KR102580436B1 - Organic light emitting display device and method for fabricating the same - Google Patents

Abstract

The present invention relates to an organic light emitting display device that can maintain correspondence between an organic light emitting device and an adhesive layer by minimizing the flow of the adhesive layer using an anti-slip structure, and a method of manufacturing the same. An organic light emitting display device according to an embodiment of the present invention includes a substrate having a display area and a bezel area surrounding the display area, a protective layer covering the organic light emitting element in the display area of the substrate, an encapsulation layer on the protective layer, and a substrate. It is located in the bezel area and includes an anti-slip structure on the periphery of the protective layer and an adhesive layer between the substrate and the encapsulation layer, covering the protective layer and the anti-slip structure, and adhering the substrate and the encapsulation layer to each other.

Description

Organic light emitting display device and method of manufacturing the same {ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME}

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and more specifically, to an organic light emitting display device including an anti-slip structure and a manufacturing method thereof.

An organic light emitting display device is a self-emitting display device that forms an organic light emitting layer between two electrodes and injects electrons and holes into the organic light emitting layer from the two electrodes, respectively, It is a display device that uses the principle of generating light by combining. Organic light emitting display devices are attracting attention as next-generation displays because they are advantageous in power consumption due to low voltage operation and have excellent response speed and viewing angle.

Organic light emitting display devices can be divided into top emission, bottom emission, or dual emission types depending on the direction in which light is emitted, and active matrix type depending on the driving method. type) or passive matrix type.

The purpose of this specification is to provide an organic light emitting display device including a new structure to solve the problem of the organic light emitting device not being compatible with the organic light emitting device due to the flow of the adhesive layer during the manufacturing of the organic light emitting display device.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to solve the problems described above, an organic light emitting display device according to an embodiment of the present invention includes a substrate having a display area and a bezel area surrounding the display area, a protective layer covering the organic light emitting element in the display area of the substrate, An encapsulation layer on the protective layer, in the bezel area of the substrate, an anti-slip structure on the periphery of the protective layer, and between the substrate and the encapsulation layer, covering the protective layer and the anti-slip structure, and connecting the substrate and the encapsulation layer. It includes an adhesive layer that adheres them to each other.

The anti-slip structure has a specific pattern on one side facing the encapsulation layer, so that it can minimize flow by supporting the encapsulation layer by contacting the adhesive layer before the protective layer before the encapsulation layer is completely adhered to the substrate.

A specific pattern may have an uneven structure that increases friction on one surface.

The width of the anti-slip structure may be thicker than the sum of the width of the organic light emitting device and the width of the protective layer.

The anti-slip structure may be composed of at least two layers, including an auxiliary layer at the bottom.

The anti-slip structure may be in at least two corner areas of the substrate.

Anti-slip structures can be placed in all corner areas of the substrate.

The anti-slip structure may be disposed on one edge area between at least two corner areas of the substrate and on the other side area opposite the one side area.

The anti-slip structure may be made of either PAC (Photo acryl) or PR (Photo resist).

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention includes forming an organic light emitting element on a display area of a TFT array substrate having a display area and a bezel area surrounding the display area, and insulating the organic light emitting element covering the organic light emitting element. Forming an anti-slip member on the layer and the bezel area of the TFT array substrate, the adhesive film adhered to one side of the encapsulation substrate is in contact with the anti-slip member, and the encapsulation substrate is such that there is a cavity between the adhesive film and the insulating layer. It includes the step of positioning and bonding the TFT array substrate and the encapsulation substrate.

The step of positioning the encapsulation substrate before the encapsulation substrate and the TFT array substrate are bonded can minimize the flow of the encapsulation substrate compared to when using a TFT array substrate without an anti-slip member.

The bonding step may further include applying heat to the adhesive film, and the applying heat may be a step in which the adhesive film bonds the TFT array substrate and the encapsulation substrate.

The step of forming the anti-slip member may include surface treating the encapsulation layer and the corresponding anti-slip member to have a concavo-convex structure.

An organic light emitting display device according to an embodiment of the present invention includes a first substrate including an organic light emitting display device structure, a second substrate including an encapsulation structure for encapsulating the organic light emitting device structure, and a space between the first substrate and the second substrate. It includes an anti-slip structure that prevents unnecessary movement of the first and second substrates relative to each other during the bonding process.

The anti-slip structure may be implemented at least partially along the outer edge of the first substrate and in contact with the front adhesive layer of the encapsulation structure to prevent unnecessary movement due to surface friction during the bonding process.

The front adhesive layer may have tackiness below a certain level to minimize bubble defects caused by adhesion of the first and second substrates.

