not limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a second element may be named a first element without departing from the scope of rights of an embodiment, and similarly, the first element may also be named a second element. The terms and/or include any combination of a plurality of related recited items or any of a plurality of related recited items.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the embodiments of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In the description of the embodiment, in the case where an element is described as being formed “on or under” of another element, on or under (on or under) or under) includes both elements formed by directly contacting each other or by indirectly placing one or more other elements between the two elements. In addition, when expressed as "on or under", it may include the meaning of not only the upward direction but also the downward direction based on one element.

Hereinafter, the embodiment will be described in detail with reference to the accompanying drawings, but the same or corresponding components regardless of reference numerals are given the same reference numerals, and overlapping descriptions thereof will be omitted.

1 to 10 clearly show only the main features in order to clearly understand the present invention conceptually, and as a result, various modifications of the diagram are expected, and the scope of the present invention is limited by the specific shapes shown in the drawings. It doesn't have to be.

2 is a front perspective view of a cooling device according to an embodiment of the present invention, and FIG. 3 is a rear perspective view of a cooling device according to an embodiment of the present invention.

2 and 3, the cooling device 1 according to an embodiment of the present invention may include a condensing unit 100, an evaporation unit 200, a first pipe 110 and a second pipe 120. can

The condensing unit 100 may cool the working fluid and supply it to the evaporation unit 200 . The condensing unit 100 may perform heat exchange in the evaporation unit 200 to cool the vaporized working fluid and supply it to the evaporation unit 200 . The cooling method of the condensing unit 100 is not limited, and various methods such as natural cooling or forced cooling may be used.

The evaporation unit 200 receives a working fluid from the condensing unit 100 , and the working fluid may circulate inside the evaporation unit 200 . The evaporator 200 may come into contact with electronic elements that generate heat, such as semiconductor devices, diodes, transistors, resistors, and capacitors used in electrical devices. These electronic devices generally have a problem in that their performance deteriorates or they do not operate when the temperature is higher than a certain temperature.

The evaporator 200 of the present invention is connected to an electronic device to perform heat exchange to prevent deterioration in performance of the electronic device, and the working fluid boils and is converted into a gaseous state due to heat generated by the electronic device.

The evaporator 200 may be made of a metal material to facilitate heat exchange. In one embodiment, the evaporator 200 may be aluminum, but is not limited thereto, and various materials having high thermal conductivity may be used.

In addition, the evaporation unit 200 has a plurality of layers including a first outer wall 230, a second outer wall 240, and a body portion 210 disposed between the first outer wall 230 and the second outer wall 240. structure may be provided. The plurality of layered structures are for manufacturing convenience, and the number of layers or connection structure is not limited. The structure of the evaporator 200 will be described again below.

The first pipe 110 may move the working fluid from the condensing unit 100 to the evaporating unit 200 . The shape of the first pipe 110 is not limited, and may be modified into various shapes. In one embodiment, the first pipe 110 is connected to the lower portion of the condensing unit 100 may be supplied to the evaporation unit 200 by gravity.

The second pipe 120 may move the working fluid vaporized in the evaporation unit 200 to the condensation unit 100 . The second pipe 120 may be connected to the top of the condensing unit 100 . The vaporized working fluid flows into the upper part of the condensing unit 100 and is cooled, and the liquefied working fluid can automatically move towards the first pipe 110 located at the lower side by gravity.

The first pipe 110 and the second pipe 120 may be connected together to either side of the first outer wall 230 or the second outer wall 240 . This is to facilitate connection between the cooling device 1 and the electronic device.

Figure 4 is an exploded perspective view of the evaporator 200, which is a component of the present invention, viewed from the rear, Figure 5 is a rear view of the main body 210, which is a component of Figure 4, Figure 6 is a component of the present invention An exploded perspective view of the phosphorus evaporator 200 viewed from the front, and FIG. 7 is a front view of the main body 210, which is a component of FIG.

