CN103441105A - Display panel and method for manufacturing the same - Google Patents
Display panel and method for manufacturing the same Download PDFInfo
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- CN103441105A CN103441105A CN201310424667XA CN201310424667A CN103441105A CN 103441105 A CN103441105 A CN 103441105A CN 201310424667X A CN201310424667X A CN 201310424667XA CN 201310424667 A CN201310424667 A CN 201310424667A CN 103441105 A CN103441105 A CN 103441105A
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- substrate
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- display floater
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 238000005520 cutting process Methods 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 51
- 239000003292 glue Substances 0.000 claims abstract description 41
- 208000034699 Vitreous floaters Diseases 0.000 claims description 47
- 229920002120 photoresistant polymer Polymers 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 5
- 239000012812 sealant material Substances 0.000 claims description 5
- 230000001458 anti-acid effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract 4
- 230000001070 adhesive effect Effects 0.000 abstract 4
- 230000001681 protective effect Effects 0.000 abstract 3
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
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- 239000000565 sealant Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- 238000003776 cleavage reaction Methods 0.000 description 9
- 230000007017 scission Effects 0.000 description 9
- 238000007688 edging Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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- 238000003701 mechanical milling Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
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- 238000004528 spin coating Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004063 acid-resistant material Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
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- 230000004888 barrier function Effects 0.000 description 1
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Abstract
The invention provides a display panel and a manufacturing method thereof. A mother substrate having a plurality of cell regions is provided, and the cell regions have a display region and a driving circuit region. An opposite substrate is formed on the mother substrate, and a plurality of sealant patterns are formed between the opposite substrate and the mother substrate. The frame glue pattern surrounds the display area, and a display medium is formed in the display areas of the mother substrate and the opposite substrate. And forming a protective adhesive material in the driving circuit region, wherein the protective adhesive material is contacted with the side wall of the frame adhesive pattern. A first cutting groove corresponding to the display area and a second cutting groove corresponding to the driving circuit area are formed in the opposite substrate, and a third cutting groove corresponding to the unit area is formed in the mother substrate. And performing a splitting procedure through the cutting groove to form a plurality of display panels. And removing the protective adhesive material. The invention can avoid the problems of cracking on the edge of the glass substrate, corrosion of the driving circuit, poor electrical property or electrical failure.
Description
Technical field
The present invention relates to a kind of display floater and manufacture method thereof, relate in particular to a kind of display floater and manufacture method thereof of using chemical cleavage.
Background technology
Along with scientific and technological progress, bulky cathode ray tube (Cathode Ray Tube, CRT) display has entered into history gradually.Therefore, liquid crystal display (Liquid Crystal Display, LCD), organic light emitting diode display (Organic Light Emitting Diode display, OLED display), electrophoretic display device (EPD) (Electro-Phoretic Display, EPD), the display floater such as plasma scope (Plasma Display Panel, PDP) little by little becomes the main flow of following display.
Machine cuts (for example using break bar) is for generally being applied at present the cutting method of display floater.In the machine cuts method, need recycling mechanical milling tech (mechnical grinding process) to carry out edging to the glass substrate of the display floater after cutting, to increase the intensity of display floater, avoid subsequent technique generation fragmentation.Yet, for ultra-thin display floater (thickness of its glass substrate is respectively between 0.03mm～0.1mm), the polishing particles that existing mechanical milling tech is used is trickle not.Therefore, after edging, the edge of glass substrate produces more serious be full of cracks (chipping) than the edge of the rear glass substrate of cutting, and the edge of the contiguous drive circuit area of colored optical filtering substrates can't carry out edging and easily produce be full of cracks, and then cause the problem of electrically bad or electrical inefficacy.Can avoid the existing problem of above-mentioned machine cuts although chemical cleavage has potentiality, because the chemical solution of chemical cleavage can corrode drive circuit, and cause the problem of electrically bad or electrical inefficacy, therefore chemical cleavage is not applied to display floater yet at present.