The upper surface area of the anti-slip structure can be implemented depending on the adhesiveness of the front adhesive layer.

The height of the anti-slip structure may be implemented to be higher than the height of the organic light emitting device structure.

The anti-slip structure is made of the same organic material as the overcoat (OC) layer or bank of the organic light emitting device structure and can be implemented in the form of a pattern that does not require a separate process mask.

The pattern shape may be discontinuous to take air passing into account.

According to embodiments of the present invention, the flow of the adhesive layer can be minimized using an anti-slip structure, thereby maintaining correspondence between the organic light emitting device and the adhesive layer.

Additionally, according to embodiments of the present invention, the adhesive layer can seal the organic light emitting device to prevent external moisture and oxygen from penetrating into the organic light emitting device.

The effects according to the present invention are not limited to those exemplified above, and further various effects are included in the present specification.

1 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment of the present invention.
Figure 2 is a plan view for explaining an organic light emitting display device according to an embodiment of the present invention.
Figure 3 is a plan view for explaining an organic light emitting display device according to another embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to another embodiment of the present invention.
5A to 5D are cross-sectional views for explaining a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. These embodiments only serve to ensure that the disclosure of the present invention is complete, and those skilled in the art It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as 'after', 'successfully after', 'after', 'before', etc., 'immediately' or 'directly' Unless used, non-consecutive cases may also be included.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

“X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted as only geometrical relationships in which the relationship between each other is vertical, and should not be interpreted as a wider range within which the configuration of the present invention can function functionally. It can mean having direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first, second, and third items” means each of the first, second, or third items, as well as two of the first, second, and third items. It can mean a combination of all items that can be presented from more than one.

Each feature of the various embodiments of the present invention can be partially or fully combined or combined with each other, various technical interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

Organic light emitting display devices are very vulnerable to moisture or oxygen. If moisture or oxygen penetrates into the organic light emitting device, problems such as dark spots and reduced lifespan may occur due to oxidation of the metal electrode or deterioration of the organic light emitting layer. You can. Therefore, to solve this problem, a side encapsulation method in which an adhesive layer is adhered to the side of the organic light-emitting device to adhere the encapsulation layer, or a front encapsulation method in which an adhesive layer is adhered to the front of the organic light-emitting device is used. In particular, a lot of research has been done recently on front-side encapsulation methods that can reduce the thickness of organic light-emitting displays and can also be applied to flexible organic light-emitting displays.

In the case of the full encapsulation method, the adhesive layer attached to the encapsulation layer is located between the organic light emitting device and the encapsulation layer. Additionally, the adhesive layer is positioned corresponding to the organic light emitting device to seal the organic light emitting device. At this time, heat is applied to the adhesive layer to seal the organic light emitting device. The heated adhesive layer can generate adhesive force and seal the organic light emitting device.

Before heat is applied to the adhesive layer, the encapsulation layer may flow. Therefore, the adhesive layer attached to the encapsulation layer can also flow. The adhesive layer positioned to correspond to the organic light emitting device may have a problem in that it cannot correspond to the organic light emitting device due to flow. Therefore, the flow of the adhesive layer may cause a problem in which the adhesive layer cannot seal the organic light emitting device. Accordingly, external moisture and oxygen may penetrate into the organic light emitting device.

Accordingly, the inventors of the present invention recognized this problem and improved the problem of the adhesive layer flowing by considering a method to protect the organic light emitting device. Accordingly, the inventors of the present invention have invented an organic light emitting display device with a new structure and a manufacturing method thereof that can prevent dark spot defects and increase the lifespan of the organic light emitting display device.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment of the present invention, and FIG. 2 is a plan view illustrating an organic light emitting display device according to an embodiment of the present invention.

The structure of the organic light emitting display device 100 will be described with reference to FIGS. 1 and 2.

As shown in FIG. 1, the organic light emitting display device 100 includes a substrate 101, an organic light emitting element 103, a protective layer 105, an adhesive layer 107 and 109, an encapsulation layer 111, and an anti-slip structure 113. ) may include.

The substrate (or TFT array substrate) 101 may include a display area (DA) and a bezel area (ZA) surrounding the display area (DA).

The display area DA is an area where an image is displayed in the organic light emitting display device 100. Accordingly, the organic light emitting device 103 and a transistor layer for driving the organic light emitting device 103 are disposed in the display area DA. In FIG. 1, only the organic light emitting device 103 is shown for convenience of explanation, but the present invention is not limited thereto.

The bezel area ZA is an area in the organic light emitting display device 100 where no image is displayed and is an area where wiring or circuitry is formed.

The substrate 101 may be made of a transparent glass material, or, in the case of a flexible organic light emitting display device, may be made of a flexible material such as metal or plastic.