Referring to FIGS. 4 to 7 , the evaporation unit 200 includes a body unit 210 partitioned into a first movement space 212 and a second movement space 213 in which a working fluid moves through a partition wall 211 , The first outer wall 230 connected to the front of the first movement space 212 to seal the first movement space 212 and the front of the second movement space 213 to form the second movement space 213 It may include a second outer wall 240 for sealing.

The body part 210 may partition a first movement space 212 and a second movement space 213 through which the working fluid can move through the partition wall 211, and the lower part of the partition wall 211 includes the first movement space 212 and the second movement space 213. A first movement passage 214 connecting the movement space 212 and the second movement space 213 may be formed.

The working fluid introduced into the first moving space 212 descends due to gravity, and the lowered working fluid may move to the second moving space 213 through the first moving passage 214 . The working fluid moved to the second moving space 213 may exchange heat with the electronic device connected to the second outer wall 240 to be vaporized and move to the condenser.

In one embodiment, the first movement space 212 may be formed through the partition wall 211 and the first inner wall 210b and the second inner wall 210c disposed on both sides of the partition wall 211, One moving passage 214 may be formed in a horizontal direction below the partition wall 211 in an elongated shape. An inlet 210a is disposed on the upper side of the first inner wall 210b, and the working fluid supplied from the condensing unit 100 may flow into the inlet 210a.

The first movement passage 214 provided in an elongated shape allows the working fluid supplied through the inlet 210a to be supplied to the entire second movement space 213 . When the working fluid is heated in the second moving space 213, the first moving passage 214 supplies the working fluid as a whole rather than the supply biased to one side, thereby increasing the cooling efficiency.

The second movement space 213 is partitioned through the partition wall 211, the second movement passage 216 is formed on the upper part of the partition wall 211, and the first movement space ( 212) and a first movement passage 214 connected thereto may be formed.

In the second movement passage 216 , the working fluid introduced into the second movement space 213 is heated and boiled, and the vaporized working fluid may move.

An outlet 216a is formed on one side of the second movement passage 216 and is incorporated inwardly from the second inner wall 210c, and the working fluid moved to the second movement passage 216 passes through the outlet 216a. It can escape and move to the condensation unit 100.

The second movement passage 216 passes through the partition wall 211 , but may be blocked from the first movement space 212 by a partition 219 provided in the first movement space 212 . This is to prevent gas from entering the inlet 210a.

A third movement passage 217 connecting the first movement space 212 and the second movement passage 216 may be formed in one area of the compartment 219 . In one embodiment, the third movement passage 217 may be disposed above the second inner wall 210c of the first movement space 212 . When air bubbles generated in the first movement space 212 or bubbles generated in the second movement space 213 pass over the first movement passage 214, the third movement passage 217 returns them to the second movement passage. (216).

The compartment 219 may be inclined to prevent bubbles generated by heating the working fluid from entering the inlet 210a, and a protrusion 219a is provided in one area of the compartment 219. Formation can block the air bubbles from entering the inlet (210a).

Also, the second movement passage 216 may be disposed above the inlet 210a. This is to prevent the vaporized and rising gas from the second moving space 213 from flowing into the inlet 210a.

A plurality of protrusions 215 may be formed on any one of the partition wall 211 or the second outer wall 240 forming the second movement space 213 toward the second movement space 213 . The purpose of the plurality of protrusions 215 is to increase heat transfer efficiency when heat generated from an electronic device in contact with the second outer wall 240 is transferred to a working fluid. In the drawing, the protrusion 215 is shown as protruding from the partition wall 211, but is not limited thereto, and may be disposed in a structure protruding from the second outer wall 240 toward the second moving space 213.

The partition wall 211 partitions the first movement space 212 and the second movement space 213, and the working fluid heated in the second movement space 213 passes through the partition wall 211 to the first movement space ( 212) to transfer heat to the working fluid.

This is because the working fluid in the second moving space 213 whose calorific value has been increased through boiling transfers heat to the working fluid existing in the first moving space 212 through the partition wall 211, so that the second moving space 213 In this case, thermal diffusion occurs, and the degree of supercooling of the working fluid in the first moving space 212 can be reduced, so that the performance of the evaporator 200 can be improved.

