KR102156765B1 - Organic Emitting Display Device and Method for Manufacturing the Same - Google Patents

Abstract

The present invention is a thin film and can be implemented in a flexible form, and an organic light emitting display device in which a crack defect is eliminated during bending by filling an empty space between a touch pad part and an active area through structural improvement, and its Regarding the manufacturing method, the organic light emitting display device of the present invention has an active region and a dead region, respectively, and is opposed to each other, and has an OLED array and a touch array on active regions of a first substrate and a second substrate. A touch pad having a plurality of touch pad electrodes spaced apart from the active region, at both edges of one side of the second substrate, the adhesive layer bonding the first substrate to the active region of the second substrate. And a dummy pad unit having a plurality of dummy pad electrodes on the first substrate so as to correspond to each of the touch pad electrodes of the touch pad unit; and a conductivity connecting the touch pad electrode and the dummy pad electrode facing each other Curable resins including balls; And a filling seal filling a spaced region between the touch pad portion between the first substrate and the second substrate and the curable resin.

Description

Organic light emitting display device and method for manufacturing the same {Organic Emitting Display Device and Method for Manufacturing the Same}

The present invention relates to an organic light-emitting display device, and in particular, a thin film is possible and can be implemented in a flexible form, and due to structural improvement, a crack defect during bending by filling an empty space between a touch pad part and an active area The present invention relates to an organic light emitting display device and a method of manufacturing the same.

Specific examples of flat panel display devices include a liquid crystal display device (LCD), an organic light emitting display device, a plasma display panel device (PDP), and a quantum dot display device. ), Field Emission Display device (FED), Electrophoretic Display Device (EPD), and the like, which have a flat panel display that embodies a common image as an essential component. A flat panel display panel has a configuration in which a pair of transparent insulating substrates are bonded to each other with a unique light emitting or polarized light or other optical material layer therebetween.

Recently, as display devices have become larger, there is an increasing demand for a flat display device that occupies less space. As one of such flat display devices, a technology for an organic light emitting display device is rapidly developing.

The organic light-emitting display device does not require a separate light source, and includes a self-luminous organic light-emitting diode inside the pixel unit, and has the advantage of omitting a light source and a structure for assembling it with the display panel. Due to its great advantage, it is being considered as a next-generation display device.

The organic light emitting diode is a device that emits light while electrons and holes form a pair and then disappear when electric charges are injected into an organic film formed between an electron injection electrode (cathode) and a hole injection electrode (anode).

Meanwhile, there is an increasing demand for adding a touch screen capable of recognizing a touch portion through a human hand or a separate input means and transmitting additional information in response to the organic light emitting display device. Currently, such a touch screen is applied in the form of attaching it to an outer surface of a display device.

And, according to the touch sensing method, it is divided into a resistive method, a capacitive method, an infrared sensing method, and the like, and in consideration of the convenience of a manufacturing method and a sensing power, a capacitive method has recently attracted attention in a small model.

Hereinafter, a conventional organic light emitting display device with a touch screen will be described with reference to the drawings.

1 is a cross-sectional view illustrating a conventional organic light emitting display device attached to a touch screen.

As shown in FIG. 1, a conventional organic light emitting display device with a touch screen is stacked sequentially from the bottom into an organic light emitting display panel 1, a touch screen 2, and a cover window 3, and the first , The second adhesive layers 15 and 25 are provided.

Here, the organic light emitting display panel 1 includes a substrate, a thin film transistor array having an arrangement on a matrix on the substrate, and an organic light emitting diode connected to each of the thin film transistors of the thin film transistor array, and covers the top of the organic light emitting diode. A protective film and a polarizing layer are provided. In this case, the first adhesive layer 15 corresponds to the polarizing layer of the organic light emitting display panel 1. Then, a second adhesive layer 25 is formed between the touch screen 2 and the cover window 3 to bond them.

The conventional organic light emitting display device with a touch screen as described above has the following problems. First, when the organic light-emitting display panel and the touch screen are formed independently of each other and then the touch screen is attached to the organic light-emitting display panel, glass for each of the organic light-emitting display panel and the touch screen is required, and the hardness is high and thickness It is thick, making it impossible to achieve a thin film and a flexible shape.

Second, when the touch screen is implemented in an in-cell type so that the pad portion of the touch screen faces the inner side, that is, to the pad portion of the organic light emitting display panel, bonding with a curable resin including conductive balls Carry out the process. In addition, an active region is bonded between the touch screen and the organic light emitting display panel by an adhesive layer. In this case, a space is generated between the touch pad unit and the active region. The space between the touch pad unit and the active area thus generated can be a moisture permeation path in the completed touch screen-attached organic light emitting display device, and is also vulnerable to cracking when the device is flexibly implemented. It can be a branch.

The present invention is conceived to solve the above problems, and can be implemented in a thin film and flexible form, and due to structural improvement, it fills the empty space between the touch pad part and the active area to crack when bending. ) To provide an organic light emitting display device and a method of manufacturing the same, which eliminates defects, has an object thereof.

