KR20170070489A - Organic light emitting display device and method for fabricating the same - Google Patents

Abstract

The present invention relates to an OLED display capable of minimizing the flow of an adhesive layer using a non-slip structure and maintaining the correspondence between the OLED and the adhesive layer, and a method of manufacturing the OLED display. An organic light emitting display according to an embodiment of the present invention includes a substrate having a display region and a display region and a bubble region surrounding the display region, a protective layer covering the organic light emitting element in a display region of the substrate, An anti-slip structure at the periphery of the protective layer and an adhesive layer between the substrate and the encapsulation layer and covering the protective layer and the anti-slip structure and bonding the substrate and the encapsulation layer to each other.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device,

The present invention relates to an organic light emitting display and a method of manufacturing the same, and more particularly, to an organic light emitting display including a slip prevention structure and a method of manufacturing the same.

The organic light emitting display device is a self light emitting display device in which an organic light emitting layer is formed between two electrodes, and electrons and holes are injected from the two electrodes into the organic light emitting layer, And is a display device using the principle of generating light by coupling. The organic light emitting display device is advantageous in power consumption by driving at a low voltage, and has excellent response speed and viewing angle, and has been attracting attention as a next generation display.

The organic light emitting display may be divided into a top emission type, a bottom emission type, and a dual emission type depending on a direction in which the light is emitted, and an active matrix type or a passive matrix type.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic light emitting diode (OLED) display including a new structure for solving the problem that the OLED display does not correspond to the organic light emitting diode due to the flow of the adhesive layer during the manufacture of the OLED display.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an OLED display including a substrate having a display area and a display area surrounding the display area, a protective layer covering the OLED in a display area of the substrate, A sealing layer on the protective layer, a slip prevention structure in the bezel region of the substrate, a slip prevention structure at the periphery of the protective layer, and a sealing layer between the substrate and the sealing layer, covering the protective layer and the non- And an adhesive layer which adheres to each other.

The anti-slip structure may have a specific pattern on one side facing the encapsulation layer to minimize contact with the adhesive layer before the encapsulation layer is fully bonded to the substrate to support the encapsulation layer to minimize flow.

The specific pattern may be a concavo-convex structure that increases the frictional force on one side.

The width of the non-slip structure may be thicker than the sum of the width of the organic light emitting element and the width of the protective layer.

The anti-slip structure may comprise at least two layers comprising an auxiliary layer at the bottom.

The anti-skid structure may be in at least two corner areas of the substrate.

The anti-slip structure may be disposed in all corner areas of the substrate.

The anti-skid structure may be disposed at an edge region between at least two corner regions of the substrate and at the other region opposite the one region.

The non-slip structure may be formed of any one of PAC (photo acryl) and PR (photo resist).

A method of manufacturing an organic light emitting display according to an embodiment of the present invention includes the steps of forming an organic light emitting device on a display area of a TFT array substrate having a display area and a bezel area surrounding the display area, Layer and a bezel region of the TFT array substrate, a step of forming a non-slip member on the bezel region of the TFT array substrate, a step of contacting the adhesive film and the non-slip member bonded to one surface of the sealing substrate, And bonding the TFT array substrate and the sealing substrate together.

The step of positioning the encapsulation substrate can minimize the flow of the encapsulation substrate compared to the case of using a TFT array substrate without the non-slip member before the encapsulation substrate and the TFT array substrate are bonded together.

The step of adhering may further comprise the step of applying heat to the adhesive film, and the step of applying heat may be a step of adhering the TFT array substrate and the sealing substrate to each other.

The step of forming the non-slip member may include the step of surface-treating the non-slip member corresponding to the sealing layer so as to have the uneven structure.

An OLED display according to an exemplary embodiment of the present invention includes a first substrate including an OLED display structure, a second substrate including an encapsulation structure for encapsulating the OLED structure, and a second substrate including a first substrate and a second substrate And a slip prevention structure that prevents unnecessary movement of the first substrate and the second substrate relative to each other in the laminating process.

The anti-slip structure may be implemented at least partially along the periphery of the first substrate and in contact with the front adhesive layer of the sealing structure to prevent unwanted movement by surface friction during the laminating process.

The tackiness of the front adhesive layer may be lower than a certain level so as to minimize bubble defects due to adhesion between the first substrate and the second substrate.

The upper surface area of the anti-slip structure can be realized according to the tackiness of the front adhesive layer.