The protrusion 215 may make surface contact with the second outer wall 240 . This can increase the efficiency of transferring heat from the electronic device in contact with the second outer wall 240 to the working fluid.

The protrusion 215 may protrude vertically from the partition wall 211 . In one embodiment, the protrusion 215 may be provided in the shape of a square pillar. The upper surface of the projection 215 in the shape of a square pillar contacts the second outer wall 240 to transfer heat generated from the electronic device to the projection 215, and the sidewall of the square pillar can transfer heat to the working fluid.

Due to the protrusion 215 having a structure protruding vertically from the partition wall 211, the surface tension of the working fluid is generated in that portion, and it can easily stay.

In addition, the vertically formed sidewall generates air bubbles through boiling in an area in contact with the partition wall 211, and the air bubbles generated on the vertically connected sidewall are easily separated from the sidewall.

In addition, the plurality of protrusions 215 may increase the degree of freedom of bubbles to slow dry-out due to gas flow.

Also, the plurality of protrusions 215 may have different heights. In one embodiment, the plurality of protrusions 215 may have a height proportionally lowered in the direction from the first moving passage 214 to the second moving passage 216, which affects the liquid film of the working fluid. It is possible to improve performance by facilitating the cooling or flow of enlarged bubbles.

A plurality of protrusions 215 are arranged at regular intervals to evenly heat the working gas as a whole. Through this, it is possible to prevent unequal heating due to heat transferred from the electronic device.

The first outer wall 230 may be coupled to the front surface of the first moving space 212 to seal the first moving space 212 . A first connection hole 231 and a second connection hole 232 may be formed in the first outer wall 230 .

The first connection hole 231 may be disposed on the front side of the inlet 210a disposed in the first movement space 212 and connected to one end of the first pipe 110 . The liquid working fluid introduced through the first connection hole 231 may move to the first movement space 212 .

The second connection hole 232 may be disposed in front of the outlet 216a disposed in the second movement passage 216 of the second movement space 213 . When the working fluid moves from the first moving space 212 to the second moving space 213, the second connection hole 232 receives the heat of the electronic device to cause boiling, and the passage through which the vaporized working fluid moves. can play the role of The gaseous working fluid introduced through the second connection hole 232 may move to the condensing unit 100 through the second pipe 120 .

The second outer wall 240 may be coupled to the front surface of the second moving space 213 to seal the second moving space 213 . The second outer wall 240 is in contact with the electronic element to transfer heat to the working fluid, and the shape of the second outer wall 240 may be modified in various ways so as to closely adhere to the shape of the contacting electronic element.

8 is an exploded perspective view of an embodiment of the evaporator 200, which is a component of the present invention, and FIG. 9 is a front view of the main body 210, which is a component of FIG.

Referring to FIGS. 8 and 9 , an embodiment of the evaporation unit 200, which is a component of the present invention, may include a guide unit 218.

The guide unit 218 is disposed to have an inclination in the first movement space 212 to guide bubbles introduced through the first movement passage 214 to the third movement passage 217 . The guide part 218 may be disposed to be spaced apart from the first inner wall 210b and the second inner wall 210c. This is to supply the working fluid to the inside of the first moving space 212 through the separation passage between the first inner wall 210b and one end of the guide part 218 . In addition, the spaced passage between the second inner wall 210c and the other end of the guide portion 218 may move air bubbles of the working fluid flowing into the first movement passage 214 to the outlet 216a.

In one embodiment, the guide part 218 may have a protruding bar shape, and the guide part 218 may be connected to the partition wall 211 by a curved surface. This is to prevent the working fluid from vaporizing in the guide part 218 . There is no limit to the shape of the curved surface, and it can be connected in various forms.

10 is a view showing the cooling flow of the working fluid in the present invention. Figure 10 (a) is a view showing the flow of the working fluid viewed from the first moving space 212 of the evaporation unit 200, Figure 10 (b) is a view of the working fluid viewed from the side of the evaporation unit 200 10(c) is a diagram showing the flow of the working fluid viewed from the second moving space 213 of the evaporator 200.