In order to achieve the above object, the organic light emitting display device of the present invention has an active region and a dead region, and is opposed to each other, and has an OLED array and a touch array on the active regions of the first substrate and the second substrate. A display device comprising: an adhesive layer bonding the active regions of the first substrate and the second substrate; and a plurality of touch pad electrodes spaced apart from the active region at both edges of one side of the second substrate. A touch pad unit; and a dummy pad unit having a plurality of dummy pad electrodes on the first substrate so as to correspond to respective touch pad electrodes of the touch pad unit; and a touch pad electrode and a dummy pad electrode facing each other are connected Curable resin including a conductive ball; And a filling seal filling a spaced area between the touch pad unit and the curable resin between the first substrate and the second substrate.

The filling seal may be an insulating heat-curable and UV-curable resin. The viscosity of the filling seal may be 50 cps or more and 500 cps or less. Further, in this case, the moisture permeability of the filling seal is preferably 5.0 g/m ² · ²⁴ hrs or less.

Meanwhile, the first substrate has a side exposed from the second substrate, and a pad electrode connected to the OLED array, a drive IC connected thereto, and a connection with an external system are connected to the exposed side of the first substrate. It can have an FPCB (Flexible Printed Circuit Board) for.

In addition, it is preferable that the dummy pad part, the pad electrode connected to the OLED array, the drive IC, and the FPCB are located on the same side of the first substrate.

In addition, the drive IC and the FPCB on the first substrate may be covered with the filling seal.

In addition, it is preferable that the filling seal filling the spaced region between the touch pad portion between the first substrate and the second substrate and the curable resin is UV-cured and thermally cured.

Alternatively, it may further include a cover seal covering the upper portions of the drive IC and the FPCB on the first substrate. In this case, the cover seal may be a UV curable seal.

In addition, it is preferable that the first and second substrates are made of a flexible substrate.

In addition, it is preferable that the filling seal is in contact with the adhesive layer and the curable resin between the first substrate and the second substrate.

In order to achieve the same object, the method of manufacturing an organic light emitting display device of the present invention comprises forming a first plastic substrate and a first buffer layer on a first glass substrate, an OLED array in the active region of the first buffer layer, and Forming a dummy pad part including a pad electrode for OLED and a plurality of dummy pad electrodes connected to the OLED array on the side; and, forming a second plastic substrate and a second buffer layer on the second glass substrate, and the Forming a touch array in the active area of the second buffer layer, and forming a touch pad portion including a touch pad electrode at both edges of one side; And, an adhesive layer on the OLED array or the touch array, and the dummy pad portion or touch pad Applying a curable resin including a conductive ball to the portion; And, the OLED array and the touch array face each other, the dummy pad portion and the touch pad portion face each other, the first such that the OLED pad electrode of the first buffer layer is exposed. , Bonding a second glass substrate; and, connecting a drive IC to an OLED pad electrode of the first buffer layer, and forming an FPCB on an exposed side of the first buffer layer; And, the bonded agent 1, injecting a filling seal adjacent to the touch pad part of the side surface of the second buffer layer to fill a spaced area between the touch pad part and the curable resin; And UV curing and thermal curing the filling seal.

In the step of injecting the filling seal, it may be further applied to cover the driver IC and the FPCB on the first buffer layer in addition to the spaced area between the touch pad part and the curable resin.

And, immediately after the step of connecting the drive IC and forming the FPCB on the first buffer layer, forming a cover seal covering the drive IC and the FPCB may be further included. In this case, it may further include UV curing the cover seal.

Meanwhile, immediately after bonding the first and second glass substrates, the step of removing the second glass substrate may be further included.

In addition, after the step of injecting the filling seal, the step of removing the first glass substrate may be further included.

In addition, when a plurality of active regions are defined on the first glass substrate and the second glass substrate, the step of cutting each unit active region after bonding of the first and second glass substrates may be further included.

The filling seal is preferably in contact with the curable resin and the adhesive layer between the first and second buffer layers after UV curing and thermal curing.

The organic light emitting display device and a method of manufacturing the same according to the present invention have the following effects.

The first substrate on which the OLED array is formed and the second substrate on which the touch array is formed are bonded together by an adhesive layer, and the dummy pads and the touch pads on the periphery are connected, and then between the first and second substrates by a capillary phenomenon. By lateral injection injection into the space of, it is possible for the filling seal to fill the spaced space between the touch pad part and the adhesive layer.

Therefore, through this, the occurrence of the empty space between the adhesive layer and the touch pad is filled with a filling seal to prevent the empty space, and through this, the weak part during bending is eliminated to thin the organic light-emitting display device to form a flexible device. Reliability can be improved.