The height of the non-slip structure may be higher than the height of the OLED structure.

The non-slip structure may be realized in the form of a pattern which is made of the same organic material as the overcoat (OC) layer or the bank of the organic light emitting diode structure and does not require a separate process mask.

The pattern shape may be discontinuous considering air passing.

According to the embodiments of the present invention, the flow of the adhesive layer can be minimized by using the non-slip structure, so that the correspondence between the organic light emitting element and the adhesive layer can be maintained.

In addition, according to embodiments of the present invention, the adhesive layer seals the organic light emitting element to prevent external moisture and oxygen from penetrating into the organic light emitting element.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a cross-sectional view illustrating an organic light emitting diode display according to an embodiment of the present invention.
2 is a plan view for explaining an organic light emitting display according to an embodiment of the present invention.
3 is a plan view illustrating an OLED display according to another embodiment of the present invention.
4 is a cross-sectional view illustrating an OLED display according to another embodiment of the present invention.
5A to 5D are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. To fully disclose the scope of the invention to a person skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Where the terms "comprises," "having," "consisting of," and the like are used in this specification, other portions may be added as long as "only" is not used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

In the case of a description of a temporal relationship, for example, if the temporal relationship is described by 'after', 'after', 'after', 'before', etc., May not be continuous unless they are not used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

The terms "X-axis direction "," Y-axis direction ", and "Z-axis direction" should not be construed solely by the geometric relationship in which the relationship between them is vertical, It may mean having directionality.

It should be understood that the term "at least one" includes all possible combinations from one or more related items. For example, the meaning of "at least one of the first item, the second item and the third item" means not only the first item, the second item or the third item, but also the second item and the second item among the first item, May refer to any combination of items that may be presented from more than one.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

The organic light emitting display device is very vulnerable to moisture or oxygen, and when water or oxygen is permeated into the organic light emitting device, there arise problems such as bad spot of dark spot due to oxidation of the metal electrode or deterioration of the organic light emitting layer, . Therefore, in order to solve such a problem, a side sealing method in which an adhesive layer is adhered to a side surface of an organic light emitting element to bond the sealing layer, or a front sealing method in which an adhesive layer is bonded to the entire surface of an organic light emitting element to bond the sealing layer. Particularly, in recent years, a front sealing method capable of reducing the thickness of an organic light emitting display device and being applicable to a flexible organic light emitting display has been studied.

In the case of the front sealing method, the adhesive layer adhered to the sealing layer is located between the organic light emitting element and the sealing layer. The adhesive layer is positioned corresponding to the organic light emitting element to seal the organic light emitting element. At this time, heat is applied to the adhesive layer to seal the organic light emitting element. The heat-sensitive adhesive layer generates an adhesive force to seal the organic light emitting element.

The sealing layer can flow before applying heat to the adhesive layer. Therefore, the adhesive layer adhered to the sealing layer can also flow. The adhesive layer positioned corresponding to the organic light emitting device may not correspond to the organic light emitting device due to the flow. Therefore, the flow of the adhesive layer may cause a problem that the adhesive layer does not seal the organic light emitting element. Whereby external moisture and oxygen can permeate into the organic light emitting element.

Accordingly, the inventors of the present invention recognized such a problem and improved the problem of flowing the adhesive layer by considering the method of protecting the organic light emitting diode. Accordingly, the inventors of the present invention have invented a new structure of an organic light emitting display device and a method of manufacturing the same, which can prevent the defect of a dark spot in an organic light emitting display device and increase the lifetime.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view illustrating an organic light emitting display according to an embodiment of the present invention. FIG. 2 is a plan view illustrating an organic light emitting display according to an embodiment of the present invention.

The structure of the OLED display 100 will be described with reference to FIGS. 1 and 2

1, the OLED display 100 includes a substrate 101, an organic light emitting diode 103, a protective layer 105, adhesive layers 107 and 109, a sealing layer 111, and a non-skid structure 113 ).

The substrate (or TFT array substrate) 101 may have a display area DA and a bezel area ZA surrounding the display area DA.

The display area DA is an area where an image is displayed in the OLED display 100. [ Therefore, a transistor layer for driving the organic light emitting device 103 and the organic light emitting device 103 is disposed in the display area DA. Although only the organic light emitting element 103 is shown in FIG. 1 for convenience of explanation, the present invention is not limited thereto.