A transistor (TFT) layer may be located on substrate 101 . The transistor layer may include various interconnections such as gate interconnections, data interconnections, and power interconnections, and a transistor connected to the interconnections.

A transistor is formed in each pixel area, allowing each pixel to be driven individually. The transistor layer can be placed on substrate 101 by a variety of methods known in the art.

The organic light emitting device 103 may be located on the display area DA of the substrate 101. The organic light emitting device 103 may include a first electrode, an organic light emitting layer, and a second electrode.

The first electrode may be located on the transistor layer. That is, the first electrode is located on the substrate 101 where the transistor layer is located and is electrically connected to the transistor. The first electrode may be formed of a transparent metal with a high work function, such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is limited thereto. no.

The organic light-emitting layer may be located on the first electrode. That is, the organic light-emitting layer is located on the substrate 101 on which the first electrode is formed. The organic light-emitting layer may be positioned between two electrodes. Therefore, light can be emitted using holes and electrons supplied from the two electrodes. The organic light-emitting layer may be formed as a single light-emitting layer that emits a single light, or may be formed as a structure of a plurality of light-emitting layers that emit white light. However, it is not limited to this, and the organic light-emitting layer can be formed to have various stacked structures depending on the design.

The second electrode may be located on the organic light emitting layer. The second electrode is formed of an opaque metal with a low work function, such as aluminum (Al), silver (Ag), gold (Au), platinum (Pt), chromium (Cr), or an alloy containing these. It can be. Additionally, the second electrode may be formed of a metal with high light reflectivity.

Organic light-emitting layers may be additionally formed between the organic light-emitting layer and the first electrode or between the organic light-emitting layer and the second electrode to increase light emission efficiency.

A protective layer (or insulating layer) 105 may be located on the substrate 101 . At this time, the protective layer 105 may be located on the organic light emitting device 103. Accordingly, the protective layer 105 may cover the organic light emitting device 103. At this time, the protective layer 105 may seal the organic light emitting device 103. Accordingly, the protective layer 105 can reduce external moisture or oxygen from penetrating into the organic light emitting device 103. Accordingly, the protective layer 105 can minimize problems such as dark spot defects and reduced lifespan of the organic light emitting display device 100 due to oxidation of the metal electrode or deterioration of the organic light emitting layer.

The protective layer 105 may be formed of, for example, aluminum (Al), silicon oxide (SiOx), silicon nitride (SiNx), zirconium (Zr)-based oxide, or multiple layers thereof, but is not limited thereto.

Adhesive layers (or adhesive films) 107 and 109 may be located on the protective layer 105. At this time, the adhesive layers 107 and 109 may cover the protective layer 105. Therefore, the adhesive layers 107 and 109 can seal the protective layer 105. Accordingly, the adhesive layers 107 and 109 can seal the organic light emitting device 103. That is, the adhesive layers 107 and 109 can additionally seal the organic light emitting device 103 sealed by the protective layer 105. Additionally, the adhesive layers 107 and 109 may be positioned between the encapsulation layer 111 and the protective layer 105. Therefore, the adhesive layers 107 and 109 can adhere the encapsulation layer 111 and the protective layer 105.

The adhesive layers 107 and 109 may include a first adhesive layer 107 and a second adhesive layer 109. The second adhesive layer 109 may be located on the first adhesive layer 107. That is, the first adhesive layer 107 may be positioned on the protective layer 105, and then the second adhesive layer 109 may be positioned continuously.

The first adhesive layer 107 and the second adhesive layer 109 may be formed of resin.

The adhesive layers 107 and 109 may be made of, for example, a combination of epoxy resin, phenol resin, acryl resin, heat and light curable resin, and organic binder. It is not limited. Additionally, the resin may be formed of a non-curable resin. Therefore, even if the content of the moisture absorbent increases and the material expands due to moisture, the stress caused by the expansion can be alleviated.

Additionally, the second adhesive layer 109 may include a moisture absorbent. At this time, the desiccant can absorb external moisture or oxygen. Therefore, the second adhesive layer 109 containing a moisture absorbent can absorb external moisture or oxygen. Therefore, the adhesive layers 107 and 109 can absorb external moisture or oxygen. That is, the adhesive layers 107 and 109 can reduce the penetration of external moisture or oxygen into the organic light emitting device 103. Accordingly, problems such as dark spot defects and reduced lifespan of the organic light emitting display device 100 due to oxidation of the metal electrode or deterioration of the organic light emitting layer can be minimized.