1 is a cross-sectional view showing a conventional organic light emitting display device attached to a touch screen
2 is a plan view showing an organic light emitting display device according to a first exemplary embodiment of the present invention
Figure 3 is a cross-sectional view of the structure along the line II' of Figure 2
4 is an enlarged view of part A of FIG. 2
Figure 5 is a cross-sectional view of the structure on the line II to II' of Figure 4
6 is a flow chart illustrating a method of manufacturing an organic light emitting diode display according to the first exemplary embodiment of the present invention.
7 is a flow chart showing a method of manufacturing an organic light emitting diode display according to a second exemplary embodiment of the present invention
8 is a plan view showing an organic light emitting diode display according to a second exemplary embodiment of the present invention
9 is a cross-sectional view of the structure on the line Ⅲ to Ⅲ'of FIG. 8
10 is a photograph of a touch pad when the organic light emitting display device of the present invention is applied

In recent years, the demand for a panel having the flexibility to be as thin as possible and more flexible (flexibility) is gradually increasing, in particular, in-cell (in-cell) touch type display device is illuminated as a future technology in the future. Currently, we are evaluating whether the product can be applied through mass production beyond the technical possibility. Therefore, the most important issues are increasing reliability and reducing defects, and for this, a technology that can compensate for weaknesses is required.

On the other hand, in the structure of the in-cell touch type organic light emitting display device, an irregular empty space is generated between the active area and the touch pad part by design as a process proceeds. Although it is a space for a touch operation, such an irregular empty space becomes a path for moisture penetration, causing a problem of reliability, and is a part with a very high probability of occurrence of a crack as the most vulnerable part during bending. Therefore, it is necessary to develop a material and process capable of filling this space and supplementing and reinforcing it, and the present invention discloses a bar in which a filling seal structure that fills the empty space is applied.

Hereinafter, an organic light emitting display device and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a plan view illustrating an organic light emitting diode display according to a first exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view illustrating a structure along a line II' of FIG. 2. And, FIG. 4 is an enlarged view of part A of FIG. 2. In addition, FIG. 5 is a cross-sectional view of the structure along the line II-II' of FIG. 4.

2 to 5, the organic light emitting diode display according to the first exemplary embodiment of the present invention has an active area A/A and a dead area around the active area A/A and face each other, and the first substrate 1000 and the first substrate 1000 are opposite to each other. 2 The substrate 3000 is bonded together.

Specifically, an OLED (Organic Light Emitting Diode) array 150 is formed on the active area A/A of the first substrate 1000, and on the active area A/A of the second substrate 3000 The touch array 230 is formed. Between the first substrate 1000 and the second substrate 3000, the OLED array 150 and the touch array 230, respectively, are in contact with each other by an adhesive layer 400, and the amount of one side of the second substrate 3000 is In the seat, a touch pad unit 2350 spaced apart from the active area A/A and having a plurality of touch pad electrodes 2351b, and the touch pad unit 2350 on the first substrate 1000 Conductivity connecting the dummy pad unit 1400 having a plurality of dummy pad electrodes 1401 to correspond to each of the touch pad electrodes 2351b of, and the touch pad electrode 2351b and the dummy pad electrode 1401 facing each other Curable resin 450 including balls 455 and filling seal 4500 filling a spaced area between the touch pad unit 2350 and curable resin 450 between the first substrate 1000 and the second substrate 3000 It is made including.

Here, in the process of bonding the first and second substrates 1000 and 3000 by mixing the conductive balls 455 inside the curable resin 450, when the adhesive layer 400 of the active region bonds both substrates, the touch The pad unit 2350 connects the touch pad electrode 2351b and the dummy pad electrode 1401. In the bonding process, the curable resin 450 may slightly overflow to the outside of the touch pad part 2350, but since it has a conductive ball 455 inside, it is applied with a space apart from the active area having an array including electrodes. Should be.

However, after the bonding is completed, an empty space may be generated in the spaced area between the curable resin including the conductive ball and the active area, thereby causing a step difference in the area with the adjacent adhesive layer. ) Is formed to fill this spaced area. Here, the filling seal 4500 is filled by a method such as side scanning injection in a module process after bonding of the first and second substrates 1000 and 3000, and at least the space between the touch pad unit 2350 and the adjacent active area is filled. To form. Here, the reason for filling the filling seal 4500 adjacent to the pad portion is that there is a spatially empty portion between the adhesive layer 400 and the touch pad portion 2350, and this portion has a large difference between the surrounding area and the step. This is because it is vulnerable to pressure such as bending on.

In addition, the first substrate 1000 is formed by being exposed to one side of the second substrate 3000 relatively, and the drive IC 500 for driving the OLED array in the exposed portion and the FPCB for connection with an external system ( Flexible Printed Circuit Board) 700 is formed. The drive IC 500 is formed on the first substrate 1000 by being connected to the pad electrode of the OLED array, and the FPCB 700 is formed at the end of the first substrate 1000 outside the drive IC 500. .

Meanwhile, when the OLED array 150 of the first substrate 1000 and the touch array 230 of the second substrate 3000 are bonded by using the adhesive layer 400, the upper portion of the OLED array 150 is provided with a protective layer 160 ), it is possible to prevent damage from being scratched by the electrodes of the touch array 230 or during the bonding process. In some cases, the protective layer 160 may be replaced with a protective layer of the uppermost layer of the OLED array 150.