The bezel area ZA is an area where no image is displayed in the OLED display 100, and is a region in which a wiring or a circuit part is formed.

The substrate 101 may be made of a transparent glass material, and in the case of a flexible organic light emitting display device, the substrate 101 may be made of a flexible material such as metal or plastic.

The transistor (TFT) layer may be located on the substrate 101. The transistor layer may include various wirings, such as gate wirings, data wirings, and power supply wirings, and transistors connected to the wirings.

A transistor is formed in each of the pixel regions to enable each pixel to be driven individually. The transistor layer can be placed on the substrate 101 by a variety of methods known in the art.

The organic light emitting element 103 may be positioned on the display area DA of the substrate 101. [ The organic light emitting device 103 may include a first electrode, an organic light emitting layer, and a second electrode.

The first electrode may be located on the transistor layer. That is, the first electrode is located on the substrate 101 where the transistor layer is located, and is electrically connected to the transistor. The first electrode may have a high work function and may be formed of a transparent metal, for example, indium tin oxide (ITO) or indium zinc oxide (IZO). However, no.

The organic light emitting layer may be located on the first electrode. That is, the organic light emitting layer is located on the substrate 101 on which the first electrode is formed. The organic light emitting layer may be located between two electrodes. Therefore, light can be emitted using holes and electrons supplied from the two electrodes. The organic light emitting layer may have a structure of a single light emitting layer that emits one light or a plurality of light emitting layer structures that emit white light. However, the present invention is not limited thereto, and the organic light emitting layer may be formed to have various lamination structures depending on the design.

The second electrode may be located on the organic light emitting layer. The second electrode is formed of an opaque metal having a low work function, for example, aluminum (Al), silver (Ag), gold (Au), platinum (Pt), chromium (Cr) . Also, the second electrode may be formed of a metal having high light reflectivity.

Between the organic light emitting layer and the first electrode or between the organic light emitting layer and the second electrode, organic light emitting layers for increasing the light emitting efficiency may be additionally formed.

The protective layer (or insulating layer) 105 may be located on the substrate 101. At this time, the protective layer 105 may be located on the organic light emitting element 103. Therefore, the protective layer 105 may cover the organic light emitting element 103. At this time, the protective layer 105 may seal the organic light emitting element 103. Accordingly, the protective layer 105 can reduce penetration of moisture or oxygen from the outside into the organic light emitting element 103. Therefore, the protective layer 105 can minimize the problems such as the defect of the dark point and the lifetime of the OLED display 100 due to metal electrode oxidation or deterioration of the organic light emitting layer.

The protective layer 105 may be formed of, for example, aluminum (Al), a silicon oxide (SiOx), a silicon nitride (SiNx), a zirconium (Zr)

The adhesive layer (or adhesive film) 107, 109 may be located on the protective layer 105. At this time, the adhesive layers 107 and 109 may cover the protective layer 105. Thus, the adhesive layers 107 and 109 can seal the protective layer 105. Thus, the adhesive layers 107 and 109 can seal the organic light emitting element 103. That is, the adhesive layers 107 and 109 can additionally seal the organic light emitting element 103 sealed by the protective layer 105. [ The adhesive layers 107 and 109 may be positioned between the sealing layer 111 and the protective layer 105. Therefore, the adhesive layers 107 and 109 can bond the sealing layer 111 and the protective layer 105 to each other.

The adhesive layers 107 and 109 may include a first adhesive layer 107 and a second adhesive layer 109. [ The second adhesive layer 109 may be located on the first adhesive layer 107. That is, the first adhesive layer 107 may be positioned on the protective layer 105, and then the second adhesive layer 109 may be continuously positioned.

The first adhesive layer 107 and the second adhesive layer 109 may be formed of resin.

The adhesive layers 107 and 109 may be formed of a combination of, for example, an epoxy resin, a phenol resin, an acryl resin, a heat and a photocurable resin, and an organic binder. It is not limited. The resin may be formed of a non-curable resin. Therefore, the content of the moisture absorbent increases, and even if it is expanded by moisture, the stress due to the expansion can be alleviated.

The second adhesive layer 109 may include a moisture absorbent. At this time, the moisture absorbent can absorb external moisture or oxygen. Therefore, the second adhesive layer 109 including the moisture absorbent can absorb external moisture or oxygen. Therefore, the adhesive layers 107 and 109 can absorb external moisture or oxygen. That is, the adhesive layers 107 and 109 can reduce permeation of external moisture or oxygen into the organic light emitting element 103. Accordingly, it is possible to minimize the problems such as the defect of the dark point and the lifetime of the OLED display 100 due to oxidation of the metal electrode or deterioration of the organic light emitting layer.