At this time, the moisture absorbent can be used, for example, barium oxide (BaO), calcium carbonate (CaCO3), calcium oxide (CaO), phosphorus oxide (P2O5), zeolite, silica gel, alumina, etc. . In addition, the desiccant can be a material that has a hydrophilic functional group to absorb external moisture or oxygen. For example, it has a hydrophilic functional group such as a carboxyl group, amino group, or hydroxyl group. Any material available can be used, but is not limited to this.

The encapsulation layer (or encapsulation structure) 111 may be located on the protective layer 105. The encapsulation layer 111 may be bonded to the protective layer 105 by adhesive layers 107 and 109. At this time, the encapsulation layer 111 may be disposed on the second adhesive layer 109 of the adhesive layers 107 and 109. At this time, the encapsulation layer 111 may be insulated glass, metal, or plastic.

At this time, the adhesive layers 107 and 109 may be positioned between the encapsulation layer 111 and the substrate 101. Therefore, the adhesive layers 107 and 109 can adhere the encapsulation layer 111 and the substrate 101 to each other. Accordingly, the encapsulation layer 111 can be bonded to the substrate 101 on which the organic light emitting device 103 and the protective layer 105 are formed through the adhesive layers 107 and 109 to form the organic light emitting display device 100.

During the cementation process, the substrate 101 and the upper structure (e.g., the encapsulation layer 111, the upper substrate, etc.) may slip or move undesirably relative to each other. Taking this into account, an anti-slip structure ( 113) may be located on the substrate 101. The anti-slip structure 113 may be located on the bezel area ZA of the substrate 101 . At this time, the organic light emitting device 103 is located on the substrate 101, and the organic light emitting device 103 may be covered with a protective layer 105. Accordingly, the anti-slip structure 113 may be located at the periphery of the protective layer 105.

At this time, an encapsulation layer 111 may be located on the substrate 101, and adhesive layers 107 and 109 may be located between the substrate 101 and the encapsulation layer 111. Accordingly, the anti-slip structure 113 on the substrate 101 may be covered by the adhesive layers 107 and 109. In particular, the anti-slip structure 113 may be covered by the first adhesive layer 107 underneath the second adhesive layer 109.

Additionally, the anti-slip structure 113 may have a specific pattern. The specific pattern may be provided on one side of the anti-slip structure 113 facing the encapsulation layer 111. At this time, the specific pattern may be, for example, an uneven structure that increases friction on one surface of the anti-slip structure 113, but is not limited thereto. The specific pattern of the anti-slip structure 113 may be formed through RF plasma processing, rubbing, or nano-imprinting, but is not limited thereto. For example, RF plasma treatment involves O2/Ar plasma treatment on the surface of the anti-slip structure 113. At this time, an uneven structure is formed on the surface of the anti-slip structure 113, and roughness may increase. Therefore, the roughness of the surface of the anti-slip structure 113 may be increased to, for example, a friction coefficient of 0.5 or more through plasma treatment. Accordingly, friction between the adhesive layers 107 and 109 and the anti-slip structure 113 may increase.

Additionally, the anti-slip structure 113 may be made of the same material as an overcoat (OC) layer or bank that may constitute a portion of the organic light-emitting device 103. At this time, the anti-slip structure 113 may be formed together when forming the overcoat layer or bank. Therefore, the anti-slip structure 113 can be implemented in a pattern form without the need for a separate process mask. For example, the material forming the anti-slip structure 113 may be one of photo acryl (PAC) or photo resist (PR), which are materials constituting the overcoat layer or the bank, but is not limited thereto.

Adhesive layers 107 and 109 may be provided on one side of the encapsulation layer 111 facing the specific pattern of the anti-slip structure 113 at the periphery of the protective layer 105. Accordingly, the anti-slip structure 113 may contact the adhesive layers 107 and 109 before the protective layer 105 before the encapsulation layer 111 is completely bonded to the substrate 101. At this time, one side of the anti-slip structure 113 has higher friction than one side of the protective layer 105. Accordingly, the anti-slip structure 113 supports the encapsulation layer 111 and can minimize the flow of the encapsulation layer 111. That is, the anti-slip structure 113 is between the substrate 101 and the encapsulation layer 111, and can prevent unnecessary movement of the substrate 101 and the encapsulation layer 111 relative to each other during the bonding process.

In addition, in order for the anti-slip structure 113 to contact the adhesive layers 107 and 109 before the protective layer 105, the width of the anti-slip structure 113 is the width of the organic light emitting device 103 on the substrate 101 and the protective layer 105. It can be thicker than the sum of its widths. That is, the height of the anti-slip structure 113 may be higher than the organic light emitting device structure including the organic light emitting device 103 and the protective layer 105.