In addition, the dummy electrode 1401 may be formed in the same process as the OLED pad electrode (not shown) connected to one end of the OLED array 150, and the touch pad electrode 2351b is the same process as the touch array 230. Can be formed from

In addition, a polarizing plate 2000 under the cover glass 3000 serves to prevent the incident reflected light from being emitted so as to prevent external light from being incident and reflected to the organic light emitting display device to be visually recognized by the viewer.

Here, these arrays (OLED array and touch array) are not formed directly on the first substrate 1000 or the second substrate 3000, respectively, but a first glass substrate (not shown) and a second glass material. After preparing a glass substrate (not shown), it is formed on these glass substrates, and then bonded by an adhesive layer between the organic light emitting array 150 and the touch electrode array 230 (that is, in a state in which the first and second substrates are held). After the bonding process is performed), the first and second glass substrates are removed by a method such as laser irradiation or etching for thinning and flexible formation. In this case, in the drawing, a first substrate and a film substrate as a second substrate are applied to the exposed portion after the glass is removed for protection. Here, the second substrate on the side where the upper side is directly touched may be attached in the form of a cover glass.

Here, on the first substrate 1000, a film adhesive layer 110, a first plastic substrate 120, a first buffer layer 130, a thin film transistor array 140, and an organic light emitting array 150 are sequentially formed, and the The protective layer 160 is formed to cover the organic light emitting array 150. A second plastic substrate 210, a second buffer layer 220, and a touch array 230 are disposed on the second substrate 3000. Here, the touch array 230 is positioned to face the organic light emitting array 150. In this case, a surface directly in contact with the adhesive layer 400 is a protective layer 160 at a lower portion, and a touch electrode array 230 at an upper portion.

The first buffer layer 130 and the second buffer layer 220 each have an active region and a dead region defined, and the inside of the thin film transistor array 140 excluding the touch electrode array 230, the organic light emitting array 150, and the pad part. Thin film transistors are formed in the active region. In addition, a touch pad portion 2350 and a pad portion of the thin film transistor array are defined in some of the dead regions.

Here, the first plastic substrate 120 and the second plastic substrate 210 are layers provided to prevent damage to the inner array formed on the inner side in addition to the material of the first and second glass substrates in the laser irradiation or etching process. . In some cases, when the first and second glass substrates are removed, it may be omitted if the first and second buffer layers 130 and 220 located below are maintained at a level without damage.

In addition, the first buffer layer 130 and the second buffer layer 220 are formed by sequentially stacking inorganic films such as an oxide film (SiO2) or a nitride film (SiNx) of the same type or alternately stacking different inorganic films. The first and second buffer layers 130 and 220 function as a barrier to prevent moisture or outside air from permeating to the organic light emitting array 150 in a subsequent process of bonding the second substrate on the first substrate. Let's do it.

In addition, a touch pad part 2350 is formed on the same surface of the second buffer layer 220 together with the touch electrode array 230.

Each touch pad electrode 2351b inside the touch pad unit 2350 is formed by a curable resin 450 including a conductive ball 455 in a process of bonding up and down by the adhesive layer 400. It is connected to the dummy pad electrode 1401 of. In this case, the dummy pad unit 1400 is formed together with the OLED array 150 to which the drive IC 500 is connected or the pad electrode (not shown) of the thin film transistor array 140.

On the other hand, the adhesive layer 400 has a moisture permeation prevention function, and directly faces and contacts the protective layer 160 covering the organic light emitting array 150, and in addition to the function of the protective layer 160, the organic light emitting array 150 ) To prevent the entry of outside air and more reliably prevent moisture permeation.

In addition, the filling seal 4500 is formed by filling the spaced space between the touch pad unit 2350 and the adhesive layer after bonding of the arrays using the adhesive layer 400, and scanning the side between the bonded first and second substrates After that, after holding for a certain period of time so that the scanned seal component is filled in the spaced space, UV irradiation is performed to temporarily cure it, and then the filling seal 4500 sufficiently flows between the first and second substrates 1000 and 3000 and the adhesive layer ( When the 400 and the filling seal 4500 meet, the filling seal 4500 is completely fixed by heat curing.

Here, the filling seal 4500 sufficiently fills the spaced space between the touch pad unit 2350 and the adhesive layer 400, and in order to complete the actual bonding process, as shown in FIGS. 2 and 3, the second substrate 3000 ) Partially protrudes to the side of the outer side. In addition, since the pad portion of the remaining first substrate 1000 includes a cover seal 800, it is possible to protect the drive IC 500 and the FPBC 700 formed in the pad portion, and the metal wiring connected to the pad electrode.

The filling seal 4500 is an insulating heat-curable and UV-curable resin since it must undergo UV curing and thermal curing processes as described above. Further, the viscosity of the filling seal 4500 is preferably 50 cps or more and 500 cps or less. When the viscosity is too high, it is filled in the spaced space, but since it takes a long time, it is desirable to have a viscosity that can sufficiently fill the spaced space for a limited time.

In this case, it is preferable that the water vapor permeability tester ratio (WVTR) of the filling seal 4500 is 5.0 g/m ² · ²⁴ hrs or less. This means that after the filling seal 4500 is filled in the spaced space, moisture coming from the outside will come into contact with the filling seal 4500 first before moisture enters the adhesive layer 400. The less moisture permeation amount, the more reliable the device Because it can be high.