At this time, for example, barium oxide (BaO), calcium carbonate (CaCO3), calcium oxide (CaO), phosphorus oxide (P2O5), zeolite, silicagel, alumina and the like can be used . The hygroscopic agent may be a substance having a hydrophilic functional group so as to absorb external moisture or oxygen. For example, it may have a hydrophilic functional group such as a carboxyl group, an amino group, a hydroxyl group, But it is not limited thereto.

The encapsulating layer (or encapsulating structure) 111 may be located on the protective layer 105. The sealing layer 111 can be bonded to the protective layer 105 by the adhesive layers 107 and 109. At this time, the sealing layer 111 may be disposed on the second adhesive layer 109 of the adhesive layers 107 and 109. At this time, the sealing layer 111 may be insulated glass, metal, or plastic.

At this time, the adhesive layers 107 and 109 may be positioned between the sealing layer 111 and the substrate 101. Therefore, the adhesive layers 107 and 109 can bond the sealing layer 111 and the substrate 101 to each other. The sealing layer 111 may be bonded to the substrate 101 on which the organic light emitting diode 103 and the protective layer 105 are formed through the adhesive layers 107 and 109 to form the organic light emitting diode display 100.

During the laminating process, the substrate 101 and the superstructure (e.g., the encapsulating layer 111, the upper substrate, etc.) may be undesired sliding or unwanted movement relative to each other, 113 may be located on the substrate 101. The anti-slip structure 113 may be located on the bubble region ZA of the substrate 101. [ At this time, the organic light emitting device 103 is positioned on the substrate 101, and the organic light emitting device 103 is covered with the protective layer 105. Therefore, the anti-slip structure 113 may be located at the periphery of the protective layer 105.

At this time, an encapsulating layer 111 is disposed on the substrate 101, and adhesive layers 107 and 109 may be disposed between the substrate 101 and the encapsulating layer 111. Thus, the anti-slip structure 113 on the substrate 101 may be covered by the adhesive layer 107, 109. In particular, the anti-slip structure 113 may be covered by a first adhesive layer 107 underlying the second adhesive layer 109.

In addition, the non-slip structure 113 may have a specific pattern. The specific pattern may be provided on one side of the anti-slip structure 113, which faces the sealing layer 111. Here, the specific pattern may be, for example, a concavo-convex structure that increases the frictional force of one surface of the anti-slip structure 113, but is not limited thereto. The specific pattern of the anti-slip structure 113 may be formed through an RF plasma process, a rubbing process, or a nano-imprinting process, but is not limited thereto. For example, the RF plasma treatment is to perform an O 2 / Ar plasma treatment on the surface of the anti-slip structure 113. At this time, the uneven structure of the surface of the non-slip structure 113 may be formed to increase the roughness. Therefore, the roughness of the surface of the non-slip structure 113 can be made to be 0.5 or more, for example, by a plasma treatment. The frictional force between the adhesive layers 107 and 109 and the anti-slip structure 113 can be increased.

The non-skid structure 113 may be formed of the same material as an overcoat (OC) layer or a bank that can form a part of the organic light emitting diode 103. At this time, the non-slip structure 113 may be formed together when forming the overcoat layer or the bank. Therefore, the anti-slip structure 113 can be realized in the form of a pattern in which a separate process mask is not required. For example, the material forming the anti-slip structure 113 may be one of material of PAC (Photo acryl) or PR (Photo resist) which is a material constituting the overcoat layer or the bank, but is not limited thereto.

Adhesive layers 107 and 109 may be provided on one surface of the sealing layer 111 facing a specific pattern of the anti-slip structure 113 at the periphery of the protective layer 105. The non-slip structure 113 may first contact the adhesive layer 107 or 109 rather than the protective layer 105 before the sealing layer 111 is fully bonded to the substrate 101. [ At this time, one surface of the non-slip structure 113 has a higher frictional force than one surface of the protective layer 105. Accordingly, the non-slip structure 113 supports the sealing layer 111, and the flow of the sealing layer 111 can be minimized. In other words, the non-slip structure 113 is between the substrate 101 and the sealing layer 111, and unnecessary movement of the substrate 101 and the sealing layer 111 to each other during the bonding process can be prevented.