Summary of the invention
In order to overcome the defect of prior art, the invention provides a kind of display floater and manufacture method thereof, can avoid the edge of glass substrate to produce be full of cracks, drive circuit is corroded and the problem of electrically bad or electrical inefficacy.
The present invention proposes a kind of manufacture method of display floater, and the manufacture method of this display floater comprises the following steps.Mother substrate with a plurality of unit areas is provided, and each unit area drive circuit area of thering is viewing area and being positioned at one of them side of viewing area, wherein in each viewing area, there is pel array.Form the subtend substrate on mother substrate, and form a plurality of gasket seal patterns between mother substrate and subtend substrate, each gasket seal patterns surrounds one of them viewing area, and forms display medium in the viewing area of mother substrate and subtend substrate.Form protection glue material in drive circuit area on mother substrate, and protection glue material at least with the sidewall contact of gasket seal patterns.Form the first cutting groove and the second cutting groove in the subtend substrate, and form the 3rd cutting groove in mother substrate.The corresponding viewing area of the first cutting groove arranges, the corresponding drive circuit area setting of the second cutting groove, and the 3rd cutting groove corresponding unit region division.Carry out the sliver program by the first cutting groove, the second cutting groove and the 3rd cutting groove, and form a plurality of display floaters.Remove the protection glue material in the drive circuit area on mother substrate.
A kind of display floater of the another proposition of the present invention, it comprises first substrate, pel array, second substrate, gasket seal patterns, display medium and protection glue material.The drive circuit area that first substrate has viewing area and is positioned at least one side of viewing area.Pel array is positioned at the viewing area of first substrate.Second substrate is positioned at the subtend of first substrate, and wherein second substrate covers pel array and exposes drive circuit area.Gasket seal patterns arranges between first substrate and second substrate and around viewing area.Display medium is between first substrate, second substrate and gasket seal patterns.Protection glue material be positioned at drive circuit area and at least with the sidewall contact of gasket seal patterns.
Based on above-mentioned; in display floater of the present invention and manufacture method thereof; due to protection glue material be formed in drive circuit area and at least with the sidewall contact of gasket seal patterns; therefore not only can protect drive circuit to avoid being corroded by chemical solution in the process of chemical cleavage and cause the problem of electrically bad or electrical inefficacy, but also can avoid display medium to spill via the sidewall of gasket seal patterns and the problem that causes drive circuit to damage.Moreover the display floater of use chemical cleavage of the present invention and manufacture method thereof not only can reduce the step of edging compared to machine cuts, and more can avoid the edge of glass substrate to produce the problem of be full of cracks, to improve the intensity at edge.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
The accompanying drawing explanation
Fig. 1 be mother substrate of the present invention on look schematic diagram.
The enlarged diagram of the A part that Fig. 2 is Fig. 1.
Fig. 3 be mother substrate of the present invention and subtend substrate in batch after vertical on look schematic diagram.
The enlarged diagram of the A part that Fig. 4 is Fig. 3.
Fig. 5 A to Fig. 5 G is the generalized section according to the manufacture method of a kind of display floater of one embodiment of the invention.
Fig. 6 be display floater of the present invention on look schematic diagram.
Fig. 7 is the generalized section according to the chemical cleavage step of another embodiment of the present invention.
Wherein, description of reference numerals is as follows:
100: mother substrate
100 ': first substrate
100a, 200a: outer surface
103: the three cutting grooves
110: unit area
120: viewing area
122: pel array
130: drive circuit area
132: drive circuit
150: gasket seal patterns
150a: sidewall
152: the fluid sealant material
154: the gap ball
160: display medium
170,170 ': protection glue material
180: the first photoresist layers
181: the first channel patterns
182: the second channel patterns
183: the three channel patterns
184: the second photoresist layers
200: the subtend substrate
200 ': second substrate
201: the first cutting grooves
202: the second cutting grooves
300: display floater
A: part
D1, d2: the degree of depth
DL1～DLn: data wire
I-I ': line
P: dot structure
PE: pixel electrode
SL1～SLn: scan line
T: active element
T1, T2: thickness
Embodiment
Fig. 1 be mother substrate 100 of the present invention on look schematic diagram, and the enlarged diagram of the A that Fig. 2 is Fig. 1 part.Referring to Fig. 1 and Fig. 2, at first, provide the mother substrate 100 with a plurality of unit areas 110.The drive circuit area 130 that each unit area 110 has viewing area 120 and is positioned at one of them side of viewing area 120, wherein have in pel array 122 and each drive circuit area 130 in each viewing area 120 and have drive circuit 132.In the present invention, pel array 122 comprises multi-strip scanning line SL1～SLn, many data wire DL1～DLn and a plurality of dot structure P.