As shown in FIG. 2 , the anti-slip structure 113 may be located on the substrate 101 . The anti-slip structure 113 may be located in the bezel area ZA of the substrate 101. At this time, the anti-slip structure 113 may be located in a corner area of the substrate 101. That is, the anti-slip structure 113 may be located corresponding to a corner area of the bezel area ZA of the substrate 101. At this time, the anti-slip structure 113 may be located in at least two corner areas. Additionally, the anti-slip structure 113 may be disposed in all corner areas ZA. As the number of anti-slip structures 113 disposed in the corner area increases, the number of anti-slip structures 113 in contact with the adhesive layer provided on one side of the encapsulation layer 111 may increase. Therefore, friction between the anti-slip structure 113 and the adhesive layers 107 and 109 may increase. Accordingly, as the anti-slip structure 113 increases, the flow of the encapsulation layer 111 can be further minimized. That is, the anti-slip structure 113 is at least partially located along the outer edge of the substrate 101 and contacts the adhesive layers 107 and 109 on one side of the encapsulation layer 111 to prevent unnecessary movement due to surface friction during the bonding process. You can.

At this time, the tackiness of the adhesive layers 107 and 109 may be below a certain level to minimize bubble defects. For example, if the adhesion of the adhesive layers 107 and 109 in contact with the anti-slip structure 113 is high, bubbles may be generated from the adhesive layers 107 and 109 when the substrate 101 and the encapsulation layer 111 are bonded. Therefore, defects may occur in the organic light emitting display device due to the generated bubbles. Accordingly, the adhesion of the adhesive layers 107 and 109 can be determined to the extent that bonding of the substrate 101 and the encapsulation layer 111 is possible while no bubbles are generated.

Additionally, the upper surface area of the anti-slip structure 113 may be implemented according to the roughness of the upper surface. The upper surface of the anti-slip structure 113 may be in contact with the adhesive layers 107 and 109. Accordingly, the upper surface of the anti-slip structure 113 may rub against the adhesive layers 107 and 109. The greater the friction between the upper surface of the anti-slip structure 113 and the adhesive layers 107 and 109, the more the flow of the encapsulation layer 111 can be minimized. At this time, as the roughness of the upper surface of the anti-slip structure 113 increases, the flow of the encapsulation layer 111 can be minimized even with a small area of the upper surface of the anti-slip structure 113. That is, as the roughness of the upper surface of the anti-slip structure 113 increases, the area of the upper surface of the anti-slip structure 113 can be reduced.

Accordingly, when bonding the substrate 101 and the encapsulation layer 111, the correspondence between the organic light emitting device 103 and the adhesive layers 107 and 109 can be maintained. Accordingly, the adhesive layers 107 and 109 seal the organic light emitting device 103, thereby preventing external moisture and oxygen from penetrating into the organic light emitting device 103.

Figure 3 is a plan view for explaining an organic light emitting display device according to another embodiment of the present invention.

The organic light emitting display device 200 shown in FIG. 3 has only the structures of the anti-slip structures 113 and 213 changed compared to the organic light emitting display device 200 shown in FIGS. 1 and 2, and other components are substantially the same. Since they are the same, duplicate descriptions are omitted.

As shown in FIG. 3 , anti-slip structures 113 and 213 may be located on the substrate 101 . The anti-slip structures 113 and 213 may be located in the bezel area ZA of the substrate 101 . At this time, the anti-slip structure 113 may be located in a corner area of the substrate 101. That is, the anti-slip structure 113 may be located corresponding to a corner area of the bezel area ZA of the substrate 101.

The anti-slip structure 113 may be located in at least two corner areas. At this time, the anti-slip structure 213 may be disposed on one edge area between at least two corner areas and on the other edge area opposite the one side area. Additionally, the anti-slip structure 113 may be placed in all corner areas. At this time, the anti-slip structure 213 may be disposed on all edge areas between all corner areas. That is, the anti-slip structures 113 and 213 may be positioned in a discontinuous pattern in the bezel area ZA of the substrate 101. At this time, the anti-slip structures 113 and 213 are formed discontinuously to prevent defective adhesion caused by air bubbles that may occur when forming the organic light emitting display device 200.

When the substrate 101 and the encapsulation layer are bonded, the gas between the substrate and the encapsulation layer may become bubbles. At this time, the problem of poor cementation may occur due to the air bubbles. Therefore, when the anti-slip structures 113 and 213 are formed in a discontinuous pattern, gas may escape between the anti-slip structures 113 and 213. That is, air passing may occur. In other words, the pattern shape of the anti-slip structures 113 and 213 must be formed taking air passing into consideration. Therefore, the anti-slip structures 113 and 213 considering air passing can minimize air bubbles when bonding the substrate 101 and the encapsulation layer, thereby preventing defective bonding of the substrate 101 and the encapsulation layer.