The width of the non-slip structure 113 is larger than the width of the organic light emitting element 103 and the protective layer 105 on the substrate 101 so that the non-slip structure 113 first contacts the adhesive layers 107 and 109 more than the protective layer 105. [ It may be thicker than the sum of the widths. That is, the height of the non-slip structure 113 may be higher than the sum of the organic light emitting device 103 and the protective layer 105.

As shown in FIG. 2, the anti-slip structure 113 may be located on the substrate 101. The non-slip structure 113 may be located in the bubble region ZA of the substrate 101. [ At this time, the non-slip structure 113 may be located in a corner area of the substrate 101. [ That is, the non-slip structure 113 may be positioned corresponding to the corner area of the BJEL area ZA of the substrate 101. At this time, the anti-slip structure 113 may be located in at least two corner areas. The anti-slip structure 113 may also be disposed in all the corner areas ZA. As the anti-slip structure 113 disposed in the corner area increases, the anti-slip structure 113 contacting the adhesive layer provided on one side of the sealing layer 111 may increase. Therefore, friction between the non-slip structure 113 and the adhesive layers 107 and 109 can be increased. Accordingly, as the non-slip structure 113 increases, the flow of the sealing layer 111 can be further minimized. That is, the non-slip structure 113 is at least partly along the outer surface of the substrate 101 and contacts the adhesive layers 107 and 109 on one side of the sealing layer 111 to prevent unnecessary movement due to surface friction during the adhesion process .

At this time, the tackiness of the adhesive layers 107 and 109 may be lower than a certain level so as to minimize bubble defects. For example, if the adhesion of the adhesive layer 107, 109 contacting the non-slip structure 113 is high, bubbles may be generated from the adhesive layer 107, 109 when the substrate 101 and the sealing layer 111 are attached. Therefore, defects may occur in the organic light emitting display device due to bubbles generated. Accordingly, the adhesiveness of the adhesive layers 107 and 109 can be determined in such a manner that the substrate 101 and the sealing layer 111 can be adhered to each other, while bubbles are not generated.

Also, the upper surface area of the anti-slip structure 113 can be realized according to the roughness of the upper surface. The upper surface of the anti-slip structure 113 may be in contact with the adhesive layer 107,109. Therefore, the upper surface of the anti-slip structure 113 can rub against the adhesive layers 107 and 109. The greater the frictional force between the upper surface of the non-slip structure 113 and the adhesive layers 107 and 109, the further the flow of the sealing layer 111 can be minimized. At this time, as the roughness of the upper surface of the non-slip structure 113 increases, the area of the upper surface of the non-slip structure 113 can minimize the flow of the sealing layer 111 even with a small area. That is, the larger the roughness of the upper surface of the anti-slip structure 113, the smaller the area of the upper surface of the anti-slip structure 113 can be.

Accordingly, when the substrate 101 and the sealing layer 111 are attached to each other, the correspondence between the organic light emitting element 103 and the adhesive layers 107 and 109 can be maintained. Accordingly, the adhesive layers 107 and 109 seal the organic light emitting element 103, and external moisture and oxygen can be prevented from penetrating into the organic light emitting element 103.

3 is a plan view illustrating an OLED display according to another embodiment of the present invention.

The OLED display 200 shown in FIG. 3 is different from the OLED display 200 shown in FIGS. 1 and 2 only in that the structure of the non-slip structures 113 and 213 is changed, The description thereof is omitted.

As shown in FIG. 3, the anti-slip structures 113 and 213 may be located on the substrate 101. The anti-slip structures 113 and 213 may be located in the bubble region ZA of the substrate 101. At this time, the non-slip structure 113 may be located in a corner area of the substrate 101. [ That is, the non-slip structure 113 may be positioned corresponding to the corner area of the BJEL area ZA of the substrate 101.

The anti-slip structure 113 may be located in at least two corner areas. At this time, the anti-slip structure 213 may be disposed at an edge area between at least two corner areas and an edge area opposite to the one area. The anti-slip structure 113 may also be disposed in all corner areas. At this time, the anti-slip structure 213 may be disposed in all the edge areas between all the corner areas. That is, the anti-slip structures 113 and 213 may be located in a discontinuous pattern form in the bezel area ZA of the substrate 101. [ At this time, the non-slip structures 113 and 213 are discontinuously formed to prevent a problem of adhesion failure due to bubbles that may occur when the OLED display 200 is formed.