Scan line SL1～SLn and data wire DL1～DLn hand over each other more and arrange, and accompany insulating barrier (not illustrating) between scan line SL1～SLn and data wire DL1～DLn.In other words, the bearing of trend of the bearing of trend of scan line SL1～SLn and data wire DL1～DLn is not parallel, preferably, the bearing of trend of scan line SL1～SLn (along X-direction) is vertical with the bearing of trend (along Y direction) of data wire DL1～DLn.Consideration based on conductivity, scan line SL1～SLn and data wire DL1～DLn are used metal material.Yet, the invention is not restricted to this.In other embodiments of the invention, scan line SL1～SLn and data wire DL1～DLn also can be used other electric conducting materials, are for example the nitride of alloy, metal material, the oxide of metal material, nitrogen oxide or other suitable material or the stack layer of metal material and other electric conducting material of metal material.
In addition, dot structure P comprises active elements T and pixel electrode PE.Active element T can be bottom grid film transistor or top grid type thin-film transistor, and it comprises grid, raceway groove, source electrode and drain electrode.Active element T and a corresponding scan line SL1～SLn and a corresponding data wire DL1～DLn is electrically connected.In addition, active element T and pixel electrode PE are electrically connected.
In addition, scan line SL1～SLn and data wire DL1～DLn all extend to drive circuit area 130, to be electrically connected with drive circuit 132.In one embodiment of this invention, drive circuit area 130 is positioned at 120 both sides, viewing area.Yet, the invention is not restricted to this.In another embodiment of the present invention, drive circuit area 130 can be positioned at a wherein side of viewing area 120, wherein three sides or four sides.Hereinafter, the embodiment that the drive circuit area 130 of take is positioned at the mother substrate of 120 both sides, viewing area is example, and display floater of the present invention and manufacture method thereof are explained in more detail.
Fig. 3 after to be mother substrate of the present invention 100 vertical with 200 groups of subtend substrates on look schematic diagram, the enlarged diagram of the A part that Fig. 4 is Fig. 3, Fig. 5 A to Fig. 5 G is the generalized section according to the manufacture method of a kind of display floater 300 of one embodiment of the invention, and Fig. 6 be display floater 300 of the present invention on look schematic diagram.Fig. 5 A and Fig. 5 G are respectively the generalized section of I-I ' along the line in Fig. 4 and Fig. 6.
Please refer to Fig. 3, Fig. 4 and Fig. 5 A, at first, subtend substrate 200 is set on mother substrate 100, and form a plurality of gasket seal patterns 150 between mother substrate 100 and subtend substrate 200.The thickness T 2 of mother substrate and the thickness T 1 of subtend substrate are respectively between 0.03mm～0.1mm.Subtend substrate 200 is for example blank glass cover-plate or other transparent cover plates or is formed with wire or the substrate of other elements.Gasket seal patterns 150 is for example to comprise fluid sealant material 152 and a plurality of gaps ball 154 be distributed in fluid sealant material 152.The material of gasket seal patterns 150 is for example the epoxy resin (epoxy) that contains silicon gap ball.Each gasket seal patterns 150 surrounds one of them viewing area 120, and forms display medium 160 in the viewing area 120 of mother substrate 100 and subtend substrate 200.When display floater is display panels, display medium 160 is for example liquid crystal molecule.In other embodiments, when display floater is organic LED display panel, display medium 160 is for example organic luminous layer.When display floater is electrophoretic display panel, display medium 160 is for example electrophoretic display medium.When display floater is plasma display, display medium 160 is for example that plasma shows medium.