Here, the first substrate 1000 including the pad part is formed to protrude from one side of the second substrate 3000, which is a signal for driving the touch array, the thin film transistor array, and the organic light emitting array together at the protruding part. It is to provide the drive IC 500 and the FPCB 700 for transmitting. Although not shown, the drive IC 500, the thin film transistor array driving pad, and the dummy pads are connected to the drive IC 500 by a wiring (not shown) formed on the first buffer layer 130. In addition, the drive IC 500 may be bonded to and connected with a flexible printed circuit board (FPCB) 700, and may be controlled by a controller (not shown) provided in the FPCB. The dummy pad part may be formed on the same layer as a metal forming a gate line or a data line in a region corresponding to the touch pad part among dead regions outside the active region. In addition, as described above, the first glass substrate is removed in the process, and the thin film transistor including the dummy pad portion and the pad portion of the organic light emitting array remain in the first buffer layer 130 or the layer in the thin film transistor array 140. . For convenience, in the plan view, such pad portions are arranged on the finally remaining first substrate 1000 to be described, but substantially, the first plastic substrate 120, the first buffer layer 130, and the upper side of the first substrate 1000 are described. Alternatively, it is further formed as a layer of the thin film transistor array 140.

In addition, the dummy pad part, the pad electrode connected to the OLED array, the drive IC, and the FPCB are preferably located on the same side of the first substrate 1000.

In addition, after the bonding process of the drive IC 500 and the FPCB 700 on the first substrate 1000 is completed on the first substrate 1000, a cover seal 800 may be further formed thereon. Here, the cover seal 800 is a type of UV curing seal, which becomes an exposed area on the first substrate 1000 and is covered and applied immediately after bonding to protect the drive IC 500 and FPBC 700 from the outside. I can.

The touch pad unit 2350 is formed on the second buffer layer 220 because the second glass substrate is removed during the process, and the first buffer layer 130 is relatively larger than the second buffer layer 220. It is formed by dividing the protruding part and both outer edges of the adjacent side. In addition, in the divided touch pad units 2350, one of the outer sides is divided into a plurality of pad electrodes for voltage application or detection of the first electrodes in the X-axis direction among the touch electrode arrays, and the other one It is formed by being divided into a plurality of pad electrodes for applying or detecting voltages of the second electrodes in the Y-axis direction.

The conductive ball 455 connected to the touch pad unit 2350 is electrically connected to the dummy pad electrode 1401 formed on the outer side of the thin film transistor array 140.

Here, in the actual process, the adhesive layer 160 and the seal 450 are formed by dividing regions from each other. In the drawing, the adhesive layer 160 has a shape that extends outside the active area in FIG. 2 with a certain width. This is because pressure is partially applied in the bonding process of the first and second substrates 1000 and 3000 after application, rather than the application area defined as above. It shows a state in which the adhesive layer 160 is spread out outside the active area A/A. In addition, the curable resin including the conductive ball 455 is formed by being spaced apart from the adhesive layer 400 by a certain distance, which is to prevent the point that the conductive ball 455 invades into the active area (A/A) and causes a short circuit. to be.

Here, after forming the filling seal 4500, between the first substrate 1000 and the second substrate 3000, the filling seal 4500 is the adhesive layer 400 and the curable resin 450 It is desirable to remove the space between the touch pad part (dummy pad part) and the adhesive layer 400 as much as possible by contacting with. Through this, the step difference between regions caused by the spaced space is eliminated, and when applied as a flexible display, the probability of occurrence of cracks when an external force such as bending is applied is significantly lowered, thereby improving reliability of the device.

Meanwhile, as shown in FIG. 2, the organic light emitting display device of the present invention includes a first substrate 1000, a first plastic substrate 120 and a first buffer layer 130 sequentially formed on the first substrate 1000, Pixels are defined on the first buffer layer 130 in a matrix form, except for a thin film transistor array 140 having a thin film transistor for each pixel, an OLED array 150 connected to the thin film transistors of each pixel, and a pad portion. A protective layer 160 covering the thin film transistor array 140 and the OLED array 150, and a touch array 230 bonded between the protective layer 160 through an adhesive layer 400, and the touch The array 230 includes a second buffer layer 220 and a second plastic substrate 210 that are sequentially formed on the array 230, and includes a second substrate 3000 positioned above the second plastic substrate 210.

Reference numeral 1100, which is not described, denotes an adhesion layer provided for surface attachment of the first flexible substrate 1000 to the first plastic substrate 120. After removing the first glass substrate (not shown) from the first plastic substrate 120 by a method such as laser irradiation, the adhesion layer 1100 is applied to the exposed first plastic substrate 120 side, and then the first The substrate 1000 is attached.

Here, the second substrate 3000 may be attached to the second plastic substrate 210 through a separate adhesive layer, or by using a mechanical method or other method, the second plastic substrate ( 210) It can only be placed on top. The second substrate 3000 functions to prevent and protect the internal array from being damaged from a user's direct touch operation.