When the substrate 101 and the sealing layer are bonded together, the gas between the substrate and the sealing layer can be air bubbles. At this time, there may arise a problem of poor adhesion of the lap joints which are not bonded together by the bubbles. Therefore, when the non-slip structures 113 and 213 are formed in the form of discontinuous patterns, the gas can escape through the non-slip structures 113 and 213. Air passing may occur. In other words, the pattern shape of the anti-slip structures 113 and 213 must be formed in consideration of air passing. Therefore, the non-slip structures 113 and 213 considering air passing can minimize the bubbles when the substrate 101 and the sealing layer are attached to each other, thereby preventing defective adhesion between the substrate 101 and the sealing layer.

Also, the anti-slip structures 113 and 213 disposed in the area between the corner area and the corner area can be disposed discontinuously at even intervals between the anti-slip structures 113 and 213. At this time, as the non-slip structures 113 and 213 increase, friction between the non-slip structures 113 and 213 and the adhesive layer may increase. In addition, since the non-slip structures 113 and 213 are disposed at regular intervals, the non-slip structures 113 and 213 can further minimize the flow of the sealing layer when the sealing layer flows. In other words, the non-slip structures 113 and 213 are at least partly along the outer surface of the substrate 101, and contact with the adhesive layer on one side of the sealing layer can prevent unnecessary movement due to surface friction during the laminating process.

Therefore, when bonding the substrate 101 and the sealing layer, the correspondence between the organic light emitting element and the adhesive layer can be maintained. Accordingly, the adhesive layer seals the organic light emitting element, thereby preventing external moisture and oxygen from penetrating into the organic light emitting element.

4 is a cross-sectional view illustrating an OLED display according to another embodiment of the present invention.

The OLED display 300 shown in FIG. 4 is different from the OLED display 100 shown in FIGS. 1 and 2 only in that the structure of the anti-slip structure 113 is changed, The description thereof is omitted.

The anti-skid structure 113 may include an auxiliary layer 313. The anti-skid structure 113 located on the substrate 101 may include an auxiliary layer 313 under the anti-skid structure 113. That is, the anti-slip structure 113 may have at least two layers.

The auxiliary layer 313 may be located on the substrate 101. A non-slip structure 113 may be positioned on the auxiliary layer 313. At this time, the auxiliary layer 313 may be located on the bezel region of the substrate 101. That is, the auxiliary layer 313 may be formed in a region where the anti-slip structure 113 is to be formed. The auxiliary layer 313 may be formed together with a part of the organic light emitting device 103 when forming the organic light emitting device 103. For example, the portion may be, but is not limited to, an obovate layer or bank. Therefore, when forming the auxiliary layer 313, it is possible to realize a pattern in which a separate process mask is not required.

At this time, the width of the auxiliary layer 313 and the width of the anti-slip structure 113 may be the same. The width of the non-skid structure 113 having the auxiliary layer 313 may be larger than the sum of the widths of the organic light emitting element 103 and the protective layer 105 on the substrate 101. [ That is, the height of the non-slip structure 113 having the auxiliary layer 313 may be higher than the sum of the organic light emitting device 103 and the protective layer 105.

5A to 5D are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention. In particular, a cross-sectional view of each step of the method of manufacturing the OLED display 100 according to the present invention is shown.

As shown in FIG. 5A, the organic light emitting element 103 may be formed on the substrate 101.

The substrate (or TFT array substrate) 101 may have a display area and a bezel area surrounding it.

The display area is an area where an image is displayed in the organic light emitting display device. Therefore, a transistor layer for driving the organic light emitting device 103 and the organic light emitting device 103 may be formed in the display region. Although only the organic light emitting element 103 is shown in FIG. 1 for convenience of explanation, the present invention is not limited thereto.

The bezel region is an area where no image is displayed in the organic light emitting display device, and is a region in which a wiring or a circuit portion is formed.

The organic light emitting element 103 may be formed on the display region of the substrate 101. [ Here, the organic light emitting diode 103 may include a first electrode, an organic light emitting layer, and a second electrode.

As shown in FIG. 5B, the protective layer 105 and the anti-slip structure 113 can be formed.