Referring to FIG. 10, the working fluid introduced through the inlet 210a moves downward in the first movement space 212 and moves to the second movement passage 216 through the first movement passage 214. .

The working fluid introduced into the second movement space 213 starts to be heated from the bottom and moves to the top, and vaporizes through boiling during the movement and rises. The elevated gas moves from the second moving passage 216 to the outlet 216a and moves to the condensing unit 100 via the second pipe 120, whereby heat exchange occurs.

In addition, air bubbles introduced into the first movement space 212 from the second movement space 213 through the first movement passage 214 move to the outlet 216a through the guide part 218 .

In the above, the embodiments of the present invention were examined in detail with reference to the accompanying drawings.

The above description is merely an example of the technical idea of the present invention, and those skilled in the art can make various modifications, changes, and substitutions without departing from the essential characteristics of the present invention. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

1 : Cooling device
100: condensation unit 110: first pipe
120: second pipe 200: evaporation unit
210: body part 210a: inlet part
210b: first inner wall 210c: second inner wall
211: partition wall 212: first movement space
213: second movement space 214: first movement passage
215: protrusion 216: second movement passage
216a: outlet 217: third moving passage
218: guide part 219: compartment part
219a: protruding jaw 230: first outer wall
231: first connection hole 232: second connection hole
240: second outer wall

Claims (19)

a condenser for cooling the working fluid;
an evaporation unit in which the working fluid moves and exchanges heat;
a first pipe through which the working fluid moves from the condensing unit to the evaporating unit; and
And a second pipe through which the working fluid is vaporized from the evaporation unit and moves to the condensation unit,
The evaporation unit is divided into a first movement space and a second movement space through a partition wall, and a first movement passage connecting the first movement space and the second movement space is formed below the partition wall,
The working fluid introduced through the first movement space moves to the second movement space through the first movement passage and causes heat exchange;
A plurality of protrusions are formed on one surface of the partition wall corresponding to the second movement space to increase a heat exchange area;
A second movement passage is provided above the second movement space,
The cooling device of claim 1 , wherein the second movement passage is blocked from the first movement space by a partition provided at an upper end of the partition wall. delete According to claim 1,
the evaporator
A body portion partitioned into a first movement space and a second movement space through the partition wall;
A first outer wall sealing the first movement space, and
A second outer wall sealing the second movement space;
A cooling device comprising a. delete delete According to claim 3,
The protrusion makes surface contact with the second outer wall. According to claim 1,
The protrusion protrudes vertically from the partition wall. According to claim 7,
The cooling device has a rectangular column shape. delete According to claim 1,
An inlet portion that is indented into the inside is disposed on the upper side of the first inner wall of the first movement space,
The inlet is connected to the first pipe and the cooling device into which the working fluid flows. According to claim 10,
A cooling device wherein a third movement passage connecting the second movement passage and the first movement space is disposed on an upper side of a second inner wall facing the first inner wall of the first movement space. According to claim 11,
A cooling device in which a guide part is disposed in the first movement space to guide air bubbles introduced through the first movement passage to a third movement passage. According to claim 12,
The cooling apparatus of claim 1 , wherein the guide part is spaced apart from the first inner wall and the second inner wall and is inclined. According to claim 13,
The cooling device of claim 1 , wherein the guide part is connected to the partition wall by a curved surface. According to claim 3,
The first pipe and the second pipe are connected together to the first outer wall or to the side of the main body. According to claim 1,
The first pipe is connected to the lower part of the condensing unit, and the second pipe is connected to the upper part of the condensing unit. According to claim 1,
A cooling device wherein a protruding jaw is formed in one region of the compartment. According to claim 1,
The plurality of protrusions have different heights from each other. According to claim 18,
The cooling device of claim 1 , wherein a height of the plurality of protrusions decreases proportionally in a direction from the first moving passage to the second moving passage.

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