In the organic light emitting display device of the present invention, the use of the glass substrate having the largest thickness in the display device of about 0.7 mm can be omitted from the completed device to make a thin film, and the thin film transistor array 140, the OLED array 150 ) And the touch array 230 as a substrate having a function of supporting the film substrate 1000 or a thin metal substrate, which is a plastic insulating film, it is possible to implement a flexible display device capable of bending or bending.

In addition, during the process of forming an array such as the thin film transistor array 140, the OLED array 150, and the touch array 230, the film is formed directly on the film substrate under conditions such as heat applied from equipment for deposition and patterning. Since thermal expansion of the substrate occurs and the process cannot be performed normally, in order to prevent this, the plastic substrates 120 and 210 and the buffer layers 130 and 220 are respectively underneath the thin film transistor array 140 and before the touch array 230 is formed. After forming) on the glass substrate, the array is substantially formed by loading the glass substrate with deposition or patterning equipment.

Meanwhile, the thin film transistor array 140 is formed by including a gate line and a data line crossing each other to define a pixel, and a thin film transistor formed at an intersection of the gate line and the data line. The pad portion forms a pad portion metal in the gate line and data line formation process.

In addition, the OLED array 150 includes at least a first electrode formed on the pixel, a second electrode formed on an upper layer spaced apart therefrom, and an organic light emitting layer formed between the first and second electrodes. Here, the first electrode may be connected to a drain electrode of the thin film transistor.

In addition, the first plastic substrate 120 and the second plastic substrate 210 may be, for example, high heat-resistant polyimide or polyamide, or a composite film thereof, for example , PET (polyethylene terephthalate), PC (polycarbonate), COP (Cyclic Olefin Polymer), PEN (Polyethylene Naphthalate), and the like.

The first and second plastic substrates 120 and 210 are formed to have a thickness in the range of approximately 1 μm to 20 μm.

In addition, the first buffer layer 130 and the second buffer layer 220 are provided to prevent the penetration of oxygen or moisture into the organic layers provided in the OLED array, and provide a kind of permeation of outside air or moisture coming from the bottom. It acts as a barrier to prevent.

The first buffer layer 130 and the second buffer layer 220 are formed of a plurality of inorganic layers. For example, the multi-layered inorganic film may be formed by continuous stacking or alternating stacking of SiNx or SiO2. In the experiment, it was confirmed that when the first and second buffer layers 130 and 220 are stacked with a thickness of about 5000 Å to 6500 Å with two or more layers, penetration of outside air or moisture is prevented. The total thickness of each of the first and second buffer layers 130 and 220 is 1 μm or less so that the thickness of the touch screen integrated display device is not increased.

4 and 5, the touch array 230 includes a first transparent channel electrode 2331 and a second transparent channel electrode 2332 crossing each other, and the first and second transparent channel electrodes 2331. And a touch pad 2351b (included in the touch pad unit 2350) for transmitting signals to each of 2332. Each of the touch pads 2351b may be connected to a dummy pad formed in the thin film transistor array. In FIG. 3, a thin film transistor array 140 is shown to include the dummy pad, and a touch electrode layer is shown in a single layer by including the touch pad and the first and second transparent channel electrodes 2331 and 2332. However, these layers are divided and patterned for each electrode.

Here, the first and second transparent channel electrodes 2331 and 2332 are made of transparent electrodes, and the touch pad electrode 2351b is a light-shielding metal pad layer having good conductivity (same layer as the metal bridge 231 ). And, a transparent electrode pattern of the same layer as the transparent electrode constituting the first and second transparent channel electrodes 2331 and 2332 may be included. In addition, the first and second transparent channel electrodes 2331 and 2332 may be located on the same layer or on different layers. For example, as shown, when the first and second transparent channel electrodes 2331 and 2332 have the same layer, the first and second transparent channel electrodes 2231 and 2332 A separate metal bridge 231 in contact between the adjacent first transparent channel electrodes 2331 or between the second transparent channel electrodes 2332 is provided to prevent shorting between the first and second transparent channel electrodes 2331 and 2332. Meanwhile, reference numeral 2332c, which is not described herein, is an integral electrode connection part 2332c that passes between the first transparent channel electrodes 2331 spaced apart from each other and connects the upper and lower second transparent channel electrodes 2332.

6 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to the first exemplary embodiment of the present invention, and accordingly, a method of manufacturing the organic light emitting display device according to the first exemplary embodiment of the present invention is as follows.

In the manufacturing method of the organic light emitting display device according to the first embodiment of the present invention, first, a first plastic substrate (120 in FIG. 3) and a first buffer layer 130 are formed on a first glass substrate (not shown). And, a thin film transistor and OLED arrays 140 and 150 in the active region of the first buffer layer 130, an OLED pad electrode (not shown) connected to the OLED array on one side, and a plurality of dummy pad electrodes ( A dummy pad portion 1400 including 1401 is formed (10S).

At the same time, on the second glass substrate (not shown), a second plastic substrate 210 and a second buffer layer 220 are formed, and a touch array 230 is formed in the active region of the second buffer layer 220 , Touch pad units 2350 including touch pad electrodes 2351b are formed on both edges of one side (20S).