The protective layer 105 may be formed on the substrate 101. At this time, the protective layer 105 may be formed on the organic light emitting device 103. Therefore, the protective layer 105 may be formed so as to cover the organic light emitting element 103. At this time, the protective layer 105 may seal the organic light emitting element 103. Accordingly, the protective layer 105 can reduce penetration of moisture or oxygen from the outside into the organic light emitting element 103. Therefore, the protective layer 105 can minimize the problems such as the defect of the dark point and the lifetime of the OLED display 100 due to metal electrode oxidation or deterioration of the organic light emitting layer.

During the laminating process, the substrate 101 and the superstructure (e.g., the protective layer 105, the top substrate, etc.) may be undesired sliding or unwanted movement relative to each other, And may be formed on the substrate 101. [ The anti-slip structure 113 may be formed in the bubble region of the substrate 101. At this time, the organic light emitting device 103 is positioned on the substrate 101, and the organic light emitting device 103 is covered with the protective layer 105. Therefore, the anti-slip structure 113 may be formed at the periphery of the protective layer 105. [

In addition, the anti-slip structure 113 may include a surface treatment step having a specific pattern. The specific pattern may be formed on one side of the anti-slip structure 113 facing the sealing layer 111. Here, the specific pattern may be, for example, a concavo-convex structure that increases the frictional force of one surface of the anti-slip structure 113, but is not limited thereto. That is, the non-slip structure 113 may include a step of surface-treating the non-slip structure 113 so as to have a concavo-convex structure on one surface thereof.

The specific pattern of the anti-slip structure 113 may be formed through an RF plasma process, a rubbing process, or a nano-imprinting process, but is not limited thereto. For example, the RF plasma treatment is to perform an O 2 / Ar plasma treatment on the surface of the anti-slip structure 113. At this time, the uneven structure of the surface of the non-slip structure 113 may be formed or the roughness may be increased by other surface treatment. Therefore, the roughness of the surface of the non-slip structure 113 can be made to be 0.5 or more, for example, by a plasma treatment. The frictional force between the adhesive layer and the anti-slip structure 113 can be increased.

The non-skid structure 113 may be formed of the same material as an overcoat (OC) layer or a bank that can form a part of the organic light emitting device 103. At this time, the non-slip structure 113 may be formed together when forming the overcoat layer or the bank. Therefore, the anti-slip structure 113 can be formed in a pattern shape requiring no separate process mask. For example, the material forming the anti-slip structure 113 may be formed of one of PAC (Photo acryl) or PR (Photo resist), which is a material constituting the overcoat layer or bank, but is not limited thereto.

The sealing layer 111 can be placed on the substrate 101, as shown in Fig. 5C. At this time, the adhesive layer bonded to one surface of the sealing layer 111 may be in contact with the anti-slip structure 113. At this time, one surface of the non-slip structure 113 may have a higher frictional force than one surface of the protective layer 105. Accordingly, the non-slip structure 113 supports the sealing layer 111 and minimizes the flow of the sealing layer 111. In other words, the contact of the non-slip structure 113 makes it possible to prevent the flow of the sealant layer 111 from occurring when the substrate 101 without the anti-slip structure 113 is used before the sealant layer 111 and the substrate 101 are bonded together. Can be minimized. In other words, the non-slip structure 113 is between the substrate 101 and the sealing layer 111, and unnecessary movement of the substrate 101 and the sealing layer 111 to each other during the bonding process can be prevented.

The width of the non-slip structure 113 is set so that the width of the organic light emitting element 103 on the substrate 101 and the width of the protective layer 105 are equal to each other It can be thicker than. That is, the height of the non-slip structure 113 may be higher than the sum of the organic light emitting device 103 and the protective layer 105. Therefore, there may be a cavity between the adhesive layer and the protective layer 105 covering the organic light emitting device 103.

As shown in FIG. 5D, the substrate 101 and the sealing layer 111 can be attached together.

The adhesive layer may be located between the sealing layer 111 and the substrate 101. At this time, the adhesive layer can bond the sealing layer 111 and the substrate 101 to each other. When the sealing layer 111 and the substrate 101 are bonded to each other, heat can be applied to the adhesive layer. The adhesive layer can increase the adhesive force by the applied heat. Accordingly, the adhesive layer can bond the substrate 101 and the sealing layer 111 to each other. The adhesive layer may cover the organic light emitting element 103. At this time, the adhesive layer may also cover the anti-slip structure 113. That is, when the sealing layer 111 and the substrate 101 are attached to each other, the adhesive layer may cover the organic light emitting diode 103 and the non-slip structure 113. In particular, the first adhesive layer 107 underlying the second adhesive layer 109 may cover the anti-slip structure 113.