In addition, in the present invention, form protection glue material 170 in the drive circuit area 130 on mother substrate 100, and protection glue material 170 at least contacts with the sidewall 150a of gasket seal patterns 150.The material of protection glue material 170 is not identical with the material of gasket seal patterns 150.Protection glue material 170 is for example to comprise antiacid glue material, and the material of protection glue material 170 is for example epoxy resin, polyvinyl chloride (polyvinyl chloride, PVC) or other suitable acid-resistant materials.In the present invention, the formation method of protection glue material 170 is for example coating protection glue material 170 in the drive circuit area 130 be included on mother substrate 100, and then by baking-curing, protects glue material 170.
Please refer to Fig. 5 B, then, form the first photoresist layer 180 in the outer surface 200a of subtend substrate 200 is upper, and form the second photoresist layer 184 on the outer surface 100a of mother substrate 100.The formation method of the first photoresist layer 180 and the second photoresist layer 184 is for example to comprise spin coating (spin coating) method.
Please refer to Fig. 5 C, then, patterning the first photoresist layer 180 and the second photoresist layer 184, the method for this patterning is for example to comprise the photoengraving carving technology.Thus, the first photoresist layer 180 has the first channel patterns 181 and the second channel patterns 182 to expose the outer surface 200a of subtend substrate 200, and the second photoresist layer 184 has the 3rd channel patterns 183 to expose the outer surface 100a of mother substrate 100.
Please refer to Fig. 5 D, afterwards, utilize the first patterned photoresist layer 180 and the second patterned photoresist layer 184 to carry out the chemical etching program as etching mask, and form the first cutting groove 201 and the second cutting groove 202 in subtend substrate 200, and form the 3rd cutting groove 103 in mother substrate 100.The first corresponding viewing area 120 of cutting groove 201 arranges, and the corresponding drive circuit area 130 of the second cutting groove 202 arranges, and the 3rd cutting groove 103 corresponding unit zones 110 arrange.The chemical etching program is for example to comprise by Wet-type etching utilizing chemical solution (such as hydrofluoric acid (Hydrofluoric Acid, HF)) to carry out etching to mother substrate 100 and subtend substrate 200.In detail, be for example that mother substrate 100 and subtend substrate 200 are soaked in chemical solution, chemical solution is sprayed to (or roller coating) on mother substrate 100 and subtend substrate 200 or other suitable methods.
Please refer to Fig. 5 E, then, carry out the sliver program by the first cutting groove 201, the second cutting groove 202 and the 3rd cutting groove 103, to form respectively first substrate 100 ' and second substrate 200 '.
It is worth mentioning that, in one embodiment of this invention, as shown in Figure 5 D, the first cutting groove 201 and the second cutting groove 202 run through subtend substrate 200 to expose protection glue material 170, and the 3rd cutting groove 103 runs through mother substrate 100 to expose protection glue material 170.Yet, the invention is not restricted to this.In another embodiment of the present invention, as shown in Figure 7, the first cutting groove 201 and the second cutting groove 202 do not run through subtend substrate 200, and the 3rd cutting groove 103 does not run through mother substrate 100.That is to say, when the thickness of subtend substrate 200 thickness that is T1 and mother substrate 100 is T2, the degree of depth of the first cutting groove 201 and the second cutting groove 202 is d1, and d1=0.8T1～1T1, and the degree of depth of the 3rd cutting groove 103 is d2, and d2=0.8T2～1T2.In detail, the present invention can optionally use the chemical etching program to cut (that is, cutting groove runs through substrate) or part cutting (that is, cutting groove does not run through substrate) fully.When using the chemical etching program to cut fully, can in same etching machine, complete the sliver program, but this mode need consider the abnormal problems such as (such as sliver may cause the extra cleaning of some etching machine needs, affecting production capacity) of etching machine is easily collected or whether can be caused to these slivers whether in etching machine simultaneously.When using the chemical etching program to carry out the part cutting, need in another board, carry out sliver program (for example steam sliver) and make it to separate, but this mode can contribute to the collection of these slivers and can avoid causing the problems such as etching machine is abnormal.