Subsequently, an adhesive layer 400 is formed on the thin film transistor and the OLED arrays 140 and 150 or the touch array 230, and a conductive ball 455 is included in the dummy pad unit 1400 or the touch pad unit 2350. Apply curable resin 450 (30S)

Next, the thin film transistor and OLED arrays 140 and 150 and the touch array 230 are opposed, the dummy pad unit 1400 and the touch pad unit 2350 are opposed, and the OLED pad electrode of the first buffer layer The first and second glass substrates are bonded together so that the (drive IC formation portion of Fig. 2) is exposed (40S).

Meanwhile, when a plurality of cells (a plurality of corresponding arrays are arranged apart from each other) are defined on the bonded first and second glass substrates, cutting for each cell is performed (50S). Such cell-by-cell cutting is performed when there are a plurality of cells on the bonded first and second glass substrates, and if only unit cells are provided on the first and second glass substrates, this process may be omitted.

Subsequently, the second glass substrate is removed by a laser or etching process (55S).

Then, the drive IC 500 is connected to the OLED pad electrode of the first buffer layer 130, and the FPCB 700 is formed on the exposed side of the first buffer layer 130 (60S). Here, when the drive IC 500 and the FPCB 700 are formed, the reason that the first glass substrate remains in the state is when the drive IC 500 and the pad electrode for OLED are connected and the FPCB 700 is attached to the first buffer layer 130 ), a certain pressure is applied during bonding, and when such pressure is applied while the first plastic substrate 120 is exposed without a hard and hard material, the soft material is the first plastic substrate 120 and the first buffer layer. Damage may be applied to the 130, so the bonding process proceeds while leaving the first glass substrate.

Then, the upper portions of the bonded drive IC 500 and FPCB 700 are subjected to temporary curing by applying a cover seal 800 to the upper portion thereof, followed by UV irradiation (70S).

Subsequently, among the side surfaces between the bonded first and second buffer layers 130 and 220, adjacent to the touch pad part 2350, filling a spaced area between the touch pad part 2350 and the curable resin 450 The filling seal 4500 is injected (80S).

Subsequently, the filling seal 4500 is completely filled in the space between the UV temporary curing (90S) and the adhesive layer 400 and the touch pad unit 2350 and then thermally cured (100S) for immobilization.

Although not shown, after the thermal curing (100S) process, the first glass substrate may be removed, thereby making the device thinner.

Here, the filling seal 4500 is preferably in contact with the curable resin and the adhesive layer between the first and second buffer layers after UV curing and thermal curing.

In addition, as shown in FIG. 3, the first plastic substrate exposed by removing the first glass substrate (see 120 in FIG. 3) is provided with a separate adhesive layer 1100 to attach the first substrate 1000 as a film substrate. I can.

In addition, the second plastic substrate exposed by removing the second glass substrate (see 210 in FIG. 3) may further form a polarizing plate 2000 and a cover glass 3000 or a protective substrate for a cover film to prevent external light visibility. I can.

7 is a flowchart illustrating a method of manufacturing an organic light emitting diode display according to a second exemplary embodiment of the present invention.

Meanwhile, FIG. 7 shows a method of manufacturing an organic light emitting diode display according to a second embodiment of the present invention. The difference from the first embodiment is a separate drive IC 500 and a cover covering the FPCB 700 When the filling seal (refer to 5500 in FIG. 8) is injected without forming the seal 800, the upper portion of the drive IC 500 and the FPCB 700 is also applied and formed (180S). In this case, compared to the first embodiment, the cover seal application 70S and the temporary hardening process are omitted in a process, so that the process can be further simplified.

Here, other steps not described follow the manufacturing method of the organic light emitting display device according to the first exemplary embodiment described above.

FIG. 8 is a plan view illustrating an organic light emitting display device according to a second exemplary embodiment of the present invention, and FIG. 9 is a cross-sectional view illustrating a structure along the line Ⅲ to Ⅲ′ of FIG. 8.

As shown in FIGS. 8 and 9, in addition to the spaced space between the touch pad unit 2350 and the adhesive layer 400, the first substrate 1000 is relatively formed at the side between the first and second buffer layers. 2 The substrate 3000 is formed to cover the exposed area (the pad portion of the OLED) as a whole. Through this, the drive IC 500 and the FPCB 700 are temporarily fixed on the first substrate 1000, do not move due to external impact, and can be protected from external physical damage.

10 is a photograph of a touch pad unit when the organic light emitting display device of the present invention is applied.

10 illustrates a touch pad unit to which the organic light emitting display device of the present invention is applied, and a filling seal is filled in a space between the touch pad unit 2350 and an adhesive layer. That is, it is possible to fill the spaced space between the touch pad unit 2350 and the adhesive layer 400 by the filling seal due to the capillary phenomenon, thereby preventing the occurrence of an empty space between the adhesive layer and the touch pad unit. And, through this, it can be expected that the reliability of the device is improved by eliminating the weak part during bending.