Additionally, the anti-slip structures 113 and 213 disposed in the corner area and the area between the corner areas may be discontinuously disposed at uniform intervals between the anti-slip structures 113 and 213. At this time, as the anti-slip structures 113 and 213 increase, the friction between the anti-slip structures 113 and 213 and the adhesive layer may increase. Additionally, since the anti-slip structures 113 and 213 are discontinuously disposed at uniform intervals, the anti-slip structures 113 and 213 can further minimize the flow of the encapsulation layer when the encapsulation layer flows. That is, the anti-slip structures 113 and 213 are at least partially located along the outer edge of the substrate 101 and contact the adhesive layer on one side of the encapsulation layer to prevent unnecessary movement due to surface friction during the bonding process.

Therefore, when bonding the substrate 101 and the encapsulation layer, the correspondence between the organic light emitting device and the adhesive layer can be maintained. Accordingly, the adhesive layer seals the organic light emitting device, thereby preventing external moisture and oxygen from penetrating into the organic light emitting device.

FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to another embodiment of the present invention.

The organic light emitting display device 300 shown in FIG. 4 only has a changed structure of the anti-slip structure 113 compared to the organic light emitting display device 100 shown in FIGS. 1 and 2, and other components are substantially the same. Since they are the same, duplicate descriptions are omitted.

The anti-slip structure 113 may include an auxiliary layer 313. The anti-slip structure 113 located on the substrate 101 may include an auxiliary layer 313 below the anti-slip structure 113. That is, the anti-slip structure 113 may have at least two layers.

The auxiliary layer 313 may be located on the substrate 101. An anti-slip structure 113 may be located on the auxiliary layer 313. At this time, the auxiliary 313 layer may be located on the bezel area of the substrate 101. That is, the auxiliary layer 313 may be formed in the area where the anti-slip structure 113 is to be formed. Additionally, the auxiliary layer 313 may be formed together with a portion of the organic light emitting device 103 when forming the organic light emitting device 103. For example, the portion may be an obocut layer or a bank, but is not limited thereto. Therefore, when forming the auxiliary layer 313, it can be implemented in a pattern form that does not require a separate process mask.

At this time, the width of the auxiliary layer 313 and the width of the anti-slip structure 113 may be the same. Therefore, the width of the anti-slip structure 113 including the auxiliary layer 313 may be thicker than the sum of the widths of the organic light emitting device 103 and the protective layer 105 on the substrate 101. That is, the height of the anti-slip structure 113 including the auxiliary layer 313 may be higher than the organic light emitting device structure including the organic light emitting device 103 and the protective layer 105.

5A to 5D are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention. In particular, a cross-sectional view according to each step of the manufacturing method of the organic light emitting display device 100 according to the present invention is shown.

As shown in FIG. 5A, the organic light emitting device 103 can be formed on the substrate 101.

The substrate (or TFT array substrate) 101 may include a display area and a bezel area surrounding the display area.

The display area is an area where an image is displayed in an organic light emitting display device. Accordingly, the organic light emitting device 103 and a transistor layer for driving the organic light emitting device 103 may be formed in the display area. In FIG. 1, only the organic light emitting device 103 is shown for convenience of explanation, but the present invention is not limited thereto.

The bezel area is an area where images are not displayed in the organic light emitting display device, and is an area where wiring or circuit parts are formed.

The organic light emitting device 103 may be formed on the display area of the substrate 101 . At this time, the organic light-emitting device 103 may include a first electrode, an organic light-emitting layer, and a second electrode.

As shown in FIG. 5B, a protective layer 105 and an anti-slip structure 113 can be formed.

The protective layer 105 may be formed on the substrate 101 . At this time, the protective layer 105 may be formed on the organic light emitting device 103. Accordingly, the protective layer 105 may be formed to cover the organic light emitting device 103. At this time, the protective layer 105 may seal the organic light emitting device 103. Accordingly, the protective layer 105 can reduce external moisture or oxygen from penetrating into the organic light emitting device 103. Accordingly, the protective layer 105 can minimize problems such as dark spot defects and reduced lifespan of the organic light emitting display device 100 due to oxidation of the metal electrode or deterioration of the organic light emitting layer.

During the cementation process, the substrate 101 and the upper structure (e.g., protective layer 105, upper substrate, etc.) may slip or move undesirably relative to each other. Taking this into account, an anti-slip structure is provided. It may be formed on the substrate 101. The anti-slip structure 113 may be formed in the bezel area of the substrate 101 . At this time, the organic light emitting device 103 is located on the substrate 101, and the organic light emitting device 103 may be covered with a protective layer 105. Accordingly, the anti-slip structure 113 may be formed around the protective layer 105.

