KR102559679B1 - 감광성 수지 조성물 - Google Patents

감광성 수지 조성물 Download PDF

Info

Publication number
KR102559679B1
KR102559679B1 KR1020180034541A KR20180034541A KR102559679B1 KR 102559679 B1 KR102559679 B1 KR 102559679B1 KR 1020180034541 A KR1020180034541 A KR 1020180034541A KR 20180034541 A KR20180034541 A KR 20180034541A KR 102559679 B1 KR102559679 B1 KR 102559679B1
Authority
KR
South Korea
Prior art keywords
resin composition
component
photosensitive resin
meth
mass
Prior art date
Application number
KR1020180034541A
Other languages
English (en)
Korean (ko)
Other versions
KR20180109731A (ko
Inventor
마사히로 가라카와
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20180109731A publication Critical patent/KR20180109731A/ko
Application granted granted Critical
Publication of KR102559679B1 publication Critical patent/KR102559679B1/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020180034541A 2017-03-28 2018-03-26 감광성 수지 조성물 KR102559679B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-063499 2017-03-28
JP2017063499A JP6658648B2 (ja) 2017-03-28 2017-03-28 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20180109731A KR20180109731A (ko) 2018-10-08
KR102559679B1 true KR102559679B1 (ko) 2023-07-27

Family

ID=63864755

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180034541A KR102559679B1 (ko) 2017-03-28 2018-03-26 감광성 수지 조성물

Country Status (3)

Country Link
JP (1) JP6658648B2 (ja)
KR (1) KR102559679B1 (ja)
TW (1) TWI780127B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7390789B2 (ja) * 2018-12-27 2023-12-04 東京応化工業株式会社 感光性樹脂フィルム及びパターン形成方法
CN113126430A (zh) * 2019-12-31 2021-07-16 太阳油墨（苏州）有限公司 阻焊剂组合物、具有其固化物的印刷电路板
JP7354963B2 (ja) * 2020-08-25 2023-10-03 味の素株式会社 感光性樹脂組成物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335807A (ja) 2005-05-31 2006-12-14 Taiyo Ink Mfg Ltd 絶縁性硬化性樹脂組成物及びその硬化物
WO2009125806A1 (ja) 2008-04-10 2009-10-15 リンテック株式会社 エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート
JP2010205127A (ja) 2009-03-05 2010-09-16 Nec Corp ラック収容機器管理システム及びラック収容機器管理方法
JP2012133364A (ja) 2010-12-21 2012-07-12 Dongwoo Fine-Chem Co Ltd スペーサー形成用感光性樹脂組成物、これを用いて製造された表示装置用スペーサー及びこれを備えた表示装置
WO2013161756A1 (ja) 2012-04-23 2013-10-31 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法
JP2015011265A (ja) 2013-07-01 2015-01-19 日立化成株式会社 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法
WO2016006264A1 (ja) 2014-07-10 2016-01-14 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200710571A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Curable resin composition and cured object obtained therefrom
JP5466522B2 (ja) 2010-02-08 2014-04-09 太陽ホールディングス株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
CN103097483B (zh) * 2010-08-27 2016-03-09 日东电工株式会社 丙烯酸类粘合剂组合物、丙烯酸类粘合剂层以及丙烯酸类粘合带
JP6064905B2 (ja) * 2011-08-10 2017-01-25 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久レジスト及び永久レジストの製造方法
WO2016125835A1 (ja) * 2015-02-05 2016-08-11 リンテック株式会社 樹脂膜形成用複合シート、及び樹脂膜付きチップの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335807A (ja) 2005-05-31 2006-12-14 Taiyo Ink Mfg Ltd 絶縁性硬化性樹脂組成物及びその硬化物
WO2009125806A1 (ja) 2008-04-10 2009-10-15 リンテック株式会社 エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート
JP2010205127A (ja) 2009-03-05 2010-09-16 Nec Corp ラック収容機器管理システム及びラック収容機器管理方法
JP2012133364A (ja) 2010-12-21 2012-07-12 Dongwoo Fine-Chem Co Ltd スペーサー形成用感光性樹脂組成物、これを用いて製造された表示装置用スペーサー及びこれを備えた表示装置
WO2013161756A1 (ja) 2012-04-23 2013-10-31 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法
JP2015011265A (ja) 2013-07-01 2015-01-19 日立化成株式会社 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法
WO2016006264A1 (ja) 2014-07-10 2016-01-14 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板

Also Published As

Publication number Publication date
KR20180109731A (ko) 2018-10-08
JP6658648B2 (ja) 2020-03-04
JP2018165799A (ja) 2018-10-25
TW201900688A (zh) 2019-01-01
TWI780127B (zh) 2022-10-11

Similar Documents

Publication Publication Date Title
JP6950536B2 (ja) 樹脂組成物
JP7452715B2 (ja) 感光性フィルム
JP2023118726A (ja) 感光性樹脂組成物
KR102559679B1 (ko) 감광성 수지 조성물
KR102611555B1 (ko) 감광성 수지 조성물
KR102554514B1 (ko) 감광성 수지 조성물
KR102559680B1 (ko) 감광성 수지 조성물
JP7281263B2 (ja) 樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置
KR102626371B1 (ko) 프린트 배선판의 제조 방법
JP7444192B2 (ja) 感光性樹脂組成物
JP7322988B2 (ja) 樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置
JP2022037501A (ja) 感光性樹脂組成物

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right