On the other hand, the present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the technical spirit of the present invention. It will be obvious to those of ordinary skill in

120: first plastic substrate 130: first buffer layer
140: thin film transistor array 150: organic light emitting array
160: protective film 210: second plastic substrate
220: second buffer layer 230: touch array
400: adhesive layer 450: curable resin
455: conductive ball 500: drive IC
700: FPCB 800: cover seal
1000: first substrate
1100: adhesive layer 1400: dummy pad portion
1401: dummy pad electrode 2000: polarizing plate
2351b: touch pad electrode 2350: touch pad unit
3000: second substrate 4500, 5500: filling seal

Claims (21)

A first substrate and a second substrate, each having an active region and a dead region and facing each other;
An OLED array provided in the active area of the first substrate;
A touch array provided in the active region of the second substrate to face the OLED array;
An adhesive layer bonding between the OLED array and the touch array;
A touch pad unit spaced apart from the active area and having a plurality of touch pad electrodes at both edges of one side of the second substrate;
A dummy pad portion having a plurality of dummy pad electrodes on the first substrate to correspond to respective touch pad electrodes of the touch pad portion;
A curable resin including conductive balls for connecting touch pad electrodes facing each other and dummy pad electrodes; And
And a filling seal between the adhesive layer and the curable resin and between the first substrate and the second substrate. The method of claim 1,
The organic light emitting display device, wherein the filling seal is an insulating heat-curable and UV-curable resin. The method of claim 2,
The organic light emitting display device, wherein the filling seal has a viscosity of 50 cps or more and 500 cps or less. The method of claim 3,
The organic light-emitting display device, wherein the filling seal has a moisture permeability of 5.0 g/m ² · ²⁴ hrs or less. The method of claim 2,
The first substrate has one side exposed from the second substrate,
An organic light-emitting display device comprising: a pad electrode connected to the OLED array, a drive IC connected thereto, and a flexible printed circuit board (FPCB) for connection with an external system, on an exposed side of the first substrate. The method of claim 5,
The organic light-emitting display device, wherein the dummy pad part, a pad electrode connected to the OLED array, a drive IC, and an FPCB are located on the same side of the first substrate. The method of claim 6,
The drive IC and the FPCB on the first substrate are covered with the filling seal. The method of claim 6,
The organic light emitting display device, wherein the filling seal is UV-cured and thermo-cured. The method of claim 6,
And a cover seal covering upper portions of the drive IC and the FPCB on the first substrate. The method of claim 9,
The organic light emitting display device, wherein the cover seal is a UV curable seal. The method of claim 1,
The first and second substrates are formed of a flexible substrate. The method of claim 1,
The filling seal, in a vertical section,
The upper surface is in contact with the second substrate,
One side of the touch pad part, the curable resin and the dummy pad part in turn contact each side,
The lower surface is in contact with the first substrate,
The other side is in contact with the side surface of the adhesive layer and the touch array. On the first glass substrate, a first plastic substrate and a first buffer layer are formed, an OLED array in an active region of the first buffer layer, an OLED pad electrode connected to the OLED array on one side, and a plurality of dummy pads Forming a dummy pad portion including an electrode;
Forming a second plastic substrate and a second buffer layer on a second glass substrate, forming a touch array in an active region of the second buffer layer, and forming a touch pad portion including a touch pad electrode at both edges of one side ;
Applying an adhesive layer to the OLED array or the touch array and a curable resin including a conductive ball on the dummy pad portion or the touch pad portion;
Bonding first and second glass substrates such that the OLED array and the touch array face each other, the dummy pad portion and the touch pad portion face each other, and the OLED pad electrode of the first buffer layer is exposed;
Connecting a drive IC to an OLED pad electrode of the first buffer layer, and forming an FPCB on an exposed side of the first buffer layer;
Injecting a filling seal between the adhesive layer and the curable resin and between the first buffer layer and the second buffer layer; And
A method of manufacturing an organic light-emitting display device, comprising the steps of UV curing and thermal curing the filling seal. The method of claim 13,
The method of manufacturing an organic light emitting display device, wherein the first and second plastic substrates are polyimide or polyamide. The method of claim 13,
In the step of injecting the fill seal, further coating is applied to cover the driver IC and the FPCB on the first buffer layer. The method of claim 13,
Forming a cover seal covering the drive IC and the FPCB immediately after connecting the drive IC and forming the FPCB on the first buffer layer. The method of claim 16,
The method of manufacturing an organic light emitting display device, further comprising UV curing the cover seal. The method of claim 13,
And immediately after bonding the first and second glass substrates, removing the second glass substrate. The method of claim 18,
After the step of injecting the fill seal, the method of manufacturing an organic light emitting display device, further comprising removing the first glass substrate. The method of claim 13,
When a plurality of active regions are defined on the first glass substrate and the second glass substrate, after bonding the first and second glass substrates, cutting for each unit active region is further included. Method of manufacturing a display device. The method of claim 13,
The method of manufacturing an organic light emitting display device, wherein the filling seal is in contact with the curable resin and the adhesive layer between the first and second buffer layers after UV curing and thermal curing.

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