Additionally, the anti-slip structure 113 may include a surface treatment step to provide a specific pattern. The specific pattern may be formed on one side of the anti-slip structure 113 facing the encapsulation layer 111. At this time, the specific pattern may be, for example, an uneven structure that increases friction on one surface of the anti-slip structure 113, but is not limited thereto. That is, the anti-slip structure 113 may include surface treatment to have a concave-convex structure on one surface.

The specific pattern of the anti-slip structure 113 may be formed through RF plasma processing, rubbing, or nano-imprinting, but is not limited thereto. For example, RF plasma treatment involves O2/Ar plasma treatment on the surface of the anti-slip structure 113. At this time, roughness may be increased by forming an uneven structure on the surface of the anti-slip structure 113 or by other surface treatments. Therefore, the roughness of the surface of the anti-slip structure 113 may be increased to, for example, a friction coefficient of 0.5 or more through plasma treatment. Accordingly, the friction between the adhesive layer and the anti-slip structure 113 may increase.

Additionally, the anti-slip structure 113 may be formed of the same material as an overcoat (OC) layer or bank that may constitute a portion of the organic light emitting device 103. At this time, the anti-slip structure 113 may be formed together when forming the overcoat layer or bank. Therefore, the anti-slip structure 113 can be formed in a pattern shape that does not require a separate process mask. For example, the material forming the anti-slip structure 113 may be formed of one of PAC (Photo acryl) or PR (Photo resist), which are materials constituting the overcoat layer or the bank, but is not limited thereto.

As shown in FIG. 5C, the encapsulation layer 111 may be placed on the substrate 101. At this time, the adhesive layer adhered to one surface of the encapsulation layer 111 and the anti-slip structure 113 may be in contact. At this time, one side of the anti-slip structure 113 may have higher friction than one side of the protective layer 105. Accordingly, the anti-slip structure 113 supports the encapsulation layer 111 and can minimize the flow of the encapsulation layer 111. That is, by contacting the anti-slip structure 113, before the encapsulation layer 111 and the substrate 101 are bonded, the flow of the encapsulation layer 111 is reduced compared to the case of using the substrate 101 without the anti-slip structure 113. It can be minimized. That is, the anti-slip structure 113 is between the substrate 101 and the encapsulation layer 111, and can prevent unnecessary movement of the substrate 101 and the encapsulation layer 111 relative to each other during the bonding process.

In addition, in order for the anti-slip structure 113 to contact the adhesive layer before the protective layer 105, the width of the anti-slip structure 113 is the sum of the widths of the organic light emitting device 103 and the protective layer 105 on the substrate 101. It may be thicker than that. That is, the height of the anti-slip structure 113 may be higher than the organic light emitting device structure including the organic light emitting device 103 and the protective layer 105. Therefore, there may be a cavity between the adhesive layer and the protective layer 105 covering the organic light emitting device 103.

As shown in FIG. 5D, the substrate 101 and the encapsulation layer 111 can be bonded.

The adhesive layer may be positioned between the encapsulation layer 111 and the substrate 101. At this time, the adhesive layer can bond the encapsulation layer 111 and the substrate 101 to each other. When the encapsulation layer 111 and the substrate 101 are bonded to each other, heat may be applied to the adhesive layer. The adhesive strength of the adhesive layer can be increased by applied heat. Therefore, the adhesive layer can bond the substrate 101 and the encapsulation layer 111. Additionally, the adhesive layer may cover the organic light emitting device 103. At this time, the adhesive layer may also cover the anti-slip structure 113. That is, when the encapsulation layer 111 and the substrate 101 are bonded, the adhesive layer may cover the organic light emitting device 103 and the anti-slip structure 113. In particular, the first adhesive layer 107 under the second adhesive layer 109 may cover the anti-slip structure 113.

Accordingly, the encapsulation layer 111 can be bonded to the organic light emitting device 103 and the substrate 101 through an adhesive layer to form the organic light emitting display device 100.

Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.

