KR102553081B1 - 초박형 동박 및 그 제작방법 - Google Patents

초박형 동박 및 그 제작방법 Download PDF

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Publication number
KR102553081B1
KR102553081B1 KR1020220010908A KR20220010908A KR102553081B1 KR 102553081 B1 KR102553081 B1 KR 102553081B1 KR 1020220010908 A KR1020220010908 A KR 1020220010908A KR 20220010908 A KR20220010908 A KR 20220010908A KR 102553081 B1 KR102553081 B1 KR 102553081B1
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KR
South Korea
Prior art keywords
concentration
copper foil
ultra
electrolyte
thin copper
Prior art date
Application number
KR1020220010908A
Other languages
English (en)
Korean (ko)
Other versions
KR20220113266A (ko
Inventor
밍 예
핑위엔 리오
사오화 리우
지시엔 시에
츄안정 리
밍황 구
Original Assignee
광동 지아위안 테크놀로지 컴퍼니., 리미티드.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 광동 지아위안 테크놀로지 컴퍼니., 리미티드. filed Critical 광동 지아위안 테크놀로지 컴퍼니., 리미티드.
Publication of KR20220113266A publication Critical patent/KR20220113266A/ko
Application granted granted Critical
Publication of KR102553081B1 publication Critical patent/KR102553081B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
KR1020220010908A 2021-02-05 2022-01-25 초박형 동박 및 그 제작방법 KR102553081B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110161499.4A CN112981481B (zh) 2021-02-05 2021-02-05 一种超薄铜箔及其制备方法
CN2021101614994 2021-02-05

Publications (2)

Publication Number Publication Date
KR20220113266A KR20220113266A (ko) 2022-08-12
KR102553081B1 true KR102553081B1 (ko) 2023-07-07

Family

ID=76348078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220010908A KR102553081B1 (ko) 2021-02-05 2022-01-25 초박형 동박 및 그 제작방법

Country Status (3)

Country Link
JP (1) JP7302046B2 (zh)
KR (1) KR102553081B1 (zh)
CN (1) CN112981481B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114703514B (zh) * 2022-04-11 2023-04-25 广东嘉元科技股份有限公司 一种改性铜箔及其制备方法和在锂离子电池方面的用途
CN114990641B (zh) * 2022-06-02 2023-10-17 山东金宝电子有限公司 一种载体超薄铜箔及其制备方法
CN115058711B (zh) * 2022-06-17 2022-12-27 山东大学 一种易剥离的超薄载体铜箔的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101892499A (zh) 2010-07-24 2010-11-24 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
KR20140050541A (ko) * 2012-10-18 2014-04-29 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
JP6072962B2 (ja) * 2015-01-09 2017-02-01 Ｊｘ金属株式会社 めっき付き金属基材
CN107245735A (zh) * 2017-05-26 2017-10-13 东强（连州）铜箔有限公司 一种高耐药性和耐热性合金铜箔的镀液和制备方法
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101892499A (zh) 2010-07-24 2010-11-24 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法

Also Published As

Publication number Publication date
JP2022120813A (ja) 2022-08-18
CN112981481B (zh) 2021-12-28
CN112981481A (zh) 2021-06-18
KR20220113266A (ko) 2022-08-12
JP7302046B2 (ja) 2023-07-03

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