Please refer to Fig. 5 F, then, remove the first photoresist layer 180 and the second photoresist layer 184.The removing method of the first photoresist layer 180 and the second photoresist layer 184 is for example to carry out wet etch process or other suitable methods.
Please refer to Fig. 5 G and Fig. 6, afterwards, remove protection glue material 170 in the drive circuit area 130 on mother substrate 100 to expose drive circuit area 130, and then form a plurality of display floaters 300.Display floater 300 is for example display panels, organic LED display panel, electrophoretic display panel, plasma display or other forms of display floater.The removing method of protection glue material 170 is for example to comprise removing or soaking alkali electroless liquid being removed.In one embodiment of this invention, residual part protection glue material 170 ' at least contact with the sidewall 150a of gasket seal patterns 150, and then can avoid that display medium 160 spills via the sidewall 150a of gasket seal patterns 150 and the problem that causes drive circuit 132 damages.Yet, the invention is not restricted to this.In other embodiments of the invention; residual part protection glue material 170 ' may be also very micro-; for example may only make the carbon content of sidewall 150a or the drive circuit 132 of gasket seal patterns 150 (because protection glue material 170 is macromolecular material; under EDX (Energy Dispersive X-Ray, energy dispersion X ray) analyzes, have the higher carbon content residual) increase approximately 2%.
From Fig. 5 G and Fig. 6, display floater 300 of the present invention comprises first substrate 100 ', pel array 122, second substrate 200 ', gasket seal patterns 150, display medium 160 and protection glue material 170 '.The drive circuit area 130 that first substrate 100 ' has viewing area 120 and is positioned at least one side of viewing area 120.Pel array 122 is positioned at the viewing area 120 of first substrate 100 '.Second substrate 200 ' is positioned at the subtend of first substrate 100 ', and wherein second substrate 200 ' covers pel array 122 and exposes drive circuit area 130.Gasket seal patterns 150 is positioned between first substrate 100 ' and second substrate 200 ' and 120 settings around viewing area.Display medium 160 is positioned between first substrate 100 ', second substrate 200 ' and gasket seal patterns 150.Protection glue material 170 ' is positioned at drive circuit area 130 and at least contacts with the sidewall 150a of gasket seal patterns 150.
In sum; in display floater of the present invention and manufacture method thereof; due to protection glue material be formed in drive circuit area and at least with the sidewall contact of gasket seal patterns; therefore not only can protect drive circuit to avoid being corroded by chemical solution in the process of chemical cleavage and cause the problem of electrically bad or electrical inefficacy, but also can avoid display medium to spill via the sidewall of gasket seal patterns and the problem that causes drive circuit to damage.Moreover the display floater of use chemical cleavage of the present invention and manufacture method thereof not only can reduce the step of edging compared to machine cuts, and more can avoid the edge of glass substrate to produce the problem of be full of cracks, to improve the intensity at edge.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; any those of ordinary skills; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is as the criterion when looking appended the scope that claim defines.
Claims (14)
1. the manufacture method of a display floater comprises:
One mother substrate is provided, and this mother substrate has a plurality of unit areas, and the one drive circuit district that has a viewing area and be positioned at one of them side of this viewing area, each unit area, wherein in each viewing area, has a pel array;
Form a subtend substrate on this mother substrate, and form a plurality of gasket seal patterns between this mother substrate and this subtend substrate, each gasket seal patterns surrounds one of them viewing area, and forms a display medium in described a plurality of viewing areas of this mother substrate and this subtend substrate;
Form a protection glue material in described a plurality of drive circuit area on this mother substrate, and this protection glue material at least with the sidewall contact of this gasket seal patterns;
Form one first cutting groove and one second cutting groove in this subtend substrate, and form one the 3rd cutting groove in this mother substrate, the corresponding described a plurality of viewing areas of this first cutting groove arrange, the corresponding described a plurality of drive circuit area settings of this second cutting groove, and the corresponding described a plurality of unit areas of the 3rd cutting groove arrange;
To carry out a sliver program, and form a plurality of display floaters by this first cutting groove, this second cutting groove and the 3rd cutting groove; And
Remove this protection glue material in the described a plurality of drive circuit area on this mother substrate.