100, 200, 300: Organic light emitting display device
101: substrate
103: Organic light emitting device
105: protective layer
107: first adhesive layer
109: second adhesive layer
111: Encapsulation layer
113,213: Anti-slip structure
313: Auxiliary layer

Claims (20)

A substrate having a display area and a bezel area surrounding the display area;
a protective layer covering the organic light emitting device in the display area of the substrate;
an encapsulation layer on the protective layer;
An anti-slip structure located in the bezel area of the substrate and on the periphery of the protective layer; and
A layer is between the substrate and the encapsulation layer, covers the protective layer and the anti-slip structure, and adheres the substrate and the encapsulation layer to each other,
The layer that adheres the substrate and the encapsulation layer to each other is,
A first layer, one surface of which is in contact with the top and both sides of the protective layer and the top and both sides of the anti-slip structure, covering and sealing the protective layer and the anti-slip structure, and
An organic light emitting display device comprising a second layer on one side in contact with the first layer and on the other side with the encapsulation layer. According to claim 1,
The anti-slip structure is provided with a specific pattern on one surface facing the encapsulation layer, so that before the encapsulation layer is completely adhered to the substrate, it first contacts the layer that bonds the substrate and the encapsulation layer to each other rather than the protective layer. An organic light emitting display device that supports the encapsulation layer to minimize flow. According to claim 2,
The organic light emitting display device wherein the specific pattern is a convex-convex structure that increases friction of the one surface. According to claim 2,
The width of the anti-slip structure is thicker than the sum of the width of the organic light-emitting element and the width of the protective layer. According to claim 4,
The anti-slip structure is comprised of at least two layers including an auxiliary layer at the bottom. According to claim 2,
The anti-slip structure is located in at least two corner areas of the substrate. According to claim 6,
The anti-slip structure is disposed in all corner areas of the substrate. According to claim 6,
The anti-slip structure is disposed on an edge area between the at least two corner areas of the substrate and on another side area opposite the one side area. According to claim 2,
The anti-slip structure is an organic light emitting display device made of either PAC (Photo acryl) or PR (Photo resist). forming an organic light emitting device on the display area of a TFT array substrate having a display area and a bezel area surrounding the display area;
forming an anti-slip member on a protective layer covering the organic light emitting device and a bezel area of the TFT array substrate;
Positioning the encapsulation substrate so that an adhesive film adhered to one surface of the encapsulation substrate is in contact with the anti-slip member and there is a cavity between the adhesive film and the protective layer; and
It includes bonding the TFT array substrate and the encapsulation substrate,
The adhesive film includes a plurality of layers for sealing the organic light emitting device,
One side of the first layer among the plurality of layers is in contact with the second layer among the plurality of layers,
One side of the second layer is in contact with the encapsulation substrate, and the other side is in contact with the first layer,
In the bonding step, the other side of the first layer is in contact with the top and both sides of the protective layer and the top and both sides of the anti-slip member to cover and seal the protective layer and the anti-slip member. Manufacturing method. According to claim 10,
The step of positioning the encapsulation substrate minimizes the movement of the encapsulation substrate compared to the case of using a TFT array substrate without the anti-slip member before the encapsulation substrate and the TFT array substrate are bonded to each other. method. According to claim 11,
The cementing step further includes applying heat to the adhesive film,
The method of manufacturing an organic light emitting display device in which the applying heat is a step in which the adhesive film adheres the TFT array substrate and the encapsulation substrate. According to claim 10,
The forming of the anti-slip member includes surface treating the anti-slip member corresponding to the encapsulation substrate to have a concavo-convex structure. A first substrate including an organic light emitting device structure;
a second substrate including an encapsulation structure that encapsulates the organic light emitting device structure;
an anti-slip structure located between the first substrate and the second substrate and preventing unnecessary movement of the first substrate and the second substrate relative to each other during a bonding process; and
A front adhesive layer comprising a plurality of layers for adhering the first substrate and the second substrate to each other and sealing the organic light emitting device structure,
The first layer of the front adhesive layer has one side in contact with the top and both sides of the organic light-emitting device structure and the top and both sides of the anti-slip structure to cover and seal the organic light-emitting device structure and the anti-slip structure, and the other side is in contact with the front surface. in contact with the second layer of the adhesive layer,
An organic light emitting display device wherein one side of the second layer is in contact with the first layer and the other side is in contact with the encapsulation structure. According to claim 14,
The anti-slip structure is at least partially along the outer edge of the first substrate and is in contact with the front adhesive layer to prevent unnecessary movement due to surface friction during the bonding process. According to claim 15,
The front adhesive layer has a tackiness of a certain level or less to minimize bubble defects caused by adhesion of the first and second substrates. According to claim 16,
The organic light emitting display device wherein the upper surface area of the anti-slip structure is implemented depending on the adhesiveness of the front adhesive layer. According to claim 17,
An organic light emitting display device in which the height of the anti-slip structure is implemented to be higher than the height of the organic light emitting device structure. According to claim 18,
The anti-slip structure is made of the same organic material as the overcoat (OC) layer or bank of the organic light emitting device structure and is implemented in a pattern form without the need for a separate process mask. According to claim 19,
The pattern shape is discontinuous in consideration of air passing.

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