Accordingly, the sealing layer 111 may be bonded to the organic light emitting diode 103 and the substrate 101 through the adhesive layer to form the OLED display 100.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100, 200, 300: organic light emitting display
101: substrate
103: Organic light emitting device
105: protective layer
107: first adhesive layer
109: Second adhesive layer
111: sealing layer
113,213: Non-slip structure
313: auxiliary layer

Claims (20)

A substrate having a display region and a bubble region surrounding the display region;
A protective layer covering an organic light emitting element in a display region of the substrate;
An encapsulation layer on the protective layer;
A slip prevention structure in a bezel region of the substrate, the slip prevention structure being at a periphery of the protective layer; And
And an adhesive layer between the substrate and the sealing layer, the sealing layer covering the protection layer and the non-slip structure and bonding the substrate and the sealing layer to each other. The method according to claim 1,
The non-slip structure has a specific pattern on a surface facing the encapsulation layer so that the encapsulation layer contacts the adhesive layer more than the protective layer before the encapsulation layer is fully adhered to the substrate to support the encapsulation layer to minimize flow And the organic light emitting display device. 3. The method of claim 2,
Wherein the specific pattern is a concavo-convex structure that increases the frictional force of the one surface. 3. The method of claim 2,
Wherein the width of the non-slip structure is thicker than the sum of the width of the organic light emitting element and the width of the protective layer. 5. The method of claim 4,
Wherein the non-skid structure is composed of at least two layers including an auxiliary layer at the bottom. 3. The method of claim 2,
Wherein the non-slip structure is in at least two corner areas of the substrate. The method according to claim 6,
Wherein the non-skid structure is disposed in all corner areas of the substrate. The method according to claim 6,
Wherein the non-skid structure is disposed in an edge area between the at least two corner areas of the substrate and the other area opposite to the one area. 3. The method of claim 2,
The non-skid structure may be formed of any one of PAC (Photo acryl) and PR (Photo Resist) Forming an organic light emitting element on the display area of the TFT array substrate having a display area and a bezel area surrounding the display area;
Forming an insulating layer covering the organic light emitting device and a non-slip member on a bezel region of the TFT array substrate;
Positioning the encapsulation substrate such that the adhesive film is in contact with the adhesive film on one side of the encapsulation substrate and the cavity is between the adhesive film and the insulation layer; And
And bonding the TFT array substrate and the sealing substrate together. 11. The method of claim 10,
Wherein the step of positioning the sealing substrate minimizes the flow of the sealing substrate when using the TFT array substrate without the non-slip member before the sealing substrate and the TFT array substrate are bonded together, Way. 12. The method of claim 11,
Wherein the step of attaching further comprises the step of applying heat to the adhesive film,
Wherein the step of applying the heat is a step of bonding the TFT array substrate and the sealing substrate with the adhesive film. 11. The method of claim 10,
Wherein the step of forming the non-slip member includes a step of surface-treating the non-slip member corresponding to the sealing substrate so as to have a concavo-convex structure. A first substrate including an organic light emitting display device structure;
A second substrate including an encapsulation structure for encapsulating the organic light emitting diode structure; And
And a slip prevention structure disposed between the first substrate and the second substrate and preventing unnecessary movement of the first substrate and the second substrate relative to each other during a bonding process. 15. The method of claim 14,
Wherein the non-skid structure is at least partially along the outer surface of the first substrate and is in contact with the front adhesive layer of the sealing structure to prevent unnecessary movement due to surface friction during the adhesion process. 16. The method of claim 15,
Wherein the front adhesive layer has a tackiness of a certain level or less so as to minimize bubble defects due to adhesion between the first substrate and the second substrate. 17. The method of claim 16,
Wherein the upper surface area of the non-slip structure is implemented according to the tackiness of the front adhesive layer. 18. The method of claim 17,
Wherein the height of the non-slip structure is higher than the height of the organic light emitting diode structure. 19. The method of claim 18,
Wherein the non-slip structure is formed of the same organic material as the overcoat (OC) layer or the bank of the organic light emitting diode structure, and is implemented in a pattern form requiring no separate process mask. 20. The method of claim 19,
The pattern shape is discontinuous in consideration of air passing.

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