2. the manufacture method of display floater as claimed in claim 1 wherein forms this first cutting groove and this second cutting groove in this subtend substrate, and the method for formation the 3rd cutting groove comprises in this mother substrate:
An outer surface in this subtend substrate forms one first photoresist layer, and this first photoresist layer has one first channel patterns and one second channel patterns to expose the outer surface of this subtend substrate;
An outer surface at this mother substrate forms one second photoresist layer, and this second photoresist layer has one the 3rd channel patterns to expose the outer surface of this mother substrate; And
Utilize this first photoresist layer and this second photoresist layer as etching mask, to carry out a chemical etching program, and form this first cutting groove and this second cutting groove in this subtend substrate, and form the 3rd cutting groove in this mother substrate.
3. the manufacture method of display floater as claimed in claim 1, wherein this first cutting groove and this second cutting groove run through this subtend substrate to expose this protection glue material, and the 3rd cutting groove runs through this mother substrate to expose this protection glue material.
4. the manufacture method of display floater as claimed in claim 1, wherein this first cutting groove and this second cutting groove do not run through this subtend substrate, and the 3rd cutting groove does not run through this mother substrate.
5. the manufacture method of display floater as claimed in claim 4, wherein:
The thickness of this subtend substrate is T1, and the degree of depth of this first cutting groove and this second cutting groove is d1, and d1=0.8T1～1T1; And
The thickness of this mother substrate is T2, and the degree of depth of the 3rd cutting groove is d2, and d2=0.8T2～1T2.
6. the manufacture method of display floater as claimed in claim 1, wherein the thickness of this mother substrate and this subtend substrate is between 0.03mm～0.1mm.
7. the manufacture method of display floater as claimed in claim 1, wherein this gasket seal patterns is not identical with the material of this protection glue material.
8. the manufacture method of display floater as claimed in claim 7, wherein this gasket seal patterns comprises a fluid sealant material and a plurality of gaps ball be distributed in sealing glue material.
9. the manufacture method of display floater as claimed in claim 7, wherein this protection glue material comprises an antiacid glue material.
10. a display floater comprises:
One first substrate, the one drive circuit district that it has a viewing area and is positioned at least one side of this viewing area;
One pel array, be positioned at this viewing area of this first substrate;
One second substrate, be positioned at the subtend of this first substrate, and wherein this second substrate covers this pel array and exposes this drive circuit area;
One gasket seal patterns arranges between this first substrate and this second substrate and around this viewing area;
One display medium, between this first substrate, this second substrate and this gasket seal patterns; And
One protection glue material, be positioned at this drive circuit area and at least with the sidewall contact of this gasket seal patterns.
11. display floater as claimed in claim 10, wherein this gasket seal patterns is not identical with the material of this protection glue material.
12. display floater as claimed in claim 11, wherein this gasket seal patterns comprises a fluid sealant material and a plurality of gaps ball be distributed in sealing glue material.
13. display floater as claimed in claim 11, wherein this protection glue material comprises an antiacid glue material.
14. display floater as claimed in claim 10, wherein the thickness of this first substrate and this second substrate is between 0.03mm～0.1mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102123273A TWI514458B (en) | 2013-06-28 | 2013-06-28 | Display panel and fabricating method thereof |
| TW102123273 | 2013-06-28 |
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| CN103441105A true CN103441105A (en) | 2013-12-11 |
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| CN201310424667XA Pending CN103441105A (en) | 2013-06-28 | 2013-09-17 | Display panel and method for manufacturing the same |
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| CN108648623A (en) * | 2018-04-24 | 2018-10-12 | 云谷（固安）科技有限公司 | Display screen, its manufacturing method and display terminal |
| CN111856823A (en) * | 2019-04-30 | 2020-10-30 | 立景光电股份有限公司 | Display panel |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050237439A1 (en) * | 2004-04-21 | 2005-10-27 | Toppoly Optoelectronics Corp. | Touch panel |
| CN101339314A (en) * | 2008-08-13 | 2009-01-07 | 友达光电股份有限公司 | Touch control type display panel, photovoltaic device and process for production thereof |
| JP2009047875A (en) * | 2007-08-20 | 2009-03-05 | Hitachi Displays Ltd | Manufacturing method for liquid crystal display unit |
| CN101482681A (en) * | 2008-01-11 | 2009-07-15 | 元太科技工业股份有限公司 | Production method and equipment for electrophoresis type display equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4682346B2 (en) * | 2006-08-02 | 2011-05-11 | 株式会社 日立ディスプレイズ | Liquid crystal display device and method of manufacturing liquid crystal display device |
| JP5637699B2 (en) * | 2010-02-24 | 2014-12-10 | 株式会社ジャパンディスプレイ | Method for manufacturing substrate for electrical solid state device |
-
2013
- 2013-06-28 TW TW102123273A patent/TWI514458B/en not_active IP Right Cessation
- 2013-09-17 CN CN201310424667XA patent/CN103441105A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050237439A1 (en) * | 2004-04-21 | 2005-10-27 | Toppoly Optoelectronics Corp. | Touch panel |
| JP2009047875A (en) * | 2007-08-20 | 2009-03-05 | Hitachi Displays Ltd | Manufacturing method for liquid crystal display unit |
| CN101482681A (en) * | 2008-01-11 | 2009-07-15 | 元太科技工业股份有限公司 | Production method and equipment for electrophoresis type display equipment |
| CN101339314A (en) * | 2008-08-13 | 2009-01-07 | 友达光电股份有限公司 | Touch control type display panel, photovoltaic device and process for production thereof |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150069308A (en) * | 2013-12-13 | 2015-06-23 | 엘지디스플레이 주식회사 | Organic Emitting Display Device and Method for Manufacturing the Same |
| KR102156765B1 (en) | 2013-12-13 | 2020-09-16 | 엘지디스플레이 주식회사 | Organic Emitting Display Device and Method for Manufacturing the Same |
| WO2016061852A1 (en) * | 2014-10-24 | 2016-04-28 | 深圳市华星光电技术有限公司 | Substrate packaging method and packaging structure |
| CN104460092A (en) * | 2014-12-25 | 2015-03-25 | 厦门天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN105990373B (en) * | 2015-02-25 | 2019-04-12 | 群创光电股份有限公司 | Display device and its manufacturing method |
| CN105990373A (en) * | 2015-02-25 | 2016-10-05 | 群创光电股份有限公司 | Display device and manufacture method thereof |
| CN106571309B (en) * | 2016-10-27 | 2019-11-05 | 江西沃格光电股份有限公司 | Flat-panel monitor processing method |
| CN106571309A (en) * | 2016-10-27 | 2017-04-19 | 江西沃格光电股份有限公司 | Flat panel display (FPD) processing method |
| CN106773213A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN106773213B (en) * | 2017-01-03 | 2020-02-18 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN107919364A (en) * | 2017-11-17 | 2018-04-17 | 京东方科技集团股份有限公司 | Display base plate motherboard, display base plate and production method, display device |
| CN108648623A (en) * | 2018-04-24 | 2018-10-12 | 云谷（固安）科技有限公司 | Display screen, its manufacturing method and display terminal |
| CN111856823A (en) * | 2019-04-30 | 2020-10-30 | 立景光电股份有限公司 | Display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI514458B (en) | 2015-12-21 |
| TW201501191A (en) | 2015-01-01 |
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